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ATMEGA1608-XUR ATMEGA1608-XUR Microchip Technology ATmega808-09-1608-09-DataSheet-DS40002172C.pdf Description: IC MCU 8BIT 16KB FLASH 28SSOP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Produkt ist nicht verfügbar
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ATMEGA4809-MUR ATMEGA4809-MUR Microchip Technology ATmega4808-09-DataSheet-DS40002173C.pdf Description: IC MCU 8BIT 48KB FLASH 48UQFN
Packaging: Cut Tape (CT)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-UQFN (6x6)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
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7+3.27 EUR
25+3.18 EUR
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PD69208T4ILQ-TR PD69208T4ILQ-TR Microchip Technology Description: IC POE CNTRL 8 CHANNEL 56QFN
Power - Max: 95 W
Number of Channels: 8
Part Status: Obsolete
Auxiliary Sense: Yes
Supplier Device Package: 56-QFN (8x8)
Standards: 802.3at (PoE+), 802.3af (PoE)
Internal Switch(s): Yes
Voltage - Supply: 32V ~ 57V
Operating Temperature: -40°C ~ 85°C
Type: Controller (PSE)
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PD69204T4ILQ-TR PD69204T4ILQ-TR Microchip Technology 136500-pd69204t4-datasheet Description: POE PSE CONTROLLER
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PD69204T4ILQ-TR-LE PD69204T4ILQ-TR-LE Microchip Technology PD69208T4_PD69204T4_PD69208M_PoE_PSE_Manager_Datasheet.pdf Description: PD69204T4 IC 4P PSE POE MNGR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 32V ~ 57V
Current - Supply: 14mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE)
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: Yes
Number of Channels: 4
Power - Max: 95 W
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PD69208T4ILQ-TR-LE PD69208T4ILQ-TR-LE Microchip Technology PD69208T4_PD69204T4_PD69208M_PoE_PSE_Manager_Datasheet.pdf Description: PD69208T4 IC 8P PSE POE MNGR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 32V ~ 57V
Current - Supply: 14mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE)
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: Yes
Part Status: Active
Number of Channels: 8
Power - Max: 95 W
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PD69204T4ILQ-TR-LE PD69204T4ILQ-TR-LE Microchip Technology PD69208T4_PD69204T4_PD69208M_PoE_PSE_Manager_Datasheet.pdf Description: PD69204T4 IC 4P PSE POE MNGR
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 32V ~ 57V
Current - Supply: 14mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE)
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: Yes
Number of Channels: 4
Power - Max: 95 W
auf Bestellung 1093 Stücke:
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25+11.72 EUR
100+11.33 EUR
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PD69208T4ILQ-TR-LE PD69208T4ILQ-TR-LE Microchip Technology PD69208T4_PD69204T4_PD69208M_PoE_PSE_Manager_Datasheet.pdf Description: PD69208T4 IC 8P PSE POE MNGR
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 32V ~ 57V
Current - Supply: 14mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE)
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: Yes
Part Status: Active
Number of Channels: 8
Power - Max: 95 W
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DM320118 DM320118 Microchip Technology CryptoAuth-Trust-Platform-Users-Guide-DS50002921A.pdf Description: CRYPTOAUTH TRUST PLATFORM KIT
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: ATECC608B, ATSAMD21E18A
Type: MCU 32-Bit
Function: Anti Tamper and Security
Packaging: Bulk
Platform: CryptoAuth Trust Platform
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Mounting Type: Fixed
Produkt ist nicht verfügbar
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DT100104 DT100104 Microchip Technology ATECC608A-Trust-Development-Board-Users-Guide-DS50002922A.pdf Description: ATECC608B TRUST PLATFORM KIT
Part Status: Active
Platform: mikroBUS™ Click™
Utilized IC / Part: ATECC608B
Contents: Board(s)
Type: Interface
Function: Security
Packaging: Bulk
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DSC6111CI1A-016.0000T DSC6111CI1A-016.0000T Microchip Technology filehandler.aspx?ddocname=en587492 Description: MEMS OSC XO 16.0000MHZ CMOS SMD
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DSC6111CI1A-016.0000T DSC6111CI1A-016.0000T Microchip Technology filehandler.aspx?ddocname=en587492 Description: MEMS OSC XO 16.0000MHZ CMOS SMD
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DM164152 DM164152 Microchip Technology 70005402C.pdf Description: BM83 BLUETOOTH AUDIO DEV KIT
Utilized IC / Part: BM83
Contents: Board(s), Cable(s)
Part Status: Active
Supplied Contents: Board(s), Cable(s)
Type: Transceiver
For Use With/Related Products: BM83
Packaging: Bulk
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MIC33M656-SAYMP-TR Microchip Technology MIC33M656-Data-Sheet-DS20006256A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 3.84V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIC33M656-FAYMP-TR Microchip Technology MIC33M656-Data-Sheet-DS20006256A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Tape & Reel (TR)
Voltage - Output (Max): 1.28V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
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ATSAMD51G18A-MU-EFP ATSAMD51G18A-MU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 37
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ATSAMC21N18A-AN ATSAMC21N18A-AN Microchip Technology SAM-C20-C21-Family-Data-Sheet-DS60001479J.pdf Description: IC MCU 32BIT 256KB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 84
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b, 3x16b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
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3+10.45 EUR
25+9.51 EUR
100+8.6 EUR
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ATSAME54P20A-AU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 128TQFP
Package / Case: 128-TQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 99
Part Status: Active
Supplier Device Package: 128-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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ATSAMD51J18A-MU-EFP ATSAMD51J18A-MU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
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ATSAME54P20A-AUT-EFP ATSAME54P20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 128TQFP
DigiKey Programmable: Not Verified
Number of I/O: 99
Part Status: Active
Supplier Device Package: 128-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 128-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAME51J18A-AUT-EFP ATSAME51J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAME54N20A-AUT-EFP ATSAME54N20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 81
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAMD51G18A-MUT-EFP ATSAMD51G18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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RN2903A-I/RMSA103 RN2903A-I/RMSA103 Microchip Technology RN2903-Data-Sheet-DS50002390J.pdf Description: RF TXRX MOD ISM<1GHZ CAST SMD
Packaging: Tray
Package / Case: 47-SMD Module
Sensitivity: -146dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 18.5dBm
Data Rate: 300kbps
Protocol: LoRa™
Current - Receiving: 1.8mA ~ 3.1mA
Current - Transmitting: 105mA ~ 122mA
Antenna Type: Antenna Not Included, Castellation
Modulation: FSK, GFSK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: UART
Part Status: Active
DigiKey Programmable: Not Verified
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1+31.94 EUR
25+29.21 EUR
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MIC33M656-HAYMP-TR Microchip Technology MIC33M656-Data-Sheet-DS20006256A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 1.28V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Part Status: Active
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIC33M650YMP-TR Microchip Technology MIC33M650-Data-Sheet-DS20006253A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Voltage - Output (Max): 3.3V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Tape & Reel (TR)
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Produkt ist nicht verfügbar
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ATSAME51J18A-AU-EFP ATSAME51J18A-AU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
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ATSAMD51J18A-AU-EFP ATSAMD51J18A-AU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
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ATSAMD51J18A-MUT-EFP ATSAMD51J18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAMD51J18A-AUT-EFP ATSAMD51J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Produkt ist nicht verfügbar
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MIC33M656-HAYMP-TR Microchip Technology MIC33M656-Data-Sheet-DS20006256A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 1.28V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Cut Tape (CT)
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MIC33M656-SAYMP-TR Microchip Technology MIC33M656-Data-Sheet-DS20006256A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 3.84V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Cut Tape (CT)
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100+8.62 EUR
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ATSAMD51J18A-AUT-EFP ATSAMD51J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
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MIC33M650YMP-TR Microchip Technology MIC33M650-Data-Sheet-DS20006253A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 3.3V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Package / Case: 53-PowerBFQFN Module
Packaging: Cut Tape (CT)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Part Status: Active
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ATSAMD51G18A-MUT-EFP ATSAMD51G18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 37
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ATSAME54P20A-AUT-EFP ATSAME54P20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 128TQFP
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 128-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 99
Part Status: Active
Supplier Device Package: 128-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
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ATSAME54N20A-AUT-EFP ATSAME54N20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 81
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Produkt ist nicht verfügbar
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ATSAMD51J18A-MUT-EFP ATSAMD51J18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
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MIC33M656-FAYMP-TR Microchip Technology MIC33M656-Data-Sheet-DS20006256A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 1.28V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Cut Tape (CT)
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ATSAME51J18A-AUT-EFP ATSAME51J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
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SAM9X60T-V/DWB SAM9X60T-V/DWB Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: IC MPU SAM9X60 600MHZ 228TFBGA
Part Status: Active
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: Yes
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 228-TFBGA (11x11)
Voltage - I/O: 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 228-TFBGA
Packaging: Tape & Reel (TR)
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SAM9X60-V/DWB SAM9X60-V/DWB Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: IC MPU SAM9X60 600MHZ 228TFBGA
Part Status: Active
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: Yes
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 228-TFBGA (11x11)
Voltage - I/O: 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 228-TFBGA
Packaging: Tray
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SAM9X60T-V/DWB SAM9X60T-V/DWB Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: IC MPU SAM9X60 600MHZ 228TFBGA
Graphics Acceleration: Yes
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 228-TFBGA (11x11)
Voltage - I/O: 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 228-TFBGA
Packaging: Cut Tape (CT)
Part Status: Active
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Display & Interface Controllers: Keyboard, LCD, Touchscreen
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DSC1221NI2-125M0000 DSC1221NI2-125M0000 Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 125 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 6-VDFN
Packaging: Tube
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
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DSC1222NI2-156M2500 DSC1222NI2-156M2500 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 156.25 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 50mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVPECL
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 6-VDFN
Packaging: Tube
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DSC1221CL2-25M00000 DSC1221CL2-25M00000 Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Base Resonator: MEMS
Frequency: 25 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tube
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DSC1221DA2-25M00000 DSC1221DA2-25M00000 Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 25 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 6-VDFN
Packaging: Tube
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DSC1222NI2-150M0000 DSC1222NI2-150M0000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Current - Supply (Max): 50mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVPECL
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 6-VDFN
Packaging: Tube
Base Resonator: MEMS
Frequency: 150 MHz
Height - Seated (Max): 0.035" (0.90mm)
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DSC1222DI2-156M2500 DSC1222DI2-156M2500 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 156.2500MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (2.5x2)
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DSC1223DI2-150M0000 DSC1223DI2-150M0000 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 150.0000MHZ LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
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MRF89XAM9AT-I/RM MRF89XAM9AT-I/RM Microchip Technology 75017B.pdf Description: RF TXRX MOD ISM < 1GHZ TRACE SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
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DSC1222CI2-25M00000 DSC1222CI2-25M00000 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 25.0000MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC1223DI2-212M5000 DSC1223DI2-212M5000 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 212.5000MHZ LVDS SMD
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DSC1222CI2-212M5000 DSC1222CI2-212M5000 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 212.5000MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
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DSC1223BI2-156M2500 DSC1223BI2-156M2500 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 156.25 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Tube
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DSC1223CI2-133M3333 DSC1223CI2-133M3333 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 133.333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tube
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DSC1224DI2-125M0000 DSC1224DI2-125M0000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 125 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 40mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: HCSL
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 6-VDFN
Packaging: Tube
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DSC1224DL1-100M0000 DSC1224DL1-100M0000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 100 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 40mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: HCSL
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 6-VDFN
Packaging: Tube
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MRF89XAM9AT-I/RM MRF89XAM9AT-I/RM Microchip Technology 75017B.pdf Description: RF TXRX MOD ISM < 1GHZ TRACE SMD
Packaging: Cut Tape (CT)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
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SAM9X60D5M-I/4FB SAM9X60D5M-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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ATMEGA1608-XUR ATmega808-09-1608-09-DataSheet-DS40002172C.pdf
ATMEGA1608-XUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 28SSOP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: AVR
EEPROM Size: 256 x 8
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ATMEGA4809-MUR ATmega4808-09-DataSheet-DS40002173C.pdf
ATMEGA4809-MUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 48KB FLASH 48UQFN
Packaging: Cut Tape (CT)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-UQFN (6x6)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
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PD69208T4ILQ-TR
PD69208T4ILQ-TR
Hersteller: Microchip Technology
Description: IC POE CNTRL 8 CHANNEL 56QFN
Power - Max: 95 W
Number of Channels: 8
Part Status: Obsolete
Auxiliary Sense: Yes
Supplier Device Package: 56-QFN (8x8)
Standards: 802.3at (PoE+), 802.3af (PoE)
Internal Switch(s): Yes
Voltage - Supply: 32V ~ 57V
Operating Temperature: -40°C ~ 85°C
Type: Controller (PSE)
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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PD69204T4ILQ-TR 136500-pd69204t4-datasheet
PD69204T4ILQ-TR
Hersteller: Microchip Technology
Description: POE PSE CONTROLLER
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PD69204T4ILQ-TR-LE PD69208T4_PD69204T4_PD69208M_PoE_PSE_Manager_Datasheet.pdf
PD69204T4ILQ-TR-LE
Hersteller: Microchip Technology
Description: PD69204T4 IC 4P PSE POE MNGR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 32V ~ 57V
Current - Supply: 14mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE)
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: Yes
Number of Channels: 4
Power - Max: 95 W
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PD69208T4ILQ-TR-LE PD69208T4_PD69204T4_PD69208M_PoE_PSE_Manager_Datasheet.pdf
PD69208T4ILQ-TR-LE
Hersteller: Microchip Technology
Description: PD69208T4 IC 8P PSE POE MNGR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 32V ~ 57V
Current - Supply: 14mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE)
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: Yes
Part Status: Active
Number of Channels: 8
Power - Max: 95 W
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PD69204T4ILQ-TR-LE PD69208T4_PD69204T4_PD69208M_PoE_PSE_Manager_Datasheet.pdf
PD69204T4ILQ-TR-LE
Hersteller: Microchip Technology
Description: PD69204T4 IC 4P PSE POE MNGR
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 32V ~ 57V
Current - Supply: 14mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE)
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: Yes
Number of Channels: 4
Power - Max: 95 W
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PD69208T4ILQ-TR-LE PD69208T4_PD69204T4_PD69208M_PoE_PSE_Manager_Datasheet.pdf
PD69208T4ILQ-TR-LE
Hersteller: Microchip Technology
Description: PD69208T4 IC 8P PSE POE MNGR
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 32V ~ 57V
Current - Supply: 14mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE)
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: Yes
Part Status: Active
Number of Channels: 8
Power - Max: 95 W
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DM320118 CryptoAuth-Trust-Platform-Users-Guide-DS50002921A.pdf
DM320118
Hersteller: Microchip Technology
Description: CRYPTOAUTH TRUST PLATFORM KIT
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: ATECC608B, ATSAMD21E18A
Type: MCU 32-Bit
Function: Anti Tamper and Security
Packaging: Bulk
Platform: CryptoAuth Trust Platform
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Mounting Type: Fixed
Produkt ist nicht verfügbar
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DT100104 ATECC608A-Trust-Development-Board-Users-Guide-DS50002922A.pdf
DT100104
Hersteller: Microchip Technology
Description: ATECC608B TRUST PLATFORM KIT
Part Status: Active
Platform: mikroBUS™ Click™
Utilized IC / Part: ATECC608B
Contents: Board(s)
Type: Interface
Function: Security
Packaging: Bulk
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DSC6111CI1A-016.0000T filehandler.aspx?ddocname=en587492
DSC6111CI1A-016.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
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DSC6111CI1A-016.0000T filehandler.aspx?ddocname=en587492
DSC6111CI1A-016.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
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DM164152 70005402C.pdf
DM164152
Hersteller: Microchip Technology
Description: BM83 BLUETOOTH AUDIO DEV KIT
Utilized IC / Part: BM83
Contents: Board(s), Cable(s)
Part Status: Active
Supplied Contents: Board(s), Cable(s)
Type: Transceiver
For Use With/Related Products: BM83
Packaging: Bulk
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MIC33M656-SAYMP-TR MIC33M656-Data-Sheet-DS20006256A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 3.84V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIC33M656-FAYMP-TR MIC33M656-Data-Sheet-DS20006256A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Tape & Reel (TR)
Voltage - Output (Max): 1.28V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Produkt ist nicht verfügbar
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ATSAMD51G18A-MU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51G18A-MU-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48QFN
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 37
Produkt ist nicht verfügbar
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ATSAMC21N18A-AN SAM-C20-C21-Family-Data-Sheet-DS60001479J.pdf
ATSAMC21N18A-AN
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 84
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b, 3x16b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
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3+10.45 EUR
25+9.51 EUR
100+8.6 EUR
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ATSAME54P20A-AU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 128TQFP
Package / Case: 128-TQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 99
Part Status: Active
Supplier Device Package: 128-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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ATSAMD51J18A-MU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-MU-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Produkt ist nicht verfügbar
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ATSAME54P20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME54P20A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 128TQFP
DigiKey Programmable: Not Verified
Number of I/O: 99
Part Status: Active
Supplier Device Package: 128-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 128-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAME51J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51J18A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAME54N20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME54N20A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 81
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAMD51G18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51G18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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RN2903A-I/RMSA103 RN2903-Data-Sheet-DS50002390J.pdf
RN2903A-I/RMSA103
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM<1GHZ CAST SMD
Packaging: Tray
Package / Case: 47-SMD Module
Sensitivity: -146dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 18.5dBm
Data Rate: 300kbps
Protocol: LoRa™
Current - Receiving: 1.8mA ~ 3.1mA
Current - Transmitting: 105mA ~ 122mA
Antenna Type: Antenna Not Included, Castellation
Modulation: FSK, GFSK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: UART
Part Status: Active
DigiKey Programmable: Not Verified
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1+31.94 EUR
25+29.21 EUR
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MIC33M656-HAYMP-TR MIC33M656-Data-Sheet-DS20006256A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 1.28V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Part Status: Active
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIC33M650YMP-TR MIC33M650-Data-Sheet-DS20006253A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Voltage - Output (Max): 3.3V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Tape & Reel (TR)
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Produkt ist nicht verfügbar
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ATSAME51J18A-AU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51J18A-AU-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Produkt ist nicht verfügbar
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ATSAMD51J18A-AU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-AU-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Produkt ist nicht verfügbar
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ATSAMD51J18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAMD51J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Produkt ist nicht verfügbar
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MIC33M656-HAYMP-TR MIC33M656-Data-Sheet-DS20006256A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 1.28V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MIC33M656-SAYMP-TR MIC33M656-Data-Sheet-DS20006256A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 3.84V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Cut Tape (CT)
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AnzahlPrivatkunde
2+10.66 EUR
25+8.89 EUR
100+8.62 EUR
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ATSAMD51J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Produkt ist nicht verfügbar
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MIC33M650YMP-TR MIC33M650-Data-Sheet-DS20006253A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 3.3V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Package / Case: 53-PowerBFQFN Module
Packaging: Cut Tape (CT)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Part Status: Active
Produkt ist nicht verfügbar
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ATSAMD51G18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51G18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48QFN
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 37
Produkt ist nicht verfügbar
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ATSAME54P20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME54P20A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 128TQFP
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 128-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 99
Part Status: Active
Supplier Device Package: 128-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Produkt ist nicht verfügbar
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ATSAME54N20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME54N20A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 81
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Produkt ist nicht verfügbar
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ATSAMD51J18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Produkt ist nicht verfügbar
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MIC33M656-FAYMP-TR MIC33M656-Data-Sheet-DS20006256A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Part Status: Active
Voltage - Output (Min/Fixed): 0.6V
Voltage - Input (Min): 2.4V
Voltage - Output (Max): 1.28V
Synchronous Rectifier: Yes
Supplier Device Package: 53-B1QFN (6x10)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 1.6MHz, 2.2MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TJ)
Current - Output: 6A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 53-PowerBFQFN Module
Packaging: Cut Tape (CT)
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AnzahlPrivatkunde
2+10.64 EUR
25+8.88 EUR
100+8.6 EUR
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ATSAME51J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51J18A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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SAM9X60T-V/DWB SAM9X60-Data-Sheet-DS60001579.pdf
SAM9X60T-V/DWB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Part Status: Active
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: Yes
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 228-TFBGA (11x11)
Voltage - I/O: 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 228-TFBGA
Packaging: Tape & Reel (TR)
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1500+12.9 EUR
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SAM9X60-V/DWB SAM9X60-Data-Sheet-DS60001579.pdf
SAM9X60-V/DWB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Part Status: Active
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: Yes
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 228-TFBGA (11x11)
Voltage - I/O: 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 228-TFBGA
Packaging: Tray
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2+12.92 EUR
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SAM9X60T-V/DWB SAM9X60-Data-Sheet-DS60001579.pdf
SAM9X60T-V/DWB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Graphics Acceleration: Yes
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 228-TFBGA (11x11)
Voltage - I/O: 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 228-TFBGA
Packaging: Cut Tape (CT)
Part Status: Active
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Display & Interface Controllers: Keyboard, LCD, Touchscreen
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2+12.9 EUR
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DSC1221NI2-125M0000 DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1221NI2-125M0000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 125 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 6-VDFN
Packaging: Tube
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Produkt ist nicht verfügbar
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DSC1222NI2-156M2500 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1222NI2-156M2500
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 156.25 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 50mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVPECL
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 6-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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DSC1221CL2-25M00000 DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1221CL2-25M00000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Base Resonator: MEMS
Frequency: 25 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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DSC1221DA2-25M00000 DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1221DA2-25M00000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 25 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 6-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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DSC1222NI2-150M0000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1222NI2-150M0000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Current - Supply (Max): 50mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVPECL
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 6-VDFN
Packaging: Tube
Base Resonator: MEMS
Frequency: 150 MHz
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1222DI2-156M2500 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1222DI2-156M2500
Hersteller: Microchip Technology
Description: MEMS OSC XO 156.2500MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (2.5x2)
Produkt ist nicht verfügbar
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DSC1223DI2-150M0000 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1223DI2-150M0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 150.0000MHZ LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MRF89XAM9AT-I/RM 75017B.pdf
MRF89XAM9AT-I/RM
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM < 1GHZ TRACE SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
500+17.24 EUR
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DSC1222CI2-25M00000 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1222CI2-25M00000
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1223DI2-212M5000 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1223DI2-212M5000
Hersteller: Microchip Technology
Description: MEMS OSC XO 212.5000MHZ LVDS SMD
Produkt ist nicht verfügbar
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DSC1222CI2-212M5000 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1222CI2-212M5000
Hersteller: Microchip Technology
Description: MEMS OSC XO 212.5000MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1223BI2-156M2500 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1223BI2-156M2500
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 156.25 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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DSC1223CI2-133M3333 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1223CI2-133M3333
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 133.333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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DSC1224DI2-125M0000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1224DI2-125M0000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 125 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 40mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: HCSL
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 6-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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DSC1224DL1-100M0000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1224DL1-100M0000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Base Resonator: MEMS
Frequency: 100 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 40mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: HCSL
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 6-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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MRF89XAM9AT-I/RM 75017B.pdf
MRF89XAM9AT-I/RM
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM < 1GHZ TRACE SMD
Packaging: Cut Tape (CT)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 930 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+19.27 EUR
25+18.2 EUR
Mindestbestellmenge: 2 Stücke
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SAM9X60D5M-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D5M-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 65 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+15.54 EUR
25+12.95 EUR
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