| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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EVB-EY1603TI-ADJ | Intel |
 Description: EVAL BOARD LINEAR REG 150MA 40V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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ED8106N00QI | Intel | Description: IC REG CTRLR BUCK 24QFN |
auf Bestellung 1754 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA2U19C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA2U19C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA2U19I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Supplier Device Package: 484-UBGA (19x19) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 484-FBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA4U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 925MHz Package / Case: 672-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA4U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 672-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA2U19I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CGXFC5C6F23A7N | Intel |
Description: IC FPGA 240 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 77000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 29080 Total RAM Bits: 5001216 Number of I/O: 240 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA2U19C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA2U19C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA2U19C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 99 Stücke: Lieferzeit 10-14 Tag (e) |
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5CSEBA2U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA2U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA2U23C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA2U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Architecture: MCU, FPGA Supplier Device Package: 484-UBGA (19x19) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 484-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Architecture: MCU, FPGA Supplier Device Package: 484-UBGA (19x19) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 600MHz Package / Case: 484-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Architecture: MCU, FPGA Supplier Device Package: 484-UBGA (19x19) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 600MHz Package / Case: 484-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U19I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 484-FBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 484-UBGA (19x19) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
auf Bestellung 207 Stücke: Lieferzeit 10-14 Tag (e) |
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5CSEBA4U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 64KB Speed: 700MHz Package / Case: 672-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U23C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEBA4U23C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Primary Attributes: FPGA - 40K Logic Elements Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 600MHz Package / Case: 672-FBGA Packaging: Tray |
auf Bestellung 41 Stücke: Lieferzeit 10-14 Tag (e) |
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5CSEBA4U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA2U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Qualification: AEC-Q100 Grade: Automotive Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 25K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 64KB Speed: 700MHz Package / Case: 672-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA2U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA2U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA2U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA2U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 25K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 672-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA4U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Qualification: AEC-Q100 Grade: Automotive Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 64KB Speed: 700MHz Package / Case: 672-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA4U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 800MHz Package / Case: 672-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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5CSEMA4U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Architecture: MCU, FPGA Supplier Device Package: 672-UBGA (23x23) Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 40K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 85°C (TJ) RAM Size: 64KB Speed: 600MHz Package / Case: 672-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
| EVB-ED8101P02QI | Intel |
Description: EVAL BOARD FOR ED8101 Supplied Contents: Board(s) Utilized IC / Part: ED8101, ET4040 Type: Power Management Function: Digital Power Controller Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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EVB-EY1501DI-ADJ | Intel |
Description: EVAL BAORD FOR EY1501 Channels per IC: 1 - Single Supplied Contents: Board(s) Utilized IC / Part: EY1501DI-ADJ Board Type: Fully Populated Regulator Type: Positive Adjustable Current - Output: 1A Voltage - Input: 2.2V ~ 6V Voltage - Output: 0.8V ~ 5V Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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EVI-ED8100COMMIF | Intel |
Description: DONGLE FOR ED8100 SERIES Accessory Type: Interface Board Packaging: Bulk |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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ED8101P00QI | Intel |
Description: IC REG CTRLR BUCK I2C 24QFN Number of Outputs: 1 Clock Sync: No Duty Cycle (Max): 100% Output Phases: 1 Serial Interfaces: I²C Control Features: Power Good Supplier Device Package: 24-QFN (4x4) Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V Topology: Buck Frequency - Switching: 500kHz ~ 1MHz Output Configuration: Positive Operating Temperature: -40°C ~ 85°C (TA) Function: Step-Down Mounting Type: Surface Mount Output Type: PWM Signal Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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ER3110DI | Intel |
Description: IC REG BUCK ADJUSTABLE 1A 12DFN Part Status: Obsolete Voltage - Output (Min/Fixed): 0.6V Voltage - Input (Min): 3V Voltage - Output (Max): 34V Synchronous Rectifier: Yes Supplier Device Package: 12-DFN (4x3) Topology: Buck Voltage - Input (Max): 36V Frequency - Switching: 300kHz ~ 2MHz Output Configuration: Positive Operating Temperature: -40°C ~ 125°C (TA) Current - Output: 1A Function: Step-Down Number of Outputs: 1 Mounting Type: Surface Mount Output Type: Adjustable Package / Case: 12-VFDFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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ES1020QI | Intel | Description: IC CONTROLLER SEQUENCING 24QFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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ES1022SI | Intel |
Description: IC CONTROLLER HOT SWAP 14SOIC DigiKey Programmable: Not Verified Current - Supply: 286 µA Supplier Device Package: 14-SOIC Applications: Power Supply Sequencer Voltage - Supply: 3.3V ~ 24V Operating Temperature: -40°C ~ 85°C Voltage - Input: 3.3V ~ 24V Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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EY1501DI-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 1A 10DFN Current - Supply (Max): 7 mA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 212mV @ 1A PSRR: 72dB ~ 58dB (120Hz ~ 1KHz) Part Status: Obsolete Control Features: Enable, Power Good, Soft Start Voltage - Output (Min/Fixed): 0.8V Voltage - Output (Max): 5V Supplier Device Package: 10-DFN (3x3) Number of Regulators: 1 Voltage - Input (Max): 6V Current - Quiescent (Iq): 5 mA Output Configuration: Positive Operating Temperature: -40°C ~ 125°C Current - Output: 1A Mounting Type: Surface Mount Output Type: Adjustable Package / Case: 10-VFDFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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EY1601SA-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 50MA 8SOIC |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||
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ER3110DI | Intel |
Description: IC REG BUCK ADJUSTABLE 1A 12DFN Part Status: Obsolete Voltage - Output (Min/Fixed): 0.6V Voltage - Input (Min): 3V Voltage - Output (Max): 34V Synchronous Rectifier: Yes Supplier Device Package: 12-DFN (4x3) Topology: Buck Voltage - Input (Max): 36V Frequency - Switching: 300kHz ~ 2MHz Output Configuration: Positive Operating Temperature: -40°C ~ 125°C (TA) Current - Output: 1A Function: Step-Down Number of Outputs: 1 Mounting Type: Surface Mount Output Type: Adjustable Package / Case: 12-VFDFN Exposed Pad Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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ES1020QI | Intel | Description: IC CONTROLLER SEQUENCING 24QFN |
auf Bestellung 211 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||
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ES1022SI | Intel |
Description: IC CONTROLLER HOT SWAP 14SOIC Voltage - Supply: 3.3V ~ 24V Operating Temperature: -40°C ~ 85°C Voltage - Input: 3.3V ~ 24V Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) DigiKey Programmable: Not Verified Current - Supply: 286 µA Supplier Device Package: 14-SOIC Applications: Power Supply Sequencer |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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EY1501DI-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 1A 10DFN Current - Supply (Max): 7 mA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 212mV @ 1A PSRR: 72dB ~ 58dB (120Hz ~ 1KHz) Part Status: Obsolete Control Features: Enable, Power Good, Soft Start Voltage - Output (Min/Fixed): 0.8V Voltage - Output (Max): 5V Supplier Device Package: 10-DFN (3x3) Number of Regulators: 1 Voltage - Input (Max): 6V Current - Quiescent (Iq): 5 mA Output Configuration: Positive Operating Temperature: -40°C ~ 125°C Current - Output: 1A Mounting Type: Surface Mount Output Type: Adjustable Package / Case: 10-VFDFN Exposed Pad Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| ED8101P01QI | Intel |
Description: IC PWM CTRLR SGL TRUE DGTL 24QFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| ED8101P02QI | Intel |
Description: IC PWM CTRLR SGL TRUE DGTL 24QFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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ED8106N02QI | Intel |
Description: IC REG CTRLR BUCK 24QFN Output Type: PWM Signal Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) Number of Outputs: 1 Part Status: Obsolete Clock Sync: No Duty Cycle (Max): 100% Output Phases: 1 Control Features: Power Good Supplier Device Package: 24-QFN (4x4) Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V Topology: Buck Frequency - Switching: 500kHz ~ 1MHz Output Configuration: Positive Operating Temperature: -40°C ~ 85°C (TA) Function: Step-Down Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| EQC1241QI | Intel | Description: IC REG BUCK SYNC 2A 24QFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||
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EN23F2QI | Intel |
Description: DC DC CONVERTER 0.75-3.3V Number of Outputs: 1 Control Features: Enable, Active High Voltage - Output 1: 0.75 ~ 3.3V Voltage - Input (Min): 4.5V Supplier Device Package: 92-QFN (13x12) Current - Output (Max): 15A Efficiency: 91% Voltage - Input (Max): 13.2V Applications: ITE (Commercial) Operating Temperature: -40°C ~ 85°C Type: Non-Isolated PoL Module Mounting Type: Surface Mount Size / Dimension: 0.51" L x 0.47" W x 0.12" H (13.0mm x 12.0mm x 3.0mm) Package / Case: 92-PowerBFQFN Module Features: Remote On/Off, OCP, OTP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| EN5310DC | Intel |
Description: DC DC CONVERTER 0.8-3.3V 3W Number of Outputs: 1 Control Features: Enable, Active High Voltage - Output 1: 0.8 ~ 3.3V Voltage - Input (Min): 2.375V Supplier Device Package: 36-DFN (12.5x8.1) Current - Output (Max): 1A Efficiency: 90% Voltage - Input (Max): 5.5V Applications: ITE (Commercial) Operating Temperature: 0°C ~ 70°C Type: Non-Isolated PoL Module Mounting Type: Surface Mount Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Package / Case: 36-PowerDFN Module Features: Remote On/Off, OCP, OTP, OVP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| EN5310DI | Intel |
Description: DC DC CONVERTER 0.8-3.3V 3W Features: Remote On/Off, OCP, OTP, OVP Packaging: Tape & Reel (TR) Package / Case: 36-PowerDFN Module Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 90% Current - Output (Max): 1A Supplier Device Package: 36-DFN (12.5x8.1) Voltage - Input (Min): 2.375V Voltage - Output 1: 0.8 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| EN5312QI | Intel |
Description: DC DC CONVERTER 0.6-6V 6W |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||
| EN5330DC | Intel |
Description: DC DC CONVERTER 0.8-3.3V 10W Features: Remote On/Off, OCP, OTP, OVP, UVLO Packaging: Tape & Reel (TR) Package / Case: 36-PowerDFN Module Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: 0°C ~ 70°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 90% Current - Output (Max): 3A Supplier Device Package: 36-DFN (12.5x8.1) Voltage - Input (Min): 2.375V Voltage - Output 1: 0.8 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| EN5330DI | Intel |
Description: DC DC CONVERTER 0.8-3.3V 10W Features: Remote On/Off, OCP, OTP, OVP, UVLO Packaging: Tape & Reel (TR) Package / Case: 36-PowerDFN Module Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 90% Current - Output (Max): 3A Supplier Device Package: 36-DFN (12.5x8.1) Voltage - Input (Min): 2.375V Voltage - Output 1: 0.8 ~ 3.3V Control Features: Enable, Active High Number of Outputs: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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5AGXBA1D4F27I5 | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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5AGXFB5K4F40I5 | Intel |
Description: IC FPGA 704 I/O 1517FBGA Number of I/O: 704 Part Status: Obsolete Total RAM Bits: 23625728 Number of LABs/CLBs: 19811 Supplier Device Package: 1517-FBGA (40x40) Number of Logic Elements/Cells: 420000 Voltage - Supply: 1.07V ~ 1.13V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1517-BBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| EVB-EY1603TI-ADJ |
|
Hersteller: Intel
Description: EVAL BOARD LINEAR REG 150MA 40V
Description: EVAL BOARD LINEAR REG 150MA 40V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ED8106N00QI |
Hersteller: Intel
Description: IC REG CTRLR BUCK 24QFN
Description: IC REG CTRLR BUCK 24QFN
auf Bestellung 1754 Stücke:
Lieferzeit 10-14 Tag (e)
| 5CSEBA2U19C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA2U19C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
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Stück im Wert von UAH
| 5CSEBA2U19I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA4U19I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 484-FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 484-FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEMA4U23C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 925MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 925MHz
Package / Case: 672-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEMA4U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 672-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA2U19I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
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Stück im Wert von UAH
| 5CGXFC5C6F23A7N |
|
Hersteller: Intel
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 77000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 29080
Total RAM Bits: 5001216
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 77000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 29080
Total RAM Bits: 5001216
Number of I/O: 240
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA2U19C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
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Stück im Wert von UAH
| 5CSEBA2U19C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA2U19C8SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 140.32 EUR |
| 5CSEBA2U23C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 5CSEBA2U23C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| 5CSEBA2U23C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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| 5CSEBA2U23I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Produkt ist nicht verfügbar
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| 5CSEBA4U19C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Produkt ist nicht verfügbar
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| 5CSEBA4U19C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 484-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 484-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| 5CSEBA4U19C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 484-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 484-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| 5CSEBA4U19C8SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 484-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 484-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| 5CSEBA4U19I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 484-FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 484-FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 484-UBGA (19x19)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 262.7 EUR |
| 5CSEBA4U23A7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| 5CSEBA4U23C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Produkt ist nicht verfügbar
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| 5CSEBA4U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| 5CSEBA4U23C8SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 672-FBGA
Packaging: Tray
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 194.53 EUR |
| 5CSEBA4U23I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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| 5CSEMA2U23A7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Qualification: AEC-Q100
Grade: Automotive
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 25K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Qualification: AEC-Q100
Grade: Automotive
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 25K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| 5CSEMA2U23C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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| 5CSEMA2U23C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| 5CSEMA2U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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| 5CSEMA2U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 25K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 25K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 672-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| 5CSEMA4U23A7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Qualification: AEC-Q100
Grade: Automotive
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Qualification: AEC-Q100
Grade: Automotive
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 64KB
Speed: 700MHz
Package / Case: 672-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| 5CSEMA4U23C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 800MHz
Package / Case: 672-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| 5CSEMA4U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 672-FBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Architecture: MCU, FPGA
Supplier Device Package: 672-UBGA (23x23)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 40K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 64KB
Speed: 600MHz
Package / Case: 672-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| EVB-ED8101P02QI |
Hersteller: Intel
Description: EVAL BOARD FOR ED8101
Supplied Contents: Board(s)
Utilized IC / Part: ED8101, ET4040
Type: Power Management
Function: Digital Power Controller
Packaging: Bulk
Description: EVAL BOARD FOR ED8101
Supplied Contents: Board(s)
Utilized IC / Part: ED8101, ET4040
Type: Power Management
Function: Digital Power Controller
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
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| EVB-EY1501DI-ADJ |
|
Hersteller: Intel
Description: EVAL BAORD FOR EY1501
Channels per IC: 1 - Single
Supplied Contents: Board(s)
Utilized IC / Part: EY1501DI-ADJ
Board Type: Fully Populated
Regulator Type: Positive Adjustable
Current - Output: 1A
Voltage - Input: 2.2V ~ 6V
Voltage - Output: 0.8V ~ 5V
Packaging: Bulk
Description: EVAL BAORD FOR EY1501
Channels per IC: 1 - Single
Supplied Contents: Board(s)
Utilized IC / Part: EY1501DI-ADJ
Board Type: Fully Populated
Regulator Type: Positive Adjustable
Current - Output: 1A
Voltage - Input: 2.2V ~ 6V
Voltage - Output: 0.8V ~ 5V
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
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| EVI-ED8100COMMIF |
Hersteller: Intel
Description: DONGLE FOR ED8100 SERIES
Accessory Type: Interface Board
Packaging: Bulk
Description: DONGLE FOR ED8100 SERIES
Accessory Type: Interface Board
Packaging: Bulk
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 289.69 EUR |
| ED8101P00QI |
Hersteller: Intel
Description: IC REG CTRLR BUCK I2C 24QFN
Number of Outputs: 1
Clock Sync: No
Duty Cycle (Max): 100%
Output Phases: 1
Serial Interfaces: I²C
Control Features: Power Good
Supplier Device Package: 24-QFN (4x4)
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Topology: Buck
Frequency - Switching: 500kHz ~ 1MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Function: Step-Down
Mounting Type: Surface Mount
Output Type: PWM Signal
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC REG CTRLR BUCK I2C 24QFN
Number of Outputs: 1
Clock Sync: No
Duty Cycle (Max): 100%
Output Phases: 1
Serial Interfaces: I²C
Control Features: Power Good
Supplier Device Package: 24-QFN (4x4)
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Topology: Buck
Frequency - Switching: 500kHz ~ 1MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Function: Step-Down
Mounting Type: Surface Mount
Output Type: PWM Signal
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| ER3110DI |
|
Hersteller: Intel
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Part Status: Obsolete
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 3V
Voltage - Output (Max): 34V
Synchronous Rectifier: Yes
Supplier Device Package: 12-DFN (4x3)
Topology: Buck
Voltage - Input (Max): 36V
Frequency - Switching: 300kHz ~ 2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 1A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 12-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Part Status: Obsolete
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 3V
Voltage - Output (Max): 34V
Synchronous Rectifier: Yes
Supplier Device Package: 12-DFN (4x3)
Topology: Buck
Voltage - Input (Max): 36V
Frequency - Switching: 300kHz ~ 2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 1A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 12-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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| ES1020QI |
Hersteller: Intel
Description: IC CONTROLLER SEQUENCING 24QFN
Description: IC CONTROLLER SEQUENCING 24QFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| ES1022SI |
|
Hersteller: Intel
Description: IC CONTROLLER HOT SWAP 14SOIC
DigiKey Programmable: Not Verified
Current - Supply: 286 µA
Supplier Device Package: 14-SOIC
Applications: Power Supply Sequencer
Voltage - Supply: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3.3V ~ 24V
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC CONTROLLER HOT SWAP 14SOIC
DigiKey Programmable: Not Verified
Current - Supply: 286 µA
Supplier Device Package: 14-SOIC
Applications: Power Supply Sequencer
Voltage - Supply: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3.3V ~ 24V
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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| EY1501DI-ADJ |
|
Hersteller: Intel
Description: IC REG LINEAR POS ADJ 1A 10DFN
Current - Supply (Max): 7 mA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 212mV @ 1A
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Part Status: Obsolete
Control Features: Enable, Power Good, Soft Start
Voltage - Output (Min/Fixed): 0.8V
Voltage - Output (Max): 5V
Supplier Device Package: 10-DFN (3x3)
Number of Regulators: 1
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 5 mA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 1A
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC REG LINEAR POS ADJ 1A 10DFN
Current - Supply (Max): 7 mA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 212mV @ 1A
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Part Status: Obsolete
Control Features: Enable, Power Good, Soft Start
Voltage - Output (Min/Fixed): 0.8V
Voltage - Output (Max): 5V
Supplier Device Package: 10-DFN (3x3)
Number of Regulators: 1
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 5 mA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 1A
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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| EY1601SA-ADJ |
|
Hersteller: Intel
Description: IC REG LINEAR POS ADJ 50MA 8SOIC
Description: IC REG LINEAR POS ADJ 50MA 8SOIC
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| ER3110DI |
|
Hersteller: Intel
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Part Status: Obsolete
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 3V
Voltage - Output (Max): 34V
Synchronous Rectifier: Yes
Supplier Device Package: 12-DFN (4x3)
Topology: Buck
Voltage - Input (Max): 36V
Frequency - Switching: 300kHz ~ 2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 1A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 12-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC REG BUCK ADJUSTABLE 1A 12DFN
Part Status: Obsolete
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 3V
Voltage - Output (Max): 34V
Synchronous Rectifier: Yes
Supplier Device Package: 12-DFN (4x3)
Topology: Buck
Voltage - Input (Max): 36V
Frequency - Switching: 300kHz ~ 2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 1A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 12-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
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| ES1020QI |
Hersteller: Intel
Description: IC CONTROLLER SEQUENCING 24QFN
Description: IC CONTROLLER SEQUENCING 24QFN
auf Bestellung 211 Stücke:
Lieferzeit 10-14 Tag (e)
| ES1022SI |
|
Hersteller: Intel
Description: IC CONTROLLER HOT SWAP 14SOIC
Voltage - Supply: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3.3V ~ 24V
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Current - Supply: 286 µA
Supplier Device Package: 14-SOIC
Applications: Power Supply Sequencer
Description: IC CONTROLLER HOT SWAP 14SOIC
Voltage - Supply: 3.3V ~ 24V
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3.3V ~ 24V
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Current - Supply: 286 µA
Supplier Device Package: 14-SOIC
Applications: Power Supply Sequencer
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| EY1501DI-ADJ |
|
Hersteller: Intel
Description: IC REG LINEAR POS ADJ 1A 10DFN
Current - Supply (Max): 7 mA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 212mV @ 1A
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Part Status: Obsolete
Control Features: Enable, Power Good, Soft Start
Voltage - Output (Min/Fixed): 0.8V
Voltage - Output (Max): 5V
Supplier Device Package: 10-DFN (3x3)
Number of Regulators: 1
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 5 mA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 1A
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 10-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC REG LINEAR POS ADJ 1A 10DFN
Current - Supply (Max): 7 mA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 212mV @ 1A
PSRR: 72dB ~ 58dB (120Hz ~ 1KHz)
Part Status: Obsolete
Control Features: Enable, Power Good, Soft Start
Voltage - Output (Min/Fixed): 0.8V
Voltage - Output (Max): 5V
Supplier Device Package: 10-DFN (3x3)
Number of Regulators: 1
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 5 mA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 1A
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 10-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
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| ED8106N02QI |
Hersteller: Intel
Description: IC REG CTRLR BUCK 24QFN
Output Type: PWM Signal
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of Outputs: 1
Part Status: Obsolete
Clock Sync: No
Duty Cycle (Max): 100%
Output Phases: 1
Control Features: Power Good
Supplier Device Package: 24-QFN (4x4)
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Topology: Buck
Frequency - Switching: 500kHz ~ 1MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Function: Step-Down
Mounting Type: Surface Mount
Description: IC REG CTRLR BUCK 24QFN
Output Type: PWM Signal
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of Outputs: 1
Part Status: Obsolete
Clock Sync: No
Duty Cycle (Max): 100%
Output Phases: 1
Control Features: Power Good
Supplier Device Package: 24-QFN (4x4)
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Topology: Buck
Frequency - Switching: 500kHz ~ 1MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Function: Step-Down
Mounting Type: Surface Mount
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| EQC1241QI |
Hersteller: Intel
Description: IC REG BUCK SYNC 2A 24QFN
Description: IC REG BUCK SYNC 2A 24QFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| EN23F2QI |
|
Hersteller: Intel
Description: DC DC CONVERTER 0.75-3.3V
Number of Outputs: 1
Control Features: Enable, Active High
Voltage - Output 1: 0.75 ~ 3.3V
Voltage - Input (Min): 4.5V
Supplier Device Package: 92-QFN (13x12)
Current - Output (Max): 15A
Efficiency: 91%
Voltage - Input (Max): 13.2V
Applications: ITE (Commercial)
Operating Temperature: -40°C ~ 85°C
Type: Non-Isolated PoL Module
Mounting Type: Surface Mount
Size / Dimension: 0.51" L x 0.47" W x 0.12" H (13.0mm x 12.0mm x 3.0mm)
Package / Case: 92-PowerBFQFN Module
Features: Remote On/Off, OCP, OTP
Packaging: Tape & Reel (TR)
Description: DC DC CONVERTER 0.75-3.3V
Number of Outputs: 1
Control Features: Enable, Active High
Voltage - Output 1: 0.75 ~ 3.3V
Voltage - Input (Min): 4.5V
Supplier Device Package: 92-QFN (13x12)
Current - Output (Max): 15A
Efficiency: 91%
Voltage - Input (Max): 13.2V
Applications: ITE (Commercial)
Operating Temperature: -40°C ~ 85°C
Type: Non-Isolated PoL Module
Mounting Type: Surface Mount
Size / Dimension: 0.51" L x 0.47" W x 0.12" H (13.0mm x 12.0mm x 3.0mm)
Package / Case: 92-PowerBFQFN Module
Features: Remote On/Off, OCP, OTP
Packaging: Tape & Reel (TR)
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| EN5310DC |
Hersteller: Intel
Description: DC DC CONVERTER 0.8-3.3V 3W
Number of Outputs: 1
Control Features: Enable, Active High
Voltage - Output 1: 0.8 ~ 3.3V
Voltage - Input (Min): 2.375V
Supplier Device Package: 36-DFN (12.5x8.1)
Current - Output (Max): 1A
Efficiency: 90%
Voltage - Input (Max): 5.5V
Applications: ITE (Commercial)
Operating Temperature: 0°C ~ 70°C
Type: Non-Isolated PoL Module
Mounting Type: Surface Mount
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Package / Case: 36-PowerDFN Module
Features: Remote On/Off, OCP, OTP, OVP
Packaging: Tape & Reel (TR)
Description: DC DC CONVERTER 0.8-3.3V 3W
Number of Outputs: 1
Control Features: Enable, Active High
Voltage - Output 1: 0.8 ~ 3.3V
Voltage - Input (Min): 2.375V
Supplier Device Package: 36-DFN (12.5x8.1)
Current - Output (Max): 1A
Efficiency: 90%
Voltage - Input (Max): 5.5V
Applications: ITE (Commercial)
Operating Temperature: 0°C ~ 70°C
Type: Non-Isolated PoL Module
Mounting Type: Surface Mount
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Package / Case: 36-PowerDFN Module
Features: Remote On/Off, OCP, OTP, OVP
Packaging: Tape & Reel (TR)
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| EN5310DI |
Hersteller: Intel
Description: DC DC CONVERTER 0.8-3.3V 3W
Features: Remote On/Off, OCP, OTP, OVP
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 1A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.8-3.3V 3W
Features: Remote On/Off, OCP, OTP, OVP
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 1A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| EN5312QI |
|
Hersteller: Intel
Description: DC DC CONVERTER 0.6-6V 6W
Description: DC DC CONVERTER 0.6-6V 6W
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| EN5330DC |
|
Hersteller: Intel
Description: DC DC CONVERTER 0.8-3.3V 10W
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: 0°C ~ 70°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.8-3.3V 10W
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: 0°C ~ 70°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| EN5330DI |
|
Hersteller: Intel
Description: DC DC CONVERTER 0.8-3.3V 10W
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
Description: DC DC CONVERTER 0.8-3.3V 10W
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerDFN Module
Size / Dimension: 0.49" L x 0.32" W x 0.08" H (12.5mm x 8.1mm x 2.1mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 90%
Current - Output (Max): 3A
Supplier Device Package: 36-DFN (12.5x8.1)
Voltage - Input (Min): 2.375V
Voltage - Output 1: 0.8 ~ 3.3V
Control Features: Enable, Active High
Number of Outputs: 1
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| 5AGXBA1D4F27I5 |
|
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
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| 5AGXFB5K4F40I5 |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 1517FBGA
Number of I/O: 704
Part Status: Obsolete
Total RAM Bits: 23625728
Number of LABs/CLBs: 19811
Supplier Device Package: 1517-FBGA (40x40)
Number of Logic Elements/Cells: 420000
Voltage - Supply: 1.07V ~ 1.13V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1517-BBGA
Packaging: Tray
Description: IC FPGA 704 I/O 1517FBGA
Number of I/O: 704
Part Status: Obsolete
Total RAM Bits: 23625728
Number of LABs/CLBs: 19811
Supplier Device Package: 1517-FBGA (40x40)
Number of Logic Elements/Cells: 420000
Voltage - Supply: 1.07V ~ 1.13V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1517-BBGA
Packaging: Tray
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