Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (354044) > Seite 1051 nach 5901
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M2S010TS-1VFG256I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 10K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 2088 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S010TS-VF400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 10K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
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M2S010TS-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 10K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
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M2S010T-VFG256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 10K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 177 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S010-VFG256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 10K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 224 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S010-VFG256I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 10K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 111 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S025-1FCS325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-1FCS325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-1FCSG325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-1FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-1VF256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-1VFG256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-FCS325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-FCS325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-FCSG325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 360 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S025T-1FCS325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025T-1FCS325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025T-1FCSG325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025T-1FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025T-FCS325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025T-FCS325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025T-FCSG325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025T-FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025TS-1FCS325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025TS-1FCSG325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025TS-FCS325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025TS-FCS325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025TS-FCSG325 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025TS-FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025TS-VF400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
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M2S025TS-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
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M2S025TS-VFG400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025T-VF256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025T-VFG256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-VF256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-VF256I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (14x14) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-VFG256 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
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M2S025-VFG256I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Package / Case: 256-LBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 256-FPBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 129 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S050-FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 139 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S050T-FG484I | Microchip Technology | Description: IC SOC CORTEX-M3 166MHZ 484FBGA |
Produkt ist nicht verfügbar |
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M2S050TS-VF400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
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M2S050TS-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
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M2S050-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 50K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
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M2S060-1FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
auf Bestellung 176 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S060-FCSG325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x11) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 814 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S060T-1FGG484I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Packaging: Tray Package / Case: 484-BGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 484-FPBGA (23x23) Architecture: MCU, FPGA Flash Size: 256KB |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S060TS-VF400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
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M2S060TS-VF400I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 60K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
Produkt ist nicht verfügbar |
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M2S090-FGG484I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Packaging: Tray Package / Case: 484-BGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 90K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 484-FPBGA (23x23) Architecture: MCU, FPGA Flash Size: 512KB Part Status: Active |
auf Bestellung 164 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S090TS-1FCS325I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 325BGA Packaging: Tray Package / Case: 325-TFBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 90K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 325-FCBGA (11x13.5) Architecture: MCU, FPGA Flash Size: 512KB |
auf Bestellung 699 Stücke: Lieferzeit 10-14 Tag (e) |
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M2S150-1FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
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M2S150-1FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
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M2S150-1FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
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M2S150-1FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
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M2S150-FCS536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
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M2S150-FCS536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
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M2S150-FCSG536 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
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M2S150-FCSG536I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Package / Case: 536-LFBGA, CSPBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 536-CSPBGA (16x16) Architecture: MCU, FPGA Flash Size: 512KB |
Produkt ist nicht verfügbar |
M2S010TS-1VFG256I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 2088 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 94.97 EUR |
100+ | 93.62 EUR |
M2S010TS-VF400 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S010TS-VF400I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S010T-VFG256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 68.13 EUR |
M2S010-VFG256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 224 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 62.85 EUR |
100+ | 61.93 EUR |
M2S010-VFG256I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 10K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 111 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 71.42 EUR |
100+ | 70.37 EUR |
M2S025-1FCS325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-1FCS325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-1FCSG325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-1FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-1VF256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-1VFG256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-FCS325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-FCS325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-FCSG325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 360 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 120.98 EUR |
100+ | 119.23 EUR |
M2S025T-1FCS325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025T-1FCS325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025T-1FCSG325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025T-1FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025T-FCS325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025T-FCS325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025T-FCSG325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025T-FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025TS-1FCS325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025TS-1FCSG325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025TS-FCS325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025TS-FCS325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025TS-FCSG325 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025TS-FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025TS-VF400 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S025TS-VF400I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S025TS-VFG400 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025T-VF256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025T-VFG256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-VF256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-VF256I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (14x14)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-VF400I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-VFG256 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
M2S025-VFG256I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 256-FPBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 150.94 EUR |
100+ | 148.74 EUR |
M2S050-FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 191.75 EUR |
M2S050T-FG484I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Produkt ist nicht verfügbar
M2S050TS-VF400 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S050TS-VF400I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S050-VF400I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 50K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S060-1FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
auf Bestellung 176 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 214.7 EUR |
M2S060-FCSG325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 814 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 187.19 EUR |
M2S060T-1FGG484I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 300.85 EUR |
M2S060TS-VF400 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S060TS-VF400I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 60K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
M2S090-FGG484I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
auf Bestellung 164 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 414.36 EUR |
M2S090TS-1FCS325I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x13.5)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 325BGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 90K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 325-FCBGA (11x13.5)
Architecture: MCU, FPGA
Flash Size: 512KB
auf Bestellung 699 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 392.3 EUR |
M2S150-1FCS536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-1FCS536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-1FCSG536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-1FCSG536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-FCS536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-FCS536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-FCSG536 |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar
M2S150-FCSG536I |
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Package / Case: 536-LFBGA, CSPBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 536-CSPBGA (16x16)
Architecture: MCU, FPGA
Flash Size: 512KB
Produkt ist nicht verfügbar