YTE-130-02-L-5-655 Samtec
Hersteller: SamtecBoard to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Elevated Socket Strip"
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 52.59 EUR |
| 27+ | 47.91 EUR |
| 54+ | 46.75 EUR |
| 108+ | 45.32 EUR |
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Technische Details YTE-130-02-L-5-655 Samtec
Description: CONN HD ARRAY RCP 150P VERT GOLD, Packaging: Tube, Connector Type: Elevated Socket, Mounting Type: Through Hole, Number of Positions: 150, Style: Board to Board, Operating Temperature: -55°C ~ 105°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Contact Length - Post: 0.050" (1.27mm), Insulation Height: 0.655" (16.63mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 5.
Weitere Produktangebote YTE-130-02-L-5-655 nach Preis ab 70.05 EUR bis 70.05 EUR
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YTE-130-02-L-5-655 | Hersteller : Samtec Inc. |
Description: CONN HD ARRAY RCP 150P VERT GOLD Packaging: Tube Connector Type: Elevated Socket Mounting Type: Through Hole Number of Positions: 150 Style: Board to Board Operating Temperature: -55°C ~ 105°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Length - Post: 0.050" (1.27mm) Insulation Height: 0.655" (16.63mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 5 |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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