WS991AX500T4 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 186.16 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details WS991AX500T4 Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS, Packaging: Bulk, Composition: Sn63Pb37 (63/37), Type: Solder Paste, Melting Point: 361°F (183°C), Form: Jar, 17.64 oz (500g), Mesh Type: 4, Process: Leaded, Flux Type: Water Soluble, Part Status: Active, Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.
Weitere Produktangebote WS991AX500T4
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
WS991AX500T4 | Hersteller : Chip Quik | Solder Thermally Stable Solder Paste WS (Water-Soluble) Sn63/Pb37 T4 (500g jar) |
Produkt ist nicht verfügbar |