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2N2222AUB/TR 2N2222AUB/TR Microchip Technology 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf Description: TRANS NPN 50V 0.8A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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2N2222AUA/TR 2N2222AUA/TR Microchip Technology 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf Description: TRANS NPN 50V 0.8A 4-SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: 4-SMD
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
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1N5822US/TR 1N5822US/TR Microchip Technology 131998-lds-0303-1.pdf Description: DIODE SCHOTTKY 40V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
Current - Reverse Leakage @ Vr: 100 µA @ 40 V
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MIC94310-DYMT-TR MIC94310-DYMT-TR Microchip Technology MIC94310-Data-Sheet-20006105B.pdf Description: IC REG LINEAR 1.85V 200MA 4TMLF
Control Features: Enable
Voltage - Output (Min/Fixed): 1.85V
Supplier Device Package: 4-TMLF® (1.2x1.6)
Number of Regulators: 1
Voltage - Input (Max): 3.6V
Current - Quiescent (Iq): 250 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 85dB ~ 50dB (100Hz ~ 10MHz)
Package / Case: 4-UDFN Exposed Pad, 4-TMLF®
Packaging: Tape & Reel (TR)
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MIC94310-DYMT-TR MIC94310-DYMT-TR Microchip Technology MIC94310-Data-Sheet-20006105B.pdf Description: IC REG LINEAR 1.85V 200MA 4TMLF
Current - Quiescent (Iq): 250 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad, 4-TMLF®
Packaging: Cut Tape (CT)
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 85dB ~ 50dB (100Hz ~ 10MHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.85V
Supplier Device Package: 4-TMLF® (1.2x1.6)
Number of Regulators: 1
Voltage - Input (Max): 3.6V
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MPLAD7.5KP10A Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
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ATSAMD21E15L-MFT ATSAMD21E15L-MFT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-VQFN (5x5)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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ATSAMD21E15L-MFT ATSAMD21E15L-MFT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-VQFN (5x5)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATSAMD21E15L-AFT ATSAMD21E15L-AFT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 32KB FLASH 32TQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 26
Grade: Automotive
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tape & Reel (TR)
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ATSAMD21E15L-AFT ATSAMD21E15L-AFT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 32KB FLASH 32TQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 26
Grade: Automotive
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Cut Tape (CT)
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ATSAMD21J16B-MUT ATSAMD21J16B-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 64KB FLASH 64QFN
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ATSAMDA1E14B-ABT ATSAMDA1E14B-ABT Microchip Technology 40001895A.pdf Description: IC MCU 32BIT 16KB FLASH 32TQFP
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: I²C, SCI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tape & Reel (TR)
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ATSAMDA1E14B-ABT ATSAMDA1E14B-ABT Microchip Technology 40001895A.pdf Description: IC MCU 32BIT 16KB FLASH 32TQFP
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: I²C, SCI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Cut Tape (CT)
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ATSAMD21J17D-MUT ATSAMD21J17D-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 52
DigiKey Programmable: Not Verified
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ATSAMD21J17D-MUT ATSAMD21J17D-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 52
DigiKey Programmable: Not Verified
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ATSAMD21J17D-MFT ATSAMD21J17D-MFT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 64QFN
Qualification: AEC-Q100
Grade: Automotive
Connectivity: I2C, LINbus, SPI, UART/USART, USB
DigiKey Programmable: Not Verified
Number of I/O: 52
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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ATSAMD21J17D-MFT ATSAMD21J17D-MFT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 64QFN
Qualification: AEC-Q100
Grade: Automotive
Connectivity: I2C, LINbus, SPI, UART/USART, USB
DigiKey Programmable: Not Verified
Number of I/O: 52
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATSAMD21J17D-AUT ATSAMD21J17D-AUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 64TQFP
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ATSAMD21J17D-AUT ATSAMD21J17D-AUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 64TQFP
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ATSAMD21J17D-MU ATSAMD21J17D-MU Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 64QFN
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ATSAMDA1E15B-ABT ATSAMDA1E15B-ABT Microchip Technology 40001895A.pdf Description: IC MCU 32BIT 32KB FLASH 32TQFP
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: I²C, SCI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tape & Reel (TR)
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ATSAMDA1E15B-ABT ATSAMDA1E15B-ABT Microchip Technology 40001895A.pdf Description: IC MCU 32BIT 32KB FLASH 32TQFP
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-TQFP (7x7)
Connectivity: I²C, SCI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Cut Tape (CT)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
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ATSAML11E14A-MF ATSAML11E14A-MF Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 16KB FLASH 32VQFN
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-VQFN (5x5)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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1N4744AG 1N4744AG Microchip Technology 1N4728AG_1N4764AG_e3.pdf Description: DIODE ZENER 15V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 11.4 V
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CDLL4487/TR CDLL4487/TR Microchip Technology CDLL4496.pdf Description: DIODE ZENER 82V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 65.6 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 160 Ohms
Voltage - Zener (Nom) (Vz): 82 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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CDLL4486/TR CDLL4486/TR Microchip Technology CDLL4496.pdf Description: DIODE ZENER 75V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 60.4 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 130 Ohms
Voltage - Zener (Nom) (Vz): 75 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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CDLL4483/TR CDLL4483/TR Microchip Technology CDLL4496.pdf Description: DIODE ZENER 56V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 44.8 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 70 Ohms
Voltage - Zener (Nom) (Vz): 56 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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CDLL4480/TR CDLL4480/TR Microchip Technology CDLL4496.pdf Description: DIODE ZENER 43V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 50 nA @ 34.4 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 40 Ohms
Voltage - Zener (Nom) (Vz): 43 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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CDLL4481/TR CDLL4481/TR Microchip Technology CDLL4496.pdf Description: DIODE ZENER 47V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 50 nA @ 37.6 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 50 Ohms
Voltage - Zener (Nom) (Vz): 47 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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CDLL4482/TR CDLL4482/TR Microchip Technology CDLL4496.pdf Description: DIODE ZENER 51V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 40.8 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 60 Ohms
Voltage - Zener (Nom) (Vz): 51 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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CDLL4485/TR CDLL4485/TR Microchip Technology CDLL4496.pdf Description: DIODE ZENER 68V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 54.4 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 100 Ohms
Voltage - Zener (Nom) (Vz): 68 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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CDLL4484/TR CDLL4484/TR Microchip Technology CDLL4496.pdf Description: DIODE ZENER 62V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 49.6 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 62 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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CDLL4488/TR CDLL4488/TR Microchip Technology CDLL4496.pdf Description: DIODE ZENER 91V 1.5W DO213AB
Part Status: Active
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 91 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 250 nA @ 72.8 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
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CDLL4489/TR CDLL4489/TR Microchip Technology CDLL4496.pdf Description: DIODE ZENER 100V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 250 Ohms
Voltage - Zener (Nom) (Vz): 100 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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JANS1N4972US JANS1N4972US Microchip Technology 11059-sd44a-datasheet Description: DIODE ZENER 39V 5W D5B
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
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JANTXV1N6620US JANTXV1N6620US Microchip Technology 11068-sd52a-datasheet Description: DIODE GEN PURP 220V 1.2A D-5A
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 1.2A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 220 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Current - Reverse Leakage @ Vr: 500 nA @ 220 V
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2N6211 2N6211 Microchip Technology Description: TRANS PNP 225V 0.005A TO66
Packaging: Bulk
Package / Case: TO-213AA, TO-66-2
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -55°C ~ 200°C (TA)
Vce Saturation (Max) @ Ib, Ic: 1.4V @ 125mA, 1A
Current - Collector Cutoff (Max): 5mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 1A, 5V
Supplier Device Package: TO-66 (TO-213AA)
Part Status: Active
Current - Collector (Ic) (Max): 5 mA
Voltage - Collector Emitter Breakdown (Max): 225 V
Power - Max: 3 W
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
1+66.67 EUR
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1N4740AGE3 1N4740AGE3 Microchip Technology 1N4728AG_1N4764AG_e3.pdf Description: DIODE ZENER 10V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 7.6 V
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JAN1N5620/TR JAN1N5620/TR Microchip Technology Description: DIODE GEN PURP 800V 1A
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 200°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 800 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 800 V
Qualification: MIL-PRF-19500/427
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1N5712-1E3 1N5712-1E3 Microchip Technology 8865-lds-0040-pdf.pdf Description: DIODE SCHOTTKY 20V 75MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
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2N2907AE3 2N2907AE3 Microchip Technology 00005313A.pdf Description: TRANS PNP 60V 0.6A TO-18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 10V
Supplier Device Package: TO-18
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
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2N2907AUB/TR 2N2907AUB/TR Microchip Technology 00005313A.pdf Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 10V
Supplier Device Package: UB
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
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JAN2N2907AUB/TR JAN2N2907AUB/TR Microchip Technology 00005313A.pdf Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
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JANTXV2N2907AUB/TR JANTXV2N2907AUB/TR Microchip Technology 00005313A.pdf Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
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MNS2N2907AUB Microchip Technology 00005313A.pdf Description: MNS2N2907AUB
Packaging: Bulk
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JANHCB2N2907A JANHCB2N2907A Microchip Technology 00005313A.pdf Description: TRANS PNP 60V 0.6A TO-18
Packaging: Tape & Reel (TR)
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
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JANKCB2N2907A JANKCB2N2907A Microchip Technology 00005313A.pdf Description: TRANS PNP 60V 0.6A TO-18
Packaging: Tape & Reel (TR)
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
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JAN2N2907AUA/TR JAN2N2907AUA/TR Microchip Technology 00005313A.pdf Description: TRANS PNP 60V 0.6A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
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JANS2N2907AUB/TR JANS2N2907AUB/TR Microchip Technology 00005313A.pdf Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
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JANTXV2N2907AUA/TR JANTXV2N2907AUA/TR Microchip Technology Description: TRANS PNP 60V 0.6A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
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JANSR2N2907AUB/TR JANSR2N2907AUB/TR Microchip Technology Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
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JANSP2N2907AUB/TR JANSP2N2907AUB/TR Microchip Technology Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
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JANSL2N2907AUB/TR JANSL2N2907AUB/TR Microchip Technology Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
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JANSD2N2907AUB/TR JANSD2N2907AUB/TR Microchip Technology Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
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JANSM2N2907AUB/TR JANSM2N2907AUB/TR Microchip Technology Description: TRANS PNP 60V 0.6A UB
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 60 V
Current - Collector (Ic) (Max): 600 mA
Part Status: Active
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
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JANS2N2907AUA/TR JANS2N2907AUA/TR Microchip Technology Description: TRANS PNP 60V 0.6A UA
Current - Collector (Ic) (Max): 600 mA
Part Status: Active
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 60 V
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JANSR2N2907AUA JANSR2N2907AUA Microchip Technology Description: TRANS PNP 60V 0.6A UA
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 60 V
Current - Collector (Ic) (Max): 600 mA
Part Status: Active
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANSR2N2907AUA/TR JANSR2N2907AUA/TR Microchip Technology Description: TRANS PNP 60V 0.6A UA
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 60 V
Current - Collector (Ic) (Max): 600 mA
Part Status: Active
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
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JANSP2N2907AUA/TR JANSP2N2907AUA/TR Microchip Technology Description: TRANS PNP 60V 0.6A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
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M2GL060-VFG400I M2GL060-VFG400I Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC FPGA 207 I/O 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 2.625V
Number of Logic Elements/Cells: 56520
Supplier Device Package: 400-VFBGA (17x17)
Total RAM Bits: 1869824
Number of I/O: 207
DigiKey Programmable: Not Verified
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2N2222AUB/TR 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf
2N2222AUB/TR
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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2N2222AUA/TR 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf
2N2222AUA/TR
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A 4-SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: 4-SMD
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Produkt ist nicht verfügbar
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1N5822US/TR 131998-lds-0303-1.pdf
1N5822US/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
Current - Reverse Leakage @ Vr: 100 µA @ 40 V
Produkt ist nicht verfügbar
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MIC94310-DYMT-TR MIC94310-Data-Sheet-20006105B.pdf
MIC94310-DYMT-TR
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.85V 200MA 4TMLF
Control Features: Enable
Voltage - Output (Min/Fixed): 1.85V
Supplier Device Package: 4-TMLF® (1.2x1.6)
Number of Regulators: 1
Voltage - Input (Max): 3.6V
Current - Quiescent (Iq): 250 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 85dB ~ 50dB (100Hz ~ 10MHz)
Package / Case: 4-UDFN Exposed Pad, 4-TMLF®
Packaging: Tape & Reel (TR)
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MIC94310-DYMT-TR MIC94310-Data-Sheet-20006105B.pdf
MIC94310-DYMT-TR
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.85V 200MA 4TMLF
Current - Quiescent (Iq): 250 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad, 4-TMLF®
Packaging: Cut Tape (CT)
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 85dB ~ 50dB (100Hz ~ 10MHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.85V
Supplier Device Package: 4-TMLF® (1.2x1.6)
Number of Regulators: 1
Voltage - Input (Max): 3.6V
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37+0.49 EUR
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MPLAD7.5KP10A 132315-plad7-5kp-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE
Produkt ist nicht verfügbar
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ATSAMD21E15L-MFT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21E15L-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-VQFN (5x5)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAMD21E15L-MFT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21E15L-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-VQFN (5x5)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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ATSAMD21E15L-AFT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21E15L-AFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 32TQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 26
Grade: Automotive
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAMD21E15L-AFT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21E15L-AFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 32TQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 26
Grade: Automotive
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Cut Tape (CT)
auf Bestellung 1963 Stücke:
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5+4.26 EUR
25+3.88 EUR
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ATSAMD21J16B-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J16B-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64QFN
Produkt ist nicht verfügbar
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ATSAMDA1E14B-ABT 40001895A.pdf
ATSAMDA1E14B-ABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 16KB FLASH 32TQFP
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: I²C, SCI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAMDA1E14B-ABT 40001895A.pdf
ATSAMDA1E14B-ABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 16KB FLASH 32TQFP
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: I²C, SCI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Cut Tape (CT)
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ATSAMD21J17D-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J17D-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 52
DigiKey Programmable: Not Verified
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ATSAMD21J17D-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J17D-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 52
DigiKey Programmable: Not Verified
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4+5.24 EUR
25+4.78 EUR
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ATSAMD21J17D-MFT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J17D-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64QFN
Qualification: AEC-Q100
Grade: Automotive
Connectivity: I2C, LINbus, SPI, UART/USART, USB
DigiKey Programmable: Not Verified
Number of I/O: 52
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAMD21J17D-MFT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J17D-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64QFN
Qualification: AEC-Q100
Grade: Automotive
Connectivity: I2C, LINbus, SPI, UART/USART, USB
DigiKey Programmable: Not Verified
Number of I/O: 52
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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ATSAMD21J17D-AUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J17D-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64TQFP
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ATSAMD21J17D-AUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J17D-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64TQFP
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ATSAMD21J17D-MU SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J17D-MU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64QFN
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ATSAMDA1E15B-ABT 40001895A.pdf
ATSAMDA1E15B-ABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 32TQFP
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: I²C, SCI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAMDA1E15B-ABT 40001895A.pdf
ATSAMDA1E15B-ABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 32TQFP
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-TQFP (7x7)
Connectivity: I²C, SCI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Cut Tape (CT)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
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AnzahlPreis
3+7.04 EUR
25+6.38 EUR
100+5.79 EUR
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ATSAML11E14A-MF SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11E14A-MF
Hersteller: Microchip Technology
Description: IC MCU 32BIT 16KB FLASH 32VQFN
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-VQFN (5x5)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 490 Stücke:
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AnzahlPreis
4+4.44 EUR
25+4.05 EUR
100+3.67 EUR
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1N4744AG 1N4728AG_1N4764AG_e3.pdf
1N4744AG
Hersteller: Microchip Technology
Description: DIODE ZENER 15V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 11.4 V
Produkt ist nicht verfügbar
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CDLL4487/TR CDLL4496.pdf
CDLL4487/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 82V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 65.6 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 160 Ohms
Voltage - Zener (Nom) (Vz): 82 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CDLL4486/TR CDLL4496.pdf
CDLL4486/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 75V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 60.4 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 130 Ohms
Voltage - Zener (Nom) (Vz): 75 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CDLL4483/TR CDLL4496.pdf
CDLL4483/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 56V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 44.8 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 70 Ohms
Voltage - Zener (Nom) (Vz): 56 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CDLL4480/TR CDLL4496.pdf
CDLL4480/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 43V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 50 nA @ 34.4 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 40 Ohms
Voltage - Zener (Nom) (Vz): 43 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CDLL4481/TR CDLL4496.pdf
CDLL4481/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 47V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 50 nA @ 37.6 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 50 Ohms
Voltage - Zener (Nom) (Vz): 47 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CDLL4482/TR CDLL4496.pdf
CDLL4482/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 51V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 40.8 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 60 Ohms
Voltage - Zener (Nom) (Vz): 51 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CDLL4485/TR CDLL4496.pdf
CDLL4485/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 68V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 54.4 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 100 Ohms
Voltage - Zener (Nom) (Vz): 68 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CDLL4484/TR CDLL4496.pdf
CDLL4484/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 62V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 49.6 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 62 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CDLL4488/TR CDLL4496.pdf
CDLL4488/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 91V 1.5W DO213AB
Part Status: Active
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 91 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 250 nA @ 72.8 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Produkt ist nicht verfügbar
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CDLL4489/TR CDLL4496.pdf
CDLL4489/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 100V 1.5W DO213AB
Current - Reverse Leakage @ Vr: 250 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: DO-213AB
Impedance (Max) (Zzt): 250 Ohms
Voltage - Zener (Nom) (Vz): 100 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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JANS1N4972US 11059-sd44a-datasheet
JANS1N4972US
Hersteller: Microchip Technology
Description: DIODE ZENER 39V 5W D5B
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
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JANTXV1N6620US 11068-sd52a-datasheet
JANTXV1N6620US
Hersteller: Microchip Technology
Description: DIODE GEN PURP 220V 1.2A D-5A
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 1.2A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 220 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Current - Reverse Leakage @ Vr: 500 nA @ 220 V
Produkt ist nicht verfügbar
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2N6211
2N6211
Hersteller: Microchip Technology
Description: TRANS PNP 225V 0.005A TO66
Packaging: Bulk
Package / Case: TO-213AA, TO-66-2
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -55°C ~ 200°C (TA)
Vce Saturation (Max) @ Ib, Ic: 1.4V @ 125mA, 1A
Current - Collector Cutoff (Max): 5mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 1A, 5V
Supplier Device Package: TO-66 (TO-213AA)
Part Status: Active
Current - Collector (Ic) (Max): 5 mA
Voltage - Collector Emitter Breakdown (Max): 225 V
Power - Max: 3 W
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+66.67 EUR
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1N4740AGE3 1N4728AG_1N4764AG_e3.pdf
1N4740AGE3
Hersteller: Microchip Technology
Description: DIODE ZENER 10V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 7.6 V
Produkt ist nicht verfügbar
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JAN1N5620/TR
JAN1N5620/TR
Hersteller: Microchip Technology
Description: DIODE GEN PURP 800V 1A
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 200°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 800 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 800 V
Qualification: MIL-PRF-19500/427
Produkt ist nicht verfügbar
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1N5712-1E3 8865-lds-0040-pdf.pdf
1N5712-1E3
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 75MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
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2N2907AE3 00005313A.pdf
2N2907AE3
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A TO-18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 10V
Supplier Device Package: TO-18
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
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2N2907AUB/TR 00005313A.pdf
2N2907AUB/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 10V
Supplier Device Package: UB
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
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JAN2N2907AUB/TR 00005313A.pdf
JAN2N2907AUB/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
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JANTXV2N2907AUB/TR 00005313A.pdf
JANTXV2N2907AUB/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
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MNS2N2907AUB 00005313A.pdf
Hersteller: Microchip Technology
Description: MNS2N2907AUB
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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JANHCB2N2907A 00005313A.pdf
JANHCB2N2907A
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A TO-18
Packaging: Tape & Reel (TR)
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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JANKCB2N2907A 00005313A.pdf
JANKCB2N2907A
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A TO-18
Packaging: Tape & Reel (TR)
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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JAN2N2907AUA/TR 00005313A.pdf
JAN2N2907AUA/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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JANS2N2907AUB/TR 00005313A.pdf
JANS2N2907AUB/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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JANTXV2N2907AUA/TR
JANTXV2N2907AUA/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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JANSR2N2907AUB/TR
JANSR2N2907AUB/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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JANSP2N2907AUB/TR
JANSP2N2907AUB/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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JANSL2N2907AUB/TR
JANSL2N2907AUB/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
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JANSD2N2907AUB/TR
JANSD2N2907AUB/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
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JANSM2N2907AUB/TR
JANSM2N2907AUB/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UB
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 60 V
Current - Collector (Ic) (Max): 600 mA
Part Status: Active
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANS2N2907AUA/TR
JANS2N2907AUA/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UA
Current - Collector (Ic) (Max): 600 mA
Part Status: Active
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 60 V
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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JANSR2N2907AUA
JANSR2N2907AUA
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UA
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 60 V
Current - Collector (Ic) (Max): 600 mA
Part Status: Active
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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JANSR2N2907AUA/TR
JANSR2N2907AUA/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UA
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 60 V
Current - Collector (Ic) (Max): 600 mA
Part Status: Active
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANSP2N2907AUA/TR
JANSP2N2907AUA/TR
Hersteller: Microchip Technology
Description: TRANS PNP 60V 0.6A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/291
Produkt ist nicht verfügbar
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M2GL060-VFG400I 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2GL060-VFG400I
Hersteller: Microchip Technology
Description: IC FPGA 207 I/O 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 2.625V
Number of Logic Elements/Cells: 56520
Supplier Device Package: 400-VFBGA (17x17)
Total RAM Bits: 1869824
Number of I/O: 207
DigiKey Programmable: Not Verified
auf Bestellung 507 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+194.64 EUR
25+181.66 EUR
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