| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 100-020-000 | 3M |
Description: CONN IC DIP SOCKET 20POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-020-001 | 3M |
Description: CONN IC DIP SOCKET 20POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-022-000 | 3M |
Description: CONN IC DIP SOCKET 22POS GOLD Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-024-000 | 3M |
Description: CONN IC DIP SOCKET 24POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-024-001 | 3M |
Description: CONN IC DIP SOCKET 24POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-028-000 | 3M |
Description: CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -65°C ~ 125°C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-028-001 | 3M |
Description: CONN IC DIP SOCKET 28POS GOLD Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk Part Status: Obsolete Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-032-000 | 3M |
Description: CONN IC DIP SOCKET 32POS GOLD Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-032-001 | 3M |
Description: CONN IC DIP SOCKET 32POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-040-000 | 3M |
Description: CONN IC DIP SOCKET 40POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-040-001 | 3M |
Description: CONN IC DIP SOCKET 40POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame, Seal Tape Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-042-000 | 3M |
Description: CONN IC DIP SOCKET 42POS GOLD Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 42 (2 x 21) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 100-048-000 | 3M |
Description: CONN IC DIP SOCKET 48POS GOLD Part Status: Obsolete Contact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 8.00µin (0.203µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 48 (2 x 24) Operating Temperature: -65°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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203-6585-00-0602J | 3M |
Description: SOCKET LASER DIODE 3POSAccessory Type: Laser - Socket For Use With/Related Products: Laser Diode Modules Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
203-6585-50-0602J | 3M |
Description: SOCKET LASER DIODE 3POSPart Status: Active Accessory Type: Laser - Socket For Use With/Related Products: Laser Diode Modules Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
|
203-6970-00-0602J | 3M |
Description: SOCKET LASER DIODE 3POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket |
auf Bestellung 103 Stücke: Lieferzeit 10-14 Tag (e) |
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203-6970-50-0602J | 3M |
Description: SOCKET LASER DIODE 3POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket Part Status: Active |
auf Bestellung 197 Stücke: Lieferzeit 10-14 Tag (e) |
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204-6585-00-0602J | 3M |
Description: SOCKET LASER DIODE 4POSAccessory Type: Laser - Socket For Use With/Related Products: Laser Diode Modules Packaging: Bulk |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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204-6585-50-0602J | 3M |
Description: SOCKET LASER DIODE 4POSAccessory Type: Laser - Socket For Use With/Related Products: Laser Diode Modules Packaging: Bulk |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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204-6970-00-0602J | 3M |
Description: SOCKET LASER DIODE 4POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket Part Status: Active |
auf Bestellung 187 Stücke: Lieferzeit 10-14 Tag (e) |
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204-6970-50-0602J | 3M |
Description: SOCKET LASER DIODE 4POSPackaging: Bulk For Use With/Related Products: Laser Diode Modules Accessory Type: Laser - Socket Part Status: Active |
auf Bestellung 136 Stücke: Lieferzeit 10-14 Tag (e) |
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203-2737-55-1102 | 3M |
Description: CONN TRANSIST TO-3/TO-66 3POSPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: Transistor, TO-3 and TO-66 Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 3 (Rectangular) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.234" (5.94mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 114 Stücke: Lieferzeit 10-14 Tag (e) |
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SBR-ST-29-P-ML | 3M |
Description: CONN SOCKET SAS 29POS VERT |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
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SBR-EV-29-P-ML | 3M |
Description: CONN SAS RCPT 29POS SLD PCBPackaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 29 Termination: Solder Connector Style: Receptacle Contact Finish Thickness: 30.0µin (0.76µm) Part Status: Obsolete |
auf Bestellung 150 Stücke: Lieferzeit 10-14 Tag (e) |
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SBH-ST-29-SA-ML | 3M |
Description: CONN PLUG SAS 29POS STRADDLE MNT |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
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SBH-ST-29-SM-ML | 3M |
Description: CONN SAS PLUG 29POS SLD SMDFeatures: Flange Packaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 29 Termination: Solder Connector Style: Plug Contact Finish Thickness: 30.0µin (0.76µm) Part Status: Obsolete |
auf Bestellung 936 Stücke: Lieferzeit 10-14 Tag (e) |
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| SBR-RA-29-S-ML | 3M |
Description: CONN SAS RCPT 29POS SLD R/APackaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Through Hole, Right Angle Number of Positions: 29 Termination: Solder Connector Style: Receptacle Contact Finish Thickness: 30.0µin (0.76µm) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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4808-3000-CP | 3M |
Description: CONN IC DIP SOCKET 8POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 11364 Stücke: Lieferzeit 10-14 Tag (e) |
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4814-3000-CP | 3M |
Description: CONN IC DIP SOCKET 14POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 11763 Stücke: Lieferzeit 10-14 Tag (e) |
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4816-3000-CP | 3M |
Description: CONN IC DIP SOCKET 16POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 2680 Stücke: Lieferzeit 10-14 Tag (e) |
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4818-3000-CP | 3M |
Description: CONN IC DIP SOCKET 18POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 7986 Stücke: Lieferzeit 10-14 Tag (e) |
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4820-3000-CP | 3M |
Description: CONN IC DIP SOCKET 20POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 7708 Stücke: Lieferzeit 10-14 Tag (e) |
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4824-3000-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 1211 Stücke: Lieferzeit 10-14 Tag (e) |
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4824-6000-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TINPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -25°C ~ 85°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
auf Bestellung 4177 Stücke: Lieferzeit 10-14 Tag (e) |
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| 4828-3000-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINPart Status: Obsolete Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -25°C ~ 85°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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4828-6000-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 1624 Stücke: Lieferzeit 10-14 Tag (e) |
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4832-6000-CP | 3M |
Description: CONN IC DIP SOCKET 32POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 2304 Stücke: Lieferzeit 10-14 Tag (e) |
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4840-6000-CP | 3M |
Description: CONN IC DIP SOCKET 40POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 2378 Stücke: Lieferzeit 10-14 Tag (e) |
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4848-6000-CP | 3M |
Description: CONN IC DIP SOCKET 48POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 1401 Stücke: Lieferzeit 10-14 Tag (e) |
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4808-3004-CP | 3M |
Description: CONN IC DIP SOCKET 8POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 22069 Stücke: Lieferzeit 10-14 Tag (e) |
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4814-3004-CP | 3M |
Description: CONN IC DIP SOCKET 14POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 4435 Stücke: Lieferzeit 10-14 Tag (e) |
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4816-3004-CP | 3M |
Description: CONN IC DIP SOCKET 16POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 4965 Stücke: Lieferzeit 10-14 Tag (e) |
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4818-3004-CP | 3M |
Description: CONN IC DIP SOCKET 18POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 6024 Stücke: Lieferzeit 10-14 Tag (e) |
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4820-3004-CP | 3M |
Description: CONN IC DIP SOCKET 20POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 8467 Stücke: Lieferzeit 10-14 Tag (e) |
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4824-3004-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TIN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
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4824-6004-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 2954 Stücke: Lieferzeit 10-14 Tag (e) |
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4828-3004-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 6900 Stücke: Lieferzeit 10-14 Tag (e) |
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4828-6004-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 2150 Stücke: Lieferzeit 10-14 Tag (e) |
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4832-6004-CP | 3M |
Description: CONN IC DIP SOCKET 32POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 2880 Stücke: Lieferzeit 10-14 Tag (e) |
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4840-6004-CP | 3M |
Description: CONN IC DIP SOCKET 40POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 1792 Stücke: Lieferzeit 10-14 Tag (e) |
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4848-6004-CP | 3M |
Description: CONN IC DIP SOCKET 48POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 1582 Stücke: Lieferzeit 10-14 Tag (e) |
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D7E50-7316-02 | 3M |
Description: CONN COMPACT FLASH CARD SNAP-INPart Status: Active Insertion, Removal Method: Push In, Push Out Ejector Side: Right Card Type: CompactFlash® - Type I Mounting Type: Snap-In Connector Type: Ejector Packaging: Bulk |
auf Bestellung 650 Stücke: Lieferzeit 10-14 Tag (e) |
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D7E50-8316-03 | 3M |
Description: CONN COMPACT FLASH CARD SNAP-INPackaging: Bulk Connector Type: Ejector Mounting Type: Snap-In Card Type: CompactFlash® - Type I Ejector Side: Right Insertion, Removal Method: Push In, Push Out Part Status: Active |
auf Bestellung 691 Stücke: Lieferzeit 10-14 Tag (e) |
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3418-0000 | 3M |
Description: CONN IDC 40POS 26-28AWG VERTNumber of Rows: 4 Cable Pitch: 0.050" (1.27mm) Cable Termination: IDC Contact Finish Thickness: 10.0µin (0.25µm) Row Spacing: 0.100" (2.54mm) Number of Positions: 40 Wire Gauge: 26-28 AWG, Stranded or Solid Mounting Type: Through Hole Color: Gray Contact Finish: Gold Connector Type: Ribbon Cable Features: Feed Through Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
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3426-0000 | 3M |
Description: CONN IDC 50POS 26-28AWG VERTNumber of Rows: 4 Cable Pitch: 0.050" (1.27mm) Cable Termination: IDC Contact Finish Thickness: 10.0µin (0.25µm) Row Spacing: 0.100" (2.54mm) Number of Positions: 50 Wire Gauge: 26-28 AWG, Stranded or Solid Mounting Type: Through Hole Color: Gray Contact Finish: Gold Connector Type: Ribbon Cable Features: Feed Through Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
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3434-0000 | 3M |
Description: CONN IDC 26POS 26-28AWG VERTNumber of Rows: 4 Cable Pitch: 0.050" (1.27mm) Cable Termination: IDC Contact Finish Thickness: 10.0µin (0.25µm) Row Spacing: 0.100" (2.54mm) Number of Positions: 26 Wire Gauge: 26-28 AWG, Stranded or Solid Mounting Type: Through Hole Color: Gray Contact Finish: Gold Connector Type: Ribbon Cable Features: Feed Through Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| MP2-H024-41P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 24POS PCBPart Status: Obsolete Contact Finish Thickness: 30.0µin (0.76µm) Connector Style: Futurebus+® Connector Usage: Backplane Termination: Press-Fit Number of Positions Loaded: All Number of Rows: 4 Pitch: 0.079" (2.00mm) Number of Positions: 24 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1008 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| MP2-H030-51P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 30POS PCBContact Finish Thickness: 30.0µin (0.76µm) Connector Style: Futurebus+® Connector Usage: Backplane Termination: Press-Fit Number of Positions Loaded: All Number of Rows: 5 Pitch: 0.079" (2.00mm) Number of Positions: 30 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| MP2-H030-54P1-S-TR30 | 3M |
Description: CONN HEADER FUTUREBUS+ 30POS PCBTermination: Press-Fit Number of Positions Loaded: All Number of Rows: 5 Pitch: 0.079" (2.00mm) Number of Positions: 30 Mounting Type: Through Hole Color: Beige Contact Finish: Gold Connector Type: Header, Male Pins Features: Board Guide, Mating Guide Packaging: Box Part Status: Obsolete Contact Finish Thickness: 3.00µin (0.076µm) Connector Style: Futurebus+® Connector Usage: Backplane |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| MP2-H048-41P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 48POS PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1008 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 100-020-000 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-020-001 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-022-000 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 22POS GOLD
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Description: CONN IC DIP SOCKET 22POS GOLD
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-024-000 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-024-001 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-028-000 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -65°C ~ 125°C
Description: CONN IC DIP SOCKET 28POS GOLD
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -65°C ~ 125°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-028-001 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-032-000 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Description: CONN IC DIP SOCKET 32POS GOLD
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-032-001 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Description: CONN IC DIP SOCKET 32POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-040-000 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-040-001 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Description: CONN IC DIP SOCKET 40POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Seal Tape
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-042-000 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 42POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Description: CONN IC DIP SOCKET 42POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 100-048-000 |
Hersteller: 3M
Description: CONN IC DIP SOCKET 48POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 48POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -65°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 203-6585-00-0602J |
![]() |
Hersteller: 3M
Description: SOCKET LASER DIODE 3POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
Description: SOCKET LASER DIODE 3POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 203-6585-50-0602J |
![]() |
Hersteller: 3M
Description: SOCKET LASER DIODE 3POS
Part Status: Active
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
Description: SOCKET LASER DIODE 3POS
Part Status: Active
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 203-6970-00-0602J |
![]() |
Hersteller: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.93 EUR |
| 10+ | 16.93 EUR |
| 100+ | 14.03 EUR |
| 203-6970-50-0602J |
![]() |
Hersteller: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
auf Bestellung 197 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.5 EUR |
| 10+ | 15.79 EUR |
| 100+ | 13.05 EUR |
| 204-6585-00-0602J |
![]() |
Hersteller: 3M
Description: SOCKET LASER DIODE 4POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
Description: SOCKET LASER DIODE 4POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 26.87 EUR |
| 10+ | 20.97 EUR |
| 204-6585-50-0602J |
![]() |
Hersteller: 3M
Description: SOCKET LASER DIODE 4POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
Description: SOCKET LASER DIODE 4POS
Accessory Type: Laser - Socket
For Use With/Related Products: Laser Diode Modules
Packaging: Bulk
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 26.12 EUR |
| 10+ | 20.3 EUR |
| 204-6970-00-0602J |
![]() |
Hersteller: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
auf Bestellung 187 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 24.42 EUR |
| 10+ | 18.98 EUR |
| 100+ | 15.79 EUR |
| 204-6970-50-0602J |
![]() |
Hersteller: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
auf Bestellung 136 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.5 EUR |
| 10+ | 18.22 EUR |
| 100+ | 15.14 EUR |
| 203-2737-55-1102 |
![]() |
Hersteller: 3M
Description: CONN TRANSIST TO-3/TO-66 3POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN TRANSIST TO-3/TO-66 3POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 99.23 EUR |
| 10+ | 84.35 EUR |
| 30+ | 78.06 EUR |
| 50+ | 75.29 EUR |
| 100+ | 71.71 EUR |
| SBR-ST-29-P-ML |
![]() |
Hersteller: 3M
Description: CONN SOCKET SAS 29POS VERT
Description: CONN SOCKET SAS 29POS VERT
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SBR-EV-29-P-ML |
![]() |
Hersteller: 3M
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.44 EUR |
| 10+ | 9.33 EUR |
| 25+ | 8.59 EUR |
| 40+ | 8.25 EUR |
| 80+ | 7.75 EUR |
| SBH-ST-29-SA-ML |
![]() |
Hersteller: 3M
Description: CONN PLUG SAS 29POS STRADDLE MNT
Description: CONN PLUG SAS 29POS STRADDLE MNT
Produkt ist nicht verfügbar
Mindestbestellmenge: 5400 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SBH-ST-29-SM-ML |
![]() |
Hersteller: 3M
Description: CONN SAS PLUG 29POS SLD SMD
Features: Flange
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
Description: CONN SAS PLUG 29POS SLD SMD
Features: Flange
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
auf Bestellung 936 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.54 EUR |
| 10+ | 10.47 EUR |
| 25+ | 9.92 EUR |
| 40+ | 9.69 EUR |
| 80+ | 9.22 EUR |
| 230+ | 8.08 EUR |
| 440+ | 7.84 EUR |
| SBR-RA-29-S-ML |
![]() |
Hersteller: 3M
Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 4808-3000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 11364 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.71 EUR |
| 15+ | 1.46 EUR |
| 25+ | 1.38 EUR |
| 50+ | 1.31 EUR |
| 100+ | 1.25 EUR |
| 250+ | 1.17 EUR |
| 500+ | 1.12 EUR |
| 1000+ | 1.06 EUR |
| 2500+ | 1 EUR |
| 4814-3000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 11763 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.82 EUR |
| 14+ | 1.55 EUR |
| 28+ | 1.44 EUR |
| 56+ | 1.37 EUR |
| 112+ | 1.31 EUR |
| 252+ | 1.24 EUR |
| 504+ | 1.18 EUR |
| 1008+ | 1.12 EUR |
| 2520+ | 1.05 EUR |
| 4816-3000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 2680 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 1.99 EUR |
| 13+ | 1.69 EUR |
| 25+ | 1.58 EUR |
| 50+ | 1.51 EUR |
| 100+ | 1.44 EUR |
| 250+ | 1.34 EUR |
| 500+ | 1.29 EUR |
| 1000+ | 1.23 EUR |
| 2500+ | 1.14 EUR |
| 4818-3000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 7986 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.68 EUR |
| 22+ | 2.15 EUR |
| 44+ | 2.05 EUR |
| 66+ | 1.99 EUR |
| 110+ | 1.92 EUR |
| 264+ | 1.81 EUR |
| 506+ | 1.73 EUR |
| 1012+ | 1.64 EUR |
| 2508+ | 1.54 EUR |
| 4820-3000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 7708 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.12 EUR |
| 20+ | 1.7 EUR |
| 40+ | 1.62 EUR |
| 60+ | 1.57 EUR |
| 100+ | 1.52 EUR |
| 260+ | 1.42 EUR |
| 500+ | 1.36 EUR |
| 1000+ | 1.3 EUR |
| 2500+ | 1.21 EUR |
| 4824-3000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 24POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 1211 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.76 EUR |
| 16+ | 1.44 EUR |
| 32+ | 1.37 EUR |
| 64+ | 1.31 EUR |
| 112+ | 1.26 EUR |
| 256+ | 1.19 EUR |
| 512+ | 1.13 EUR |
| 1008+ | 1.07 EUR |
| 4824-6000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -25°C ~ 85°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 24POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -25°C ~ 85°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 4177 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.76 EUR |
| 16+ | 1.44 EUR |
| 32+ | 1.37 EUR |
| 64+ | 1.31 EUR |
| 112+ | 1.26 EUR |
| 256+ | 1.19 EUR |
| 512+ | 1.13 EUR |
| 1008+ | 1.07 EUR |
| 2512+ | 1.01 EUR |
| 4828-3000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -25°C ~ 85°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 28POS TIN
Part Status: Obsolete
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -25°C ~ 85°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 4828-6000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 1624 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.33 EUR |
| 14+ | 2.76 EUR |
| 28+ | 2.63 EUR |
| 56+ | 2.5 EUR |
| 112+ | 2.38 EUR |
| 252+ | 2.25 EUR |
| 504+ | 2.14 EUR |
| 1008+ | 2.03 EUR |
| 4832-6000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 2304 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 1.9 EUR |
| 14+ | 1.59 EUR |
| 36+ | 1.48 EUR |
| 60+ | 1.43 EUR |
| 108+ | 1.37 EUR |
| 252+ | 1.29 EUR |
| 504+ | 1.23 EUR |
| 1008+ | 1.17 EUR |
| 4840-6000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 2378 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.52 EUR |
| 10+ | 3 EUR |
| 30+ | 2.77 EUR |
| 50+ | 2.68 EUR |
| 100+ | 2.55 EUR |
| 250+ | 2.38 EUR |
| 500+ | 2.27 EUR |
| 1000+ | 2.17 EUR |
| 4848-6000-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 1401 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.25 EUR |
| 16+ | 3.49 EUR |
| 32+ | 3.32 EUR |
| 56+ | 3.19 EUR |
| 104+ | 3.06 EUR |
| 256+ | 2.87 EUR |
| 504+ | 2.74 EUR |
| 1000+ | 2.61 EUR |
| 4808-3004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 22069 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.82 EUR |
| 14+ | 1.56 EUR |
| 25+ | 1.46 EUR |
| 50+ | 1.39 EUR |
| 100+ | 1.32 EUR |
| 250+ | 1.24 EUR |
| 500+ | 1.18 EUR |
| 1000+ | 1.13 EUR |
| 2500+ | 1.06 EUR |
| 4814-3004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 4435 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.7 EUR |
| 15+ | 1.45 EUR |
| 28+ | 1.34 EUR |
| 56+ | 1.29 EUR |
| 112+ | 1.23 EUR |
| 252+ | 1.15 EUR |
| 504+ | 1.09 EUR |
| 1008+ | 1.05 EUR |
| 2520+ | 0.98 EUR |
| 4816-3004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 4965 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.09 EUR |
| 12+ | 1.77 EUR |
| 25+ | 1.67 EUR |
| 50+ | 1.58 EUR |
| 100+ | 1.51 EUR |
| 250+ | 1.42 EUR |
| 500+ | 1.34 EUR |
| 1000+ | 1.29 EUR |
| 2500+ | 1.2 EUR |
| 4818-3004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 6024 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15+ | 1.44 EUR |
| 22+ | 1.15 EUR |
| 44+ | 1.11 EUR |
| 66+ | 1.07 EUR |
| 110+ | 1.04 EUR |
| 264+ | 0.98 EUR |
| 506+ | 0.93 EUR |
| 1012+ | 0.88 EUR |
| 2508+ | 0.83 EUR |
| 4820-3004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 8467 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15+ | 1.44 EUR |
| 20+ | 1.17 EUR |
| 40+ | 1.11 EUR |
| 60+ | 1.08 EUR |
| 100+ | 1.04 EUR |
| 260+ | 0.98 EUR |
| 500+ | 0.93 EUR |
| 1000+ | 0.88 EUR |
| 2500+ | 0.83 EUR |
| 4824-3004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Description: CONN IC DIP SOCKET 24POS TIN
Produkt ist nicht verfügbar
Mindestbestellmenge: 6400 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 4824-6004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 2954 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 2.49 EUR |
| 16+ | 2.06 EUR |
| 32+ | 1.95 EUR |
| 64+ | 1.86 EUR |
| 112+ | 1.78 EUR |
| 256+ | 1.69 EUR |
| 512+ | 1.61 EUR |
| 1008+ | 1.54 EUR |
| 2512+ | 1.44 EUR |
| 4828-3004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 6900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.08 EUR |
| 14+ | 2.55 EUR |
| 28+ | 2.43 EUR |
| 56+ | 2.31 EUR |
| 112+ | 2.2 EUR |
| 252+ | 2.07 EUR |
| 504+ | 1.98 EUR |
| 1008+ | 1.88 EUR |
| 2506+ | 1.76 EUR |
| 4828-6004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 2150 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.95 EUR |
| 14+ | 2.45 EUR |
| 28+ | 2.33 EUR |
| 56+ | 2.23 EUR |
| 112+ | 2.12 EUR |
| 252+ | 2 EUR |
| 504+ | 1.9 EUR |
| 1008+ | 1.81 EUR |
| 4832-6004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 2880 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.12 EUR |
| 12+ | 1.77 EUR |
| 36+ | 1.64 EUR |
| 60+ | 1.58 EUR |
| 108+ | 1.52 EUR |
| 252+ | 1.43 EUR |
| 504+ | 1.36 EUR |
| 1008+ | 1.3 EUR |
| 2508+ | 1.21 EUR |
| 4840-6004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 1792 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.26 EUR |
| 11+ | 1.93 EUR |
| 30+ | 1.78 EUR |
| 50+ | 1.71 EUR |
| 100+ | 1.63 EUR |
| 250+ | 1.54 EUR |
| 500+ | 1.46 EUR |
| 1000+ | 1.39 EUR |
| 4848-6004-CP |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 1582 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 4.14 EUR |
| 16+ | 3.4 EUR |
| 32+ | 3.24 EUR |
| 56+ | 3.11 EUR |
| 104+ | 2.98 EUR |
| 256+ | 2.8 EUR |
| 504+ | 2.67 EUR |
| 1000+ | 2.53 EUR |
| D7E50-7316-02 |
![]() |
Hersteller: 3M
Description: CONN COMPACT FLASH CARD SNAP-IN
Part Status: Active
Insertion, Removal Method: Push In, Push Out
Ejector Side: Right
Card Type: CompactFlash® - Type I
Mounting Type: Snap-In
Connector Type: Ejector
Packaging: Bulk
Description: CONN COMPACT FLASH CARD SNAP-IN
Part Status: Active
Insertion, Removal Method: Push In, Push Out
Ejector Side: Right
Card Type: CompactFlash® - Type I
Mounting Type: Snap-In
Connector Type: Ejector
Packaging: Bulk
auf Bestellung 650 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.23 EUR |
| 10+ | 11.25 EUR |
| 25+ | 10.54 EUR |
| 50+ | 10.03 EUR |
| 100+ | 9.56 EUR |
| 300+ | 8.84 EUR |
| 500+ | 8.53 EUR |
| D7E50-8316-03 |
![]() |
Hersteller: 3M
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
auf Bestellung 691 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.96 EUR |
| 10+ | 13.55 EUR |
| 25+ | 12.71 EUR |
| 50+ | 12.1 EUR |
| 100+ | 11.52 EUR |
| 300+ | 10.66 EUR |
| 500+ | 10.29 EUR |
| 3418-0000 |
![]() |
Hersteller: 3M
Description: CONN IDC 40POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 40
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
Description: CONN IDC 40POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 40
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 3426-0000 |
![]() |
Hersteller: 3M
Description: CONN IDC 50POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 50
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
Description: CONN IDC 50POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 50
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 3434-0000 |
![]() |
Hersteller: 3M
Description: CONN IDC 26POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 26
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
Description: CONN IDC 26POS 26-28AWG VERT
Number of Rows: 4
Cable Pitch: 0.050" (1.27mm)
Cable Termination: IDC
Contact Finish Thickness: 10.0µin (0.25µm)
Row Spacing: 0.100" (2.54mm)
Number of Positions: 26
Wire Gauge: 26-28 AWG, Stranded or Solid
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Ribbon Cable
Features: Feed Through
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MP2-H024-41P1-S-TG30 |
![]() |
Hersteller: 3M
Description: CONN HEADER FUTUREBUS+ 24POS PCB
Part Status: Obsolete
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 4
Pitch: 0.079" (2.00mm)
Number of Positions: 24
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Tube
Description: CONN HEADER FUTUREBUS+ 24POS PCB
Part Status: Obsolete
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 4
Pitch: 0.079" (2.00mm)
Number of Positions: 24
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 1008 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MP2-H030-51P1-S-TG30 |
![]() |
Hersteller: 3M
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 30
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Tube
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Contact Finish Thickness: 30.0µin (0.76µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 30
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 840 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MP2-H030-54P1-S-TR30 |
![]() |
Hersteller: 3M
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 30
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
Part Status: Obsolete
Contact Finish Thickness: 3.00µin (0.076µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Termination: Press-Fit
Number of Positions Loaded: All
Number of Rows: 5
Pitch: 0.079" (2.00mm)
Number of Positions: 30
Mounting Type: Through Hole
Color: Beige
Contact Finish: Gold
Connector Type: Header, Male Pins
Features: Board Guide, Mating Guide
Packaging: Box
Part Status: Obsolete
Contact Finish Thickness: 3.00µin (0.076µm)
Connector Style: Futurebus+®
Connector Usage: Backplane
Produkt ist nicht verfügbar
Mindestbestellmenge: 840 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MP2-H048-41P1-S-TG30 |
![]() |
Hersteller: 3M
Description: CONN HEADER FUTUREBUS+ 48POS PCB
Description: CONN HEADER FUTUREBUS+ 48POS PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 1008 Stücke
Im Einkaufswagen
Stück im Wert von UAH

























