| Foto | Bezeichnung | Hersteller | Beschreibung |
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EPCQ128SI16N | Intel |
 Description: IC CONFIG DEVICE 128MBIT 16SOICPackaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Memory Size: 128MB Programmable Type: In System Programmable Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Supplier Device Package: 16-SOIC Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPCQ256SI16N | Intel |
Description: IC CONFIG DEVICE 256MBIT 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Memory Size: 256MB Programmable Type: In System Programmable Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Supplier Device Package: 16-SOIC Part Status: Obsolete DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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5CSTFD5D5F31I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 27 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEMA6F31I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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5CSXFC6C6U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 39 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSTFD6D5F31I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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5CSEMA6F31A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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5CSXFC6C6U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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EP4CGX15BN11C7N | Intel |
Description: IC FPGA 72 I/O 148QFN Packaging: Tray Package / Case: 148-WFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.16V ~ 1.24V Number of Logic Elements/Cells: 14400 Supplier Device Package: 148-QFN (11x11) Number of LABs/CLBs: 900 Total RAM Bits: 552960 Number of I/O: 72 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP4CGX15BN11I7N | Intel |
Description: IC FPGA 72 I/O 148QFN Packaging: Tray Package / Case: 148-WFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.16V ~ 1.24V Number of Logic Elements/Cells: 14400 Supplier Device Package: 148-QFN (11x11) Number of LABs/CLBs: 900 Total RAM Bits: 552960 Number of I/O: 72 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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5CSXFC5C6U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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5CSXFC6C6U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 54 Stücke: Lieferzeit 21-28 Tag (e) |
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5CEBA2U15C6N | Intel |
Description: IC FPGA 176 I/O 324UBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 25000 Supplier Device Package: 324-UBGA (15x15) Number of LABs/CLBs: 9434 Total RAM Bits: 2002944 Number of I/O: 176 DigiKey Programmable: Not Verified |
auf Bestellung 118 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEBA5U19C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA |
Produkt ist nicht verfügbar |
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5CEBA2U15I7N | Intel |
Description: IC FPGA 176 I/O 324UBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 25000 Supplier Device Package: 324-UBGA (15x15) Number of LABs/CLBs: 9434 Total RAM Bits: 2002944 Number of I/O: 176 DigiKey Programmable: Not Verified |
auf Bestellung 83 Stücke: Lieferzeit 21-28 Tag (e) |
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5CEBA2F17C6N | Intel |
Description: IC FPGA 128 I/O 256FBGA |
Produkt ist nicht verfügbar |
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5CSEBA5U19I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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5CSEBA5U23C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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5CEBA2F17I7N | Intel |
Description: IC FPGA 128 I/O 256FBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 25000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 9434 Total RAM Bits: 2002944 Number of I/O: 128 DigiKey Programmable: Not Verified |
auf Bestellung 120 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEBA5U23C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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5CEBA2F17A7N | Intel |
Description: IC FPGA 128 I/O 256FBGA |
Produkt ist nicht verfügbar |
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5CSEBA5U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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5CEBA4U15C6N | Intel |
Description: IC FPGA 176 I/O 324UBGA |
Produkt ist nicht verfügbar |
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5CSEBA5U19C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA |
Produkt ist nicht verfügbar |
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5CEBA4U15I7N | Intel |
Description: IC FPGA 176 I/O 324UBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 49000 Supplier Device Package: 324-UBGA (15x15) Number of LABs/CLBs: 18480 Total RAM Bits: 3464192 Part Status: Active Number of I/O: 176 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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5CSEBA5U19C7N | Intel | Description: IC SOC CORTEX-A9 800MHZ 484UBGA |
Produkt ist nicht verfügbar |
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EP4CGX15BF14A7N | Intel |
Description: IC FPGA 72 I/O 169FBGA Packaging: Tray Package / Case: 169-LBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.16V ~ 1.24V Number of Logic Elements/Cells: 14400 Supplier Device Package: 169-FBGA (14x14) Number of LABs/CLBs: 900 Total RAM Bits: 552960 Number of I/O: 72 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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5CEBA4F17C6N | Intel |
Description: IC FPGA 128 I/O 256FBGA |
Produkt ist nicht verfügbar |
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5CSEBA5U19C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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5CSEBA5U19I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 84 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSXFC5C6U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 60 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSXFC6D6F31C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 27 Stücke: Lieferzeit 21-28 Tag (e) |
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5CEBA4F17I7N | Intel |
Description: IC FPGA 128 I/O 256FBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 49000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 18480 Total RAM Bits: 3464192 Number of I/O: 128 DigiKey Programmable: Not Verified |
auf Bestellung 474 Stücke: Lieferzeit 21-28 Tag (e) |
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5CEBA4F17A7N | Intel |
Description: IC FPGA 128 I/O 256FBGA |
Produkt ist nicht verfügbar |
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5CSXFC6D6F31C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEMA5F31C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 16 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEBA6U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 35 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEMA6U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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5CSEMA6U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 65 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEBA5U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 60 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEBA5U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 110 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEMA5U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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5CSEMA5F31C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 27 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEMA5F31C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 13 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEMA5F31I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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5CSEMA5F31A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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5CSEBA6U19C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA |
Produkt ist nicht verfügbar |
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5CSEMA6F31C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEMA6F31C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEMA6F31C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 27 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEBA6U19I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 84 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEBA6U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 30 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEBA6U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 60 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSEMA5U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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5CSXFC6D6F31I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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5CSXFC5D6F31C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 896FBGA Packaging: Tray Package / Case: 896-BGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 27 Stücke: Lieferzeit 21-28 Tag (e) |
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DK-DEV-5CGTD9N | Intel |
Description: CYCLONE V GT DEVELOPMENT KIT Packaging: Box For Use With/Related Products: 5CGTFD9 Type: FPGA Contents: Board(s), Cable(s), Power Supply Platform: Cyclone V GT FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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| DK-DEV-5CSXC6N/ES | Intel |
Description: CYCLONE V SOC DEVELOPMENT KIT Packaging: Box For Use With/Related Products: 5CSXFC6 Type: FPGA Contents: Board(s), Cable(s), Power Supply Platform: Cyclone V SX SoC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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EPM7160EQI100-15 | Intel |
Description: IC CPLD 160MC 15NS 100QFP Packaging: Tray Package / Case: 100-BQFP Mounting Type: Surface Mount Programmable Type: EE PLD Number of Gates: 3200 Number of Macrocells: 160 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 15 ns Supplier Device Package: 100-PQFP (20x14) Number of Logic Elements/Blocks: 10 Voltage Supply - Internal: 4.75V ~ 5.25V Number of I/O: 84 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP3SE110F1152C2N | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.86V ~ 1.15V Number of Logic Elements/Cells: 107500 Supplier Device Package: 1152-FBGA (35x35) Number of LABs/CLBs: 4300 Total RAM Bits: 8936448 Part Status: Obsolete Number of I/O: 744 |
Produkt ist nicht verfügbar |
| EPCQ128SI16N |
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Hersteller: Intel
Description: IC CONFIG DEVICE 128MBIT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 128MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC CONFIG DEVICE 128MBIT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 128MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPCQ256SI16N |
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Hersteller: Intel
Description: IC CONFIG DEVICE 256MBIT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 256MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
DigiKey Programmable: Verified
Description: IC CONFIG DEVICE 256MBIT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 256MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| 5CSTFD5D5F31I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 963.56 EUR |
| 5CSEMA6F31I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 5CSXFC6C6U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 39 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 664.79 EUR |
| 5CSTFD6D5F31I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 5CSEMA6F31A7N |
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 700MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSXFC6C6U23C7N |
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| EP4CGX15BN11C7N |
|
Hersteller: Intel
Description: IC FPGA 72 I/O 148QFN
Packaging: Tray
Package / Case: 148-WFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.16V ~ 1.24V
Number of Logic Elements/Cells: 14400
Supplier Device Package: 148-QFN (11x11)
Number of LABs/CLBs: 900
Total RAM Bits: 552960
Number of I/O: 72
DigiKey Programmable: Not Verified
Description: IC FPGA 72 I/O 148QFN
Packaging: Tray
Package / Case: 148-WFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.16V ~ 1.24V
Number of Logic Elements/Cells: 14400
Supplier Device Package: 148-QFN (11x11)
Number of LABs/CLBs: 900
Total RAM Bits: 552960
Number of I/O: 72
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP4CGX15BN11I7N |
|
Hersteller: Intel
Description: IC FPGA 72 I/O 148QFN
Packaging: Tray
Package / Case: 148-WFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.16V ~ 1.24V
Number of Logic Elements/Cells: 14400
Supplier Device Package: 148-QFN (11x11)
Number of LABs/CLBs: 900
Total RAM Bits: 552960
Number of I/O: 72
DigiKey Programmable: Not Verified
Description: IC FPGA 72 I/O 148QFN
Packaging: Tray
Package / Case: 148-WFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.16V ~ 1.24V
Number of Logic Elements/Cells: 14400
Supplier Device Package: 148-QFN (11x11)
Number of LABs/CLBs: 900
Total RAM Bits: 552960
Number of I/O: 72
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 5CSXFC5C6U23C7N |
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 5CSXFC6C6U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 54 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 790.3 EUR |
| 5CEBA2U15C6N |
|
Hersteller: Intel
Description: IC FPGA 176 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 9434
Total RAM Bits: 2002944
Number of I/O: 176
DigiKey Programmable: Not Verified
Description: IC FPGA 176 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 9434
Total RAM Bits: 2002944
Number of I/O: 176
DigiKey Programmable: Not Verified
auf Bestellung 118 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 186 EUR |
| 5CSEBA5U19C8SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Produkt ist nicht verfügbar
| 5CEBA2U15I7N |
|
Hersteller: Intel
Description: IC FPGA 176 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 9434
Total RAM Bits: 2002944
Number of I/O: 176
DigiKey Programmable: Not Verified
Description: IC FPGA 176 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 9434
Total RAM Bits: 2002944
Number of I/O: 176
DigiKey Programmable: Not Verified
auf Bestellung 83 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 187.9 EUR |
| 5CSEBA5U19I7SN |
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 5CSEBA5U23C8SN |
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CEBA2F17I7N |
|
Hersteller: Intel
Description: IC FPGA 128 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 9434
Total RAM Bits: 2002944
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC FPGA 128 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 9434
Total RAM Bits: 2002944
Number of I/O: 128
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 165.46 EUR |
| 5CSEBA5U23C7SN |
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA5U23I7SN |
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 5CSEBA5U19C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Produkt ist nicht verfügbar
| 5CEBA4U15I7N |
|
Hersteller: Intel
Description: IC FPGA 176 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 49000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 18480
Total RAM Bits: 3464192
Part Status: Active
Number of I/O: 176
DigiKey Programmable: Not Verified
Description: IC FPGA 176 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 49000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 18480
Total RAM Bits: 3464192
Part Status: Active
Number of I/O: 176
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 5CSEBA5U19C7N |
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Produkt ist nicht verfügbar
| EP4CGX15BF14A7N |
|
Hersteller: Intel
Description: IC FPGA 72 I/O 169FBGA
Packaging: Tray
Package / Case: 169-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.16V ~ 1.24V
Number of Logic Elements/Cells: 14400
Supplier Device Package: 169-FBGA (14x14)
Number of LABs/CLBs: 900
Total RAM Bits: 552960
Number of I/O: 72
DigiKey Programmable: Not Verified
Description: IC FPGA 72 I/O 169FBGA
Packaging: Tray
Package / Case: 169-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.16V ~ 1.24V
Number of Logic Elements/Cells: 14400
Supplier Device Package: 169-FBGA (14x14)
Number of LABs/CLBs: 900
Total RAM Bits: 552960
Number of I/O: 72
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 5CSEBA5U19C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 5CSEBA5U19I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 84 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 515.16 EUR |
| 5CSXFC5C6U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 60 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 740.22 EUR |
| 5CSXFC6D6F31C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 712.3 EUR |
| 5CEBA4F17I7N |
|
Hersteller: Intel
Description: IC FPGA 128 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 49000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 18480
Total RAM Bits: 3464192
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC FPGA 128 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 49000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 18480
Total RAM Bits: 3464192
Number of I/O: 128
DigiKey Programmable: Not Verified
auf Bestellung 474 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 234.83 EUR |
| 5CSXFC6D6F31C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 925MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1068.47 EUR |
| 5CSEMA5F31C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 16 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 442.1 EUR |
| 5CSEBA6U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 35 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 773.66 EUR |
| 5CSEMA6U23C8N |
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEMA6U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 65 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 796.25 EUR |
| 5CSEBA5U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 60 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 380.67 EUR |
| 5CSEBA5U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 110 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 570.99 EUR |
| 5CSEMA5U23C8N |
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEMA5F31C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 552.66 EUR |
| 5CSEMA5F31C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 925MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 663.23 EUR |
| 5CSEMA5F31I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 5CSEMA5F31A7N |
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 700MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA6U19C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Produkt ist nicht verfügbar
| 5CSEMA6F31C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 584.69 EUR |
| 5CSEMA6F31C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 730.89 EUR |
| 5CSEMA6F31C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 925MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 877.06 EUR |
| 5CSEBA6U19I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 84 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 713.73 EUR |
| 5CSEBA6U23C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 644.72 EUR |
| 5CSEBA6U23C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 60 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 773.66 EUR |
| 5CSEMA5U23C6N |
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSXFC6D6F31I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1068.47 EUR |
| 5CSXFC5D6F31C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 557.31 EUR |
| DK-DEV-5CGTD9N |
|
Hersteller: Intel
Description: CYCLONE V GT DEVELOPMENT KIT
Packaging: Box
For Use With/Related Products: 5CGTFD9
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GT FPGA
Part Status: Active
Description: CYCLONE V GT DEVELOPMENT KIT
Packaging: Box
For Use With/Related Products: 5CGTFD9
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GT FPGA
Part Status: Active
Produkt ist nicht verfügbar
| DK-DEV-5CSXC6N/ES |
|
Hersteller: Intel
Description: CYCLONE V SOC DEVELOPMENT KIT
Packaging: Box
For Use With/Related Products: 5CSXFC6
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V SX SoC
Part Status: Obsolete
Description: CYCLONE V SOC DEVELOPMENT KIT
Packaging: Box
For Use With/Related Products: 5CSXFC6
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V SX SoC
Part Status: Obsolete
Produkt ist nicht verfügbar
| EPM7160EQI100-15 |
|
Hersteller: Intel
Description: IC CPLD 160MC 15NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 3200
Number of Macrocells: 160
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 10
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 84
DigiKey Programmable: Not Verified
Description: IC CPLD 160MC 15NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 3200
Number of Macrocells: 160
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 10
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 84
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP3SE110F1152C2N |
|
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.86V ~ 1.15V
Number of Logic Elements/Cells: 107500
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 4300
Total RAM Bits: 8936448
Part Status: Obsolete
Number of I/O: 744
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.86V ~ 1.15V
Number of Logic Elements/Cells: 107500
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 4300
Total RAM Bits: 8936448
Part Status: Obsolete
Number of I/O: 744
Produkt ist nicht verfügbar