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60KS200C Microchip Technology hEoWU7bkhlQwy0ffGwOaEf1c9T3ha.w54KLrg6576q4 Description: TVS DIODE 180VWM 335VC CASE-11
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JANTXV1N6104AUS JANTXV1N6104AUS Microchip Technology 127892-lds-0277-1-datasheet Description: TVS DIODE 6.2VWM 12.1VC SQ-MELF
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JANTXV1N6104 JANTXV1N6104 Microchip Technology 127891-lds-0277-datasheet Description: TVS DIODE 6.2VWM 12.71VC AXIAL
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JANTXV1N6104A JANTXV1N6104A Microchip Technology 127891-lds-0277-datasheet Description: TVS DIODE 6.2VWM 12.1VC AXIAL
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JANTXV1N6105 JANTXV1N6105 Microchip Technology 127891-lds-0277-datasheet Description: TVS DIODE 6.9VWM 14.07VC AXIAL
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JANTXV1N6075 JANTXV1N6075 Microchip Technology 10971-sa7-53-datasheet Description: DIODE GEN PURP 150V 850MA A-PAK
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 155°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 150 V
Qualification: MIL-PRF-19500/503
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JANTXV1N6074 JANTXV1N6074 Microchip Technology 10971-sa7-53-datasheet Description: DIODE GP 100V 850MA A AXIAL
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MIC6315-41D4UY-TR MIC6315-41D4UY-TR Microchip Technology MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf Description: IC SUPERVISOR 1 CHANNEL SOT143
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: SOT-143
Voltage - Threshold: 4.1V
Reset Timeout: 1.1s Minimum
Number of Voltages Monitored: 1
Operating Temperature: -40°C ~ 85°C (TA)
Reset: Active Low
Type: Simple Reset/Power-On Reset
Output: Open Drain or Open Collector
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Packaging: Tape & Reel (TR)
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MIC6315-41D4UY-TR MIC6315-41D4UY-TR Microchip Technology MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf Description: IC SUPERVISOR 1 CHANNEL SOT143
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: SOT-143
Package / Case: TO-253-4, TO-253AA
Packaging: Cut Tape (CT)
Voltage - Threshold: 4.1V
Reset Timeout: 1.1s Minimum
Number of Voltages Monitored: 1
Operating Temperature: -40°C ~ 85°C (TA)
Reset: Active Low
Type: Simple Reset/Power-On Reset
Output: Open Drain or Open Collector
Mounting Type: Surface Mount
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VCC6-1306-226M562500 Microchip Technology 1243794-vcc6 Description: CUSTOM DIFFERENTIAL XO
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Function: Enable/Disable
Type: XO (Standard)
Height - Seated (Max): 0.063" (1.60mm)
Part Status: Last Time Buy
Frequency: 226.5625 MHz
Base Resonator: Crystal
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DSC1223DA3-100M0000 DSC1223DA3-100M0000 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 100.0000MHZ LVDS SMD
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DSC1221NL1-125M0000T Microchip Technology Description: MEMS OSC AUTO LOWPWR -40C-105C
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DSC1223CI2-100M0000T Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011D.pdf Description: OSC MEMS AUTO -40C-85C SMD
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DSC1223CI3-125M0000T Microchip Technology Description: OSC MEMS LVDS SMD
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DSC1224BI2-100M0000 DSC1224BI2-100M0000 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 100.0000MHZ HCSL SMD
Base Resonator: MEMS
Frequency: 100 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 40mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: HCSL
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Strip
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DSC1224DI3-100M0000 DSC1224DI3-100M0000 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011E.pdf Description: MEMS OSC, LOW JITTER, 100MHZ, HC
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DSC1222CI3-164M4257 DSC1222CI3-164M4257 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 164.4257MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 164.4257 MHz
Base Resonator: MEMS
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DSC1223DA2-156M2500 DSC1223DA2-156M2500 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 156.2500MHZ LVDS SMD
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DSC1222DL3-156M2500 DSC1222DL3-156M2500 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 156.2500MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSC1223CI3-100M0000T Microchip Technology Description: MEMS OSC, LOW JITTER, 100MHZ, LV
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DSC1221NI2-125M0000T Microchip Technology Description: OSC MEMS LOW PWR SMD
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DSC1223NI1-106M2500T Microchip Technology Description: MEMS OSC AUTO LOWPWR -40C-85C
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DSC1223BI2-66M66660 DSC1223BI2-66M66660 Microchip Technology Description: OSC MEMS LVDS SMD
Base Resonator: MEMS
Frequency: 66.6666 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Tube
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DSC1223NI1-135M0000T Microchip Technology Description: MEMS OSC AUTO LOWPWR -40C-85C
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DSC1223CI3-100M0000 Microchip Technology Description: MEMS OSC, LOW JITTER, 100MHZ, LV
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DSC1222NE1-100M0000T DSC1222NE1-100M0000T Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011E.pdf Description: MEMS OSC, LOW JITTER, 100MHZ, LV
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JANS1N5711UBD/TR JANS1N5711UBD/TR Microchip Technology Description: DIODE ARRAY SCHOTTKY 50V 33MA UB
Qualification: MIL-PRF-19500/444
Grade: Military
Current - Average Rectified (Io) (per Diode): 33mA
Diode Configuration: 1 Pair Series Connection
Voltage - Forward (Vf) (Max) @ If: 1 V @ 15 mA
Voltage - DC Reverse (Vr) (Max): 50 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: UB
Current - Average Rectified (Io): 33mA
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Technology: Schottky
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 200 nA @ 50 V
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JANS1N5711-1 JANS1N5711-1 Microchip Technology Description: DIODE SCHOTTKY 70V 33MA DO35
Qualification: MIL-PRF-19500/444
Grade: Military
Current - Reverse Leakage @ Vr: 200 nA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 15 mA
Voltage - DC Reverse (Vr) (Max): 70 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: DO-35 (DO-204AH)
Current - Average Rectified (Io): 33mA
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Technology: Schottky
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Packaging: Bulk
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ATSAML10D14A-MU ATSAML10D14A-MU Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 16KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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ATSAML10E16A-AF ATSAML10E16A-AF Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 32TQFP
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
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ATSAML10D16A-YFT ATSAML10D16A-YFT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24SSOP
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-SSOP
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
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ATSAML10D16A-YFT ATSAML10D16A-YFT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24SSOP
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-SSOP
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
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ATSAML10E16A-UUT ATSAML10E16A-UUT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 32WLCSP
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ATSAML10E14A-AF ATSAML10E14A-AF Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 16KB FLASH 32TQFP
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
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RE46C117S8TF RE46C117S8TF Microchip Technology 22159B.pdf Description: IC HORN DRIVER DUAL 8SOIC
DigiKey Programmable: Not Verified
Current - Supply: 14 µA
Part Status: Active
Supplier Device Package: 8-SOIC
Input Type: Logic
Operating Temperature: 0°C ~ 50°C
Type: Horn Driver
Mounting Type: Surface Mount
Output Type: Logic
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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MSCGLQ200A65TG Microchip Technology Description: PM-IGBT-SP4
Packaging: Bulk
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MSCGLQ100A65TG Microchip Technology Description: PM-IGBT-SP4
Part Status: Active
Packaging: Bulk
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ATSAMS70Q19B-CNT ATSAMS70Q19B-CNT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 512KB FLSH 144LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 114
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tape & Reel (TR)
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ATSAMS70N20A-CNT ATSAMS70N20A-CNT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
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ATSAMD20J18A-CNT ATSAMD20J18A-CNT Microchip Technology SAM-D20-Family-Data-Sheet-DS60001504.pdf Description: IC MCU 32BIT 256KB FLASH 64UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-UFBGA (5x5)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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ATSAMD20J15A-CNT ATSAMD20J15A-CNT Microchip Technology atmel-42129-sam-d20_summary.pdf Description: IC MCU 32BIT 32KB FLASH 64UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-UFBGA (5x5)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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ATSAMD20J14A-CNT ATSAMD20J14A-CNT Microchip Technology atmel-42129-sam-d20_summary.pdf Description: IC MCU 32BIT 16KB FLASH 64UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-UFBGA (5x5)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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MASMBJ8.5CA MASMBJ8.5CA Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 8.5VWM 14.4V DO214AA
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Voltage - Breakdown (Min): 9.44V
Bidirectional Channels: 1
Supplier Device Package: DO-214AA (SMBJ)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
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MXLSMBJ8.5CA MXLSMBJ8.5CA Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 8.5VWM 14.4VC SMBJ
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Voltage - Breakdown (Min): 9.44V
Qualification: MIL-PRF-19500
Grade: Military
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MXSMBJ8.5CA MXSMBJ8.5CA Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 8.5VWM 14.4VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Voltage - Breakdown (Min): 9.44V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
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MXLSMBJ8.5CAe3 MXLSMBJ8.5CAe3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 8.5VWM 14.4VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Voltage - Breakdown (Min): 9.44V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
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MXSMBJ8.5CAe3 MXSMBJ8.5CAe3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 8.5VWM 14.4VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Voltage - Breakdown (Min): 9.44V
Bidirectional Channels: 1
Qualification: MIL-PRF-19500
Grade: Military
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Produkt ist nicht verfügbar
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MASMBJ8.5CAe3 MASMBJ8.5CAe3 Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 8.5VWM 14.4V DO214AA
Voltage - Breakdown (Min): 9.44V
Bidirectional Channels: 1
Supplier Device Package: DO-214AA (SMBJ)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Qualification: MIL-PRF-19500
Grade: Military
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JANTX1N1616R JANTX1N1616R Microchip Technology 8952-lds-0139-datasheet Description: DIODE GP REV 600V 15A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Qualification: MIL-PRF-19500/162
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JAN1N1616R JAN1N1616R Microchip Technology 8952-lds-0139-datasheet Description: DIODE GP REV 600V 15A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Qualification: MIL-PRF-19500/162
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1N1616 1N1616 Microchip Technology 8952-lds-0139-datasheet Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
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JANTX1N1616 JANTX1N1616 Microchip Technology 8952-lds-0139-datasheet Description: DIODE GEN PURP 600V 15A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Qualification: MIL-PRF-19500/162
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JAN1N1616 JAN1N1616 Microchip Technology Description: DIODE GP REV 600V 15A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Qualification: MIL-PRF-19500/162
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1N1616R 1N1616R Microchip Technology 8952-lds-0139-datasheet Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
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AT32UC3A4256HHB-C1UR Microchip Technology Description: EDBG - EDBG
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LAN8741AI-EN-TR LAN8741AI-EN-TR Microchip Technology 8741a.pdf Description: IC TRANSCEIVER 1/1 32SQFN
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Duplex: Full
Supplier Device Package: 32-SQFN (5x5)
Protocol: MII, RMII
Data Rate: 100Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 1.6V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
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LAN8741AI-EN-TR LAN8741AI-EN-TR Microchip Technology 8741a.pdf Description: IC TRANSCEIVER 1/1 32SQFN
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Duplex: Full
Supplier Device Package: 32-SQFN (5x5)
Protocol: MII, RMII
Data Rate: 100Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 1.6V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
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6+3.67 EUR
25+3.62 EUR
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1N5832 Microchip Technology 5868-1n5832-34-datasheet Description: DIODE SCHOTTKY 20V 40A DO5
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1N5830 1N5830 Microchip Technology 5867-1n5829-31-datasheet Description: DIODE SCHOTTKY 30V 25A DO203AA
Current - Reverse Leakage @ Vr: 3 mA @ 30 V
Voltage - Forward (Vf) (Max) @ If: 460 mV @ 25 A
Voltage - DC Reverse (Vr) (Max): 30 V
Operating Temperature - Junction: -65°C ~ 125°C
Supplier Device Package: DO-203AA (DO-4)
Current - Average Rectified (Io): 25A
Capacitance @ Vr, F: 1650pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-203AA, DO-4, Stud
Packaging: Bulk
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1N5831 1N5831 Microchip Technology 1n5829.pdf 1N5829-1N5831-ssi.pdf Description: DIODE SCHOTTKY 40V 25A DO203AA
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60KS200C hEoWU7bkhlQwy0ffGwOaEf1c9T3ha.w54KLrg6576q4
Hersteller: Microchip Technology
Description: TVS DIODE 180VWM 335VC CASE-11
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JANTXV1N6104AUS 127892-lds-0277-1-datasheet
JANTXV1N6104AUS
Hersteller: Microchip Technology
Description: TVS DIODE 6.2VWM 12.1VC SQ-MELF
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JANTXV1N6104 127891-lds-0277-datasheet
JANTXV1N6104
Hersteller: Microchip Technology
Description: TVS DIODE 6.2VWM 12.71VC AXIAL
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JANTXV1N6104A 127891-lds-0277-datasheet
JANTXV1N6104A
Hersteller: Microchip Technology
Description: TVS DIODE 6.2VWM 12.1VC AXIAL
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JANTXV1N6105 127891-lds-0277-datasheet
JANTXV1N6105
Hersteller: Microchip Technology
Description: TVS DIODE 6.9VWM 14.07VC AXIAL
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JANTXV1N6075 10971-sa7-53-datasheet
JANTXV1N6075
Hersteller: Microchip Technology
Description: DIODE GEN PURP 150V 850MA A-PAK
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 850mA
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 155°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 2.04 V @ 9.4 A
Current - Reverse Leakage @ Vr: 1 µA @ 150 V
Qualification: MIL-PRF-19500/503
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JANTXV1N6074 10971-sa7-53-datasheet
JANTXV1N6074
Hersteller: Microchip Technology
Description: DIODE GP 100V 850MA A AXIAL
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MIC6315-41D4UY-TR MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf
MIC6315-41D4UY-TR
Hersteller: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT143
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: SOT-143
Voltage - Threshold: 4.1V
Reset Timeout: 1.1s Minimum
Number of Voltages Monitored: 1
Operating Temperature: -40°C ~ 85°C (TA)
Reset: Active Low
Type: Simple Reset/Power-On Reset
Output: Open Drain or Open Collector
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Packaging: Tape & Reel (TR)
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MIC6315-41D4UY-TR MIC6315-Open-Drain-Microprocessor-Reset-Circuit-DS20006450A.pdf
MIC6315-41D4UY-TR
Hersteller: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT143
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: SOT-143
Package / Case: TO-253-4, TO-253AA
Packaging: Cut Tape (CT)
Voltage - Threshold: 4.1V
Reset Timeout: 1.1s Minimum
Number of Voltages Monitored: 1
Operating Temperature: -40°C ~ 85°C (TA)
Reset: Active Low
Type: Simple Reset/Power-On Reset
Output: Open Drain or Open Collector
Mounting Type: Surface Mount
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AnzahlPrivatkunde
22+0.99 EUR
26+0.82 EUR
100+0.75 EUR
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VCC6-1306-226M562500 1243794-vcc6
Hersteller: Microchip Technology
Description: CUSTOM DIFFERENTIAL XO
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Function: Enable/Disable
Type: XO (Standard)
Height - Seated (Max): 0.063" (1.60mm)
Part Status: Last Time Buy
Frequency: 226.5625 MHz
Base Resonator: Crystal
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DSC1223DA3-100M0000 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1223DA3-100M0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 100.0000MHZ LVDS SMD
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DSC1221NL1-125M0000T
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-105C
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DSC1223CI2-100M0000T DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011D.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-85C SMD
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DSC1223CI3-125M0000T
Hersteller: Microchip Technology
Description: OSC MEMS LVDS SMD
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DSC1224BI2-100M0000 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1224BI2-100M0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 100.0000MHZ HCSL SMD
Base Resonator: MEMS
Frequency: 100 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 40mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: HCSL
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Strip
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DSC1224DI3-100M0000 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011E.pdf
DSC1224DI3-100M0000
Hersteller: Microchip Technology
Description: MEMS OSC, LOW JITTER, 100MHZ, HC
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DSC1222CI3-164M4257 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1222CI3-164M4257
Hersteller: Microchip Technology
Description: MEMS OSC XO 164.4257MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 164.4257 MHz
Base Resonator: MEMS
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DSC1223DA2-156M2500 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1223DA2-156M2500
Hersteller: Microchip Technology
Description: MEMS OSC XO 156.2500MHZ LVDS SMD
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DSC1222DL3-156M2500 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1222DL3-156M2500
Hersteller: Microchip Technology
Description: MEMS OSC XO 156.2500MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSC1223CI3-100M0000T
Hersteller: Microchip Technology
Description: MEMS OSC, LOW JITTER, 100MHZ, LV
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DSC1221NI2-125M0000T
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR SMD
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DSC1223NI1-106M2500T
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
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DSC1223BI2-66M66660
DSC1223BI2-66M66660
Hersteller: Microchip Technology
Description: OSC MEMS LVDS SMD
Base Resonator: MEMS
Frequency: 66.6666 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Tube
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DSC1223NI1-135M0000T
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
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DSC1223CI3-100M0000
Hersteller: Microchip Technology
Description: MEMS OSC, LOW JITTER, 100MHZ, LV
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DSC1222NE1-100M0000T DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011E.pdf
DSC1222NE1-100M0000T
Hersteller: Microchip Technology
Description: MEMS OSC, LOW JITTER, 100MHZ, LV
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JANS1N5711UBD/TR
JANS1N5711UBD/TR
Hersteller: Microchip Technology
Description: DIODE ARRAY SCHOTTKY 50V 33MA UB
Qualification: MIL-PRF-19500/444
Grade: Military
Current - Average Rectified (Io) (per Diode): 33mA
Diode Configuration: 1 Pair Series Connection
Voltage - Forward (Vf) (Max) @ If: 1 V @ 15 mA
Voltage - DC Reverse (Vr) (Max): 50 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: UB
Current - Average Rectified (Io): 33mA
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Technology: Schottky
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 200 nA @ 50 V
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JANS1N5711-1
JANS1N5711-1
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 70V 33MA DO35
Qualification: MIL-PRF-19500/444
Grade: Military
Current - Reverse Leakage @ Vr: 200 nA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 15 mA
Voltage - DC Reverse (Vr) (Max): 70 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: DO-35 (DO-204AH)
Current - Average Rectified (Io): 33mA
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Technology: Schottky
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Packaging: Bulk
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ATSAML10D14A-MU SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D14A-MU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 16KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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ATSAML10E16A-AF SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10E16A-AF
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 32TQFP
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
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ATSAML10D16A-YFT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D16A-YFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24SSOP
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-SSOP
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
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ATSAML10D16A-YFT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D16A-YFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24SSOP
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-SSOP
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
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ATSAML10E16A-UUT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10E16A-UUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 32WLCSP
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ATSAML10E14A-AF SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10E14A-AF
Hersteller: Microchip Technology
Description: IC MCU 32BIT 16KB FLASH 32TQFP
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
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RE46C117S8TF 22159B.pdf
RE46C117S8TF
Hersteller: Microchip Technology
Description: IC HORN DRIVER DUAL 8SOIC
DigiKey Programmable: Not Verified
Current - Supply: 14 µA
Part Status: Active
Supplier Device Package: 8-SOIC
Input Type: Logic
Operating Temperature: 0°C ~ 50°C
Type: Horn Driver
Mounting Type: Surface Mount
Output Type: Logic
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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MSCGLQ200A65TG
Hersteller: Microchip Technology
Description: PM-IGBT-SP4
Packaging: Bulk
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MSCGLQ100A65TG
Hersteller: Microchip Technology
Description: PM-IGBT-SP4
Part Status: Active
Packaging: Bulk
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ATSAMS70Q19B-CNT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMS70Q19B-CNT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLSH 144LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 114
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tape & Reel (TR)
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ATSAMS70N20A-CNT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMS70N20A-CNT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
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ATSAMD20J18A-CNT SAM-D20-Family-Data-Sheet-DS60001504.pdf
ATSAMD20J18A-CNT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-UFBGA (5x5)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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ATSAMD20J15A-CNT atmel-42129-sam-d20_summary.pdf
ATSAMD20J15A-CNT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 64UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-UFBGA (5x5)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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ATSAMD20J14A-CNT atmel-42129-sam-d20_summary.pdf
ATSAMD20J14A-CNT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 16KB FLASH 64UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-UFBGA (5x5)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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MASMBJ8.5CA RF01000+%283%29.pdf
MASMBJ8.5CA
Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.4V DO214AA
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Voltage - Breakdown (Min): 9.44V
Bidirectional Channels: 1
Supplier Device Package: DO-214AA (SMBJ)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
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MXLSMBJ8.5CA 10560-msmb-datasheet
MXLSMBJ8.5CA
Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.4VC SMBJ
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Voltage - Breakdown (Min): 9.44V
Qualification: MIL-PRF-19500
Grade: Military
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MXSMBJ8.5CA 10560-msmb-datasheet
MXSMBJ8.5CA
Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.4VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Voltage - Breakdown (Min): 9.44V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
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MXLSMBJ8.5CAe3 10560-msmb-datasheet
MXLSMBJ8.5CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.4VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Voltage - Breakdown (Min): 9.44V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
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MXSMBJ8.5CAe3 10560-msmb-datasheet
MXSMBJ8.5CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.4VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Voltage - Breakdown (Min): 9.44V
Bidirectional Channels: 1
Qualification: MIL-PRF-19500
Grade: Military
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
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MASMBJ8.5CAe3 RF01000+%283%29.pdf
MASMBJ8.5CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.4V DO214AA
Voltage - Breakdown (Min): 9.44V
Bidirectional Channels: 1
Supplier Device Package: DO-214AA (SMBJ)
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 41.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 14.4V
Qualification: MIL-PRF-19500
Grade: Military
Produkt ist nicht verfügbar
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JANTX1N1616R 8952-lds-0139-datasheet
JANTX1N1616R
Hersteller: Microchip Technology
Description: DIODE GP REV 600V 15A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Qualification: MIL-PRF-19500/162
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JAN1N1616R 8952-lds-0139-datasheet
JAN1N1616R
Hersteller: Microchip Technology
Description: DIODE GP REV 600V 15A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Qualification: MIL-PRF-19500/162
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1N1616 8952-lds-0139-datasheet
1N1616
Hersteller: Microchip Technology
Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
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JANTX1N1616 8952-lds-0139-datasheet
JANTX1N1616
Hersteller: Microchip Technology
Description: DIODE GEN PURP 600V 15A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Qualification: MIL-PRF-19500/162
Produkt ist nicht verfügbar
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JAN1N1616
JAN1N1616
Hersteller: Microchip Technology
Description: DIODE GP REV 600V 15A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Qualification: MIL-PRF-19500/162
Produkt ist nicht verfügbar
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1N1616R 8952-lds-0139-datasheet
1N1616R
Hersteller: Microchip Technology
Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Produkt ist nicht verfügbar
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AT32UC3A4256HHB-C1UR
Hersteller: Microchip Technology
Description: EDBG - EDBG
Produkt ist nicht verfügbar
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LAN8741AI-EN-TR 8741a.pdf
LAN8741AI-EN-TR
Hersteller: Microchip Technology
Description: IC TRANSCEIVER 1/1 32SQFN
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Duplex: Full
Supplier Device Package: 32-SQFN (5x5)
Protocol: MII, RMII
Data Rate: 100Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 1.6V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Produkt ist nicht verfügbar
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LAN8741AI-EN-TR 8741a.pdf
LAN8741AI-EN-TR
Hersteller: Microchip Technology
Description: IC TRANSCEIVER 1/1 32SQFN
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Duplex: Full
Supplier Device Package: 32-SQFN (5x5)
Protocol: MII, RMII
Data Rate: 100Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 1.6V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
auf Bestellung 1392 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.67 EUR
25+3.62 EUR
Mindestbestellmenge: 6 Stücke
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1N5832 5868-1n5832-34-datasheet
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 40A DO5
Produkt ist nicht verfügbar
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1N5830 5867-1n5829-31-datasheet
1N5830
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 30V 25A DO203AA
Current - Reverse Leakage @ Vr: 3 mA @ 30 V
Voltage - Forward (Vf) (Max) @ If: 460 mV @ 25 A
Voltage - DC Reverse (Vr) (Max): 30 V
Operating Temperature - Junction: -65°C ~ 125°C
Supplier Device Package: DO-203AA (DO-4)
Current - Average Rectified (Io): 25A
Capacitance @ Vr, F: 1650pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-203AA, DO-4, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5831 1n5829.pdf 1N5829-1N5831-ssi.pdf
1N5831
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 25A DO203AA
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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