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GD25LD40EKIGR GigaDevice Semiconductor (HK) Limited DS-00849-GD25LD20E-Rev1.2.pdf Description: IC FLASH 4MBIT SPI/DUAL 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (1.5x1.5)
Write Cycle Time - Word, Page: 100µs, 6ms
Memory Interface: SPI - Dual I/O
Access Time: 12 ns
Memory Organization: 512K x 8
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GD25LD40ETIGR GigaDevice Semiconductor (HK) Limited DS-00849-GD25LD20E-Rev1.2.pdf Description: IC FLASH 4MBIT SPI/DUAL 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 100µs, 6ms
Memory Interface: SPI - Dual I/O
Access Time: 12 ns
Memory Organization: 512K x 8
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GD25LD80CEIGR GD25LD80CEIGR GigaDevice Semiconductor (HK) Limited gd25ld80c Description: IC FLSH 8MBIT SPI/DUAL I/O 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (2x3)
Write Cycle Time - Word, Page: 60µs, 6ms
Memory Interface: SPI - Dual I/O
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
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GD25LD80CKIGR GigaDevice Semiconductor (HK) Limited DS-00390-GD25LD80C-Rev1.2.pdf Description: IC FLASH 8MBIT SPI/DUAL 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (1.5x1.5)
Write Cycle Time - Word, Page: 97µs, 6ms
Memory Interface: SPI - Dual I/O
Access Time: 12 ns
Memory Organization: 1M x 8
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GD25LD80CSIGR GD25LD80CSIGR GigaDevice Semiconductor (HK) Limited gd25ld80c Description: IC FLASH 8MBIT SPI/DUAL I/O 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 60µs, 6ms
Memory Interface: SPI - Dual I/O
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
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GD25LD80CTIGR GD25LD80CTIGR GigaDevice Semiconductor (HK) Limited gd25ld80c Description: IC FLASH 8MBIT SPI/DUAL I/O 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 60µs, 6ms
Memory Interface: SPI - Dual I/O
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
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GD25LD80ETIGY GigaDevice Semiconductor (HK) Limited DS-00900-GD25LD80E-Rev1.0.pdf Description: IC FLASH 8MBIT SPI/DUAL 8SOP
Packaging: Tray
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 100µs, 6ms
Memory Interface: SPI - Dual I/O
Access Time: 12 ns
Memory Organization: 1M x 8
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GD25LE128ESIGR GD25LE128ESIGR GigaDevice Semiconductor (HK) Limited 2023__Gde.pdf Description: IC FLASH 128MBIT SPI/QUAD 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 16M x 8
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GD25LE128ESIGR GD25LE128ESIGR GigaDevice Semiconductor (HK) Limited 2023__Gde.pdf Description: IC FLASH 128MBIT SPI/QUAD 8SOP
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 16M x 8
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500+3.31 EUR
1000+3.22 EUR
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GD25LE128EXHEGR GigaDevice Semiconductor (HK) Limited Description: IC FLASH 128MBIT SPI/QUAD 8USON
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O, QPI
Write Cycle Time - Word, Page: 100µs, 4ms
Supplier Device Package: 8-FO-USON8 (3x3)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-XDFN Exposed Pad
Packaging: Tape & Reel (TR)
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GD25LE128EXHIGR GigaDevice Semiconductor (HK) Limited DS-00600-GD25LE128E-Rev1.5.pdf Description: SERIAL NOR FLASH
Packaging: Tape & Reel (TR)
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O, QPI
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 8-FO-USON8 (3x3)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-XDFN Exposed Pad
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GD25LE128EXHIGR GigaDevice Semiconductor (HK) Limited DS-00600-GD25LE128E-Rev1.5.pdf Description: SERIAL NOR FLASH
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O, QPI
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 8-FO-USON8 (3x3)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-XDFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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GD25LE32DLIGR GigaDevice Semiconductor (HK) Limited 2023__Gde.pdf Description: IC FLASH 32MBIT SPI/QUAD 21WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 21-XFBGA, WLSCP
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 21-WLCSP
Write Cycle Time - Word, Page: 2.4ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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GD25LE32E3IGR GigaDevice Semiconductor (HK) Limited DS-00560-GD25LE32E-Rev1.5.pdf Description: IC FLASH 32MBIT SPI/QUAD 10WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 10-XFBGA, WLCSP
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 10-WLCSP
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
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GD25LE32EEEGR GD25LE32EEEGR GigaDevice Semiconductor (HK) Limited DS-00560-GD25LE32E-Rev1.5.pdf Description: IC FLASH 32MBIT SPI/QUAD 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (3x2)
Write Cycle Time - Word, Page: 100µs, 4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
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GD25LE32EEIGR GD25LE32EEIGR GigaDevice Semiconductor (HK) Limited DS-00560-GD25LE32E-Rev1.5.pdf Description: IC FLASH 32MBIT SPI/QUAD 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (3x2)
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
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GD25LE32ELIGR GigaDevice Semiconductor (HK) Limited DS-00560-GD25LE32E-Rev1.5.pdf Description: IC FLASH 32MBIT SPI/QUAD 10WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 10-XFBGA, WLCSP
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 10-WLCSP
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
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GD25LE32ENIGR GigaDevice Semiconductor (HK) Limited DS-00560-GD25LE32E-Rev1.5.pdf Description: IC FLASH 32MBIT SPI/QUAD 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (3x4)
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
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GD25LE32EQIGR GD25LE32EQIGR GigaDevice Semiconductor (HK) Limited DS-00560-GD25LE32E-Rev1.5.pdf Description: IC FLASH 32MBIT SPI/QUAD 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (4x4)
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
Produkt ist nicht verfügbar
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GD25LE32ESIGR GD25LE32ESIGR GigaDevice Semiconductor (HK) Limited 2023__Gde.pdf Description: IC FLASH 32MBIT SPI/QUAD 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
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GD25LE32ESIGR GD25LE32ESIGR GigaDevice Semiconductor (HK) Limited 2023__Gde.pdf Description: IC FLASH 32MBIT SPI/QUAD 8SOP
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
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GD25LE64ELIGR GigaDevice Semiconductor (HK) Limited DS-00567-GD25LE64E-Rev1.4.pdf Description: IC FLASH 64MBIT SPI/QUAD 16WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-XFBGA, WLCSP
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-WLCSP
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 8M x 8
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GD25LE64ELIGR GigaDevice Semiconductor (HK) Limited DS-00567-GD25LE64E-Rev1.4.pdf Description: IC FLASH 64MBIT SPI/QUAD 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-XFBGA, WLCSP
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-WLCSP
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 8M x 8
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GD25LE64ENIGR GigaDevice Semiconductor (HK) Limited DS-00567-GD25LE64E-Rev1.4.pdf Description: IC FLASH 64MBIT SPI/QUAD 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (3x4)
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 8M x 8
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GD25LF128EXHEGR GigaDevice Semiconductor (HK) Limited Description: IC FLASH 128MBIT SPI/QUAD 8USON
Memory Organization: 16M x 8
Access Time: 5.5 ns
Memory Interface: SPI - Quad I/O, QPI, DTR
Write Cycle Time - Word, Page: 100µs, 4ms
Supplier Device Package: 8-FO-USON8 (3x3)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-XDFN Exposed Pad
Packaging: Tape & Reel (TR)
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GD25LF255ELIGR GigaDevice Semiconductor (HK) Limited DS-00620-GD25LF255E-Rev1.1.pdf Description: IC FLASH 256MBIT SPI/QUAD WLCSP
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI, DTR
Supplier Device Package: 32-WLCSP
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 32-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
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GD25LF255ESIGR GD25LF255ESIGR GigaDevice Semiconductor (HK) Limited Description: IC FLASH 256MBIT SPI/QUAD 8SOP
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI, DTR
Supplier Device Package: 8-SOP
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
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GD25LF255EWIGR GD25LF255EWIGR GigaDevice Semiconductor (HK) Limited DS-00620-GD25LF255E-Rev1.1.pdf Description: IC FLASH 256MBIT SPI/QUAD 8WSON
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI, DTR
Supplier Device Package: 8-WSON (5x6)
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tape & Reel (TR)
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GD25LF255EWIGY GD25LF255EWIGY GigaDevice Semiconductor (HK) Limited DS-00620-GD25LF255E-Rev1.1.pdf Description: IC FLASH 256MBIT SPI/QUAD 8WSON
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tray
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI, DTR
Supplier Device Package: 8-WSON (5x6)
Memory Format: FLASH
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GD25LF80EEEGR GigaDevice Semiconductor (HK) Limited Description: NOR FLASH
Memory Organization: 1M x 8
Access Time: 5.5 ns
Memory Interface: SPI - Quad I/O, QPI, DTR
Write Cycle Time - Word, Page: 100µs, 4ms
Supplier Device Package: 8-USON (3x2)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Mbit
Mounting Type: Surface Mount
Package / Case: 8-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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GD25LF80ESIGR GigaDevice Semiconductor (HK) Limited Description: NOR FLASH
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Memory Organization: 1M x 8
Access Time: 5.5 ns
Memory Interface: SPI - Quad I/O, QPI, DTR
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 8-SOP
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Mbit
Mounting Type: Surface Mount
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GD25LH16ENIGR GigaDevice Semiconductor (HK) Limited Description: LINEAR IC
Packaging: Tape & Reel (TR)
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GD25LH32ENIGR GigaDevice Semiconductor (HK) Limited Description: LINEAR IC
Packaging: Tape & Reel (TR)
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GD25LQ05CEIGR GD25LQ05CEIGR GigaDevice Semiconductor (HK) Limited gd25lq05c Description: NOR FLASH
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GD25LQ05CEIGR GD25LQ05CEIGR GigaDevice Semiconductor (HK) Limited gd25lq05c Description: NOR FLASH
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GD25LQ10CEIGR GD25LQ10CEIGR GigaDevice Semiconductor (HK) Limited gd25lq05c Description: NOR FLASH
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GD25LQ10CEIGR GD25LQ10CEIGR GigaDevice Semiconductor (HK) Limited gd25lq05c Description: NOR FLASH
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GD25LQ10CTIGR GD25LQ10CTIGR GigaDevice Semiconductor (HK) Limited gd25lq05c Description: NOR FLASH
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GD25LQ10CTIGR GD25LQ10CTIGR GigaDevice Semiconductor (HK) Limited gd25lq05c Description: NOR FLASH
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GD25LQ128DSAGR GigaDevice Semiconductor (HK) Limited Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 16M x 8
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GD25LQ128DSIG GD25LQ128DSIG GigaDevice Semiconductor (HK) Limited DS-00291-GD25LQ128D-Rev1.9.pdf Description: IC FLASH 128MBIT SPI/QUAD 8SOP
DigiKey Programmable: Verified
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 2.4ms
Part Status: Not For New Designs
Supplier Device Package: 8-SOP
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tube
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GD25LQ128DVIGR GigaDevice Semiconductor (HK) Limited gd25lq128d Description: IC FLASH 128MBIT SPI/QUAD 8VSOP
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 2.4ms
Part Status: Active
Supplier Device Package: 8-VSOP
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
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GD25LQ128DWIGR GD25LQ128DWIGR GigaDevice Semiconductor (HK) Limited DS-00291-GD25LQ128D-Rev1.9.pdf Description: IC FLASH 128MBIT SPI/QUAD 8WSON
DigiKey Programmable: Not Verified
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 2.4ms
Part Status: Not For New Designs
Supplier Device Package: 8-WSON (5x6)
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tape & Reel (TR)
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GD25LQ128DWIGR GD25LQ128DWIGR GigaDevice Semiconductor (HK) Limited DS-00291-GD25LQ128D-Rev1.9.pdf Description: IC FLASH 128MBIT SPI/QUAD 8WSON
DigiKey Programmable: Not Verified
Clock Frequency: 120 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Cut Tape (CT)
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 2.4ms
Part Status: Not For New Designs
Supplier Device Package: 8-WSON (5x6)
Memory Format: FLASH
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GD25LQ128DYIGR GD25LQ128DYIGR GigaDevice Semiconductor (HK) Limited DS-00291-GD25LQ128D-Rev1.9.pdf Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 2.4ms
Memory Interface: SPI - Quad I/O
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
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GD25LQ128DYIGR GD25LQ128DYIGR GigaDevice Semiconductor (HK) Limited DS-00291-GD25LQ128D-Rev1.9.pdf Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Packaging: Cut Tape (CT)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 2.4ms
Memory Interface: SPI - Quad I/O
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
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500+3.69 EUR
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GD25LQ128EBIRY GigaDevice Semiconductor (HK) Limited Description: IC FLSH 128MBIT SPI/QUAD 24TFBGA
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 24-TFBGA (6x8)
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
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GD25LQ128EQIGR GigaDevice Semiconductor (HK) Limited Description: IC FLASH 128MBIT SPI/QUAD 8USON
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 8-USON (4x4)
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-XDFN Exposed Pad
Packaging: Tape & Reel (TR)
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GD25LQ128ESIGR GD25LQ128ESIGR GigaDevice Semiconductor (HK) Limited 2023__Gde.pdf Description: IC FLASH 128MBIT SPI/QUAD 8SOP
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
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GD25LQ128ESIGR GD25LQ128ESIGR GigaDevice Semiconductor (HK) Limited 2023__Gde.pdf Description: IC FLASH 128MBIT SPI/QUAD 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
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GD25LQ128ESJGR GD25LQ128ESJGR GigaDevice Semiconductor (HK) Limited Description: IC FLASH 128MBIT SPI/QUAD 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 6 ns
Memory Organization: 16M x 8
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GD25LQ128EWIGR GigaDevice Semiconductor (HK) Limited 2023__Gde.pdf Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (5x6)
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
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GD25LQ128EWIGR GigaDevice Semiconductor (HK) Limited 2023__Gde.pdf Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Packaging: Cut Tape (CT)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (5x6)
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
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GD25LQ128EYIGR GigaDevice Semiconductor (HK) Limited GD25LQ128E Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 8-WSON (6x8)
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tape & Reel (TR)
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GD25LQ128EYIGY GigaDevice Semiconductor (HK) Limited Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 6 ns
Memory Organization: 16M x 8
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GD25LQ16C8IGR GigaDevice Semiconductor (HK) Limited gd25lq16c Description: NOR FLASH
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GD25LQ16CNIGR GD25LQ16CNIGR GigaDevice Semiconductor (HK) Limited DS-00289-GD25LQ16C-Rev2.1.pdf Description: IC FLASH 16MBIT SPI/QUAD 8USON
Memory Organization: 2M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 50µs, 2.4ms
Part Status: Not For New Designs
Supplier Device Package: 8-USON (4x3)
Memory Format: FLASH
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 16Mbit
Mounting Type: Surface Mount
Package / Case: 8-UDFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Clock Frequency: 104 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2.1V
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GD25LQ16CNIGR GD25LQ16CNIGR GigaDevice Semiconductor (HK) Limited DS-00289-GD25LQ16C-Rev2.1.pdf Description: IC FLASH 16MBIT SPI/QUAD 8USON
Memory Organization: 2M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 50µs, 2.4ms
Part Status: Not For New Designs
Supplier Device Package: 8-USON (4x3)
Memory Format: FLASH
Clock Frequency: 104 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2.1V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 16Mbit
Mounting Type: Surface Mount
Package / Case: 8-UDFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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GD25LQ16CSIG GD25LQ16CSIG GigaDevice Semiconductor (HK) Limited gd25lq16c Description: NOR FLASH
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GD25LQ16CSIGR GD25LQ16CSIGR GigaDevice Semiconductor (HK) Limited DS-00289-GD25LQ16C-Rev2.1.pdf Description: IC FLASH 16MBIT SPI/QUAD 8SOP
Voltage - Supply: 1.65V ~ 2.1V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 16Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Memory Organization: 2M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 50µs, 2.4ms
Part Status: Active
Supplier Device Package: 8-SOP
Memory Format: FLASH
DigiKey Programmable: Verified
Clock Frequency: 104 MHz
Technology: FLASH - NOR
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GD25LD40EKIGR DS-00849-GD25LD20E-Rev1.2.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 4MBIT SPI/DUAL 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (1.5x1.5)
Write Cycle Time - Word, Page: 100µs, 6ms
Memory Interface: SPI - Dual I/O
Access Time: 12 ns
Memory Organization: 512K x 8
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GD25LD40ETIGR DS-00849-GD25LD20E-Rev1.2.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 4MBIT SPI/DUAL 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 100µs, 6ms
Memory Interface: SPI - Dual I/O
Access Time: 12 ns
Memory Organization: 512K x 8
Produkt ist nicht verfügbar
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GD25LD80CEIGR gd25ld80c
GD25LD80CEIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLSH 8MBIT SPI/DUAL I/O 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (2x3)
Write Cycle Time - Word, Page: 60µs, 6ms
Memory Interface: SPI - Dual I/O
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
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GD25LD80CKIGR DS-00390-GD25LD80C-Rev1.2.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 8MBIT SPI/DUAL 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (1.5x1.5)
Write Cycle Time - Word, Page: 97µs, 6ms
Memory Interface: SPI - Dual I/O
Access Time: 12 ns
Memory Organization: 1M x 8
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GD25LD80CSIGR gd25ld80c
GD25LD80CSIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 8MBIT SPI/DUAL I/O 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 60µs, 6ms
Memory Interface: SPI - Dual I/O
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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GD25LD80CTIGR gd25ld80c
GD25LD80CTIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 8MBIT SPI/DUAL I/O 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 60µs, 6ms
Memory Interface: SPI - Dual I/O
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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GD25LD80ETIGY DS-00900-GD25LD80E-Rev1.0.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 8MBIT SPI/DUAL 8SOP
Packaging: Tray
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 50 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 100µs, 6ms
Memory Interface: SPI - Dual I/O
Access Time: 12 ns
Memory Organization: 1M x 8
Produkt ist nicht verfügbar
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GD25LE128ESIGR 2023__Gde.pdf
GD25LE128ESIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 16M x 8
Produkt ist nicht verfügbar
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GD25LE128ESIGR 2023__Gde.pdf
GD25LE128ESIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8SOP
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 16M x 8
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10+3.77 EUR
25+3.67 EUR
50+3.58 EUR
100+3.5 EUR
250+3.39 EUR
500+3.31 EUR
1000+3.22 EUR
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GD25LE128EXHEGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8USON
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O, QPI
Write Cycle Time - Word, Page: 100µs, 4ms
Supplier Device Package: 8-FO-USON8 (3x3)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-XDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LE128EXHIGR DS-00600-GD25LE128E-Rev1.5.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: SERIAL NOR FLASH
Packaging: Tape & Reel (TR)
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O, QPI
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 8-FO-USON8 (3x3)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-XDFN Exposed Pad
Produkt ist nicht verfügbar
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GD25LE128EXHIGR DS-00600-GD25LE128E-Rev1.5.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: SERIAL NOR FLASH
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O, QPI
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 8-FO-USON8 (3x3)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-XDFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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GD25LE32DLIGR 2023__Gde.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 32MBIT SPI/QUAD 21WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 21-XFBGA, WLSCP
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 21-WLCSP
Write Cycle Time - Word, Page: 2.4ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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GD25LE32E3IGR DS-00560-GD25LE32E-Rev1.5.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 32MBIT SPI/QUAD 10WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 10-XFBGA, WLCSP
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 10-WLCSP
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
Produkt ist nicht verfügbar
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GD25LE32EEEGR DS-00560-GD25LE32E-Rev1.5.pdf
GD25LE32EEEGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 32MBIT SPI/QUAD 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (3x2)
Write Cycle Time - Word, Page: 100µs, 4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
Produkt ist nicht verfügbar
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GD25LE32EEIGR DS-00560-GD25LE32E-Rev1.5.pdf
GD25LE32EEIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 32MBIT SPI/QUAD 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (3x2)
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
Produkt ist nicht verfügbar
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GD25LE32ELIGR DS-00560-GD25LE32E-Rev1.5.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 32MBIT SPI/QUAD 10WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 10-XFBGA, WLCSP
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 10-WLCSP
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
Produkt ist nicht verfügbar
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GD25LE32ENIGR DS-00560-GD25LE32E-Rev1.5.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 32MBIT SPI/QUAD 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (3x4)
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
Produkt ist nicht verfügbar
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GD25LE32EQIGR DS-00560-GD25LE32E-Rev1.5.pdf
GD25LE32EQIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 32MBIT SPI/QUAD 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-XDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (4x4)
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
Produkt ist nicht verfügbar
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GD25LE32ESIGR 2023__Gde.pdf
GD25LE32ESIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 32MBIT SPI/QUAD 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
Produkt ist nicht verfügbar
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GD25LE32ESIGR 2023__Gde.pdf
GD25LE32ESIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 32MBIT SPI/QUAD 8SOP
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 4M x 8
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12+1.86 EUR
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50+1.77 EUR
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250+1.68 EUR
500+1.64 EUR
1000+1.59 EUR
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GD25LE64ELIGR DS-00567-GD25LE64E-Rev1.4.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 64MBIT SPI/QUAD 16WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-XFBGA, WLCSP
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-WLCSP
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 8M x 8
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8+2.92 EUR
10+2.71 EUR
25+2.63 EUR
50+2.57 EUR
100+2.52 EUR
250+2.44 EUR
500+2.38 EUR
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GD25LE64ELIGR DS-00567-GD25LE64E-Rev1.4.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 64MBIT SPI/QUAD 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-XFBGA, WLCSP
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-WLCSP
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 8M x 8
Produkt ist nicht verfügbar
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GD25LE64ENIGR DS-00567-GD25LE64E-Rev1.4.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 64MBIT SPI/QUAD 8USON
Packaging: Tape & Reel (TR)
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-USON (3x4)
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 8M x 8
Produkt ist nicht verfügbar
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GD25LF128EXHEGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8USON
Memory Organization: 16M x 8
Access Time: 5.5 ns
Memory Interface: SPI - Quad I/O, QPI, DTR
Write Cycle Time - Word, Page: 100µs, 4ms
Supplier Device Package: 8-FO-USON8 (3x3)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-XDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LF255ELIGR DS-00620-GD25LF255E-Rev1.1.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 256MBIT SPI/QUAD WLCSP
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI, DTR
Supplier Device Package: 32-WLCSP
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 32-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LF255ESIGR
GD25LF255ESIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 256MBIT SPI/QUAD 8SOP
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI, DTR
Supplier Device Package: 8-SOP
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LF255EWIGR DS-00620-GD25LF255E-Rev1.1.pdf
GD25LF255EWIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 256MBIT SPI/QUAD 8WSON
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI, DTR
Supplier Device Package: 8-WSON (5x6)
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LF255EWIGY DS-00620-GD25LF255E-Rev1.1.pdf
GD25LF255EWIGY
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 256MBIT SPI/QUAD 8WSON
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tray
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI, DTR
Supplier Device Package: 8-WSON (5x6)
Memory Format: FLASH
Produkt ist nicht verfügbar
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GD25LF80EEEGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: NOR FLASH
Memory Organization: 1M x 8
Access Time: 5.5 ns
Memory Interface: SPI - Quad I/O, QPI, DTR
Write Cycle Time - Word, Page: 100µs, 4ms
Supplier Device Package: 8-USON (3x2)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Mbit
Mounting Type: Surface Mount
Package / Case: 8-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LF80ESIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: NOR FLASH
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Memory Organization: 1M x 8
Access Time: 5.5 ns
Memory Interface: SPI - Quad I/O, QPI, DTR
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 8-SOP
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Mbit
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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GD25LH16ENIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LH32ENIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LQ05CEIGR gd25lq05c
GD25LQ05CEIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: NOR FLASH
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GD25LQ05CEIGR gd25lq05c
GD25LQ05CEIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: NOR FLASH
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GD25LQ10CEIGR gd25lq05c
GD25LQ10CEIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: NOR FLASH
Produkt ist nicht verfügbar
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GD25LQ10CEIGR gd25lq05c
GD25LQ10CEIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: NOR FLASH
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GD25LQ10CTIGR gd25lq05c
GD25LQ10CTIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: NOR FLASH
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GD25LQ10CTIGR gd25lq05c
GD25LQ10CTIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: NOR FLASH
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GD25LQ128DSAGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 16M x 8
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GD25LQ128DSIG DS-00291-GD25LQ128D-Rev1.9.pdf
GD25LQ128DSIG
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8SOP
DigiKey Programmable: Verified
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 2.4ms
Part Status: Not For New Designs
Supplier Device Package: 8-SOP
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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GD25LQ128DVIGR gd25lq128d
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8VSOP
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 2.4ms
Part Status: Active
Supplier Device Package: 8-VSOP
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LQ128DWIGR DS-00291-GD25LQ128D-Rev1.9.pdf
GD25LQ128DWIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8WSON
DigiKey Programmable: Not Verified
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 2.4ms
Part Status: Not For New Designs
Supplier Device Package: 8-WSON (5x6)
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LQ128DWIGR DS-00291-GD25LQ128D-Rev1.9.pdf
GD25LQ128DWIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8WSON
DigiKey Programmable: Not Verified
Clock Frequency: 120 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Cut Tape (CT)
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 2.4ms
Part Status: Not For New Designs
Supplier Device Package: 8-WSON (5x6)
Memory Format: FLASH
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10+4.14 EUR
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GD25LQ128DYIGR DS-00291-GD25LQ128D-Rev1.9.pdf
GD25LQ128DYIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 2.4ms
Memory Interface: SPI - Quad I/O
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
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GD25LQ128DYIGR DS-00291-GD25LQ128D-Rev1.9.pdf
GD25LQ128DYIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Packaging: Cut Tape (CT)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 2.4ms
Memory Interface: SPI - Quad I/O
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
auf Bestellung 2787 Stücke:
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5+4.5 EUR
10+4.2 EUR
25+4.08 EUR
50+3.99 EUR
100+3.9 EUR
250+3.77 EUR
500+3.69 EUR
1000+3.59 EUR
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GD25LQ128EBIRY
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLSH 128MBIT SPI/QUAD 24TFBGA
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 24-TFBGA (6x8)
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
Produkt ist nicht verfügbar
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GD25LQ128EQIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8USON
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 8-USON (4x4)
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-XDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LQ128ESIGR 2023__Gde.pdf
GD25LQ128ESIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8SOP
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
auf Bestellung 376 Stücke:
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6+4 EUR
10+3.74 EUR
25+3.63 EUR
50+3.56 EUR
100+3.47 EUR
250+3.37 EUR
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GD25LQ128ESIGR 2023__Gde.pdf
GD25LQ128ESIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
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GD25LQ128ESJGR
GD25LQ128ESJGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8SOP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 6 ns
Memory Organization: 16M x 8
Produkt ist nicht verfügbar
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GD25LQ128EWIGR 2023__Gde.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (5x6)
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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GD25LQ128EWIGR 2023__Gde.pdf
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Packaging: Cut Tape (CT)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (5x6)
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
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25+3.84 EUR
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500+3.3 EUR
1000+3.18 EUR
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GD25LQ128EYIGR GD25LQ128E
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Memory Organization: 16M x 8
Access Time: 6 ns
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 60µs, 2.4ms
Supplier Device Package: 8-WSON (6x8)
Memory Format: FLASH
Clock Frequency: 120 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 1.65V ~ 2V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GD25LQ128EYIGY
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 128MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 6 ns
Memory Organization: 16M x 8
Produkt ist nicht verfügbar
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GD25LQ16C8IGR gd25lq16c
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: NOR FLASH
Produkt ist nicht verfügbar
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GD25LQ16CNIGR DS-00289-GD25LQ16C-Rev2.1.pdf
GD25LQ16CNIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 16MBIT SPI/QUAD 8USON
Memory Organization: 2M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 50µs, 2.4ms
Part Status: Not For New Designs
Supplier Device Package: 8-USON (4x3)
Memory Format: FLASH
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 16Mbit
Mounting Type: Surface Mount
Package / Case: 8-UDFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Clock Frequency: 104 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2.1V
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GD25LQ16CNIGR DS-00289-GD25LQ16C-Rev2.1.pdf
GD25LQ16CNIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 16MBIT SPI/QUAD 8USON
Memory Organization: 2M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 50µs, 2.4ms
Part Status: Not For New Designs
Supplier Device Package: 8-USON (4x3)
Memory Format: FLASH
Clock Frequency: 104 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 2.1V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 16Mbit
Mounting Type: Surface Mount
Package / Case: 8-UDFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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11+2.03 EUR
12+1.8 EUR
25+1.71 EUR
50+1.65 EUR
100+1.61 EUR
250+1.52 EUR
500+1.48 EUR
1000+1.42 EUR
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GD25LQ16CSIG gd25lq16c
GD25LQ16CSIG
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: NOR FLASH
Produkt ist nicht verfügbar
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GD25LQ16CSIGR DS-00289-GD25LQ16C-Rev2.1.pdf
GD25LQ16CSIGR
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 16MBIT SPI/QUAD 8SOP
Voltage - Supply: 1.65V ~ 2.1V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 16Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Memory Organization: 2M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 50µs, 2.4ms
Part Status: Active
Supplier Device Package: 8-SOP
Memory Format: FLASH
DigiKey Programmable: Verified
Clock Frequency: 104 MHz
Technology: FLASH - NOR
auf Bestellung 6000 Stücke:
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2000+0.92 EUR
4000+0.89 EUR
6000+0.88 EUR
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