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AVR128DB28-I/SS AVR128DB28-I/SS Microchip Technology AVR128DB28-32-48-64-DataSheet-DS40002247.pdf Description: IC MCU 8BIT 128KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
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AVR128DB28-I/SO AVR128DB28-I/SO Microchip Technology AVR128DB28-32-48-64-DataSheet-DS40002247A.pdf Description: IC MCU 8BIT 128KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
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AVR128DB28-E/SS AVR128DB28-E/SS Microchip Technology AVR128DB28-32-48-64-DataSheet-DS40002247.pdf Description: IC MCU 8BIT 128KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
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AVR128DB28-E/SO AVR128DB28-E/SO Microchip Technology AVR128DB28-32-48-64-DataSheet-DS40002247A.pdf Description: IC MCU 8BIT 128KB FLASH 28SOIC
DigiKey Programmable: Not Verified
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Number of I/O: 23
Part Status: Active
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: AVR
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
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AVR128DB28-E/SP AVR128DB28-E/SP Microchip Technology AVR128DB28-32-48-64-DataSheet-DS40002247A.pdf Description: IC MCU 8BIT 128KB FLASH 28SPDIP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 24MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Number of I/O: 23
Part Status: Active
Supplier Device Package: 28-SPDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: AVR
DigiKey Programmable: Not Verified
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AVR128DB28T-E/SS AVR128DB28T-E/SS Microchip Technology AVR128DB28-32-48-64-DataSheet-DS40002247.pdf Description: IC MCU 8BIT 128KB FLASH 28SSOP
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: AVR
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 23
Part Status: Active
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
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JAN1N6340US JAN1N6340US Microchip Technology 11083-lds-0193-1-datasheet Description: DIODE ZENER 47V 500MW MELF
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MCP3564RT-E/ST MCP3564RT-E/ST Microchip Technology MCP3561_2_4R-Data-Sheet-DS200006391C.pdf Description: IC ADC 24BIT 20-TSSOP
Packaging: Tape & Reel (TR)
Features: Internal Oscillator, Temperature Sensor
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 24
Configuration: MUX-PGA-ADC
Data Interface: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.7V
Sampling Rate (Per Second): 153.6k
Input Type: Differential, Single Ended
Number of Inputs: 4, 8
Supplier Device Package: 20-TSSOP
Architecture: Sigma-Delta
Ratio - S/H:ADC: 0:4
Part Status: Active
Number of A/D Converters: 1
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MCP3564RT-E/ST MCP3564RT-E/ST Microchip Technology MCP3561_2_4R-Data-Sheet-DS200006391C.pdf Description: IC ADC 24BIT 20-TSSOP
Packaging: Cut Tape (CT)
Features: Internal Oscillator, Temperature Sensor
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 24
Configuration: MUX-PGA-ADC
Data Interface: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.7V
Sampling Rate (Per Second): 153.6k
Input Type: Differential, Single Ended
Number of Inputs: 4, 8
Supplier Device Package: 20-TSSOP
Architecture: Sigma-Delta
Ratio - S/H:ADC: 0:4
Part Status: Active
Number of A/D Converters: 1
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MCP3564RT-E/NC MCP3564RT-E/NC Microchip Technology MCP3561_2_4R-Data-Sheet-DS200006391C.pdf Description: IC ADC 24BIT 20-UQFN
Packaging: Tape & Reel (TR)
Features: Internal Oscillator, Temperature Sensor
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 24
Configuration: MUX-PGA-ADC
Data Interface: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.7V
Sampling Rate (Per Second): 153.6k
Input Type: Differential, Single Ended
Number of Inputs: 4, 8
Supplier Device Package: 20-UQFN (3x3)
Architecture: Sigma-Delta
Ratio - S/H:ADC: 0:4
Part Status: Active
Number of A/D Converters: 1
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MCP3564RT-E/NC MCP3564RT-E/NC Microchip Technology MCP3561_2_4R-Data-Sheet-DS200006391C.pdf Description: IC ADC 24BIT 20-UQFN
Packaging: Cut Tape (CT)
Features: Internal Oscillator, Temperature Sensor
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 24
Configuration: MUX-PGA-ADC
Data Interface: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.7V
Sampling Rate (Per Second): 153.6k
Input Type: Differential, Single Ended
Number of Inputs: 4, 8
Supplier Device Package: 20-UQFN (3x3)
Architecture: Sigma-Delta
Ratio - S/H:ADC: 0:4
Part Status: Active
Number of A/D Converters: 1
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DM860A-AQE Microchip Technology Description: IC MPU 240MHZ 320LFBGA
Part Status: Obsolete
Display & Interface Controllers: LCD
Graphics Acceleration: Yes
RAM Controllers: SDRAM, SRAM
Co-Processors/DSP: Multimedia: Audio Engine, Security; Real Time Secure
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 10/100Mbps
Supplier Device Package: 320-LFBGA (13x13)
Core Processor: ARM926EJ
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 320-LFBGA
Packaging: Tray
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DM860A-LTB Microchip Technology Description: IC MPU 240MHZ 320LFBGA
Core Processor: ARM926EJ
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 320-LFBGA
Packaging: Tray
Part Status: Obsolete
Display & Interface Controllers: LCD
Graphics Acceleration: Yes
RAM Controllers: SDRAM, SRAM
Co-Processors/DSP: Multimedia: Audio Engine, Security; Real Time Secure
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 10/100Mbps
Supplier Device Package: 320-LFBGA (13x13)
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DM860-TE Microchip Technology DM860_PB_Ver2_8-27-08.pdf Description: IC MPU 240MHZ 292LFBGA
Core Processor: ARM926EJ
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tray
Part Status: Obsolete
Display & Interface Controllers: LCD
Graphics Acceleration: Yes
RAM Controllers: SDRAM, SRAM
Co-Processors/DSP: Multimedia: Audio Engine, Security; Real Time Secure
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 10/100Mbps
Supplier Device Package: 292-LFBGA (17x17)
Produkt ist nicht verfügbar
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A3P125-FGG144I A3P125-FGG144I Microchip Technology 130704-ds0097-proasic3-family-flash-fpgas-datasheet Description: IC FPGA 97 I/O 144FBGA
DigiKey Programmable: Not Verified
Number of I/O: 97
Total RAM Bits: 36864
Supplier Device Package: 144-FPBGA (13x13)
Voltage - Supply: 1.425V ~ 1.575V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 125000
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
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A3P125-TQG144I A3P125-TQG144I Microchip Technology 130704-ds0097-proasic3-family-flash-fpgas-datasheet Description: IC FPGA 100 I/O 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Total RAM Bits: 36864
Supplier Device Package: 144-TQFP (20x20)
Voltage - Supply: 1.425V ~ 1.575V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 125000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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A3P125-VQG100I A3P125-VQG100I Microchip Technology Description: IC FPGA 71 I/O 100VQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 71
Total RAM Bits: 36864
Supplier Device Package: 100-VQFP (14x14)
Voltage - Supply: 1.425V ~ 1.575V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 125000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
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DC1033AI2-025.0000T DC1033AI2-025.0000T Microchip Technology Description: LOW-POWER PRECISION CMOS OSCILLA
Packaging: Bulk
Part Status: Active
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EV18H79A Microchip Technology Description: ML-TDK WITH IMU-14
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: ATECC608A
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EV45Y33A Microchip Technology Description: ML-BOSCH WITH IMU-2
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: ATECC608A
Part Status: Active
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ATSAML11E14A-AU ATSAML11E14A-AU Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 16KB FLASH 32TQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tray
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DSC6101JI2A-026.0000T DSC6101JI2A-026.0000T Microchip Technology 20005624B.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 26 MHz
Part Status: Obsolete
Height - Seated (Max): 0.035" (0.89mm)
Current - Supply (Max): 3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
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DSC6101JI2A-026.0000T DSC6101JI2A-026.0000T Microchip Technology 20005624B.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Part Status: Obsolete
Frequency: 26 MHz
Base Resonator: MEMS
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DSC6101JI2A-025.0000T DSC6101JI2A-025.0000T Microchip Technology filehandler.aspx?ddocname=en587492 Description: MEMS OSC XO 25.0000MHZ CMOS SMD
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DSC6101JI2A-025.0000T DSC6101JI2A-025.0000T Microchip Technology filehandler.aspx?ddocname=en587492 Description: MEMS OSC XO 25.0000MHZ CMOS SMD
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TC1055-2.5VCT713 TC1055-2.5VCT713 Microchip Technology 50001894.pdf Description: IC REG LINEAR 2.5V 100MA SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 6.5V
Number of Regulators: 1
Supplier Device Package: SOT-23-5
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Active
PSRR: 64dB (1kHz)
Voltage Dropout (Max): 0.25V @ 100mA
Protection Features: Over Current, Over Temperature
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MIC37302BR TR MIC37302BR TR Microchip Technology MCRLS03652-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR POS ADJ 3A S-PAK-5
Protection Features: Over Current, Over Temperature, Reverse Polarity
Control Features: Enable
Voltage - Output (Min/Fixed): 1.24V
Voltage - Output (Max): 5.5V
Supplier Device Package: S-PAK-5
Number of Regulators: 1
Voltage - Input (Max): 6V
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 3A
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: SPak-5 (5 leads + Tab)
Packaging: Bulk
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MIC37150-1.5BR MIC37150-1.5BR Microchip Technology MCRLS02986-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR 1.5V 1.5A S-PAK-3
Operating Temperature: -40°C ~ 125°C
Current - Output: 1.5A
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: Spak-3 (3 Leads + Tab)
Packaging: Bulk
Protection Features: Over Current, Over Temperature, Reverse Polarity
Voltage - Output (Min/Fixed): 1.5V
Supplier Device Package: S-PAK-3
Number of Regulators: 1
Voltage - Input (Max): 6V
Output Configuration: Positive
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MIC37150-1.5WR-TR MIC37150-1.5WR-TR Microchip Technology MIC37150-1-2-3-1.5A-Low-Voltage-Microcap-LDO-Regulators-DS20006491A.pdf Description: IC REG LINEAR 1.5V 1.5A SPAK-3
Protection Features: Over Current, Over Temperature, Reverse Polarity
Part Status: Active
Voltage - Output (Min/Fixed): 1.5V
Supplier Device Package: S-PAK-3
Number of Regulators: 1
Voltage - Input (Max): 6V
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 1.5A
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: Spak-3 (3 Leads + Tab)
Packaging: Cut Tape (CT)
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ADM00716 ADM00716 Microchip Technology Description: AUTOMOTIVE NETWORKING DEVELOPMEN
Contents: Board(s)
Part Status: Active
Primary Attributes: mikroBUS™ Click™, PICtail™ Plus
Supplied Contents: Board(s)
Type: Interface
Function: CANbus and LINbus
Packaging: Bulk
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SG109T-JAN SG109T-JAN Microchip Technology 11111-sg109-pdf Description: IC REG LINEAR 5.05V 1A TO39
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SG109K-883B Microchip Technology 11111-sg109-datasheet Description: IC REG LINEAR 5V 1A TO204AD
Protection Features: Over Temperature
Part Status: Active
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: TO-204AD (TO-3)
Number of Regulators: 1
Voltage - Input (Max): 25V
Current - Quiescent (Iq): 10 mA
Output Configuration: Positive
Operating Temperature: -55°C ~ 150°C (TJ)
Current - Output: 1A
Mounting Type: Through Hole
Output Type: Fixed
Package / Case: TO-204AA, TO-3
Packaging: Tray
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SG109T-883B Microchip Technology 11111-sg109-datasheet Description: POSITIVE FIXED LINEAR VOLTAGE RE
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JAN1N963B-1 JAN1N963B-1 Microchip Technology 125314-lds-0287-datasheet Description: DIODE ZENER
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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JANTXV1N963B-1 JANTXV1N963B-1 Microchip Technology 125314-lds-0287-datasheet Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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JAN1N963C-1 JAN1N963C-1 Microchip Technology 125314-lds-0287-datasheet Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±2%
Packaging: Bulk
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JANTX1N963C-1 JANTX1N963C-1 Microchip Technology 125314-lds-0287-datasheet Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±2%
Packaging: Bulk
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JANTX1N963D-1 JANTX1N963D-1 Microchip Technology 125314-lds-0287-datasheet Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±1%
Packaging: Bulk
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JANTX1N963BUR-1 JANTX1N963BUR-1 Microchip Technology 125313-lds-0287-1-datasheet Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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JANTXV1N963C-1 JANTXV1N963C-1 Microchip Technology 125314-lds-0287-datasheet Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±2%
Packaging: Bulk
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JANTXV1N963D-1 JANTXV1N963D-1 Microchip Technology 125314-lds-0287-datasheet Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±1%
Packaging: Bulk
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JAN1N963CUR-1 Microchip Technology 125313-lds-0287-1-datasheet Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±2%
Packaging: Bulk
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JAN1N963DUR-1 Microchip Technology 125313-lds-0287-1-datasheet Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Packaging: Bulk
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JAN1N963D-1 JAN1N963D-1 Microchip Technology 125314-lds-0287-datasheet Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±1%
Packaging: Bulk
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JANTX1N963DUR-1 JANTX1N963DUR-1 Microchip Technology 125313-lds-0287-1-datasheet Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±1%
Packaging: Bulk
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JANTXV1N963CUR-1 Microchip Technology 125313-lds-0287-1-datasheet Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±2%
Packaging: Bulk
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JANTXV1N963DUR-1 Microchip Technology 125313-lds-0287-1-datasheet Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Packaging: Bulk
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SST26VF032BT-104V/SM70SVAO SST26VF032BT-104V/SM70SVAO Microchip Technology SST26VF032B-SST26VF032BA-Data-Sheet-DS20005218J.pdf Description: IC FLASH 32MBIT SPI/QUAD 8SOIJ
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIJ
Grade: Automotive
Part Status: Active
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SST26VF032BT-80E/SM70SVAO SST26VF032BT-80E/SM70SVAO Microchip Technology SST26VF032B-SST26VF032BA-Data-Sheet-DS20005218J.pdf Description: IC FLASH 32MBIT SPI/QUAD 8SOIJ
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIJ
Grade: Automotive
Part Status: Active
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SST26VF032BT-104V/TD Microchip Technology Description: IC FLASH 32MBIT SPI/QUAD 24TBGA
Packaging: Tape & Reel (TR)
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 24-TBGA (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
DigiKey Programmable: Not Verified
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SST26VF032B-104V/TD Microchip Technology Description: IC FLASH 32MBIT SPI/QUAD 24TBGA
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 24-TBGA (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME51G18A-MU ATSAME51G18A-MU Microchip Technology SAM-D5x-E5x-Family-Data-Sheet-DS60001507.pdf Description: IC MCU 32BIT 256KB FLASH 48VQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
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ATSAME51N19A-AU ATSAME51N19A-AU Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 81
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
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ATSAME51N19A-AFT ATSAME51N19A-AFT Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
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ATSAME51N19A-AFT ATSAME51N19A-AFT Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
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ATSAME51N19A-AF ATSAME51N19A-AF Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 81
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
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100+14.58 EUR
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ATSAME51N20A-AF ATSAME51N20A-AF Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 81
Grade: Automotive
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
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ATSAME51G18A-MF ATSAME51G18A-MF Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 48VQFN
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ATSAME51G18A-MUT ATSAME51G18A-MUT Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 48VQFN
DigiKey Programmable: Not Verified
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 37
Supplier Device Package: 48-QFN (7x7)
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ATSAME51G18A-MUT ATSAME51G18A-MUT Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 48VQFN
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 48-QFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
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AVR128DB28-I/SS AVR128DB28-32-48-64-DataSheet-DS40002247.pdf
AVR128DB28-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
7+3.27 EUR
25+2.99 EUR
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AVR128DB28-I/SO AVR128DB28-32-48-64-DataSheet-DS40002247A.pdf
AVR128DB28-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
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AVR128DB28-E/SS AVR128DB28-32-48-64-DataSheet-DS40002247.pdf
AVR128DB28-E/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
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AVR128DB28-E/SO AVR128DB28-32-48-64-DataSheet-DS40002247A.pdf
AVR128DB28-E/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 28SOIC
DigiKey Programmable: Not Verified
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Number of I/O: 23
Part Status: Active
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: AVR
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
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AVR128DB28-E/SP AVR128DB28-32-48-64-DataSheet-DS40002247A.pdf
AVR128DB28-E/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 28SPDIP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 24MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Number of I/O: 23
Part Status: Active
Supplier Device Package: 28-SPDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: AVR
DigiKey Programmable: Not Verified
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AVR128DB28T-E/SS AVR128DB28-32-48-64-DataSheet-DS40002247.pdf
AVR128DB28T-E/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 28SSOP
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: AVR
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 23
Part Status: Active
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Produkt ist nicht verfügbar
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JAN1N6340US 11083-lds-0193-1-datasheet
JAN1N6340US
Hersteller: Microchip Technology
Description: DIODE ZENER 47V 500MW MELF
Produkt ist nicht verfügbar
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MCP3564RT-E/ST MCP3561_2_4R-Data-Sheet-DS200006391C.pdf
MCP3564RT-E/ST
Hersteller: Microchip Technology
Description: IC ADC 24BIT 20-TSSOP
Packaging: Tape & Reel (TR)
Features: Internal Oscillator, Temperature Sensor
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 24
Configuration: MUX-PGA-ADC
Data Interface: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.7V
Sampling Rate (Per Second): 153.6k
Input Type: Differential, Single Ended
Number of Inputs: 4, 8
Supplier Device Package: 20-TSSOP
Architecture: Sigma-Delta
Ratio - S/H:ADC: 0:4
Part Status: Active
Number of A/D Converters: 1
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MCP3564RT-E/ST MCP3561_2_4R-Data-Sheet-DS200006391C.pdf
MCP3564RT-E/ST
Hersteller: Microchip Technology
Description: IC ADC 24BIT 20-TSSOP
Packaging: Cut Tape (CT)
Features: Internal Oscillator, Temperature Sensor
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 24
Configuration: MUX-PGA-ADC
Data Interface: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.7V
Sampling Rate (Per Second): 153.6k
Input Type: Differential, Single Ended
Number of Inputs: 4, 8
Supplier Device Package: 20-TSSOP
Architecture: Sigma-Delta
Ratio - S/H:ADC: 0:4
Part Status: Active
Number of A/D Converters: 1
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MCP3564RT-E/NC MCP3561_2_4R-Data-Sheet-DS200006391C.pdf
MCP3564RT-E/NC
Hersteller: Microchip Technology
Description: IC ADC 24BIT 20-UQFN
Packaging: Tape & Reel (TR)
Features: Internal Oscillator, Temperature Sensor
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 24
Configuration: MUX-PGA-ADC
Data Interface: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.7V
Sampling Rate (Per Second): 153.6k
Input Type: Differential, Single Ended
Number of Inputs: 4, 8
Supplier Device Package: 20-UQFN (3x3)
Architecture: Sigma-Delta
Ratio - S/H:ADC: 0:4
Part Status: Active
Number of A/D Converters: 1
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MCP3564RT-E/NC MCP3561_2_4R-Data-Sheet-DS200006391C.pdf
MCP3564RT-E/NC
Hersteller: Microchip Technology
Description: IC ADC 24BIT 20-UQFN
Packaging: Cut Tape (CT)
Features: Internal Oscillator, Temperature Sensor
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 24
Configuration: MUX-PGA-ADC
Data Interface: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.7V
Sampling Rate (Per Second): 153.6k
Input Type: Differential, Single Ended
Number of Inputs: 4, 8
Supplier Device Package: 20-UQFN (3x3)
Architecture: Sigma-Delta
Ratio - S/H:ADC: 0:4
Part Status: Active
Number of A/D Converters: 1
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DM860A-AQE
Hersteller: Microchip Technology
Description: IC MPU 240MHZ 320LFBGA
Part Status: Obsolete
Display & Interface Controllers: LCD
Graphics Acceleration: Yes
RAM Controllers: SDRAM, SRAM
Co-Processors/DSP: Multimedia: Audio Engine, Security; Real Time Secure
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 10/100Mbps
Supplier Device Package: 320-LFBGA (13x13)
Core Processor: ARM926EJ
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 320-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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DM860A-LTB
Hersteller: Microchip Technology
Description: IC MPU 240MHZ 320LFBGA
Core Processor: ARM926EJ
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 320-LFBGA
Packaging: Tray
Part Status: Obsolete
Display & Interface Controllers: LCD
Graphics Acceleration: Yes
RAM Controllers: SDRAM, SRAM
Co-Processors/DSP: Multimedia: Audio Engine, Security; Real Time Secure
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 10/100Mbps
Supplier Device Package: 320-LFBGA (13x13)
Produkt ist nicht verfügbar
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DM860-TE DM860_PB_Ver2_8-27-08.pdf
Hersteller: Microchip Technology
Description: IC MPU 240MHZ 292LFBGA
Core Processor: ARM926EJ
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tray
Part Status: Obsolete
Display & Interface Controllers: LCD
Graphics Acceleration: Yes
RAM Controllers: SDRAM, SRAM
Co-Processors/DSP: Multimedia: Audio Engine, Security; Real Time Secure
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 10/100Mbps
Supplier Device Package: 292-LFBGA (17x17)
Produkt ist nicht verfügbar
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A3P125-FGG144I 130704-ds0097-proasic3-family-flash-fpgas-datasheet
A3P125-FGG144I
Hersteller: Microchip Technology
Description: IC FPGA 97 I/O 144FBGA
DigiKey Programmable: Not Verified
Number of I/O: 97
Total RAM Bits: 36864
Supplier Device Package: 144-FPBGA (13x13)
Voltage - Supply: 1.425V ~ 1.575V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 125000
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
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A3P125-TQG144I 130704-ds0097-proasic3-family-flash-fpgas-datasheet
A3P125-TQG144I
Hersteller: Microchip Technology
Description: IC FPGA 100 I/O 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Total RAM Bits: 36864
Supplier Device Package: 144-TQFP (20x20)
Voltage - Supply: 1.425V ~ 1.575V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 125000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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A3P125-VQG100I
A3P125-VQG100I
Hersteller: Microchip Technology
Description: IC FPGA 71 I/O 100VQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 71
Total RAM Bits: 36864
Supplier Device Package: 100-VQFP (14x14)
Voltage - Supply: 1.425V ~ 1.575V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 125000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
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DC1033AI2-025.0000T
DC1033AI2-025.0000T
Hersteller: Microchip Technology
Description: LOW-POWER PRECISION CMOS OSCILLA
Packaging: Bulk
Part Status: Active
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EV18H79A
Hersteller: Microchip Technology
Description: ML-TDK WITH IMU-14
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: ATECC608A
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EV45Y33A
Hersteller: Microchip Technology
Description: ML-BOSCH WITH IMU-2
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: ATECC608A
Part Status: Active
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ATSAML11E14A-AU SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11E14A-AU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 16KB FLASH 32TQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tray
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DSC6101JI2A-026.0000T 20005624B.pdf
DSC6101JI2A-026.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 26 MHz
Part Status: Obsolete
Height - Seated (Max): 0.035" (0.89mm)
Current - Supply (Max): 3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
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DSC6101JI2A-026.0000T 20005624B.pdf
DSC6101JI2A-026.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Part Status: Obsolete
Frequency: 26 MHz
Base Resonator: MEMS
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DSC6101JI2A-025.0000T filehandler.aspx?ddocname=en587492
DSC6101JI2A-025.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Produkt ist nicht verfügbar
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DSC6101JI2A-025.0000T filehandler.aspx?ddocname=en587492
DSC6101JI2A-025.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
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TC1055-2.5VCT713 50001894.pdf
TC1055-2.5VCT713
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.5V 100MA SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 6.5V
Number of Regulators: 1
Supplier Device Package: SOT-23-5
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Active
PSRR: 64dB (1kHz)
Voltage Dropout (Max): 0.25V @ 100mA
Protection Features: Over Current, Over Temperature
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MIC37302BR TR MCRLS03652-1.pdf?t.download=true&u=5oefqw
MIC37302BR TR
Hersteller: Microchip Technology
Description: IC REG LINEAR POS ADJ 3A S-PAK-5
Protection Features: Over Current, Over Temperature, Reverse Polarity
Control Features: Enable
Voltage - Output (Min/Fixed): 1.24V
Voltage - Output (Max): 5.5V
Supplier Device Package: S-PAK-5
Number of Regulators: 1
Voltage - Input (Max): 6V
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 3A
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: SPak-5 (5 leads + Tab)
Packaging: Bulk
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MIC37150-1.5BR MCRLS02986-1.pdf?t.download=true&u=5oefqw
MIC37150-1.5BR
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.5V 1.5A S-PAK-3
Operating Temperature: -40°C ~ 125°C
Current - Output: 1.5A
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: Spak-3 (3 Leads + Tab)
Packaging: Bulk
Protection Features: Over Current, Over Temperature, Reverse Polarity
Voltage - Output (Min/Fixed): 1.5V
Supplier Device Package: S-PAK-3
Number of Regulators: 1
Voltage - Input (Max): 6V
Output Configuration: Positive
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MIC37150-1.5WR-TR MIC37150-1-2-3-1.5A-Low-Voltage-Microcap-LDO-Regulators-DS20006491A.pdf
MIC37150-1.5WR-TR
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.5V 1.5A SPAK-3
Protection Features: Over Current, Over Temperature, Reverse Polarity
Part Status: Active
Voltage - Output (Min/Fixed): 1.5V
Supplier Device Package: S-PAK-3
Number of Regulators: 1
Voltage - Input (Max): 6V
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 1.5A
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: Spak-3 (3 Leads + Tab)
Packaging: Cut Tape (CT)
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ADM00716
ADM00716
Hersteller: Microchip Technology
Description: AUTOMOTIVE NETWORKING DEVELOPMEN
Contents: Board(s)
Part Status: Active
Primary Attributes: mikroBUS™ Click™, PICtail™ Plus
Supplied Contents: Board(s)
Type: Interface
Function: CANbus and LINbus
Packaging: Bulk
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SG109T-JAN 11111-sg109-pdf
SG109T-JAN
Hersteller: Microchip Technology
Description: IC REG LINEAR 5.05V 1A TO39
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SG109K-883B 11111-sg109-datasheet
Hersteller: Microchip Technology
Description: IC REG LINEAR 5V 1A TO204AD
Protection Features: Over Temperature
Part Status: Active
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: TO-204AD (TO-3)
Number of Regulators: 1
Voltage - Input (Max): 25V
Current - Quiescent (Iq): 10 mA
Output Configuration: Positive
Operating Temperature: -55°C ~ 150°C (TJ)
Current - Output: 1A
Mounting Type: Through Hole
Output Type: Fixed
Package / Case: TO-204AA, TO-3
Packaging: Tray
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SG109T-883B 11111-sg109-datasheet
Hersteller: Microchip Technology
Description: POSITIVE FIXED LINEAR VOLTAGE RE
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JAN1N963B-1 125314-lds-0287-datasheet
JAN1N963B-1
Hersteller: Microchip Technology
Description: DIODE ZENER
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N963B-1 125314-lds-0287-datasheet
JANTXV1N963B-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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JAN1N963C-1 125314-lds-0287-datasheet
JAN1N963C-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N963C-1 125314-lds-0287-datasheet
JANTX1N963C-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N963D-1 125314-lds-0287-datasheet
JANTX1N963D-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±1%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N963BUR-1 125313-lds-0287-1-datasheet
JANTX1N963BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N963C-1 125314-lds-0287-datasheet
JANTXV1N963C-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N963D-1 125314-lds-0287-datasheet
JANTXV1N963D-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±1%
Packaging: Bulk
Produkt ist nicht verfügbar
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JAN1N963CUR-1 125313-lds-0287-1-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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JAN1N963DUR-1 125313-lds-0287-1-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Packaging: Bulk
Produkt ist nicht verfügbar
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JAN1N963D-1 125314-lds-0287-datasheet
JAN1N963D-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO35
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±1%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N963DUR-1 125313-lds-0287-1-datasheet
JANTX1N963DUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±1%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N963CUR-1 125313-lds-0287-1-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N963DUR-1 125313-lds-0287-1-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO213AA
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 1 µA @ 9.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 11.5 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Packaging: Bulk
Produkt ist nicht verfügbar
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SST26VF032BT-104V/SM70SVAO SST26VF032B-SST26VF032BA-Data-Sheet-DS20005218J.pdf
SST26VF032BT-104V/SM70SVAO
Hersteller: Microchip Technology
Description: IC FLASH 32MBIT SPI/QUAD 8SOIJ
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIJ
Grade: Automotive
Part Status: Active
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SST26VF032BT-80E/SM70SVAO SST26VF032B-SST26VF032BA-Data-Sheet-DS20005218J.pdf
SST26VF032BT-80E/SM70SVAO
Hersteller: Microchip Technology
Description: IC FLASH 32MBIT SPI/QUAD 8SOIJ
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIJ
Grade: Automotive
Part Status: Active
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SST26VF032BT-104V/TD
Hersteller: Microchip Technology
Description: IC FLASH 32MBIT SPI/QUAD 24TBGA
Packaging: Tape & Reel (TR)
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 24-TBGA (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SST26VF032B-104V/TD
Hersteller: Microchip Technology
Description: IC FLASH 32MBIT SPI/QUAD 24TBGA
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 24-TBGA (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 4M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME51G18A-MU SAM-D5x-E5x-Family-Data-Sheet-DS60001507.pdf
ATSAME51G18A-MU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48VQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 5300 Stücke:
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AnzahlPrivatkunde
3+10 EUR
25+9.17 EUR
100+8.31 EUR
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ATSAME51N19A-AU SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51N19A-AU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 81
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
auf Bestellung 118 Stücke:
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AnzahlPrivatkunde
2+13.72 EUR
25+12.57 EUR
100+11.41 EUR
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ATSAME51N19A-AFT SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51N19A-AFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Produkt ist nicht verfügbar
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ATSAME51N19A-AFT SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51N19A-AFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Produkt ist nicht verfügbar
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ATSAME51N19A-AF SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51N19A-AF
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 81
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
auf Bestellung 650 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.17 EUR
25+15.72 EUR
100+14.58 EUR
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ATSAME51N20A-AF SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51N20A-AF
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 81
Grade: Automotive
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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ATSAME51G18A-MF SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51G18A-MF
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48VQFN
Produkt ist nicht verfügbar
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ATSAME51G18A-MUT SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51G18A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48VQFN
DigiKey Programmable: Not Verified
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 37
Supplier Device Package: 48-QFN (7x7)
Produkt ist nicht verfügbar
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ATSAME51G18A-MUT SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51G18A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48VQFN
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 48-QFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Produkt ist nicht verfügbar
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