Produkte > DIGI INTERNATIONAL > Alle Produkte des Herstellers DIGI INTERNATIONAL (5125) > Seite 86 nach 86
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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|---|---|---|---|---|---|---|---|
| DC-ME-Y413-LX | DIGI INTERNATIONAL |
Category: Ethernet modulesDescription: Module: Ethernet; uC: NS9210; 36.7x19.05x18.67mm; IEEE 802.3; RJ45 Interface: CAN; Ethernet; GPIO; I2C; SPI; UART Kind of connector: RJ45 Type of communications module: Ethernet Communictions protocol: IEEE 802.3 Microcontroller: NS9210 Operating temperature: -40...75°C Dimensions: 36.7x19.05x18.67mm Memory: 8MB FLASH; 16MB RAM |
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| XB3-24Z8PS | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0 Operating temperature: -40...85°C Mounting: SMD Interface: I2C; SPI; UART Type of communications module: RF Kind of module: XBee Receiver sensitivity: -103dBm TX/RX supply current: 135/17mA Supply voltage: 2.1...3.6V Transmitter output power: 19dBm Frequency: 2.4GHz Ciphering: AES128; AES256 Kind of antenna: PCB |
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| XB3-C-G1-UT-101 | DIGI INTERNATIONAL |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm Type of communications module: LTE Bluetooth version: BLE Transmission: 2G; 3G; GNSS; LTE CAT1 Dimensions: 30.48x43.18mm Interface: SPI; UART; USB Supply voltage: 2.8...5.5V DC Kind of connector: U.FL x3 Operating temperature: -40...80°C Kit contents: SIM card (AT&T) Uplink ransfer rate: 5Mbps Downlink transfer rate: 10Mbps |
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CC-WMP255-KIT | DIGI INTERNATIONAL |
Category: Single board computersDescription: Single-board computer; Cortex A33,Cortex M33; WIFI; STM32MP255C Kind of architecture: Cortex A33; Cortex M33 Memory: 2GB RAM; 128GB FLASH Communictions protocol: WIFI Processor: STM32MP255C Clock frequency: 1.2GHz Interface: CAN FD; Ethernet; HDMI; LVDS; microSD; MIPI; MIPI-CSI2; USB 3.0 Kind of connector: HDMI; LVDS; microSD; MIPI-CSI; RJ45; USB 3.0 Manufacturer series: ConnectCore® Kit contents: antenna; power supply; Single-board computer; USB cable Kind of memory: DDR4 Bluetooth version: 5.4 WiFi: 2,4GHz; 5GHz; 6 Operating system support: Yocto Linux Type of minicomputer: Single-board computer |
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| CC-MX-YC7D-ZN | DIGI INTERNATIONAL |
Category: Single board computersDescription: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4 Operating temperature: -40...85°C Kind of memory: LPDDR4 Type of minicomputer: SOM Dimensions: 40x45x3.5mm Memory: 1GB RAM; 8GB FLASH Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB Manufacturer series: ConnectCore® Kind of architecture: Cortex A55; Cortex M33 Communictions protocol: Ethernet Processor: Ethos U-65 microNPU; i.MX 93 Trade name: integrated compute module |
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| CC-WMX-YC7D-KN | DIGI INTERNATIONAL |
Category: Single board computersDescription: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4 Operating temperature: -40...85°C Kind of memory: LPDDR4 Type of minicomputer: SOM Dimensions: 40x45x3.5mm Memory: 1GB RAM; 8GB FLASH Bluetooth version: 5.2 WiFi: 6 Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB Manufacturer series: ConnectCore® Kind of architecture: Cortex A55; Cortex M33 Communictions protocol: IEEE 802.11ax; WIFI Processor: Ethos U-65 microNPU; i.MX 93 Trade name: integrated compute module |
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| XB3-C-G1-UT-001 | DIGI INTERNATIONAL |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm Type of communications module: LTE Bluetooth version: BLE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Transmission: 2G; 3G; GNSS; LTE CAT1 Dimensions: 30.48x43.18mm Interface: SPI; UART; USB Supply voltage: 2.8...5.5V DC Kind of connector: U.FL x3 Operating temperature: -40...80°C |
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|
XKB2-A2T-WWC | DIGI INTERNATIONAL |
Category: Development kits for data transmissionDescription: Dev.kit: RF Interface: SPI; UART Kit contents: module Digi XBee 802.15.4; prototype board x2; USB cable x2 Type of development kit: RF |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
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XK3-Z8S-WZM | DIGI INTERNATIONAL |
Category: Development kits for data transmissionDescription: Dev.kit: evaluation; Comp: EFR32MG; Rec.sensit: -103dBm; 2.4GHz Type of development kit: evaluation Kit contents: antenna x3; module XBEE® ZigBee SMT x3; prototype board x3; USB cable x3 Components: EFR32MG Communication with PC: USB Interface: GPIO; I2C; SPI; UART; USB Kind of connector: pin strips; U.FL; USB B micro Receiver sensitivity: -103dBm Transmitter output power: 8dBm Frequency: 2.4GHz Supply voltage: 2.1...3.6V DC Operating temperature: -40...85°C Transmission: ISM 2.4GHz |
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| CC-ACC-LCDH-10 | DIGI INTERNATIONAL |
Category: Intelligent displays modulesDescription: Display: LCD; 10" Type of display: LCD Screen size: 10" |
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| XB3-C-G1-UT-102 | DIGI INTERNATIONAL |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm Type of communications module: LTE Bluetooth version: BLE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Transmission: 2G; 3G; GNSS; LTE CAT1 Dimensions: 30.48x43.18mm Interface: SPI; UART; USB Supply voltage: 2.8...5.5V DC Kind of connector: U.FL x3 Operating temperature: -40...80°C Kit contents: SIM card (Verizon) |
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XB3-24Z8UT-J | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; u.FL; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 8dBm; THT Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0 Operating temperature: -40...85°C Mounting: THT Interface: I2C; SPI; UART Type of communications module: RF Kind of module: XBee Receiver sensitivity: -103dBm TX/RX supply current: 40/17mA Supply voltage: 2.1...3.6V Transmitter output power: 8dBm Frequency: 2.4GHz Ciphering: AES128; AES256 Kind of antenna: u.FL |
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| XB3-24Z8ST | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; SMA; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0 Operating temperature: -40...85°C Mounting: THT Interface: I2C; SPI; UART Type of communications module: RF Kind of module: XBee Receiver sensitivity: -103dBm TX/RX supply current: 135/17mA Supply voltage: 2.1...3.6V Transmitter output power: 19dBm Frequency: 2.4GHz Ciphering: AES128; AES256 Kind of antenna: SMA |
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| XB3-24Z8PT | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0 Operating temperature: -40...85°C Mounting: THT Interface: I2C; SPI; UART Type of communications module: RF Kind of module: XBee Receiver sensitivity: -103dBm TX/RX supply current: 135/17mA Supply voltage: 2.1...3.6V Transmitter output power: 19dBm Frequency: 2.4GHz Ciphering: AES128; AES256 Kind of antenna: PCB |
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| XB3-24Z8RS | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD Mounting: SMD Interface: I2C; SPI; UART Kind of module: XBee Type of communications module: RF Kind of antenna: RF PAD Receiver sensitivity: -103dBm Operating temperature: -40...85°C TX/RX supply current: 135/17mA Supply voltage: 2.1...3.6V Transmitter output power: 19dBm Frequency: 2.4GHz Ciphering: AES128; AES256 Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0 |
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| XB3-24Z8US | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; u.FL; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0 Operating temperature: -40...85°C Mounting: SMD Interface: I2C; SPI; UART Type of communications module: RF Kind of module: XBee Receiver sensitivity: -103dBm TX/RX supply current: 135/17mA Supply voltage: 2.1...3.6V Transmitter output power: 19dBm Frequency: 2.4GHz Ciphering: AES128; AES256 Kind of antenna: u.FL |
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| XB3-24Z8UT | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; u.FL; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0 Operating temperature: -40...85°C Mounting: THT Interface: I2C; SPI; UART Type of communications module: RF Kind of module: XBee Receiver sensitivity: -103dBm TX/RX supply current: 135/17mA Supply voltage: 2.1...3.6V Transmitter output power: 19dBm Frequency: 2.4GHz Ciphering: AES128; AES256 Kind of antenna: u.FL |
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XK3-C-N1-T-EB | DIGI INTERNATIONAL |
Category: Development kits for data transmissionDescription: Dev.kit: evaluation; Bluetooth: BLE; Comp: SARA-R410M-02B Type of development kit: evaluation Bluetooth version: BLE Kit contents: antenna; module; prototype board; SIM LTE-M card; USB cable Components: SARA-R410M-02B Interface: ADC; GPIO; I2C; SPI; UART; USB Kind of connector: pin strips; U.FL; USB B micro Receiver sensitivity: -105dBm Transmitter output power: 23dBm Supply voltage: 3.3...4.3V DC Operating temperature: -40...85°C Transmission: LTE- M/NB-IoT Dimensions: 24.38x32.94mm |
auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) |
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| XB3-C-GM1-UT-101 | DIGI INTERNATIONAL |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Bluetooth: BLE; GNSS,LTE- M/NB-IoT; 24.38x32.94mm Type of communications module: LTE Bluetooth version: BLE Transmission: GNSS; LTE- M/NB-IoT Dimensions: 24.38x32.94mm Interface: SPI; UART; USB Supply voltage: 3.3...4.3V DC Kind of connector: U.FL x3 Operating temperature: -40...85°C Kit contents: SIM card (AT&T) |
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| XB3-C-GM2-UT-101 | DIGI INTERNATIONAL |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Bluetooth: BLE; 2G,GNSS,LTE- M/NB-IoT; 24.38x32.94mm Type of communications module: LTE Bluetooth version: BLE Transmission: 2G; GNSS; LTE- M/NB-IoT Dimensions: 24.38x32.94mm Interface: SPI; UART; USB Supply voltage: 3.3...4.3V DC Kind of connector: U.FL x3 Operating temperature: -40...85°C Kit contents: SIM card (AT&T) |
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XK3-C-G1-UT-W | DIGI INTERNATIONAL |
Category: Development kits for data transmissionDescription: Dev.kit: evaluation Type of development kit: evaluation Interface: SPI; UART; USB |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
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XBRR-24Z8RM-J | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 8dBm; SMD Mounting: SMD Interface: I2C; SPI; UART Kind of module: XBee Type of communications module: RF Kind of antenna: RF PAD Receiver sensitivity: -103dBm Operating temperature: -40...85°C TX/RX supply current: 32/14mA Supply voltage: 1.71...3.8V Transmitter output power: 8dBm Frequency: 2.4GHz Ciphering: AES128; AES256 Bluetooth version: BLE Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee |
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| XB-8XR-DMRM-001 | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; RF PAD; XBee; 863÷870MHz; GPIO,SPI,UART; -107dBm; 13dBm Mounting: SMD Interface: GPIO; SPI; UART Kind of module: XBee Type of communications module: RF Kind of antenna: RF PAD Receiver sensitivity: -107dBm Operating temperature: -40...85°C TX/RX supply current: 76/26mA Supply voltage: 1.8...3.6V Transmitter output power: 13dBm Frequency: 863...870MHz Ciphering: AES128 Communictions protocol: DigiMesh |
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| XB3-24ARS | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD Mounting: SMD Interface: I2C; SPI; UART Kind of module: XBee Type of communications module: RF Kind of antenna: RF PAD Receiver sensitivity: -103dBm Operating temperature: -40...85°C TX/RX supply current: 135/17mA Supply voltage: 2.1...3.6V Transmitter output power: 19dBm Frequency: 2.4GHz Ciphering: AES128; AES256 Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee |
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| XB3-24DMRS | DIGI INTERNATIONAL |
Category: RF modulesDescription: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD Mounting: SMD Interface: I2C; SPI; UART Kind of module: XBee Type of communications module: RF Kind of antenna: RF PAD Receiver sensitivity: -103dBm Operating temperature: -40...85°C TX/RX supply current: 135/17mA Supply voltage: 2.1...3.6V Transmitter output power: 19dBm Frequency: 2.4GHz Ciphering: AES128; AES256 Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee |
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| DC-ME-Y413-LX |
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Hersteller: DIGI INTERNATIONAL
Category: Ethernet modules
Description: Module: Ethernet; uC: NS9210; 36.7x19.05x18.67mm; IEEE 802.3; RJ45
Interface: CAN; Ethernet; GPIO; I2C; SPI; UART
Kind of connector: RJ45
Type of communications module: Ethernet
Communictions protocol: IEEE 802.3
Microcontroller: NS9210
Operating temperature: -40...75°C
Dimensions: 36.7x19.05x18.67mm
Memory: 8MB FLASH; 16MB RAM
Category: Ethernet modules
Description: Module: Ethernet; uC: NS9210; 36.7x19.05x18.67mm; IEEE 802.3; RJ45
Interface: CAN; Ethernet; GPIO; I2C; SPI; UART
Kind of connector: RJ45
Type of communications module: Ethernet
Communictions protocol: IEEE 802.3
Microcontroller: NS9210
Operating temperature: -40...75°C
Dimensions: 36.7x19.05x18.67mm
Memory: 8MB FLASH; 16MB RAM
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| XB3-24Z8PS |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: SMD
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: PCB
Category: RF modules
Description: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: SMD
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: PCB
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| XB3-C-G1-UT-101 |
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Hersteller: DIGI INTERNATIONAL
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm
Type of communications module: LTE
Bluetooth version: BLE
Transmission: 2G; 3G; GNSS; LTE CAT1
Dimensions: 30.48x43.18mm
Interface: SPI; UART; USB
Supply voltage: 2.8...5.5V DC
Kind of connector: U.FL x3
Operating temperature: -40...80°C
Kit contents: SIM card (AT&T)
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm
Type of communications module: LTE
Bluetooth version: BLE
Transmission: 2G; 3G; GNSS; LTE CAT1
Dimensions: 30.48x43.18mm
Interface: SPI; UART; USB
Supply voltage: 2.8...5.5V DC
Kind of connector: U.FL x3
Operating temperature: -40...80°C
Kit contents: SIM card (AT&T)
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
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| CC-WMP255-KIT |
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Hersteller: DIGI INTERNATIONAL
Category: Single board computers
Description: Single-board computer; Cortex A33,Cortex M33; WIFI; STM32MP255C
Kind of architecture: Cortex A33; Cortex M33
Memory: 2GB RAM; 128GB FLASH
Communictions protocol: WIFI
Processor: STM32MP255C
Clock frequency: 1.2GHz
Interface: CAN FD; Ethernet; HDMI; LVDS; microSD; MIPI; MIPI-CSI2; USB 3.0
Kind of connector: HDMI; LVDS; microSD; MIPI-CSI; RJ45; USB 3.0
Manufacturer series: ConnectCore®
Kit contents: antenna; power supply; Single-board computer; USB cable
Kind of memory: DDR4
Bluetooth version: 5.4
WiFi: 2,4GHz; 5GHz; 6
Operating system support: Yocto Linux
Type of minicomputer: Single-board computer
Category: Single board computers
Description: Single-board computer; Cortex A33,Cortex M33; WIFI; STM32MP255C
Kind of architecture: Cortex A33; Cortex M33
Memory: 2GB RAM; 128GB FLASH
Communictions protocol: WIFI
Processor: STM32MP255C
Clock frequency: 1.2GHz
Interface: CAN FD; Ethernet; HDMI; LVDS; microSD; MIPI; MIPI-CSI2; USB 3.0
Kind of connector: HDMI; LVDS; microSD; MIPI-CSI; RJ45; USB 3.0
Manufacturer series: ConnectCore®
Kit contents: antenna; power supply; Single-board computer; USB cable
Kind of memory: DDR4
Bluetooth version: 5.4
WiFi: 2,4GHz; 5GHz; 6
Operating system support: Yocto Linux
Type of minicomputer: Single-board computer
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| CC-MX-YC7D-ZN |
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Hersteller: DIGI INTERNATIONAL
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Operating temperature: -40...85°C
Kind of memory: LPDDR4
Type of minicomputer: SOM
Dimensions: 40x45x3.5mm
Memory: 1GB RAM; 8GB FLASH
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Manufacturer series: ConnectCore®
Kind of architecture: Cortex A55; Cortex M33
Communictions protocol: Ethernet
Processor: Ethos U-65 microNPU; i.MX 93
Trade name: integrated compute module
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Operating temperature: -40...85°C
Kind of memory: LPDDR4
Type of minicomputer: SOM
Dimensions: 40x45x3.5mm
Memory: 1GB RAM; 8GB FLASH
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Manufacturer series: ConnectCore®
Kind of architecture: Cortex A55; Cortex M33
Communictions protocol: Ethernet
Processor: Ethos U-65 microNPU; i.MX 93
Trade name: integrated compute module
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| CC-WMX-YC7D-KN |
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Hersteller: DIGI INTERNATIONAL
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Operating temperature: -40...85°C
Kind of memory: LPDDR4
Type of minicomputer: SOM
Dimensions: 40x45x3.5mm
Memory: 1GB RAM; 8GB FLASH
Bluetooth version: 5.2
WiFi: 6
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Manufacturer series: ConnectCore®
Kind of architecture: Cortex A55; Cortex M33
Communictions protocol: IEEE 802.11ax; WIFI
Processor: Ethos U-65 microNPU; i.MX 93
Trade name: integrated compute module
Category: Single board computers
Description: SOM; integrated compute module; Cortex A55,Cortex M33; LPDDR4
Operating temperature: -40...85°C
Kind of memory: LPDDR4
Type of minicomputer: SOM
Dimensions: 40x45x3.5mm
Memory: 1GB RAM; 8GB FLASH
Bluetooth version: 5.2
WiFi: 6
Interface: 8/18bit parallel; ADC; CAN FD; DSP; GPIO; I2C; I2S; LVDS; MIPI-CSI; MIPI-DSI; PDM; PWM; SAI; S/PDIF; SPI; UART; USB
Manufacturer series: ConnectCore®
Kind of architecture: Cortex A55; Cortex M33
Communictions protocol: IEEE 802.11ax; WIFI
Processor: Ethos U-65 microNPU; i.MX 93
Trade name: integrated compute module
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| XB3-C-G1-UT-001 |
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Hersteller: DIGI INTERNATIONAL
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm
Type of communications module: LTE
Bluetooth version: BLE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: 2G; 3G; GNSS; LTE CAT1
Dimensions: 30.48x43.18mm
Interface: SPI; UART; USB
Supply voltage: 2.8...5.5V DC
Kind of connector: U.FL x3
Operating temperature: -40...80°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm
Type of communications module: LTE
Bluetooth version: BLE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: 2G; 3G; GNSS; LTE CAT1
Dimensions: 30.48x43.18mm
Interface: SPI; UART; USB
Supply voltage: 2.8...5.5V DC
Kind of connector: U.FL x3
Operating temperature: -40...80°C
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| XKB2-A2T-WWC |
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Hersteller: DIGI INTERNATIONAL
Category: Development kits for data transmission
Description: Dev.kit: RF
Interface: SPI; UART
Kit contents: module Digi XBee 802.15.4; prototype board x2; USB cable x2
Type of development kit: RF
Category: Development kits for data transmission
Description: Dev.kit: RF
Interface: SPI; UART
Kit contents: module Digi XBee 802.15.4; prototype board x2; USB cable x2
Type of development kit: RF
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 165.42 EUR |
| XK3-Z8S-WZM |
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Hersteller: DIGI INTERNATIONAL
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Comp: EFR32MG; Rec.sensit: -103dBm; 2.4GHz
Type of development kit: evaluation
Kit contents: antenna x3; module XBEE® ZigBee SMT x3; prototype board x3; USB cable x3
Components: EFR32MG
Communication with PC: USB
Interface: GPIO; I2C; SPI; UART; USB
Kind of connector: pin strips; U.FL; USB B micro
Receiver sensitivity: -103dBm
Transmitter output power: 8dBm
Frequency: 2.4GHz
Supply voltage: 2.1...3.6V DC
Operating temperature: -40...85°C
Transmission: ISM 2.4GHz
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Comp: EFR32MG; Rec.sensit: -103dBm; 2.4GHz
Type of development kit: evaluation
Kit contents: antenna x3; module XBEE® ZigBee SMT x3; prototype board x3; USB cable x3
Components: EFR32MG
Communication with PC: USB
Interface: GPIO; I2C; SPI; UART; USB
Kind of connector: pin strips; U.FL; USB B micro
Receiver sensitivity: -103dBm
Transmitter output power: 8dBm
Frequency: 2.4GHz
Supply voltage: 2.1...3.6V DC
Operating temperature: -40...85°C
Transmission: ISM 2.4GHz
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| CC-ACC-LCDH-10 |
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Hersteller: DIGI INTERNATIONAL
Category: Intelligent displays modules
Description: Display: LCD; 10"
Type of display: LCD
Screen size: 10"
Category: Intelligent displays modules
Description: Display: LCD; 10"
Type of display: LCD
Screen size: 10"
Produkt ist nicht verfügbar
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| XB3-C-G1-UT-102 |
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Hersteller: DIGI INTERNATIONAL
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm
Type of communications module: LTE
Bluetooth version: BLE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: 2G; 3G; GNSS; LTE CAT1
Dimensions: 30.48x43.18mm
Interface: SPI; UART; USB
Supply voltage: 2.8...5.5V DC
Kind of connector: U.FL x3
Operating temperature: -40...80°C
Kit contents: SIM card (Verizon)
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; Down: 10Mbps; Up: 5Mbps; 30.48x43.18mm
Type of communications module: LTE
Bluetooth version: BLE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: 2G; 3G; GNSS; LTE CAT1
Dimensions: 30.48x43.18mm
Interface: SPI; UART; USB
Supply voltage: 2.8...5.5V DC
Kind of connector: U.FL x3
Operating temperature: -40...80°C
Kit contents: SIM card (Verizon)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XB3-24Z8UT-J |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; u.FL; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 8dBm; THT
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: THT
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 40/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 8dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: u.FL
Category: RF modules
Description: Module: RF; u.FL; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 8dBm; THT
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: THT
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 40/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 8dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: u.FL
Produkt ist nicht verfügbar
Im Einkaufswagen
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| XB3-24Z8ST |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; SMA; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: THT
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: SMA
Category: RF modules
Description: Module: RF; SMA; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: THT
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: SMA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XB3-24Z8PT |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: THT
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: PCB
Category: RF modules
Description: Module: RF; PCB; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: THT
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: PCB
Produkt ist nicht verfügbar
Im Einkaufswagen
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| XB3-24Z8RS |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Mounting: SMD
Interface: I2C; SPI; UART
Kind of module: XBee
Type of communications module: RF
Kind of antenna: RF PAD
Receiver sensitivity: -103dBm
Operating temperature: -40...85°C
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Category: RF modules
Description: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Mounting: SMD
Interface: I2C; SPI; UART
Kind of module: XBee
Type of communications module: RF
Kind of antenna: RF PAD
Receiver sensitivity: -103dBm
Operating temperature: -40...85°C
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XB3-24Z8US |
![]() |
Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; u.FL; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: SMD
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: u.FL
Category: RF modules
Description: Module: RF; u.FL; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: SMD
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: u.FL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XB3-24Z8UT |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; u.FL; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: THT
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: u.FL
Category: RF modules
Description: Module: RF; u.FL; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; THT
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee® 3.0
Operating temperature: -40...85°C
Mounting: THT
Interface: I2C; SPI; UART
Type of communications module: RF
Kind of module: XBee
Receiver sensitivity: -103dBm
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Kind of antenna: u.FL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XK3-C-N1-T-EB |
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Hersteller: DIGI INTERNATIONAL
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: BLE; Comp: SARA-R410M-02B
Type of development kit: evaluation
Bluetooth version: BLE
Kit contents: antenna; module; prototype board; SIM LTE-M card; USB cable
Components: SARA-R410M-02B
Interface: ADC; GPIO; I2C; SPI; UART; USB
Kind of connector: pin strips; U.FL; USB B micro
Receiver sensitivity: -105dBm
Transmitter output power: 23dBm
Supply voltage: 3.3...4.3V DC
Operating temperature: -40...85°C
Transmission: LTE- M/NB-IoT
Dimensions: 24.38x32.94mm
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: BLE; Comp: SARA-R410M-02B
Type of development kit: evaluation
Bluetooth version: BLE
Kit contents: antenna; module; prototype board; SIM LTE-M card; USB cable
Components: SARA-R410M-02B
Interface: ADC; GPIO; I2C; SPI; UART; USB
Kind of connector: pin strips; U.FL; USB B micro
Receiver sensitivity: -105dBm
Transmitter output power: 23dBm
Supply voltage: 3.3...4.3V DC
Operating temperature: -40...85°C
Transmission: LTE- M/NB-IoT
Dimensions: 24.38x32.94mm
auf Bestellung 5 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 243.11 EUR |
| XB3-C-GM1-UT-101 |
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Hersteller: DIGI INTERNATIONAL
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; GNSS,LTE- M/NB-IoT; 24.38x32.94mm
Type of communications module: LTE
Bluetooth version: BLE
Transmission: GNSS; LTE- M/NB-IoT
Dimensions: 24.38x32.94mm
Interface: SPI; UART; USB
Supply voltage: 3.3...4.3V DC
Kind of connector: U.FL x3
Operating temperature: -40...85°C
Kit contents: SIM card (AT&T)
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; GNSS,LTE- M/NB-IoT; 24.38x32.94mm
Type of communications module: LTE
Bluetooth version: BLE
Transmission: GNSS; LTE- M/NB-IoT
Dimensions: 24.38x32.94mm
Interface: SPI; UART; USB
Supply voltage: 3.3...4.3V DC
Kind of connector: U.FL x3
Operating temperature: -40...85°C
Kit contents: SIM card (AT&T)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XB3-C-GM2-UT-101 |
![]() |
Hersteller: DIGI INTERNATIONAL
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; 2G,GNSS,LTE- M/NB-IoT; 24.38x32.94mm
Type of communications module: LTE
Bluetooth version: BLE
Transmission: 2G; GNSS; LTE- M/NB-IoT
Dimensions: 24.38x32.94mm
Interface: SPI; UART; USB
Supply voltage: 3.3...4.3V DC
Kind of connector: U.FL x3
Operating temperature: -40...85°C
Kit contents: SIM card (AT&T)
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: BLE; 2G,GNSS,LTE- M/NB-IoT; 24.38x32.94mm
Type of communications module: LTE
Bluetooth version: BLE
Transmission: 2G; GNSS; LTE- M/NB-IoT
Dimensions: 24.38x32.94mm
Interface: SPI; UART; USB
Supply voltage: 3.3...4.3V DC
Kind of connector: U.FL x3
Operating temperature: -40...85°C
Kit contents: SIM card (AT&T)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XK3-C-G1-UT-W |
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Hersteller: DIGI INTERNATIONAL
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Interface: SPI; UART; USB
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Interface: SPI; UART; USB
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 364.72 EUR |
| XBRR-24Z8RM-J |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 8dBm; SMD
Mounting: SMD
Interface: I2C; SPI; UART
Kind of module: XBee
Type of communications module: RF
Kind of antenna: RF PAD
Receiver sensitivity: -103dBm
Operating temperature: -40...85°C
TX/RX supply current: 32/14mA
Supply voltage: 1.71...3.8V
Transmitter output power: 8dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Bluetooth version: BLE
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee
Category: RF modules
Description: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 8dBm; SMD
Mounting: SMD
Interface: I2C; SPI; UART
Kind of module: XBee
Type of communications module: RF
Kind of antenna: RF PAD
Receiver sensitivity: -103dBm
Operating temperature: -40...85°C
TX/RX supply current: 32/14mA
Supply voltage: 1.71...3.8V
Transmitter output power: 8dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Bluetooth version: BLE
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XB-8XR-DMRM-001 |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; RF PAD; XBee; 863÷870MHz; GPIO,SPI,UART; -107dBm; 13dBm
Mounting: SMD
Interface: GPIO; SPI; UART
Kind of module: XBee
Type of communications module: RF
Kind of antenna: RF PAD
Receiver sensitivity: -107dBm
Operating temperature: -40...85°C
TX/RX supply current: 76/26mA
Supply voltage: 1.8...3.6V
Transmitter output power: 13dBm
Frequency: 863...870MHz
Ciphering: AES128
Communictions protocol: DigiMesh
Category: RF modules
Description: Module: RF; RF PAD; XBee; 863÷870MHz; GPIO,SPI,UART; -107dBm; 13dBm
Mounting: SMD
Interface: GPIO; SPI; UART
Kind of module: XBee
Type of communications module: RF
Kind of antenna: RF PAD
Receiver sensitivity: -107dBm
Operating temperature: -40...85°C
TX/RX supply current: 76/26mA
Supply voltage: 1.8...3.6V
Transmitter output power: 13dBm
Frequency: 863...870MHz
Ciphering: AES128
Communictions protocol: DigiMesh
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XB3-24ARS |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Mounting: SMD
Interface: I2C; SPI; UART
Kind of module: XBee
Type of communications module: RF
Kind of antenna: RF PAD
Receiver sensitivity: -103dBm
Operating temperature: -40...85°C
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee
Category: RF modules
Description: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Mounting: SMD
Interface: I2C; SPI; UART
Kind of module: XBee
Type of communications module: RF
Kind of antenna: RF PAD
Receiver sensitivity: -103dBm
Operating temperature: -40...85°C
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XB3-24DMRS |
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Hersteller: DIGI INTERNATIONAL
Category: RF modules
Description: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Mounting: SMD
Interface: I2C; SPI; UART
Kind of module: XBee
Type of communications module: RF
Kind of antenna: RF PAD
Receiver sensitivity: -103dBm
Operating temperature: -40...85°C
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee
Category: RF modules
Description: Module: RF; RF PAD; XBee; 2.4GHz; I2C,SPI,UART; -103dBm; 19dBm; SMD
Mounting: SMD
Interface: I2C; SPI; UART
Kind of module: XBee
Type of communications module: RF
Kind of antenna: RF PAD
Receiver sensitivity: -103dBm
Operating temperature: -40...85°C
TX/RX supply current: 135/17mA
Supply voltage: 2.1...3.6V
Transmitter output power: 19dBm
Frequency: 2.4GHz
Ciphering: AES128; AES256
Communictions protocol: DigiMesh; IEEE 802.15.4; ZigBee
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH







