Produkte > DIGI INTERNATIONAL > Alle Produkte des Herstellers DIGI INTERNATIONAL (5053) > Seite 85 nach 85
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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XB3-24DMPS | DIGI INTERNATIONAL |
![]() Description: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD Type of communications module: RF Kind of antenna: PCB Kind of module: XBee Frequency: 2.4GHz Receiver sensitivity: -103dBm Transmitter output power: 19dBm Mounting: SMD TX/RX supply current: 135/17mA Operating temperature: -40...85°C Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee Supply voltage: 2.1...3.6V Interface: I2C; SPI; UART Ciphering: AES128; AES256 |
Produkt ist nicht verfügbar |
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XB3-24DMPT | DIGI INTERNATIONAL |
![]() Description: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT Type of communications module: RF Kind of antenna: PCB Kind of module: XBee Frequency: 2.4GHz Receiver sensitivity: -103dBm Transmitter output power: 19dBm Mounting: THT TX/RX supply current: 135/17mA Operating temperature: -40...85°C Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee Supply voltage: 2.1...3.6V Interface: I2C; SPI; UART Ciphering: AES128; AES256 |
Produkt ist nicht verfügbar |
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CC-ACC-LCDH-10 | DIGI INTERNATIONAL |
![]() Description: Display: LCD; 10" Type of display: LCD Screen size: 10" |
Produkt ist nicht verfügbar |
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XB3-C-G1-UT-101 | DIGI INTERNATIONAL |
![]() Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm Type of communications module: LTE Bluetooth version: BLE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Transmission: 2G; 3G; GNSS; LTE CAT1 Dimensions: 30.48x43.18mm Interface: SPI; UART; USB Supply voltage: 2.8...5.5V DC Kind of connector: U.FL x3 Operating temperature: -40...80°C Kit contents: SIM card (AT&T) |
Produkt ist nicht verfügbar |
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XB3-C-GM1-UT-101 | DIGI INTERNATIONAL |
![]() Description: Module: LTE; Bluetooth: BLE; GNSS,LTE- M/NB-IoT; 24.38x32.94mm Type of communications module: LTE Bluetooth version: BLE Transmission: GNSS; LTE- M/NB-IoT Dimensions: 24.38x32.94mm Interface: SPI; UART; USB Supply voltage: 3.3...4.3V DC Kind of connector: U.FL x3 Operating temperature: -40...85°C Kit contents: SIM card (AT&T) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
XB3-C-GM2-UT-101 | DIGI INTERNATIONAL |
![]() Description: Module: LTE; Bluetooth: BLE; 2G,GNSS,LTE- M/NB-IoT; 24.38x32.94mm Type of communications module: LTE Bluetooth version: BLE Transmission: 2G; GNSS; LTE- M/NB-IoT Dimensions: 24.38x32.94mm Interface: SPI; UART; USB Supply voltage: 3.3...4.3V DC Kind of connector: U.FL x3 Operating temperature: -40...85°C Kit contents: SIM card (AT&T) |
Produkt ist nicht verfügbar |
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CC-WMP255-KIT | DIGI INTERNATIONAL |
![]() Description: Single-board computer; Cortex A33,Cortex M33; WIFI; STM32MP255C Kind of architecture: Cortex A33; Cortex M33 Memory: 2GB RAM; 128GB FLASH Communictions protocol: WIFI Processor: STM32MP255C Clock frequency: 1.2GHz Interface: CAN FD; Ethernet; HDMI; LVDS; microSD; MIPI; MIPI-CSI2; USB 3.0 Kind of connector: HDMI; LVDS; microSD; MIPI-CSI; RJ45; USB 3.0 Manufacturer series: ConnectCore® Kit contents: antenna; power supply; Single-board computer; USB cable Kind of memory: DDR4 Bluetooth version: 5.4 WiFi: 2,4GHz; 5GHz; 6 Operating system support: Yocto Linux Type of minicomputer: Single-board computer |
Produkt ist nicht verfügbar |
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CC-MX-ZC6D-Z1 | DIGI INTERNATIONAL |
![]() Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4 Type of minicomputer: SOM Trade name: integrated compute module Kind of architecture: Cortex A55; Cortex M33 Manufacturer series: ConnectCore® Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB Processor: i.MX 93 Memory: 512MB RAM; 8GB FLASH Kind of memory: LPDDR4 Dimensions: 40x45x3.5mm Communictions protocol: Ethernet Operating temperature: -40...85°C |
Produkt ist nicht verfügbar |
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CC-WMX-ZC6D-L1 | DIGI INTERNATIONAL |
![]() Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4 Type of minicomputer: SOM Trade name: integrated compute module Kind of architecture: Cortex A55; Cortex M33 Manufacturer series: ConnectCore® Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB Processor: i.MX 93 Memory: 512MB RAM; 8GB FLASH Kind of memory: LPDDR4 Dimensions: 40x45x3.5mm Communictions protocol: IEEE 802.11ax; WIFI WiFi: 6 Bluetooth version: 5.2 Operating temperature: -40...85°C |
Produkt ist nicht verfügbar |
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CC-MX-YC7D-ZN | DIGI INTERNATIONAL |
![]() Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4 Type of minicomputer: SOM Trade name: integrated compute module Kind of architecture: Cortex A55; Cortex M33 Manufacturer series: ConnectCore® Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB Processor: Ethos U-65 microNPU; i.MX 93 Memory: 1GB RAM; 8GB FLASH Kind of memory: LPDDR4 Dimensions: 40x45x3.5mm Communictions protocol: Ethernet Operating temperature: -40...85°C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
CC-WMX-YC7D-KN | DIGI INTERNATIONAL |
![]() Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4 Type of minicomputer: SOM Trade name: integrated compute module Kind of architecture: Cortex A55; Cortex M33 Manufacturer series: ConnectCore® Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB Processor: Ethos U-65 microNPU; i.MX 93 Memory: 1GB RAM; 8GB FLASH Kind of memory: LPDDR4 Dimensions: 40x45x3.5mm Communictions protocol: IEEE 802.11ax; WIFI WiFi: 6 Bluetooth version: 5.2 Operating temperature: -40...85°C |
Produkt ist nicht verfügbar |
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XB3-C-G1-UT-001 | DIGI INTERNATIONAL |
![]() Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm Type of communications module: LTE Bluetooth version: BLE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Transmission: 2G; 3G; GNSS; LTE CAT1 Dimensions: 30.48x43.18mm Interface: SPI; UART; USB Supply voltage: 2.8...5.5V DC Kind of connector: U.FL x3 Operating temperature: -40...80°C |
Produkt ist nicht verfügbar |
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XKB2-A2T-WWC | DIGI INTERNATIONAL |
![]() Description: Dev.kit: RF Type of development kit: RF Kit contents: module Digi XBee 802.15.4; prototype board x2; USB cable x2 Interface: SPI; UART |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
|
XB3-24DMPS |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Type of communications module: RF
Kind of antenna: PCB
Kind of module: XBee
Frequency: 2.4GHz
Receiver sensitivity: -103dBm
Transmitter output power: 19dBm
Mounting: SMD
TX/RX supply current: 135/17mA
Operating temperature: -40...85°C
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee
Supply voltage: 2.1...3.6V
Interface: I2C; SPI; UART
Ciphering: AES128; AES256
Category: RF modules
Description: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Type of communications module: RF
Kind of antenna: PCB
Kind of module: XBee
Frequency: 2.4GHz
Receiver sensitivity: -103dBm
Transmitter output power: 19dBm
Mounting: SMD
TX/RX supply current: 135/17mA
Operating temperature: -40...85°C
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee
Supply voltage: 2.1...3.6V
Interface: I2C; SPI; UART
Ciphering: AES128; AES256
Produkt ist nicht verfügbar
Im Einkaufswagen
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XB3-24DMPT |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT
Type of communications module: RF
Kind of antenna: PCB
Kind of module: XBee
Frequency: 2.4GHz
Receiver sensitivity: -103dBm
Transmitter output power: 19dBm
Mounting: THT
TX/RX supply current: 135/17mA
Operating temperature: -40...85°C
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee
Supply voltage: 2.1...3.6V
Interface: I2C; SPI; UART
Ciphering: AES128; AES256
Category: RF modules
Description: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT
Type of communications module: RF
Kind of antenna: PCB
Kind of module: XBee
Frequency: 2.4GHz
Receiver sensitivity: -103dBm
Transmitter output power: 19dBm
Mounting: THT
TX/RX supply current: 135/17mA
Operating temperature: -40...85°C
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee
Supply voltage: 2.1...3.6V
Interface: I2C; SPI; UART
Ciphering: AES128; AES256
Produkt ist nicht verfügbar
Im Einkaufswagen
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CC-ACC-LCDH-10 |
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Hersteller: DIGI INTERNATIONAL
Category: Intelligent displays modules
Description: Display: LCD; 10"
Type of display: LCD
Screen size: 10"
Category: Intelligent displays modules
Description: Display: LCD; 10"
Type of display: LCD
Screen size: 10"
Produkt ist nicht verfügbar
Im Einkaufswagen
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XB3-C-G1-UT-101 |
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Hersteller: DIGI INTERNATIONAL
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm
Type of communications module: LTE
Bluetooth version: BLE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: 2G; 3G; GNSS; LTE CAT1
Dimensions: 30.48x43.18mm
Interface: SPI; UART; USB
Supply voltage: 2.8...5.5V DC
Kind of connector: U.FL x3
Operating temperature: -40...80°C
Kit contents: SIM card (AT&T)
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm
Type of communications module: LTE
Bluetooth version: BLE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: 2G; 3G; GNSS; LTE CAT1
Dimensions: 30.48x43.18mm
Interface: SPI; UART; USB
Supply voltage: 2.8...5.5V DC
Kind of connector: U.FL x3
Operating temperature: -40...80°C
Kit contents: SIM card (AT&T)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
XB3-C-GM1-UT-101 |
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Hersteller: DIGI INTERNATIONAL
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; GNSS,LTE- M/NB-IoT; 24.38x32.94mm
Type of communications module: LTE
Bluetooth version: BLE
Transmission: GNSS; LTE- M/NB-IoT
Dimensions: 24.38x32.94mm
Interface: SPI; UART; USB
Supply voltage: 3.3...4.3V DC
Kind of connector: U.FL x3
Operating temperature: -40...85°C
Kit contents: SIM card (AT&T)
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; GNSS,LTE- M/NB-IoT; 24.38x32.94mm
Type of communications module: LTE
Bluetooth version: BLE
Transmission: GNSS; LTE- M/NB-IoT
Dimensions: 24.38x32.94mm
Interface: SPI; UART; USB
Supply voltage: 3.3...4.3V DC
Kind of connector: U.FL x3
Operating temperature: -40...85°C
Kit contents: SIM card (AT&T)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
XB3-C-GM2-UT-101 |
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Hersteller: DIGI INTERNATIONAL
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; 2G,GNSS,LTE- M/NB-IoT; 24.38x32.94mm
Type of communications module: LTE
Bluetooth version: BLE
Transmission: 2G; GNSS; LTE- M/NB-IoT
Dimensions: 24.38x32.94mm
Interface: SPI; UART; USB
Supply voltage: 3.3...4.3V DC
Kind of connector: U.FL x3
Operating temperature: -40...85°C
Kit contents: SIM card (AT&T)
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; 2G,GNSS,LTE- M/NB-IoT; 24.38x32.94mm
Type of communications module: LTE
Bluetooth version: BLE
Transmission: 2G; GNSS; LTE- M/NB-IoT
Dimensions: 24.38x32.94mm
Interface: SPI; UART; USB
Supply voltage: 3.3...4.3V DC
Kind of connector: U.FL x3
Operating temperature: -40...85°C
Kit contents: SIM card (AT&T)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
CC-WMP255-KIT |
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Hersteller: DIGI INTERNATIONAL
Category: Single board computers
Description: Single-board computer; Cortex A33,Cortex M33; WIFI; STM32MP255C
Kind of architecture: Cortex A33; Cortex M33
Memory: 2GB RAM; 128GB FLASH
Communictions protocol: WIFI
Processor: STM32MP255C
Clock frequency: 1.2GHz
Interface: CAN FD; Ethernet; HDMI; LVDS; microSD; MIPI; MIPI-CSI2; USB 3.0
Kind of connector: HDMI; LVDS; microSD; MIPI-CSI; RJ45; USB 3.0
Manufacturer series: ConnectCore®
Kit contents: antenna; power supply; Single-board computer; USB cable
Kind of memory: DDR4
Bluetooth version: 5.4
WiFi: 2,4GHz; 5GHz; 6
Operating system support: Yocto Linux
Type of minicomputer: Single-board computer
Category: Single board computers
Description: Single-board computer; Cortex A33,Cortex M33; WIFI; STM32MP255C
Kind of architecture: Cortex A33; Cortex M33
Memory: 2GB RAM; 128GB FLASH
Communictions protocol: WIFI
Processor: STM32MP255C
Clock frequency: 1.2GHz
Interface: CAN FD; Ethernet; HDMI; LVDS; microSD; MIPI; MIPI-CSI2; USB 3.0
Kind of connector: HDMI; LVDS; microSD; MIPI-CSI; RJ45; USB 3.0
Manufacturer series: ConnectCore®
Kit contents: antenna; power supply; Single-board computer; USB cable
Kind of memory: DDR4
Bluetooth version: 5.4
WiFi: 2,4GHz; 5GHz; 6
Operating system support: Yocto Linux
Type of minicomputer: Single-board computer
Produkt ist nicht verfügbar
Im Einkaufswagen
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CC-MX-ZC6D-Z1 |
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Hersteller: DIGI INTERNATIONAL
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Type of minicomputer: SOM
Trade name: integrated compute module
Kind of architecture: Cortex A55; Cortex M33
Manufacturer series: ConnectCore®
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Processor: i.MX 93
Memory: 512MB RAM; 8GB FLASH
Kind of memory: LPDDR4
Dimensions: 40x45x3.5mm
Communictions protocol: Ethernet
Operating temperature: -40...85°C
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Type of minicomputer: SOM
Trade name: integrated compute module
Kind of architecture: Cortex A55; Cortex M33
Manufacturer series: ConnectCore®
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Processor: i.MX 93
Memory: 512MB RAM; 8GB FLASH
Kind of memory: LPDDR4
Dimensions: 40x45x3.5mm
Communictions protocol: Ethernet
Operating temperature: -40...85°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
CC-WMX-ZC6D-L1 |
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Hersteller: DIGI INTERNATIONAL
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Type of minicomputer: SOM
Trade name: integrated compute module
Kind of architecture: Cortex A55; Cortex M33
Manufacturer series: ConnectCore®
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Processor: i.MX 93
Memory: 512MB RAM; 8GB FLASH
Kind of memory: LPDDR4
Dimensions: 40x45x3.5mm
Communictions protocol: IEEE 802.11ax; WIFI
WiFi: 6
Bluetooth version: 5.2
Operating temperature: -40...85°C
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Type of minicomputer: SOM
Trade name: integrated compute module
Kind of architecture: Cortex A55; Cortex M33
Manufacturer series: ConnectCore®
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Processor: i.MX 93
Memory: 512MB RAM; 8GB FLASH
Kind of memory: LPDDR4
Dimensions: 40x45x3.5mm
Communictions protocol: IEEE 802.11ax; WIFI
WiFi: 6
Bluetooth version: 5.2
Operating temperature: -40...85°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
CC-MX-YC7D-ZN |
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Hersteller: DIGI INTERNATIONAL
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Type of minicomputer: SOM
Trade name: integrated compute module
Kind of architecture: Cortex A55; Cortex M33
Manufacturer series: ConnectCore®
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Processor: Ethos U-65 microNPU; i.MX 93
Memory: 1GB RAM; 8GB FLASH
Kind of memory: LPDDR4
Dimensions: 40x45x3.5mm
Communictions protocol: Ethernet
Operating temperature: -40...85°C
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Type of minicomputer: SOM
Trade name: integrated compute module
Kind of architecture: Cortex A55; Cortex M33
Manufacturer series: ConnectCore®
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Processor: Ethos U-65 microNPU; i.MX 93
Memory: 1GB RAM; 8GB FLASH
Kind of memory: LPDDR4
Dimensions: 40x45x3.5mm
Communictions protocol: Ethernet
Operating temperature: -40...85°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
CC-WMX-YC7D-KN |
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Hersteller: DIGI INTERNATIONAL
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Type of minicomputer: SOM
Trade name: integrated compute module
Kind of architecture: Cortex A55; Cortex M33
Manufacturer series: ConnectCore®
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Processor: Ethos U-65 microNPU; i.MX 93
Memory: 1GB RAM; 8GB FLASH
Kind of memory: LPDDR4
Dimensions: 40x45x3.5mm
Communictions protocol: IEEE 802.11ax; WIFI
WiFi: 6
Bluetooth version: 5.2
Operating temperature: -40...85°C
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Type of minicomputer: SOM
Trade name: integrated compute module
Kind of architecture: Cortex A55; Cortex M33
Manufacturer series: ConnectCore®
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Processor: Ethos U-65 microNPU; i.MX 93
Memory: 1GB RAM; 8GB FLASH
Kind of memory: LPDDR4
Dimensions: 40x45x3.5mm
Communictions protocol: IEEE 802.11ax; WIFI
WiFi: 6
Bluetooth version: 5.2
Operating temperature: -40...85°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
XB3-C-G1-UT-001 |
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Hersteller: DIGI INTERNATIONAL
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm
Type of communications module: LTE
Bluetooth version: BLE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: 2G; 3G; GNSS; LTE CAT1
Dimensions: 30.48x43.18mm
Interface: SPI; UART; USB
Supply voltage: 2.8...5.5V DC
Kind of connector: U.FL x3
Operating temperature: -40...80°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm
Type of communications module: LTE
Bluetooth version: BLE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: 2G; 3G; GNSS; LTE CAT1
Dimensions: 30.48x43.18mm
Interface: SPI; UART; USB
Supply voltage: 2.8...5.5V DC
Kind of connector: U.FL x3
Operating temperature: -40...80°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
XKB2-A2T-WWC |
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Hersteller: DIGI INTERNATIONAL
Category: Development kits for data transmission
Description: Dev.kit: RF
Type of development kit: RF
Kit contents: module Digi XBee 802.15.4; prototype board x2; USB cable x2
Interface: SPI; UART
Category: Development kits for data transmission
Description: Dev.kit: RF
Type of development kit: RF
Kit contents: module Digi XBee 802.15.4; prototype board x2; USB cable x2
Interface: SPI; UART
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
1+ | 165.51 EUR |