Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (338781) > Seite 1237 nach 5647
Foto | Bezeichnung | Hersteller | Beschreibung |
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ATSAME54P20A-AUT-EFP | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 128TQFP Packaging: Tape & Reel (TR) Package / Case: 128-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 128-TQFP (14x14) Part Status: Active Number of I/O: 99 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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ATSAME51J18A-AUT-EFP | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64TQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 51 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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ATSAME54N20A-AUT-EFP | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 100TQFP |
Produkt ist nicht verfügbar |
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ATSAMD51G18A-MUT-EFP | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 48QFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM Supplier Device Package: 48-VQFN (7x7) Number of I/O: 37 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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RN2903A-I/RMSA103 | Microchip Technology |
Description: RF TXRX MOD ISM < 1GHZ SOUTH AM Packaging: Tray Package / Case: 47-SMD Module Sensitivity: -146dBm Mounting Type: Surface Mount Frequency: 902MHz ~ 928MHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.1V ~ 3.6V Power - Output: 18.5dBm Data Rate: 300kbps Protocol: LoRa™ Current - Receiving: 1.8mA ~ 3.1mA Current - Transmitting: 105mA ~ 122mA Antenna Type: Antenna Not Included, Castellation Modulation: FSK, GFSK RF Family/Standard: General ISM < 1GHz Serial Interfaces: UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 5263 Stücke: Lieferzeit 21-28 Tag (e) |
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MIC33M656-HAYMP-TR | Microchip Technology |
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN Packaging: Tape & Reel (TR) Package / Case: 53-PowerBFQFN Module Output Type: Programmable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 6A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 1.6MHz, 2.2MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 53-B1QFN (6x10) Synchronous Rectifier: Yes Voltage - Output (Max): 1.28V Voltage - Input (Min): 2.4V Voltage - Output (Min/Fixed): 0.6V Part Status: Active |
Produkt ist nicht verfügbar |
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MIC33M650YMP-TR | Microchip Technology |
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN Packaging: Tape & Reel (TR) Package / Case: 53-PowerBFQFN Module Output Type: Programmable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 6A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 1.2MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 53-B1QFN (6x10) Synchronous Rectifier: Yes Voltage - Output (Max): 3.3V Voltage - Input (Min): 2.4V Voltage - Output (Min/Fixed): 0.6V Part Status: Active |
Produkt ist nicht verfügbar |
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ATSAME51J18A-AU-EFP | Microchip Technology | Description: IC MCU 32BIT 256KB FLASH 64TQFP |
Produkt ist nicht verfügbar |
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ATSAMD51J18A-AU-EFP | Microchip Technology | Description: IC MCU 32BIT 256KB FLASH 64TQFP |
Produkt ist nicht verfügbar |
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ATSAMD51J18A-MUT-EFP | Microchip Technology | Description: IC MCU 32BIT 256KB FLASH 64VQFN |
Produkt ist nicht verfügbar |
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ATSAMD51J18A-AUT-EFP | Microchip Technology | Description: IC MCU 32BIT 256KB FLASH 64TQFP |
Produkt ist nicht verfügbar |
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MIC33M656-HAYMP-TR | Microchip Technology |
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN Packaging: Cut Tape (CT) Package / Case: 53-PowerBFQFN Module Output Type: Programmable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 6A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 1.6MHz, 2.2MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 53-B1QFN (6x10) Synchronous Rectifier: Yes Voltage - Output (Max): 1.28V Voltage - Input (Min): 2.4V Voltage - Output (Min/Fixed): 0.6V Part Status: Active |
Produkt ist nicht verfügbar |
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MIC33M656-SAYMP-TR | Microchip Technology |
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN Packaging: Cut Tape (CT) Package / Case: 53-PowerBFQFN Module Output Type: Programmable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 6A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 1.6MHz, 2.2MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 53-B1QFN (6x10) Synchronous Rectifier: Yes Voltage - Output (Max): 3.84V Voltage - Input (Min): 2.4V Voltage - Output (Min/Fixed): 0.6V Part Status: Active |
auf Bestellung 235 Stücke: Lieferzeit 21-28 Tag (e) |
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ATSAMD51J18A-AUT-EFP | Microchip Technology | Description: IC MCU 32BIT 256KB FLASH 64TQFP |
Produkt ist nicht verfügbar |
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MIC33M650YMP-TR | Microchip Technology |
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN Packaging: Cut Tape (CT) Package / Case: 53-PowerBFQFN Module Output Type: Programmable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 6A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 1.2MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 53-B1QFN (6x10) Synchronous Rectifier: Yes Voltage - Output (Max): 3.3V Voltage - Input (Min): 2.4V Voltage - Output (Min/Fixed): 0.6V Part Status: Active |
Produkt ist nicht verfügbar |
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ATSAMD51G18A-MUT-EFP | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 48QFN Packaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM Supplier Device Package: 48-VQFN (7x7) Number of I/O: 37 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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ATSAME54P20A-AUT-EFP | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 128TQFP Packaging: Cut Tape (CT) Package / Case: 128-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 128-TQFP (14x14) Part Status: Active Number of I/O: 99 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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ATSAME54N20A-AUT-EFP | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 100TQFP |
Produkt ist nicht verfügbar |
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ATSAMD51J18A-MUT-EFP | Microchip Technology | Description: IC MCU 32BIT 256KB FLASH 64VQFN |
Produkt ist nicht verfügbar |
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MIC33M656-FAYMP-TR | Microchip Technology |
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN Packaging: Cut Tape (CT) Package / Case: 53-PowerBFQFN Module Output Type: Programmable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 6A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 1.6MHz, 2.2MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 53-B1QFN (6x10) Synchronous Rectifier: Yes Voltage - Output (Max): 1.28V Voltage - Input (Min): 2.4V Voltage - Output (Min/Fixed): 0.6V Part Status: Active |
auf Bestellung 300 Stücke: Lieferzeit 21-28 Tag (e) |
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ATSAME51J18A-AUT-EFP | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64TQFP Packaging: Cut Tape (CT) Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 51 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SAM9X60T-V/DWB | Microchip Technology |
Description: IC MPU SAM9X60 600MHZ 228TFBGA Packaging: Tape & Reel (TR) Package / Case: 228-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 228-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
auf Bestellung 1500 Stücke: Lieferzeit 21-28 Tag (e) |
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SAM9X60-V/DWB | Microchip Technology |
Description: IC MPU SAM9X60 600MHZ 228TFBGA Packaging: Tray Package / Case: 228-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 228-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
auf Bestellung 2012 Stücke: Lieferzeit 21-28 Tag (e) |
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SAM9X60T-V/DWB | Microchip Technology |
Description: IC MPU SAM9X60 600MHZ 228TFBGA Packaging: Cut Tape (CT) Package / Case: 228-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 228-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
auf Bestellung 3874 Stücke: Lieferzeit 21-28 Tag (e) |
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DSC1221NI2-125M0000 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 27mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 125 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1222NI2-156M2500 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 50mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 156.25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1221CL2-25M00000 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 27mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1221DA2-25M00000 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 125°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 27mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1222NI2-150M0000 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 50mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 150 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1222DI2-156M2500 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 50mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 156.25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1223DI2-150M0000 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: LVDS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 150 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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MRF89XAM9AT-I/RM | Microchip Technology |
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD Packaging: Tape & Reel (TR) Package / Case: 12-SMD Module Sensitivity: -111dBm Mounting Type: Surface Mount Frequency: 902MHz ~ 928MHz Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.1V ~ 3.6V Power - Output: 12.5dBm Data Rate: 200kbps Current - Receiving: 3mA Current - Transmitting: 16mA ~ 25mA Antenna Type: Integrated, Trace Utilized IC / Part: MRF89XAM9A Modulation: FSK, OOK RF Family/Standard: General ISM < 1GHz Serial Interfaces: SPI Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 4500 Stücke: Lieferzeit 21-28 Tag (e) |
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DSC1222CI2-25M00000 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 50mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1223DI2-212M5000 | Microchip Technology | Description: OSC MEMS SMD HIGH PERFORMANCE |
Produkt ist nicht verfügbar |
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DSC1222CI2-212M5000 | Microchip Technology | Description: OSC MEMS SMD HIGH PERFORMANCE |
Produkt ist nicht verfügbar |
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DSC1223BI2-156M2500 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: LVDS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 156.25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1223CI2-133M3333 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: LVDS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 133.333 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1224DI2-125M0000 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: HCSL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 40mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 125 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1224DL1-100M0000 | Microchip Technology |
Description: OSC MEMS SMD HIGH PERFORMANCE Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: HCSL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 40mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 100 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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MRF89XAM9AT-I/RM | Microchip Technology |
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD Packaging: Cut Tape (CT) Package / Case: 12-SMD Module Sensitivity: -111dBm Mounting Type: Surface Mount Frequency: 902MHz ~ 928MHz Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.1V ~ 3.6V Power - Output: 12.5dBm Data Rate: 200kbps Current - Receiving: 3mA Current - Transmitting: 16mA ~ 25mA Antenna Type: Integrated, Trace Utilized IC / Part: MRF89XAM9A Modulation: FSK, OOK RF Family/Standard: General ISM < 1GHz Serial Interfaces: SPI Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 5582 Stücke: Lieferzeit 21-28 Tag (e) |
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SAM9X60D5M-I/4FB | Microchip Technology |
Description: IC MPU SAM9X60 600MHZ 233TFBGA Packaging: Tray Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
auf Bestellung 238 Stücke: Lieferzeit 21-28 Tag (e) |
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SAM9X60D5MT-I/4FB | Microchip Technology |
Description: IC MPU SAM9X60 600MHZ 233TFBGA Packaging: Tape & Reel (TR) Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
Produkt ist nicht verfügbar |
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SAM9X60D1G-I/4FB | Microchip Technology |
Description: IC MPU SAM9X60 600MHZ 233TFBGA Packaging: Tray Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
auf Bestellung 625 Stücke: Lieferzeit 21-28 Tag (e) |
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SAM9X60D1GT-I/4FB | Microchip Technology |
Description: IC MPU SAM9X60 600MHZ 233TFBGA Packaging: Tape & Reel (TR) Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
Produkt ist nicht verfügbar |
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SAM9X60D5MT-I/4FB | Microchip Technology |
Description: IC MPU SAM9X60 600MHZ 233TFBGA Packaging: Cut Tape (CT) Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
Produkt ist nicht verfügbar |
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SAM9X60D1GT-I/4FB | Microchip Technology |
Description: IC MPU SAM9X60 600MHZ 233TFBGA Packaging: Cut Tape (CT) Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Part Status: Active |
Produkt ist nicht verfügbar |
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ATSAMA5D27C-D1G-CUR | Microchip Technology |
Description: IC MPU SAMA5D2 500MHZ 289TFBGA Packaging: Cut Tape (CT) Package / Case: 289-TFBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 289-TFBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + HSIC Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI |
auf Bestellung 3445 Stücke: Lieferzeit 21-28 Tag (e) |
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ATECC608A-TNGTLSU-B | Microchip Technology | Description: TRUST & GO TLS I2C PROTO 8-UDFN |
Produkt ist nicht verfügbar |
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ATECC608A-TNGLORAS-G | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROVISION |
Produkt ist nicht verfügbar |
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ATECC608A-TNGTLSS-C | Microchip Technology | Description: TRUST & GO TLS I2C PROVISIONED 8 |
Produkt ist nicht verfügbar |
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ATECC608A-TNGLORAU-C | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROVISION |
Produkt ist nicht verfügbar |
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ATECC608A-TNGLORAU-G | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROVISION |
Produkt ist nicht verfügbar |
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ATECC608A-TNGTLSU-C | Microchip Technology | Description: TRUST & GO TLS I2C PROVISIONED 8 |
Produkt ist nicht verfügbar |
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ATECC608A-TNGLORAS-C | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROVISION |
Produkt ist nicht verfügbar |
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ATECC608A-TNGTLSS-B | Microchip Technology | Description: TRUST & GO TLS I2C PROTO 8-SOIC |
Produkt ist nicht verfügbar |
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ATECC608A-TNGTLSS-G | Microchip Technology | Description: TRUST & GO TLS I2C PROVISIONED 8 |
Produkt ist nicht verfügbar |
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ATECC608A-TNGLORAS-B | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROTO 8-S |
auf Bestellung 5 Stücke: Lieferzeit 21-28 Tag (e) |
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ATECC608A-TNGTLSU-G | Microchip Technology | Description: TRUST & GO TLS I2C PROVISIONED 8 |
Produkt ist nicht verfügbar |
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ATECC608A-TNGLORAU-B | Microchip Technology | Description: TRUST & GO LORAWAN I2C PROTO 8-U |
Produkt ist nicht verfügbar |
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KSZ9131MNXC-TR | Microchip Technology |
Description: IC TXRX FULL/HALF 8/8 64QFN Packaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V Number of Drivers/Receivers: 8/8 Data Rate: 10Mbps, 100Mbps, 1Gbps Protocol: Gigabit Ethernet Supplier Device Package: 64-QFN (8x8) Receiver Hysteresis: 500 mV Duplex: Full, Half Part Status: Active |
auf Bestellung 1990 Stücke: Lieferzeit 21-28 Tag (e) |
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ATSAME54P20A-AUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 128TQFP
Packaging: Tape & Reel (TR)
Package / Case: 128-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 128-TQFP (14x14)
Part Status: Active
Number of I/O: 99
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 128TQFP
Packaging: Tape & Reel (TR)
Package / Case: 128-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 128-TQFP (14x14)
Part Status: Active
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ATSAME51J18A-AUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ATSAME54N20A-AUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Produkt ist nicht verfügbar
ATSAMD51G18A-MUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
RN2903A-I/RMSA103 |
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM < 1GHZ SOUTH AM
Packaging: Tray
Package / Case: 47-SMD Module
Sensitivity: -146dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 18.5dBm
Data Rate: 300kbps
Protocol: LoRa™
Current - Receiving: 1.8mA ~ 3.1mA
Current - Transmitting: 105mA ~ 122mA
Antenna Type: Antenna Not Included, Castellation
Modulation: FSK, GFSK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: RF TXRX MOD ISM < 1GHZ SOUTH AM
Packaging: Tray
Package / Case: 47-SMD Module
Sensitivity: -146dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 18.5dBm
Data Rate: 300kbps
Protocol: LoRa™
Current - Receiving: 1.8mA ~ 3.1mA
Current - Transmitting: 105mA ~ 122mA
Antenna Type: Antenna Not Included, Castellation
Modulation: FSK, GFSK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5263 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 41.78 EUR |
25+ | 38.2 EUR |
MIC33M656-HAYMP-TR |
Hersteller: Microchip Technology
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
MIC33M650YMP-TR |
Hersteller: Microchip Technology
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
ATSAME51J18A-AU-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Produkt ist nicht verfügbar
ATSAMD51J18A-AU-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Produkt ist nicht verfügbar
ATSAMD51J18A-MUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Produkt ist nicht verfügbar
ATSAMD51J18A-AUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Produkt ist nicht verfügbar
MIC33M656-HAYMP-TR |
Hersteller: Microchip Technology
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
MIC33M656-SAYMP-TR |
Hersteller: Microchip Technology
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.84V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.84V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
auf Bestellung 235 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 12.66 EUR |
25+ | 10.55 EUR |
100+ | 10.22 EUR |
ATSAMD51J18A-AUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Produkt ist nicht verfügbar
MIC33M650YMP-TR |
Hersteller: Microchip Technology
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
ATSAMD51G18A-MUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ATSAME54P20A-AUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 128TQFP
Packaging: Cut Tape (CT)
Package / Case: 128-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 128-TQFP (14x14)
Part Status: Active
Number of I/O: 99
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 128TQFP
Packaging: Cut Tape (CT)
Package / Case: 128-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 128-TQFP (14x14)
Part Status: Active
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ATSAME54N20A-AUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Produkt ist nicht verfügbar
ATSAMD51J18A-MUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Produkt ist nicht verfügbar
MIC33M656-FAYMP-TR |
Hersteller: Microchip Technology
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Description: IC REG BUCK PRG 0.6V 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
auf Bestellung 300 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 12.66 EUR |
25+ | 10.55 EUR |
100+ | 10.22 EUR |
ATSAME51J18A-AUT-EFP |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SAM9X60T-V/DWB |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 1500 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1500+ | 16.23 EUR |
SAM9X60-V/DWB |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tray
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tray
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 2012 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 19.14 EUR |
25+ | 17.55 EUR |
100+ | 15.89 EUR |
SAM9X60T-V/DWB |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Cut Tape (CT)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Cut Tape (CT)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 3874 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 19.58 EUR |
25+ | 17.96 EUR |
100+ | 16.23 EUR |
DSC1221NI2-125M0000 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1222NI2-156M2500 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1221CL2-25M00000 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1221DA2-25M00000 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1222NI2-150M0000 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1222DI2-156M2500 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1223DI2-150M0000 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
MRF89XAM9AT-I/RM |
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4500 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
500+ | 19.2 EUR |
DSC1222CI2-25M00000 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1223DI2-212M5000 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Description: OSC MEMS SMD HIGH PERFORMANCE
Produkt ist nicht verfügbar
DSC1222CI2-212M5000 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Description: OSC MEMS SMD HIGH PERFORMANCE
Produkt ist nicht verfügbar
DSC1223BI2-156M2500 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1223CI2-133M3333 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1224DI2-125M0000 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1224DL1-100M0000 |
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
MRF89XAM9AT-I/RM |
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Cut Tape (CT)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Cut Tape (CT)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5582 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 19.19 EUR |
SAM9X60D5M-I/4FB |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 238 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 30.42 EUR |
25+ | 27.92 EUR |
100+ | 25.26 EUR |
SAM9X60D5MT-I/4FB |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
SAM9X60D1G-I/4FB |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 625 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 37.52 EUR |
25+ | 34.38 EUR |
100+ | 31.14 EUR |
SAM9X60D1GT-I/4FB |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
SAM9X60D5MT-I/4FB |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
SAM9X60D1GT-I/4FB |
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Cut Tape (CT)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
ATSAMA5D27C-D1G-CUR |
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 289TFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-TFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
Description: IC MPU SAMA5D2 500MHZ 289TFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-TFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
auf Bestellung 3445 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 45.42 EUR |
25+ | 41.63 EUR |
100+ | 37.69 EUR |
ATECC608A-TNGTLSU-B |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROTO 8-UDFN
Description: TRUST & GO TLS I2C PROTO 8-UDFN
Produkt ist nicht verfügbar
ATECC608A-TNGLORAS-G |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
ATECC608A-TNGTLSS-C |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
ATECC608A-TNGLORAU-C |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
ATECC608A-TNGLORAU-G |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
ATECC608A-TNGTLSU-C |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
ATECC608A-TNGLORAS-C |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
ATECC608A-TNGTLSS-B |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROTO 8-SOIC
Description: TRUST & GO TLS I2C PROTO 8-SOIC
Produkt ist nicht verfügbar
ATECC608A-TNGTLSS-G |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
ATECC608A-TNGLORAS-B |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROTO 8-S
Description: TRUST & GO LORAWAN I2C PROTO 8-S
auf Bestellung 5 Stücke:
Lieferzeit 21-28 Tag (e)ATECC608A-TNGTLSU-G |
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
ATECC608A-TNGLORAU-B |
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROTO 8-U
Description: TRUST & GO LORAWAN I2C PROTO 8-U
Produkt ist nicht verfügbar
KSZ9131MNXC-TR |
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 1990 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 9.08 EUR |