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EP4CE75F29C8N EP4CE75F29C8N Intel Cyclone IV Device Handbook, Volume 3_Web.pdf Description: IC FPGA 426 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 75408
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4713
Total RAM Bits: 2810880
Number of I/O: 426
DigiKey Programmable: Not Verified
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EP4CE40F23I7 EP4CE40F23I7 Intel Cyclone%20IV%20Device%20Handbook%2C%20Volume%203_Web.pdf Description: IC FPGA 328 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 39600
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2475
Total RAM Bits: 1161216
Number of I/O: 328
DigiKey Programmable: Not Verified
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RJ80530VY800256 Intel Description: TUALITAN PENTIUM PROCESSOR
Packaging: Bulk
auf Bestellung 5066 Stücke:
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EP2SEVOL2F672NAA Intel Description: IC FPGA STRATIX II 672BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10M50DDF484C8G 10M50DDF484C8G Intel Intel®_MAX®_10 FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 360 I/O 484FBGA
DigiKey Programmable: Not Verified
Number of I/O: 360
Total RAM Bits: 1677312
Number of LABs/CLBs: 3125
Supplier Device Package: 484-FBGA (23x23)
Number of Logic Elements/Cells: 50000
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BGA
Packaging: Tray
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25+344.79 EUR
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10M50DDF672C8G 10M50DDF672C8G Intel Intel®_MAX®_10%20FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 500 I/O 672FBGA
DigiKey Programmable: Not Verified
Number of I/O: 500
Total RAM Bits: 1677312
Number of LABs/CLBs: 3125
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 50000
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 672-BGA
Packaging: Tray
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25+405.29 EUR
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10M50DDF484I7G 10M50DDF484I7G Intel Intel®_MAX®_10 FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 360 I/O 484FBGA
DigiKey Programmable: Not Verified
Number of I/O: 360
Total RAM Bits: 1677312
Number of LABs/CLBs: 3125
Supplier Device Package: 484-FBGA (23x23)
Number of Logic Elements/Cells: 50000
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BGA
Packaging: Tray
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10M50DDF672I7G 10M50DDF672I7G Intel Intel®_MAX®_10%20FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 500 I/O 672FBGA
DigiKey Programmable: Not Verified
Number of I/O: 500
Total RAM Bits: 1677312
Number of LABs/CLBs: 3125
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 50000
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 672-BGA
Packaging: Tray
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25+540.38 EUR
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10AX032H3F34E2SG 10AX032H3F34E2SG Intel arria-10-aib.pdf Description: IC FPGA 384 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 1152-FBGA, FC (35x35)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 384
DigiKey Programmable: Not Verified
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10AX032E3F29I2LG 10AX032E3F29I2LG Intel arria-10-aib.pdf Description: IC FPGA 360 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 780-FBGA, FC (29x29)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 360
DigiKey Programmable: Not Verified
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BXC80557E2140 Intel INTLS02014-1.pdf?t.download=true&u=5oefqw Description: IC MPU E2000 1.6GHZ 775LGA
Voltage - I/O: 0.85V, 1.5V
Core Processor: Intel® Pentium® Dual-Core Desktop Processor
Operating Temperature: 73.3°C (TC)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 775-LGA
Packaging: Bulk
Display & Interface Controllers: Video
Graphics Acceleration: Yes
Number of Cores/Bus Width: 2 Core, 64-Bit
Supplier Device Package: 775-LGA (37.5x37.5)
Produkt ist nicht verfügbar
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FW82810 Intel INTLS00337-1.pdf?t.download=true&u=5oefqw Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
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FW82810E Intel INTLS02129-1.pdf?t.download=true&u=5oefqw Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.7V ~ 1.9V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
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EP1K10TC100-2NGZ EP1K10TC100-2NGZ Intel ACEX_1K_Ver3.4_May2003.pdf Description: IC FPGA 66 I/O 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Total RAM Bits: 12288
Number of LABs/CLBs: 72
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Cells: 576
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 70°C (TA)
Number of Gates: 56000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43E3VG 1SG211HN3F43E3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43E2VG 1SG211HN3F43E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43I3VG 1SG211HN3F43I3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43E1VG 1SG211HN3F43E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43I2VG 1SG211HN3F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN2F43E2VGAS 1SG211HN2F43E2VGAS Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN2F43E2VG 1SG211HN2F43E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN3F43E2LG 1SG211HN3F43E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN3F43E3XG 1SG211HN3F43E3XG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43I1VG 1SG211HN3F43I1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN2F43E1VG 1SG211HN2F43E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43E2VG 1SG211HN1F43E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN2F43I2VG 1SG211HN2F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43E2LG 1SG211HN2F43E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43I2LG 1SG211HN3F43I2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43I3XG 1SG211HN3F43I3XG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Produkt ist nicht verfügbar
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1SG211HN1F43E1VG 1SG211HN1F43E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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1SG211HN2F43I1VG 1SG211HN2F43I1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN1F43I2VG 1SG211HN1F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN1F43E2LG 1SG211HN1F43E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Produkt ist nicht verfügbar
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1SG211HN2F43I2LG 1SG211HN2F43I2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN1F43I1VG 1SG211HN1F43I1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN1F43I2LG 1SG211HN1F43I2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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AT80573JH0366M S LBB3 Intel Description: AT80573J - Intel Xeon Processor
Packaging: Bulk
Produkt ist nicht verfügbar
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AT80573JH0366M S LBB3-CONS Intel Description: AT805INTXEPROCESSL5215
Packaging: Tape & Box (TB)
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EPM1270F256I5RR Intel Description: IC CPLD 980MC 10NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
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EPM1270F256C5NRR Intel Description: IC CPLD 980MC 10NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
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EPM1270GF256C5RR Intel Description: IC CPLD 980MC 6.2NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 6.2 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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EP20K400CF672C9 EP20K400CF672C9 Intel APEX_20KC_Ver2.2_Feb2004.pdf Description: IC FPGA 488 I/O 672FBGA
Mounting Type: Surface Mount
Package / Case: 672-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 488
Total RAM Bits: 212992
Number of LABs/CLBs: 1664
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 16640
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 1052000
Produkt ist nicht verfügbar
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EP20K400EFI672-2N EP20K400EFI672-2N Intel 20K_Family_DS.pdf Description: IC FPGA 488 I/O 672FBGA
DigiKey Programmable: Not Verified
Number of I/O: 488
Total RAM Bits: 212992
Number of LABs/CLBs: 1664
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 16640
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 1052000
Mounting Type: Surface Mount
Package / Case: 672-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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EPM570GT100C4 EPM570GT100C4 Intel max2_mii51006.pdf Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
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EP2AGX95DF25I3G Intel Description: IC FPGA 260 I/O 572FBGA
DigiKey Programmable: Not Verified
Number of I/O: 260
Total RAM Bits: 6839296
Number of LABs/CLBs: 3747
Supplier Device Package: 572-FBGA, FC (25x25)
Number of Logic Elements/Cells: 89178
Voltage - Supply: 0.87V ~ 0.93V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 572-BGA, FCBGA
Packaging: Tray
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DK-DEV-5CGXC7N/P Intel Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
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DK-DEV-5CGXC7N Intel Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
Produkt ist nicht verfügbar
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1SG280HN3F43E3VG 1SG280HN3F43E3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG280HN3F43E3VGAS 1SG280HN3F43E3VGAS Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG280HN3F43E3VGS3 1SG280HN3F43E3VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG250HU3F50I3XG 1SG250HU3F50I3XG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
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AGIA040R39A2E3E Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2E2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A1E2VB Intel Description: IC FPGA AGILEX-I 3948BGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A1E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2E3E Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2I3V Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2I3V Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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EP4CE75F29C8N Cyclone IV Device Handbook, Volume 3_Web.pdf
EP4CE75F29C8N
Hersteller: Intel
Description: IC FPGA 426 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 75408
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4713
Total RAM Bits: 2810880
Number of I/O: 426
DigiKey Programmable: Not Verified
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EP4CE40F23I7 Cyclone%20IV%20Device%20Handbook%2C%20Volume%203_Web.pdf
EP4CE40F23I7
Hersteller: Intel
Description: IC FPGA 328 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 39600
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2475
Total RAM Bits: 1161216
Number of I/O: 328
DigiKey Programmable: Not Verified
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RJ80530VY800256
Hersteller: Intel
Description: TUALITAN PENTIUM PROCESSOR
Packaging: Bulk
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EP2SEVOL2F672NAA
Hersteller: Intel
Description: IC FPGA STRATIX II 672BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10M50DDF484C8G Intel®_MAX®_10 FPGA_Device_Datasheet.pdf
10M50DDF484C8G
Hersteller: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
DigiKey Programmable: Not Verified
Number of I/O: 360
Total RAM Bits: 1677312
Number of LABs/CLBs: 3125
Supplier Device Package: 484-FBGA (23x23)
Number of Logic Elements/Cells: 50000
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BGA
Packaging: Tray
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10M50DDF672C8G Intel®_MAX®_10%20FPGA_Device_Datasheet.pdf
10M50DDF672C8G
Hersteller: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
DigiKey Programmable: Not Verified
Number of I/O: 500
Total RAM Bits: 1677312
Number of LABs/CLBs: 3125
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 50000
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 672-BGA
Packaging: Tray
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10M50DDF484I7G Intel®_MAX®_10 FPGA_Device_Datasheet.pdf
10M50DDF484I7G
Hersteller: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
DigiKey Programmable: Not Verified
Number of I/O: 360
Total RAM Bits: 1677312
Number of LABs/CLBs: 3125
Supplier Device Package: 484-FBGA (23x23)
Number of Logic Elements/Cells: 50000
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BGA
Packaging: Tray
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10M50DDF672I7G Intel®_MAX®_10%20FPGA_Device_Datasheet.pdf
10M50DDF672I7G
Hersteller: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
DigiKey Programmable: Not Verified
Number of I/O: 500
Total RAM Bits: 1677312
Number of LABs/CLBs: 3125
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 50000
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 672-BGA
Packaging: Tray
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10AX032H3F34E2SG arria-10-aib.pdf
10AX032H3F34E2SG
Hersteller: Intel
Description: IC FPGA 384 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 1152-FBGA, FC (35x35)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10AX032E3F29I2LG arria-10-aib.pdf
10AX032E3F29I2LG
Hersteller: Intel
Description: IC FPGA 360 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 780-FBGA, FC (29x29)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 360
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BXC80557E2140 INTLS02014-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: IC MPU E2000 1.6GHZ 775LGA
Voltage - I/O: 0.85V, 1.5V
Core Processor: Intel® Pentium® Dual-Core Desktop Processor
Operating Temperature: 73.3°C (TC)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 775-LGA
Packaging: Bulk
Display & Interface Controllers: Video
Graphics Acceleration: Yes
Number of Cores/Bus Width: 2 Core, 64-Bit
Supplier Device Package: 775-LGA (37.5x37.5)
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FW82810 INTLS00337-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
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FW82810E INTLS02129-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.7V ~ 1.9V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
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EP1K10TC100-2NGZ ACEX_1K_Ver3.4_May2003.pdf
EP1K10TC100-2NGZ
Hersteller: Intel
Description: IC FPGA 66 I/O 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Total RAM Bits: 12288
Number of LABs/CLBs: 72
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Cells: 576
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 70°C (TA)
Number of Gates: 56000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43E3VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E3VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43E2VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43I3VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I3VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43E1VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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1SG211HN3F43I2VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN2F43E2VGAS 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E2VGAS
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN2F43E2VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN3F43E2LG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN3F43E3XG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E3XG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN3F43I1VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN2F43E1VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG211HN1F43E2VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43E2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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1SG211HN2F43I2VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43I2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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1SG211HN2F43E2LG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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1SG211HN3F43I2LG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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1SG211HN3F43I3XG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I3XG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Produkt ist nicht verfügbar
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1SG211HN1F43E1VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43E1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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1SG211HN2F43I1VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43I1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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1SG211HN1F43I2VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43I2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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1SG211HN1F43E2LG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43E2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Produkt ist nicht verfügbar
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1SG211HN2F43I2LG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43I2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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1SG211HN1F43I1VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43I1VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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1SG211HN1F43I2LG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43I2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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AT80573JH0366M S LBB3
Hersteller: Intel
Description: AT80573J - Intel Xeon Processor
Packaging: Bulk
Produkt ist nicht verfügbar
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AT80573JH0366M S LBB3-CONS
Hersteller: Intel
Description: AT805INTXEPROCESSL5215
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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EPM1270F256I5RR
Hersteller: Intel
Description: IC CPLD 980MC 10NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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EPM1270F256C5NRR
Hersteller: Intel
Description: IC CPLD 980MC 10NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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EPM1270GF256C5RR
Hersteller: Intel
Description: IC CPLD 980MC 6.2NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 6.2 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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EP20K400CF672C9 APEX_20KC_Ver2.2_Feb2004.pdf
EP20K400CF672C9
Hersteller: Intel
Description: IC FPGA 488 I/O 672FBGA
Mounting Type: Surface Mount
Package / Case: 672-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 488
Total RAM Bits: 212992
Number of LABs/CLBs: 1664
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 16640
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 1052000
Produkt ist nicht verfügbar
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EP20K400EFI672-2N 20K_Family_DS.pdf
EP20K400EFI672-2N
Hersteller: Intel
Description: IC FPGA 488 I/O 672FBGA
DigiKey Programmable: Not Verified
Number of I/O: 488
Total RAM Bits: 212992
Number of LABs/CLBs: 1664
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 16640
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 1052000
Mounting Type: Surface Mount
Package / Case: 672-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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EPM570GT100C4 max2_mii51006.pdf
EPM570GT100C4
Hersteller: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP2AGX95DF25I3G
Hersteller: Intel
Description: IC FPGA 260 I/O 572FBGA
DigiKey Programmable: Not Verified
Number of I/O: 260
Total RAM Bits: 6839296
Number of LABs/CLBs: 3747
Supplier Device Package: 572-FBGA, FC (25x25)
Number of Logic Elements/Cells: 89178
Voltage - Supply: 0.87V ~ 0.93V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 572-BGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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DK-DEV-5CGXC7N/P
Hersteller: Intel
Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
Produkt ist nicht verfügbar
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DK-DEV-5CGXC7N
Hersteller: Intel
Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
Produkt ist nicht verfügbar
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1SG280HN3F43E3VG 10_GX_SX_Device_Overview.pdf
1SG280HN3F43E3VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HN3F43E3VGAS 10_GX_SX_Device_Overview.pdf
1SG280HN3F43E3VGAS
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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1SG280HN3F43E3VGS3 10_GX_SX_Device_Overview.pdf
1SG280HN3F43E3VGS3
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG250HU3F50I3XG 10_GX_SX_Device_Overview.pdf
1SG250HU3F50I3XG
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AGIA040R39A2E3E
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIA040R39A2E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIA040R39A2E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIA040R39A1E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948BGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIA040R39A1E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A2E3E
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A2I3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIA040R39A2I3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
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