XB3-C-GM2-UT-001 Digi
Hersteller: Digi
Description: RF TXRX MODULE BT/CELL CHIP SMD
Packaging: Bag
Package / Case: 20-DIP Module
Sensitivity: -113dBm
Mounting Type: Through Hole
Memory Size: 1MB Flash, 64kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V ~ 4.3V
Power - Output: 33dBm
Data Rate: 1Mbps
Protocol: Bluetooth, GNSS, LTE
Current - Transmitting: 320mA ~ 410mA
Antenna Type: Integrated, Chip + U.FL
Utilized IC / Part: ME310-WW
RF Family/Standard: Bluetooth, Cellular, Navigation
Serial Interfaces: I2C, JTAG, SPI, UART, USB
Description: RF TXRX MODULE BT/CELL CHIP SMD
Packaging: Bag
Package / Case: 20-DIP Module
Sensitivity: -113dBm
Mounting Type: Through Hole
Memory Size: 1MB Flash, 64kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V ~ 4.3V
Power - Output: 33dBm
Data Rate: 1Mbps
Protocol: Bluetooth, GNSS, LTE
Current - Transmitting: 320mA ~ 410mA
Antenna Type: Integrated, Chip + U.FL
Utilized IC / Part: ME310-WW
RF Family/Standard: Bluetooth, Cellular, Navigation
Serial Interfaces: I2C, JTAG, SPI, UART, USB
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 125.08 EUR |
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Technische Details XB3-C-GM2-UT-001 Digi
Description: RF TXRX MODULE BT/CELL CHIP SMD, Packaging: Bag, Package / Case: 20-DIP Module, Sensitivity: -113dBm, Mounting Type: Through Hole, Memory Size: 1MB Flash, 64kB RAM, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 3.3V ~ 4.3V, Power - Output: 33dBm, Data Rate: 1Mbps, Protocol: Bluetooth, GNSS, LTE, Current - Transmitting: 320mA ~ 410mA, Antenna Type: Integrated, Chip + U.FL, Utilized IC / Part: ME310-WW, RF Family/Standard: Bluetooth, Cellular, Navigation, Serial Interfaces: I2C, JTAG, SPI, UART, USB.
Weitere Produktangebote XB3-C-GM2-UT-001 nach Preis ab 128.74 EUR bis 128.74 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||
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XB3-C-GM2-UT-001 | Hersteller : DIGI | Multiprotocol Modules Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, No SIM |
auf Bestellung 1068 Stücke: Lieferzeit 10-14 Tag (e) |
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XB3-C-GM2-UT-001 | Hersteller : DIGI INTERNATIONAL |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; 2G,GNSS,LTE- M/NB-IoT; 24.38x32.94mm; SPI,UART,USB Supply voltage: 3.3...4.3V DC Type of communications module: LTE Operating temperature: -40...85°C Dimensions: 24.38x32.94mm Communictions protocol: Bluetooth Low Energy Interface: SPI; UART; USB Kind of connector: U.FL x3 Transmission: 2G; GNSS; LTE- M/NB-IoT Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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XB3-C-GM2-UT-001 | Hersteller : DIGI INTERNATIONAL |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; 2G,GNSS,LTE- M/NB-IoT; 24.38x32.94mm; SPI,UART,USB Supply voltage: 3.3...4.3V DC Type of communications module: LTE Operating temperature: -40...85°C Dimensions: 24.38x32.94mm Communictions protocol: Bluetooth Low Energy Interface: SPI; UART; USB Kind of connector: U.FL x3 Transmission: 2G; GNSS; LTE- M/NB-IoT |
Produkt ist nicht verfügbar |