XC226796F66LACKXUMA1 Infineon Technologies
Hersteller: Infineon TechnologiesMCU 16-bit/32-bit C166SV2 CISC/DSP/RISC 768KB Flash 3.3V/5V Automotive 100-Pin LQFP
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Technische Details XC226796F66LACKXUMA1 Infineon Technologies
Description: IC MCU 16/32B 768KB FLSH 100LQFP, Packaging: Tape & Reel (TR), Package / Case: 100-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 66MHz, Program Memory Size: 768KB (768K x 8), RAM Size: 82K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: C166SV2, Data Converters: A/D 16x8/10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI, Peripherals: DMA, I2S, POR, PWM, WDT, Supplier Device Package: PG-LQFP-100-3, Number of I/O: 75, DigiKey Programmable: Not Verified.
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XC226796F66LACKXUMA1 | Hersteller : Infineon Technologies |
Description: IC MCU 16/32B 768KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 768KB (768K x 8) RAM Size: 82K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: C166SV2 Data Converters: A/D 16x8/10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: DMA, I2S, POR, PWM, WDT Supplier Device Package: PG-LQFP-100-3 Number of I/O: 75 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |