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1ST110ES2F50E2LG 1ST110ES2F50E2LG Intel 666450?fileName=s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1ST085ES2F50I2LG 1ST085ES2F50I2LG Intel 666450?fileName=s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1ST110ES2F50I1VG 1ST110ES2F50I1VG Intel 666450?fileName=s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1ST110ES2F50I2LG 1ST110ES2F50I2LG Intel 666450?fileName=s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
DK-SI-AGI027FA DK-SI-AGI027FA Intel Description: I-SERIES TRANSCEIVER-SOC DEVELOP
Packaging: Bulk
For Use With/Related Products: AGIB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: Agilex I-Series SoC FPGA Transceiver-SoC
Produkt ist nicht verfügbar
1SG211HN3F43E3VG 1SG211HN3F43E3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43E2VG 1SG211HN3F43E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43I3VG 1SG211HN3F43I3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43E1VG 1SG211HN3F43E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43I2VG 1SG211HN3F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43E2VGAS 1SG211HN2F43E2VGAS Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43E2VG 1SG211HN2F43E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43E2LG 1SG211HN3F43E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43E3XG 1SG211HN3F43E3XG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43I1VG 1SG211HN3F43I1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43E1VG 1SG211HN2F43E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43E2VG 1SG211HN1F43E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43I2VG 1SG211HN2F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43E2LG 1SG211HN2F43E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43I2LG 1SG211HN3F43I2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43I3XG 1SG211HN3F43I3XG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43E1VG 1SG211HN1F43E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43I1VG 1SG211HN2F43I1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43I2VG 1SG211HN1F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43E2LG 1SG211HN1F43E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43I2LG 1SG211HN2F43I2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43I1VG 1SG211HN1F43I1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43I2LG 1SG211HN1F43I2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
AT80573JH0366M S LBB3 Intel Description: AT80573J - Intel Xeon Processor
Packaging: Bulk
Produkt ist nicht verfügbar
AT80573JH0366M S LBB3-CONS Intel Description: AT805INTXEPROCESSL5215
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
EPM1270F256I5RR Intel Description: IC CPLD 980MC 10NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 212
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM1270F256C5NRR Intel Description: IC CPLD 980MC 10NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 212
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM1270GF256C5RR Intel Description: IC CPLD 980MC 6.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 212
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EP20K400BC652-1 EP20K400BC652-1 Intel 20K_Family_DS.pdf Description: IC FPGA 502 I/O 652BGA
Packaging: Tray
Package / Case: 652-BGA
Mounting Type: Surface Mount
Number of Gates: 1052000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 1664
Total RAM Bits: 212992
Number of I/O: 502
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EP20K400CF672C9 EP20K400CF672C9 Intel APEX_20KC_Ver2.2_Feb2004.pdf Description: IC FPGA 488 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 1052000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1664
Total RAM Bits: 212992
Number of I/O: 488
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EP20K400EFI672-2N EP20K400EFI672-2N Intel 20K_Family_DS.pdf Description: IC FPGA 488 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 1052000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1664
Total RAM Bits: 212992
Number of I/O: 488
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM570GT100C4 EPM570GT100C4 Intel max2_mii51006.pdf Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM3032ATI44-10 EPM3032ATI44-10 Intel MAX_3000A_Device_Family.pdf Description: IC CPLD 32MC 10NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 34
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
EPM3128ATC144-10 EPM3128ATC144-10 Intel MAX_3000A_Device_Family.pdf Description: IC CPLD 128MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM3256AQC208-7 EPM3256AQC208-7 Intel MAX_3000A_Device_Family.pdf Description: IC CPLD 256MC 7.5NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM3256ATI144-10 EPM3256ATI144-10 Intel MAX_3000A_Device_Family.pdf Description: IC CPLD 256MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 116
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EP2AGX95DF25I3G Intel Description: IC FPGA 260 I/O 572FBGA
Packaging: Tray
Package / Case: 572-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 89178
Supplier Device Package: 572-FBGA, FC (25x25)
Number of LABs/CLBs: 3747
Total RAM Bits: 6839296
Number of I/O: 260
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
DK-DEV-5CGTD9N-B Intel Description: DEV KIT CYCLONE V GT
Packaging: Bulk
For Use With/Related Products: 5CGTFD9
Type: FPGA
Contents: Board(s)
Platform: Cyclone V GT FPGA
Produkt ist nicht verfügbar
DK-DEV-5CGXC7N/P Intel Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
Produkt ist nicht verfügbar
DK-DEV-5CGXC7N Intel Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
Produkt ist nicht verfügbar
EPM3032ALC44-7N EPM3032ALC44-7N Intel MAX_3000A_Device_Family.pdf Description: IC CPLD 32MC 7.5NS 44PLCC
Packaging: Tray
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 34
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
EN6340QI EN6340QI Intel EN6340QI_Rev_A_Web.pdf Description: DC DC CONVERTER 0.75-6.28V
Features: Remote On/Off, OCP, OTP, SCP, UVLO
Packaging: Cut Tape (CT)
Package / Case: 34-PowerBFQFN Module
Size / Dimension: 0.24" L x 0.16" W x 0.10" H (6.0mm x 4.0mm x 2.5mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 6.6V
Efficiency: 95%
Current - Output (Max): 4A
Supplier Device Package: 34-QFN (4x6)
Voltage - Input (Min): 2.7V
Voltage - Output 1: 0.75 ~ 6.28V
Control Features: Enable, Active High
Number of Outputs: 1
Produkt ist nicht verfügbar
EP2AGX125EF35I3N EP2AGX125EF35I3N Intel Arria_II_Device.pdf Description: IC FPGA 452 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 118143
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 4964
Total RAM Bits: 8315904
Number of I/O: 452
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG280HN3F43E3VG 1SG280HN3F43E3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG280HN3F43E3VGAS 1SG280HN3F43E3VGAS Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG280HN3F43E3VGS3 1SG280HN3F43E3VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG250HU3F50I3XG 1SG250HU3F50I3XG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EP20K30ETC144-1 EP20K30ETC144-1 Intel 20K_Family_DS.pdf Description: IC FPGA 92 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 113000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 1200
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 120
Total RAM Bits: 24576
Number of I/O: 92
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SCD240110QCM SCD240110QCM Intel INTLS03918-1.pdf?t.download=true&u=5oefqw Description: SERIAL I/O CONTROLLER
Packaging: Tube
Package / Case: 100-BQFP
Supplier Device Package: 100-MQFP (14x20)
DigiKey Programmable: Not Verified
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AGIA040R39A2E3V Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
AGIA040R39A2E3E Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
AGIA040R39A2E2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
AGIA040R39A2E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
AGIA040R39A1E2VB Intel Description: IC FPGA AGILEX-I 3948BGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
AGIA040R39A1E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
1ST110ES2F50E2LG 666450?fileName=s10_datasheet-683181-666450.pdf
1ST110ES2F50E2LG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1ST085ES2F50I2LG 666450?fileName=s10_datasheet-683181-666450.pdf
1ST085ES2F50I2LG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1ST110ES2F50I1VG 666450?fileName=s10_datasheet-683181-666450.pdf
1ST110ES2F50I1VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1ST110ES2F50I2LG 666450?fileName=s10_datasheet-683181-666450.pdf
1ST110ES2F50I2LG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
DK-SI-AGI027FA
DK-SI-AGI027FA
Hersteller: Intel
Description: I-SERIES TRANSCEIVER-SOC DEVELOP
Packaging: Bulk
For Use With/Related Products: AGIB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: Agilex I-Series SoC FPGA Transceiver-SoC
Produkt ist nicht verfügbar
1SG211HN3F43E3VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E3VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43E2VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43I3VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I3VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43E1VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43I2VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43E2VGAS 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E2VGAS
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43E2VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43E2LG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43E3XG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E3XG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43I1VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43E1VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43E2VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43E2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43I2VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43I2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43E2LG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43I2LG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN3F43I3XG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I3XG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43E1VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43E1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43I1VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43I1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43I2VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43I2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43E2LG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43E2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN2F43I2LG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43I2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43I1VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43I1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG211HN1F43I2LG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43I2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
AT80573JH0366M S LBB3
Hersteller: Intel
Description: AT80573J - Intel Xeon Processor
Packaging: Bulk
Produkt ist nicht verfügbar
AT80573JH0366M S LBB3-CONS
Hersteller: Intel
Description: AT805INTXEPROCESSL5215
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
EPM1270F256I5RR
Hersteller: Intel
Description: IC CPLD 980MC 10NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 212
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM1270F256C5NRR
Hersteller: Intel
Description: IC CPLD 980MC 10NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 212
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM1270GF256C5RR
Hersteller: Intel
Description: IC CPLD 980MC 6.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 212
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EP20K400BC652-1 20K_Family_DS.pdf
EP20K400BC652-1
Hersteller: Intel
Description: IC FPGA 502 I/O 652BGA
Packaging: Tray
Package / Case: 652-BGA
Mounting Type: Surface Mount
Number of Gates: 1052000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 1664
Total RAM Bits: 212992
Number of I/O: 502
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EP20K400CF672C9 APEX_20KC_Ver2.2_Feb2004.pdf
EP20K400CF672C9
Hersteller: Intel
Description: IC FPGA 488 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 1052000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1664
Total RAM Bits: 212992
Number of I/O: 488
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EP20K400EFI672-2N 20K_Family_DS.pdf
EP20K400EFI672-2N
Hersteller: Intel
Description: IC FPGA 488 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 1052000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1664
Total RAM Bits: 212992
Number of I/O: 488
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM570GT100C4 max2_mii51006.pdf
EPM570GT100C4
Hersteller: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM3032ATI44-10 MAX_3000A_Device_Family.pdf
EPM3032ATI44-10
Hersteller: Intel
Description: IC CPLD 32MC 10NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 34
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
EPM3128ATC144-10 MAX_3000A_Device_Family.pdf
EPM3128ATC144-10
Hersteller: Intel
Description: IC CPLD 128MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM3256AQC208-7 MAX_3000A_Device_Family.pdf
EPM3256AQC208-7
Hersteller: Intel
Description: IC CPLD 256MC 7.5NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EPM3256ATI144-10 MAX_3000A_Device_Family.pdf
EPM3256ATI144-10
Hersteller: Intel
Description: IC CPLD 256MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 116
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EP2AGX95DF25I3G
Hersteller: Intel
Description: IC FPGA 260 I/O 572FBGA
Packaging: Tray
Package / Case: 572-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 89178
Supplier Device Package: 572-FBGA, FC (25x25)
Number of LABs/CLBs: 3747
Total RAM Bits: 6839296
Number of I/O: 260
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
DK-DEV-5CGTD9N-B
Hersteller: Intel
Description: DEV KIT CYCLONE V GT
Packaging: Bulk
For Use With/Related Products: 5CGTFD9
Type: FPGA
Contents: Board(s)
Platform: Cyclone V GT FPGA
Produkt ist nicht verfügbar
DK-DEV-5CGXC7N/P
Hersteller: Intel
Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
Produkt ist nicht verfügbar
DK-DEV-5CGXC7N
Hersteller: Intel
Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
Produkt ist nicht verfügbar
EPM3032ALC44-7N MAX_3000A_Device_Family.pdf
EPM3032ALC44-7N
Hersteller: Intel
Description: IC CPLD 32MC 7.5NS 44PLCC
Packaging: Tray
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 34
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
EN6340QI EN6340QI_Rev_A_Web.pdf
EN6340QI
Hersteller: Intel
Description: DC DC CONVERTER 0.75-6.28V
Features: Remote On/Off, OCP, OTP, SCP, UVLO
Packaging: Cut Tape (CT)
Package / Case: 34-PowerBFQFN Module
Size / Dimension: 0.24" L x 0.16" W x 0.10" H (6.0mm x 4.0mm x 2.5mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 6.6V
Efficiency: 95%
Current - Output (Max): 4A
Supplier Device Package: 34-QFN (4x6)
Voltage - Input (Min): 2.7V
Voltage - Output 1: 0.75 ~ 6.28V
Control Features: Enable, Active High
Number of Outputs: 1
Produkt ist nicht verfügbar
EP2AGX125EF35I3N Arria_II_Device.pdf
EP2AGX125EF35I3N
Hersteller: Intel
Description: IC FPGA 452 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 118143
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 4964
Total RAM Bits: 8315904
Number of I/O: 452
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG280HN3F43E3VG 10_GX_SX_Device_Overview.pdf
1SG280HN3F43E3VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG280HN3F43E3VGAS 10_GX_SX_Device_Overview.pdf
1SG280HN3F43E3VGAS
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG280HN3F43E3VGS3 10_GX_SX_Device_Overview.pdf
1SG280HN3F43E3VGS3
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
1SG250HU3F50I3XG 10_GX_SX_Device_Overview.pdf
1SG250HU3F50I3XG
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EP20K30ETC144-1 20K_Family_DS.pdf
EP20K30ETC144-1
Hersteller: Intel
Description: IC FPGA 92 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 113000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 1200
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 120
Total RAM Bits: 24576
Number of I/O: 92
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SCD240110QCM INTLS03918-1.pdf?t.download=true&u=5oefqw
SCD240110QCM
Hersteller: Intel
Description: SERIAL I/O CONTROLLER
Packaging: Tube
Package / Case: 100-BQFP
Supplier Device Package: 100-MQFP (14x20)
DigiKey Programmable: Not Verified
auf Bestellung 4383 Stücke:
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Anzahl Preis ohne MwSt
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Mindestbestellmenge: 11
AGIA040R39A2E3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
AGIA040R39A2E3E
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
AGIA040R39A2E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
AGIA040R39A2E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
AGIA040R39A1E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948BGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
AGIA040R39A1E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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