| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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1SG280LU3F50I3XG | Intel |
 Description: IC FPGA 704 I/O 2397BGAPackaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SX250HH1F55E1VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HH1F55E2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HH1F55I2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HH2F55E2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HH2F55I2VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HH3F55I3XG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HN2F43I1VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HU1F50I2LG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HU2F50E2LG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HU2F50I2LG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HU2F50I2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HU3F50E1VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HU3F50E2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HU3F50I3VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250LU3F50I3XG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280HH2F55I2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280HN1F43E2VGS3 | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280HN1F43I1VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280HN3F43E2VGS3 | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX280HU1F50E2LGS3 | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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EP1K10FC256-1 | Intel |
Description: IC FPGA 136 I/O 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Number of Gates: 56000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 576 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 72 Total RAM Bits: 12288 Number of I/O: 136 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPM7512BBC256-10 | Intel |
Description: IC CPLD 512MC 10NS 256BGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 10000 Number of Macrocells: 512 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 256-BGA (27x27) Number of Logic Elements/Blocks: 32 Voltage Supply - Internal: 2.375V ~ 2.625V Number of I/O: 212 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPM7512BBC256-7 | Intel |
Description: IC CPLD 512MC 7.5NS 256BGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 10000 Number of Macrocells: 512 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 256-BGA (27x27) Number of Logic Elements/Blocks: 32 Voltage Supply - Internal: 2.375V ~ 2.625V Number of I/O: 212 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| IP-OM-3D-LUT | Intel |
Description: PROTOTYPE Packaging: Bulk |
Produkt ist nicht verfügbar |
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EP4SGX180DF29C4G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP4SGX180FF35C4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180HF35C4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180KF40C4G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180DF29I4G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180DF29C3G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP4SGX180FF35I4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180FF35C3G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180HF35I4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180HF35C3G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP4SGX180KF40C3G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180KF40I4G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180DF29I3G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180DF29C2XG | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180FF35C2XG | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP4SGX180FF35I3G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180HF35I3G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180HF35C2G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180KF40C2G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX180KF40I3G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPF10K200SRC240-1X | Intel |
Description: IC FPGA 182 I/O 240RQFP Packaging: Tray Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 513000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 9984 Supplier Device Package: 240-RQFP (32x32) Number of LABs/CLBs: 1248 Total RAM Bits: 98304 Number of I/O: 182 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPF10K30AFC484-1 | Intel |
Description: IC FPGA 246 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Number of Gates: 69000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 1728 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 216 Total RAM Bits: 12288 Number of I/O: 246 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPF10K200SFC484-3 | Intel |
Description: IC FPGA 369 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Number of Gates: 513000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 9984 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 1248 Total RAM Bits: 98304 Number of I/O: 369 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPF10K200SRC240-2 | Intel |
Description: IC FPGA 182 I/O 240RQFP Packaging: Tray Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 513000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 9984 Supplier Device Package: 240-RQFP (32x32) Number of LABs/CLBs: 1248 Total RAM Bits: 98304 Number of I/O: 182 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP1S30F780I6 | Intel |
Description: IC FPGA 597 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 32470 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 3247 Total RAM Bits: 3317184 Number of I/O: 597 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPF6016BC256-2 | Intel |
Description: IC FPGA 204 I/O 256BGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 16000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1320 Supplier Device Package: 256-BGA (27x27) Number of LABs/CLBs: 132 Number of I/O: 204 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP2SGX60EF1152C5 | Intel |
Description: IC FPGA 534 I/O 1152FBGA Packaging: Tray Package / Case: 1152-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 60440 Supplier Device Package: 1152-FBGA (35x35) Number of LABs/CLBs: 3022 Total RAM Bits: 2544192 Number of I/O: 534 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPF10K10ATC100-3 | Intel |
Description: IC FPGA 66 I/O 100TQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 31000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 576 Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 72 Total RAM Bits: 6144 Number of I/O: 66 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP2S130F1508I4 | Intel |
Description: IC FPGA 1126 I/O 1508FBGA Packaging: Tray Package / Case: 1508-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 132540 Supplier Device Package: 1508-FBGA, FC (40x40) Number of LABs/CLBs: 6627 Total RAM Bits: 6747840 Number of I/O: 1126 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| 10M04SCU324I7G | Intel |
Description: IC FPGA 246 I/O 324UBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 4000 Supplier Device Package: 324-UBGA (15x15) Number of LABs/CLBs: 250 Total RAM Bits: 193536 Number of I/O: 246 |
auf Bestellung 109 Stücke: Lieferzeit 21-28 Tag (e) |
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EPM7160SLC84-6 | Intel |
Description: IC CPLD 160MC 6NS 84PLCC Packaging: Tray Package / Case: 84-LCC (J-Lead) Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 3200 Number of Macrocells: 160 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 6 ns Supplier Device Package: 84-PLCC (29.31x29.31) Number of Logic Elements/Blocks: 10 Voltage Supply - Internal: 4.75V ~ 5.25V Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPM7160EQC160-15 | Intel |
Description: IC CPLD 160MC 15NS 160QFP Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Programmable Type: EE PLD Number of Gates: 3200 Number of Macrocells: 160 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 15 ns Supplier Device Package: 160-PQFP (28x28) Number of Logic Elements/Blocks: 10 Voltage Supply - Internal: 4.75V ~ 5.25V Number of I/O: 104 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX230HF35C2G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4SGX530HH35C2G | Intel |
Description: IC FPGA 564 I/O 1152HBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP3SE80F780C4LG | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
| 1SG280LU3F50I3XG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1SX250HH1F55E1VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HH1F55E2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HH1F55I2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HH2F55E2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HH2F55I2VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HH3F55I3XG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HN2F43I1VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HU1F50I2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HU2F50E2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HU2F50I2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HU2F50I2VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HU3F50E1VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HU3F50E2VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250HU3F50I3VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX250LU3F50I3XG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280HH2F55I2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280HN1F43E2VGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280HN1F43I1VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280HN3F43E2VGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 1SX280HU1F50E2LGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| EP1K10FC256-1 |
|
Hersteller: Intel
Description: IC FPGA 136 I/O 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Number of Gates: 56000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 576
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 72
Total RAM Bits: 12288
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC FPGA 136 I/O 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Number of Gates: 56000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 576
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 72
Total RAM Bits: 12288
Number of I/O: 136
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPM7512BBC256-10 |
|
Hersteller: Intel
Description: IC CPLD 512MC 10NS 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 10000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-BGA (27x27)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 212
DigiKey Programmable: Not Verified
Description: IC CPLD 512MC 10NS 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 10000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-BGA (27x27)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 212
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPM7512BBC256-7 |
|
Hersteller: Intel
Description: IC CPLD 512MC 7.5NS 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 10000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-BGA (27x27)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 212
DigiKey Programmable: Not Verified
Description: IC CPLD 512MC 7.5NS 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 10000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-BGA (27x27)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 212
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180DF29C4G |
Hersteller: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180FF35C4G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180HF35C4G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180KF40C4G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180DF29I4G |
Hersteller: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180DF29C3G |
Hersteller: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180FF35I4G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180FF35C3G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180HF35I4G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180HF35C3G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180KF40C3G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180KF40I4G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180DF29I3G |
Hersteller: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180DF29C2XG |
Hersteller: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180FF35C2XG |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180FF35I3G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180HF35I3G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180HF35C2G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180KF40C2G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX180KF40I3G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPF10K200SRC240-1X |
|
Hersteller: Intel
Description: IC FPGA 182 I/O 240RQFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 240-RQFP (32x32)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 182
DigiKey Programmable: Not Verified
Description: IC FPGA 182 I/O 240RQFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 240-RQFP (32x32)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 182
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPF10K30AFC484-1 |
|
Hersteller: Intel
Description: IC FPGA 246 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 69000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 216
Total RAM Bits: 12288
Number of I/O: 246
DigiKey Programmable: Not Verified
Description: IC FPGA 246 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 69000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 216
Total RAM Bits: 12288
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPF10K200SFC484-3 |
|
Hersteller: Intel
Description: IC FPGA 369 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 369
DigiKey Programmable: Not Verified
Description: IC FPGA 369 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 369
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPF10K200SRC240-2 |
|
Hersteller: Intel
Description: IC FPGA 182 I/O 240RQFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 240-RQFP (32x32)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 182
DigiKey Programmable: Not Verified
Description: IC FPGA 182 I/O 240RQFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 240-RQFP (32x32)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 182
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP1S30F780I6 |
|
Hersteller: Intel
Description: IC FPGA 597 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 32470
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 3247
Total RAM Bits: 3317184
Number of I/O: 597
DigiKey Programmable: Not Verified
Description: IC FPGA 597 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 32470
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 3247
Total RAM Bits: 3317184
Number of I/O: 597
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPF6016BC256-2 |
|
Hersteller: Intel
Description: IC FPGA 204 I/O 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1320
Supplier Device Package: 256-BGA (27x27)
Number of LABs/CLBs: 132
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC FPGA 204 I/O 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1320
Supplier Device Package: 256-BGA (27x27)
Number of LABs/CLBs: 132
Number of I/O: 204
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP2SGX60EF1152C5 |
|
Hersteller: Intel
Description: IC FPGA 534 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 60440
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 3022
Total RAM Bits: 2544192
Number of I/O: 534
DigiKey Programmable: Not Verified
Description: IC FPGA 534 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 60440
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 3022
Total RAM Bits: 2544192
Number of I/O: 534
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPF10K10ATC100-3 |
|
Hersteller: Intel
Description: IC FPGA 66 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 31000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 576
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 72
Total RAM Bits: 6144
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC FPGA 66 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 31000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 576
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 72
Total RAM Bits: 6144
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP2S130F1508I4 |
|
Hersteller: Intel
Description: IC FPGA 1126 I/O 1508FBGA
Packaging: Tray
Package / Case: 1508-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 132540
Supplier Device Package: 1508-FBGA, FC (40x40)
Number of LABs/CLBs: 6627
Total RAM Bits: 6747840
Number of I/O: 1126
DigiKey Programmable: Not Verified
Description: IC FPGA 1126 I/O 1508FBGA
Packaging: Tray
Package / Case: 1508-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 132540
Supplier Device Package: 1508-FBGA, FC (40x40)
Number of LABs/CLBs: 6627
Total RAM Bits: 6747840
Number of I/O: 1126
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 10M04SCU324I7G |
|
Hersteller: Intel
Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 4000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 250
Total RAM Bits: 193536
Number of I/O: 246
Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 4000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 250
Total RAM Bits: 193536
Number of I/O: 246
auf Bestellung 109 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 52.47 EUR |
| 25+ | 41.99 EUR |
| 100+ | 40.93 EUR |
| EPM7160SLC84-6 |
|
Hersteller: Intel
Description: IC CPLD 160MC 6NS 84PLCC
Packaging: Tray
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 3200
Number of Macrocells: 160
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of Logic Elements/Blocks: 10
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC CPLD 160MC 6NS 84PLCC
Packaging: Tray
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 3200
Number of Macrocells: 160
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of Logic Elements/Blocks: 10
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPM7160EQC160-15 |
|
Hersteller: Intel
Description: IC CPLD 160MC 15NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 3200
Number of Macrocells: 160
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 10
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: IC CPLD 160MC 15NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 3200
Number of Macrocells: 160
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 10
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX230HF35C2G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4SGX530HH35C2G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SE80F780C4LG |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar