XIAO ESP32S3 SEEED STUDIO
Hersteller: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; u.FL antenna,prototype board; XIAO; PIN: 2x7
Type of development kit: evaluation
Kit contents: prototype board; u.FL antenna
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: Bluetooth 5.0; WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
Wi-Fi: 2,4GHz
Anzahl je Verpackung: 1 Stücke
Category: Development kits for data transmission
Description: Dev.kit: evaluation; u.FL antenna,prototype board; XIAO; PIN: 2x7
Type of development kit: evaluation
Kit contents: prototype board; u.FL antenna
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: Bluetooth 5.0; WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
Wi-Fi: 2,4GHz
Anzahl je Verpackung: 1 Stücke
auf Bestellung 8 Stücke:
Lieferzeit 7-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
6+ | 12.51 EUR |
10+ | 12.05 EUR |
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Technische Details XIAO ESP32S3 SEEED STUDIO
Category: Development kits for data transmission, Description: Dev.kit: evaluation; u.FL antenna,prototype board; XIAO; PIN: 2x7, Type of development kit: evaluation, Kit contents: prototype board; u.FL antenna, Components: ESP32-S3R8, Interface: ADC; GPIO; I2C; I2S; SPI; UART, Kind of connector: solder pads; U.FL; USB C socket, Communictions protocol: Bluetooth 5.0; WIFI, Manufacturer series: XIAO, Number of pins: 2x 7, Kind of architecture: Xtensa LX7, Operating temperature: -40...65°C, Memory: 8MB FLASH; 8MB SRAM, Dimensions: 21x17.5mm, Wi-Fi: 2,4GHz, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote XIAO ESP32S3 nach Preis ab 12.51 EUR bis 12.51 EUR
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XIAO ESP32S3 | Hersteller : SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; u.FL antenna,prototype board; XIAO; PIN: 2x7 Type of development kit: evaluation Kit contents: prototype board; u.FL antenna Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: Bluetooth 5.0; WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm Wi-Fi: 2,4GHz |
auf Bestellung 8 Stücke: Lieferzeit 14-21 Tag (e) |
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