| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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EP20K1500EFC1020-1X | Intel |
 Description: IC FPGA 808 I/O 1020FBGAPackaging: Tray Package / Case: 1020-BBGA Mounting Type: Surface Mount Number of Gates: 2392000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 51840 Supplier Device Package: 1020-FBGA (33x33) Number of LABs/CLBs: 5184 Total RAM Bits: 442368 Number of I/O: 808 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP20K1500EFC1020-2X | Intel |
Description: IC FPGA 808 I/O 1020FBGA Packaging: Tray Package / Case: 1020-BBGA Mounting Type: Surface Mount Number of Gates: 2392000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 51840 Supplier Device Package: 1020-FBGA (33x33) Number of LABs/CLBs: 5184 Total RAM Bits: 442368 Number of I/O: 808 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP20K1500EGC984-1 | Intel |
Description: IC FPGA Packaging: Tray Mounting Type: Surface Mount Number of Gates: 2392000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 51840 Number of LABs/CLBs: 5184 Total RAM Bits: 442368 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP20K1500EGC984-2 | Intel |
Description: IC FPGA Packaging: Tray Mounting Type: Surface Mount Number of Gates: 2392000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 51840 Number of LABs/CLBs: 5184 Total RAM Bits: 442368 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP20K1500EGC984-3 | Intel |
Description: IC FPGA Packaging: Tray Mounting Type: Surface Mount Number of Gates: 2392000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 51840 Number of LABs/CLBs: 5184 Total RAM Bits: 442368 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP20K1500EXXC | Intel |
Description: IC FPGA Packaging: Tray Number of Gates: 2392000 Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 51840 Number of LABs/CLBs: 5184 Total RAM Bits: 442368 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP20K1500XXC | Intel |
Description: IC FPGA Packaging: Tray Number of Gates: 2392000 Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 51840 Number of LABs/CLBs: 5184 Total RAM Bits: 442368 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EPM1270T144C5NAA | Intel |
Description: IC CPLD 980MC 10NS 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 980 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 1270 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 116 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP20K600EBC652-1 | Intel |
Description: IC FPGA 488 I/O 652BGA Packaging: Tray Package / Case: 652-BGA Mounting Type: Surface Mount Number of Gates: 1537000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 24320 Supplier Device Package: 652-BGA (45x45) Number of LABs/CLBs: 2432 Total RAM Bits: 311296 Number of I/O: 488 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| 10M08SAU324C8G | Intel |
Description: IC FPGA 246 I/O 324UBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 8000 Supplier Device Package: 324-UBGA (15x15) Number of LABs/CLBs: 500 Total RAM Bits: 387072 Number of I/O: 246 |
auf Bestellung 119 Stücke: Lieferzeit 21-28 Tag (e) |
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| 10M08SCU324I7G | Intel |
Description: IC FPGA 246 I/O 324UBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 8000 Supplier Device Package: 324-UBGA (15x15) Number of LABs/CLBs: 500 Total RAM Bits: 387072 Number of I/O: 246 |
auf Bestellung 119 Stücke: Lieferzeit 21-28 Tag (e) |
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| M30800SAGP-BL#U5 | Intel |
Description: M1SINGLE-CH16-BCMMICROCOMPUTM1SE Packaging: Tray |
Produkt ist nicht verfügbar |
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5AGZME5H2F35I3L | Intel |
Description: IC FPGA 150960 I/O 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Number of Gates: 534 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 603840 Supplier Device Package: 1152-FBGA (35x35) Number of LABs/CLBs: 400000 Total RAM Bits: 34322432 Number of I/O: 150960 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| NU80579EZ009C | Intel |
Description: INTEL EP80579 INTEGRATED PROCESS Packaging: Tray Package / Case: 1088-BGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 95°C (TC) Core Processor: Intel® EP80579 Integrated Processor Supplier Device Package: 1088-FCBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2 Graphics Acceleration: No SATA: SATA (2) |
Produkt ist nicht verfügbar |
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| AT80574JH046NT S LBBT-CONS | Intel |
Description: AT805INTXEPROCESSL5408 Packaging: Tape & Box (TB) |
Produkt ist nicht verfügbar |
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| EP20K100EF324I2XGZ | Intel |
Description: IC FPGA 246 I/O 324FBGA Packaging: Tray Package / Case: 324-BGA Mounting Type: Surface Mount Number of Gates: 263000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 4160 Supplier Device Package: 324-FBGA (19x19) Number of LABs/CLBs: 416 Total RAM Bits: 53248 Number of I/O: 246 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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10AS027E3F27E2LG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 270K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-FBGA, FC (27x27) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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N27960K1-20 | Intel |
Description: IC EPROM 1MBIT 20MHZ 44PLCC Packaging: Bulk Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 1Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Clock Frequency: 20 MHz Memory Format: EPROM Supplier Device Package: 44-PLCC Memory Organization: 128K x 8 DigiKey Programmable: Not Verified |
auf Bestellung 4368 Stücke: Lieferzeit 21-28 Tag (e) |
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| EPM570XXA | Intel |
Description: IC MAX IIZ CPLD 570 Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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10AS027E2F27E1HG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 270K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-FBGA, FC (27x27) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SG280HH3F55E3VG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH3F55E3VGS3 | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SX280HH3F55E3VGS3 | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280HH3F55E3VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SG280HU3F50E3VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280LU3F50E3VGAS | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SX280HU3F50E3VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SG280HH3F55E2VGS3 | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH3F55I3VG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH3F55E2VG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SX280HH3F55E2VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280HH3F55I3VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280HH3F55E2VGS3 | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280LN3F43I3VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SG280HH3F55E1VG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH3F55E1VGS3 | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SX280HH3F55E1VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280HH3F55E1VGS3 | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SG280HU3F50E2VGAS | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HU3F50I3VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HU3F50E2VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SX280HU3F50I3VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280HU3F50E2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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10M40DDF256I7G | Intel |
Description: IC FPGA/CPLD NV 178 I/O 256FBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 178 DigiKey Programmable: Not Verified |
auf Bestellung 107 Stücke: Lieferzeit 21-28 Tag (e) |
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EP2SGX30DF780C4N | Intel |
Description: IC FPGA 361 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 33880 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 1694 Total RAM Bits: 1369728 Number of I/O: 361 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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10AX032E3F27I2SG | Intel |
Description: IC FPGA 240 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 320000 Supplier Device Package: 672-FBGA, FC (27x27) Number of LABs/CLBs: 119900 Total RAM Bits: 21040128 Number of I/O: 240 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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10AX032H2F34I1HG | Intel |
Description: IC FPGA 384 I/O 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.98V Number of Logic Elements/Cells: 320000 Supplier Device Package: 1152-FCBGA (35x35) Number of LABs/CLBs: 119900 Total RAM Bits: 21040128 Number of I/O: 384 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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.jpg "EPM7032LC44-15S02A") |
EPM7032LC44-15S02A | Intel |
Description: IC CPLD 32MC 15NS 44PLCC Packaging: Tray Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Programmable Type: EE PLD Number of Gates: 600 Number of Macrocells: 32 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 15 ns Supplier Device Package: 44-PLCC (16.59x16.59) Number of Logic Elements/Blocks: 2 Voltage Supply - Internal: 4.75V ~ 5.25V Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F780C4G | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F1152C4G | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F780I4G | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F780C3G | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F1152C3G | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F1152I4G | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F780C4LG | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F1152C4LG | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F780C2G | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F780I3G | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F780I4LG | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SL150F1152I3G | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
| EP20K1500EFC1020-1X |
|
Hersteller: Intel
Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP20K1500EFC1020-2X |
|
Hersteller: Intel
Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP20K1500EGC984-1 |
|
Hersteller: Intel
Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP20K1500EGC984-2 |
|
Hersteller: Intel
Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP20K1500EGC984-3 |
|
Hersteller: Intel
Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP20K1500EXXC |
Hersteller: Intel
Description: IC FPGA
Packaging: Tray
Number of Gates: 2392000
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
Description: IC FPGA
Packaging: Tray
Number of Gates: 2392000
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP20K1500XXC |
Hersteller: Intel
Description: IC FPGA
Packaging: Tray
Number of Gates: 2392000
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
Description: IC FPGA
Packaging: Tray
Number of Gates: 2392000
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPM1270T144C5NAA |
Hersteller: Intel
Description: IC CPLD 980MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 980MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 116
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP20K600EBC652-1 |
|
Hersteller: Intel
Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BGA
Mounting Type: Surface Mount
Number of Gates: 1537000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 24320
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 2432
Total RAM Bits: 311296
Number of I/O: 488
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BGA
Mounting Type: Surface Mount
Number of Gates: 1537000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 24320
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 2432
Total RAM Bits: 311296
Number of I/O: 488
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 10M08SAU324C8G |
|
Hersteller: Intel
Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Number of I/O: 246
Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Number of I/O: 246
auf Bestellung 119 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 74.7 EUR |
| 25+ | 59.76 EUR |
| 100+ | 58.24 EUR |
| 10M08SCU324I7G |
|
Hersteller: Intel
Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Number of I/O: 246
Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Number of I/O: 246
auf Bestellung 119 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 81.35 EUR |
| 25+ | 65.06 EUR |
| 100+ | 63.45 EUR |
| M30800SAGP-BL#U5 |
|
Produkt ist nicht verfügbar
| 5AGZME5H2F35I3L |
Hersteller: Intel
Description: IC FPGA 150960 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Number of Gates: 534
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 603840
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 400000
Total RAM Bits: 34322432
Number of I/O: 150960
DigiKey Programmable: Not Verified
Description: IC FPGA 150960 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Number of Gates: 534
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 603840
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 400000
Total RAM Bits: 34322432
Number of I/O: 150960
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| NU80579EZ009C |
|
Hersteller: Intel
Description: INTEL EP80579 INTEGRATED PROCESS
Packaging: Tray
Package / Case: 1088-BGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 95°C (TC)
Core Processor: Intel® EP80579 Integrated Processor
Supplier Device Package: 1088-FCBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
SATA: SATA (2)
Description: INTEL EP80579 INTEGRATED PROCESS
Packaging: Tray
Package / Case: 1088-BGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 95°C (TC)
Core Processor: Intel® EP80579 Integrated Processor
Supplier Device Package: 1088-FCBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
SATA: SATA (2)
Produkt ist nicht verfügbar
| AT80574JH046NT S LBBT-CONS |
Produkt ist nicht verfügbar
| EP20K100EF324I2XGZ |
|
Hersteller: Intel
Description: IC FPGA 246 I/O 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Number of Gates: 263000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 4160
Supplier Device Package: 324-FBGA (19x19)
Number of LABs/CLBs: 416
Total RAM Bits: 53248
Number of I/O: 246
DigiKey Programmable: Not Verified
Description: IC FPGA 246 I/O 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Number of Gates: 263000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 4160
Supplier Device Package: 324-FBGA (19x19)
Number of LABs/CLBs: 416
Total RAM Bits: 53248
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 10AS027E3F27E2LG |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| N27960K1-20 |
|
Hersteller: Intel
Description: IC EPROM 1MBIT 20MHZ 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 20 MHz
Memory Format: EPROM
Supplier Device Package: 44-PLCC
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
Description: IC EPROM 1MBIT 20MHZ 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 20 MHz
Memory Format: EPROM
Supplier Device Package: 44-PLCC
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
auf Bestellung 4368 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 14+ | 55.15 EUR |
| EPM570XXA |
Produkt ist nicht verfügbar
| 10AS027E2F27E1HG |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SG280HH3F55E3VG |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SG280HH3F55E3VGS3 |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SX280HH3F55E3VGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280HH3F55E3VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SG280HU3F50E3VG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SG280LU3F50E3VGAS |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SX280HU3F50E3VG |
|
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SG280HH3F55E2VGS3 |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SG280HH3F55I3VG |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SG280HH3F55E2VG |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SX280HH3F55E2VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280HH3F55I3VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280HH3F55E2VGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280LN3F43I3VG |
|
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SG280HH3F55E1VG |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SG280HH3F55E1VGS3 |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SX280HH3F55E1VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280HH3F55E1VGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SG280HU3F50E2VGAS |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SG280HU3F50I3VG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SG280HU3F50E2VG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SX280HU3F50I3VG |
|
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280HU3F50E2VG |
|
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 10M40DDF256I7G |
|
Hersteller: Intel
Description: IC FPGA/CPLD NV 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 178
DigiKey Programmable: Not Verified
auf Bestellung 107 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 405.7 EUR |
| 25+ | 340.75 EUR |
| EP2SGX30DF780C4N |
|
Hersteller: Intel
Description: IC FPGA 361 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 33880
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1694
Total RAM Bits: 1369728
Number of I/O: 361
DigiKey Programmable: Not Verified
Description: IC FPGA 361 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 33880
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1694
Total RAM Bits: 1369728
Number of I/O: 361
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 10AX032E3F27I2SG |
|
Hersteller: Intel
Description: IC FPGA 240 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC FPGA 240 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 240
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 10AX032H2F34I1HG |
|
Hersteller: Intel
Description: IC FPGA 384 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA 384 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPM7032LC44-15S02A |
|
Hersteller: Intel
Description: IC CPLD 32MC 15NS 44PLCC
Packaging: Tray
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC CPLD 32MC 15NS 44PLCC
Packaging: Tray
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F780C4G |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F1152C4G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F780I4G |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F780C3G |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F1152C3G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F1152I4G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F780C4LG |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F1152C4LG |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F780C2G |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F780I3G |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F780I4LG |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SL150F1152I3G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar