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| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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BBR13-24K6J01 | Advanced-Connectek USA |
 Description: P0.4*H0.8mm BOARD TO BOARD CONN,Features: Board Guide, Mating Guide, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Array, Male Pins Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 5.90µin (0.150µm) Mated Stacking Heights: 0.8mm |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BBR13-24K6J01 |
|
Hersteller: Advanced-Connectek USA
Description: P0.4*H0.8mm BOARD TO BOARD CONN,
Features: Board Guide, Mating Guide, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 5.90µin (0.150µm)
Mated Stacking Heights: 0.8mm
Description: P0.4*H0.8mm BOARD TO BOARD CONN,
Features: Board Guide, Mating Guide, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 5.90µin (0.150µm)
Mated Stacking Heights: 0.8mm
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH