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Hersteller: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS

Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 50.0000MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 37.125 MHz
Base Resonator: MEMS

Hersteller: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 45.1584MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 45.1584MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 49.1520MHZ CMOS SMD

Hersteller: Microchip Technology
Description: MEMS OSC XO 49.1520MHZ CMOS SMD

Hersteller: Microchip Technology
Description: DUAL-SLOT PCI EXPRESS HOT-PLUG C
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC RF TXRX+MCU WIFI 55WLCSP
Packaging: Cut Tape (CT)
Package / Case: 55-UFBGA, WLCSP
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 224kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 20.5dBm
Protocol: 802.11b/g/n
Current - Receiving: 52.5mA ~ 58.5mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 244mA ~ 294mA
Supplier Device Package: 55-WLCSP (3.25x3.25)
GPIO: 9
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: I2C, SDIO, SPI, UART
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: SI CAPACITOR NON HERMETIC MMSM
Tolerance: ±10%
Features: RF, High Q, Low Loss
Packaging: Tape & Reel (TR)
Package / Case: 0402 (1005 Metric)
Size / Dimension: 0.043" L x 0.023" W (1.09mm x 0.58mm)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Height - Seated (Max): 0.016" (0.41mm)
Capacitance: 5 pF

Hersteller: Microchip Technology
Description: SI CAPACITOR NON HERMETIC MMSM
Tolerance: ±10%
Features: RF, High Q, Low Loss
Packaging: Cut Tape (CT)
Package / Case: 0402 (1005 Metric)
Size / Dimension: 0.043" L x 0.023" W (1.09mm x 0.58mm)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Height - Seated (Max): 0.016" (0.41mm)
Capacitance: 5 pF

Hersteller: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2V DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 133.9A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500

Hersteller: Microchip Technology
Description: TVS DIODE 40VWM 64.5VC SMCJ
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.4V
Voltage - Clamping (Max) @ Ipp: 64.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Part Status: Active
Qualification: MIL-PRF-19500

Hersteller: Microchip Technology
Description: TVS DIODE 60V 96.8V DO215AB

Hersteller: Microchip Technology
Description: IC REG LINEAR 1.85V/2.85V 10MLF
Packaging: Bulk
Package / Case: 10-VFDFN Exposed Pad, 10-MLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA, 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 2
Supplier Device Package: 10-MLF® (3x3)
Voltage - Output (Min/Fixed): 1.85V, 2.85V
Control Features: Enable, Power On Reset
PSRR: 60dB ~ 40dB (1KHz ~ 20kHz)
Voltage Dropout (Max): 0.25V @ 150mA, 0.42V @ 300mA
Protection Features: Over Current, Over Temperature

Hersteller: Microchip Technology
Description: IC FLASH 64MBIT PARALLEL 48TSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 4M x 16
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC FLASH 64MBIT PARALLEL 48TSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 4M x 16
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b, 3x16b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 52
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b, 3x16b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 52
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b, 3x16b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 52
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b, 3x16b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 52
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b, 3x16b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 52
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b, 3x16b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 52
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b, 3x16b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 52
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64QFN

Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64QFN

Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64TQFP

Hersteller: Microchip Technology
Description: IC CLK BUFFER 2:8 1.5GHZ 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: CML, LP-HCSL, LVCMOS, LVDS, LVPECL, SSTL
Frequency - Max: 1.5GHz
Type: Fanout Buffer (Distribution)
Input: CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.375V ~ 2.625V, 3.135V ~ 3.465V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 2:8
Differential - Input:Output: Yes/Yes
Supplier Device Package: 48-QFN (7x7)
Number of Circuits: 1
Frequency - Max: 1.5 GHz

Hersteller: Microchip Technology
Description: IC CLK BUFFER 2:12 1.5GHZ 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL
Type: Fanout Buffer (Distribution)
Input: CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.375V ~ 2.625V, 3.135V ~ 3.465V
Ratio - Input:Output: 2:12
Differential - Input:Output: Yes/Yes
Supplier Device Package: 56-QFN (8x8)
Part Status: Active
Frequency - Max: 1.5 GHz

Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 400MHZ 20QFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LP-HCSL
Frequency - Max: 400MHz
Type: Fanout Buffer (Distribution)
Input: Differential or Single-Ended
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.375V ~ 2.625V, 3.135V ~ 3.465V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 20-QFN (4x4)
Number of Circuits: 1
Frequency - Max: 400 MHz

Hersteller: Microchip Technology
Description: IC DISTRIBUTION PCIE 20-VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: HCSL
Type: Fanout Buffer (Distribution)
Input: Differential or Single-Ended
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.375V ~ 2.625V, 3.135V ~ 3.465V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 20-QFN (4x4)
Frequency - Max: 400 MHz

Hersteller: Microchip Technology
Description: IC DISTRIBUTION PCIE 20-VFQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: HCSL
Type: Fanout Buffer (Distribution)
Input: Differential or Single-Ended
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.375V ~ 2.625V, 3.135V ~ 3.465V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 20-QFN (4x4)
Frequency - Max: 400 MHz

Hersteller: Microchip Technology
Description: IC EEPROM 1KBIT SGL WIRE DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: Die
Write Cycle Time - Word, Page: 5ms
Memory Interface: Single Wire
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC EEPROM 1KBIT SGL WIRE DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: Die
Write Cycle Time - Word, Page: 5ms
Memory Interface: Single Wire
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC EEPROM 16KBIT SGL WIRE SOT23

Hersteller: Microchip Technology
Description: IC EEPROM 16KBIT SGL WIRE SOT23

Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 48UQFN
Packaging: Tube
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 48-UQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP-EP (7x7)
Number of I/O: 44
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 48UQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-UQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP-EP (7x7)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 44
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC SYNCHRONIZER ETHERNET 80VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 80-VFLGA
Mounting Type: Surface Mount
Output: CMOS, HCSL, HSTL, LVDS, LVPECL
Frequency - Max: 1.045GHz
Input: CMOS
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 3.3V
Main Purpose: Ethernet, SONET/SDH
Ratio - Input:Output: 5:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 80-LGA (11x11)
PLL: Yes
Part Status: Active
Number of Circuits: 2
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 79
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-VFBGA (7x7)
Number of I/O: 79
DigiKey Programmable: Not Verified

Hersteller: Microchip Technology
Description: CRYSTAL CMOS 114.285MHZ SMD

Hersteller: Microchip Technology
Description: CRYSTAL CMOS 114.285MHZ SMD

Hersteller: Microchip Technology
Description: IC OPAMP VFB 1 CIRCUIT SC70-5
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Amplifier Type: Voltage Feedback
Operating Temperature: -40°C ~ 85°C
Current - Supply: 2.4mA
Slew Rate: 1500V/µs
Gain Bandwidth Product: 51 MHz
Current - Input Bias: 3.5 µA
Voltage - Input Offset: 300 µV
Supplier Device Package: SC-70-5
Part Status: Active
Number of Circuits: 1
Current - Output / Channel: 72 mA
-3db Bandwidth: 109 MHz
Voltage - Supply Span (Min): 5 V
Voltage - Supply Span (Max): 18 V

Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 28VQFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified