XB3-C-GM1-UT-102 Digi
Hersteller: Digi
Description: RF TXRX MOD BT/CELL CHIP SMD VZW
Packaging: Bag
Package / Case: 20-DIP Module
Sensitivity: -113dBm
Mounting Type: Through Hole
Memory Size: 1MB Flash, 64kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V ~ 4.3V
Power - Output: 23dBm
Data Rate: 1Mbps
Protocol: Bluetooth, GNSS, LTE
Current - Transmitting: 200mA ~ 270mA
Antenna Type: Integrated, Chip + U.FL
Utilized IC / Part: ME310-W1
RF Family/Standard: Bluetooth, Cellular, Navigation
Serial Interfaces: I2C, JTAG, SPI, UART, USB
Description: RF TXRX MOD BT/CELL CHIP SMD VZW
Packaging: Bag
Package / Case: 20-DIP Module
Sensitivity: -113dBm
Mounting Type: Through Hole
Memory Size: 1MB Flash, 64kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V ~ 4.3V
Power - Output: 23dBm
Data Rate: 1Mbps
Protocol: Bluetooth, GNSS, LTE
Current - Transmitting: 200mA ~ 270mA
Antenna Type: Integrated, Chip + U.FL
Utilized IC / Part: ME310-W1
RF Family/Standard: Bluetooth, Cellular, Navigation
Serial Interfaces: I2C, JTAG, SPI, UART, USB
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 124.19 EUR |
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Technische Details XB3-C-GM1-UT-102 Digi
Description: RF TXRX MOD BT/CELL CHIP SMD VZW, Packaging: Bag, Package / Case: 20-DIP Module, Sensitivity: -113dBm, Mounting Type: Through Hole, Memory Size: 1MB Flash, 64kB RAM, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 3.3V ~ 4.3V, Power - Output: 23dBm, Data Rate: 1Mbps, Protocol: Bluetooth, GNSS, LTE, Current - Transmitting: 200mA ~ 270mA, Antenna Type: Integrated, Chip + U.FL, Utilized IC / Part: ME310-W1, RF Family/Standard: Bluetooth, Cellular, Navigation, Serial Interfaces: I2C, JTAG, SPI, UART, USB.
Weitere Produktangebote XB3-C-GM1-UT-102
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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XB3-C-GM1-UT-102 | Hersteller : DIGI INTERNATIONAL |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; GNSS,LTE- M/NB-IoT; 24.38x32.94mm; SPI,UART,USB Type of communications module: LTE Interface: SPI; UART; USB Supply voltage: 3.3...4.3V DC Dimensions: 24.38x32.94mm Operating temperature: -40...85°C Communictions protocol: Bluetooth Low Energy Kind of connector: U.FL x3 Kit contents: SIM card (Verizon) Transmission: GNSS; LTE- M/NB-IoT Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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XB3-C-GM1-UT-102 | Hersteller : DIGI | Multiprotocol Modules Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, Verizon SIM |
Produkt ist nicht verfügbar |
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XB3-C-GM1-UT-102 | Hersteller : DIGI INTERNATIONAL |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; GNSS,LTE- M/NB-IoT; 24.38x32.94mm; SPI,UART,USB Type of communications module: LTE Interface: SPI; UART; USB Supply voltage: 3.3...4.3V DC Dimensions: 24.38x32.94mm Operating temperature: -40...85°C Communictions protocol: Bluetooth Low Energy Kind of connector: U.FL x3 Kit contents: SIM card (Verizon) Transmission: GNSS; LTE- M/NB-IoT |
Produkt ist nicht verfügbar |