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1N2129A Microchip Technology S%2CR35.pdf Description: DIODE GEN PURP 100V 70A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 70A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 100 V
Produkt ist nicht verfügbar
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1N2129R Microchip Technology S%2CR35.pdf Description: DIODE GEN PURP REV 100V 70A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 70A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 100 V
Produkt ist nicht verfügbar
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1N2129RA Microchip Technology S%2CR35.pdf Description: DIODE GEN PURP REV 100V 70A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 70A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 100 V
Produkt ist nicht verfügbar
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1N2129 Microchip Technology S%2CR35.pdf Description: DIODE GEN PURP 100V 70A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 70A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 100 V
Produkt ist nicht verfügbar
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1N2283 Microchip Technology S,R304.pdf Description: DIODE GEN PURP 400V 20A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 µs
Technology: Standard
Current - Average Rectified (Io): 20A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
Produkt ist nicht verfügbar
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1N2283R Microchip Technology S,R304.pdf Description: DIODE GEN PURP 400V 35A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 µs
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
Produkt ist nicht verfügbar
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1N2159 Microchip Technology S,R304.pdf Description: DIODE GEN PURP 500V 25A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 µs
Technology: Standard
Current - Average Rectified (Io): 25A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Current - Reverse Leakage @ Vr: 10 µA @ 500 V
Produkt ist nicht verfügbar
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UTR2360 UTR2360 Microchip Technology Description: DIODE GEN PURP 600V 2A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 400 ns
Technology: Standard
Capacitance @ Vr, F: 160pF @ 0V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 2 A
Current - Reverse Leakage @ Vr: 5 µA @ 600 V
Produkt ist nicht verfügbar
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PIC16F18146-I/6N PIC16F18146-I/6N Microchip Technology PIC16F18126-46-Full-Featured-Microcontrollers-Data-Sheet-40002339C.pdf Description: IC MCU 8BIT 28KB FLASH 20VQFN
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 41x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (4x4)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
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PIC16F18146-I/SS PIC16F18146-I/SS Microchip Technology PIC16F18126-46-Full-Featured-Microcontrollers-Data-Sheet-40002339C.pdf Description: IC MCU 8BIT 28KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 41x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
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AT27C400-90PC AT27C400-90PC Microchip Technology AT27C400%20%28May00%29.pdf Description: IC EPROM 4MBIT PARALLEL 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EPROM - OTP
Memory Format: EPROM
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SMBJ12CAE3/TR13 SMBJ12CAE3/TR13 Microchip Technology SA3-37.pdf Description: TVS DIODE 12VWM 19.9VC DO214AA
Packaging: Tape & Reel (TR)
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 30.2A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: DO-214AA (SMBJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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SMBJ12CAE3/TR13 SMBJ12CAE3/TR13 Microchip Technology SA3-37.pdf Description: TVS DIODE 12VWM 19.9VC DO214AA
Packaging: Cut Tape (CT)
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 30.2A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: DO-214AA (SMBJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
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GCX1211-23-0 GCX1211-23-0 Microchip Technology 8722-gcx1200-series-datasheet Description: SI TVAR NON HERMETIC PLASTIC SMT
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 6.8pF @ 4V, 1MHz
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance Ratio Condition: C0/C30
Supplier Device Package: SOT-23-3
Part Status: Active
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 4.0
Produkt ist nicht verfügbar
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JAN1N4474CUS JAN1N4474CUS Microchip Technology 1N4460US-1N4496US.1N6485US-1NN6491US.pdf Description: DIODE ZENER 24V 1.5W D5A
Tolerance: ±2%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 16 Ohms
Supplier Device Package: D-5A
Grade: Military
Part Status: Active
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19.2 V
Qualification: MIL-PRF-19500/406
Produkt ist nicht verfügbar
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2N5759 Microchip Technology Description: POWER BJT
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-204AD (TO-3)
Part Status: Active
Current - Collector (Ic) (Max): 6 A
Voltage - Collector Emitter Breakdown (Max): 120 V
Power - Max: 150 W
Produkt ist nicht verfügbar
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MSASC100W100HX/TR Microchip Technology Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Tape & Reel (TR)
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
Current - Reverse Leakage @ Vr: 1 mA @ 100 V
Produkt ist nicht verfügbar
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MSASC100W100HS/TR Microchip Technology Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Tape & Reel (TR)
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
Current - Reverse Leakage @ Vr: 1 mA @ 100 V
Produkt ist nicht verfügbar
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MSASC100W100H/TR Microchip Technology Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Tape & Reel (TR)
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
Produkt ist nicht verfügbar
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MSASC100W100H Microchip Technology Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Bulk
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
Produkt ist nicht verfügbar
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MSASC100W100HR Microchip Technology Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Bulk
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
Produkt ist nicht verfügbar
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LND150N3-G-P002 LND150N3-G-P002 Microchip Technology LND150%20C041114.pdf Description: MOSFET N-CH 500V 30MA TO92-3
Packaging: Tape & Reel (TR)
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel, Depletion Mode
Current - Continuous Drain (Id) @ 25°C: 30mA (Tj)
Rds On (Max) @ Id, Vgs: 1000Ohm @ 500µA, 0V
Power Dissipation (Max): 740mW (Ta)
Supplier Device Package: TO-92-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 0V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Input Capacitance (Ciss) (Max) @ Vds: 10 pF @ 25 V
Produkt ist nicht verfügbar
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LND150N3-G-P002 LND150N3-G-P002 Microchip Technology LND150%20C041114.pdf Description: MOSFET N-CH 500V 30MA TO92-3
Packaging: Cut Tape (CT)
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel, Depletion Mode
Current - Continuous Drain (Id) @ 25°C: 30mA (Tj)
Rds On (Max) @ Id, Vgs: 1000Ohm @ 500µA, 0V
Power Dissipation (Max): 740mW (Ta)
Supplier Device Package: TO-92-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 0V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Input Capacitance (Ciss) (Max) @ Vds: 10 pF @ 25 V
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24LC512T-E/SN 24LC512T-E/SN Microchip Technology 24AA512-24LC512-24FC512-512K-Bit-I2C-Serial-EEPROM-20001754Q.pdf Description: IC EEPROM 512KBIT I2C 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 64K x 8
DigiKey Programmable: Verified
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24LC512T-E/SN 24LC512T-E/SN Microchip Technology 24AA512-24LC512-24FC512-512K-Bit-I2C-Serial-EEPROM-20001754Q.pdf Description: IC EEPROM 512KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 64K x 8
DigiKey Programmable: Verified
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ST6020A Microchip Technology Description: DIODE GEN PURP 200V 40A TO204AD
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 µs
Technology: Standard
Current - Average Rectified (Io): 40A
Supplier Device Package: TO-204AD (TO-3)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 A
Current - Reverse Leakage @ Vr: 5 µA @ 200 V
Produkt ist nicht verfügbar
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ST6020D Microchip Technology Description: STD RECTIFIER
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 20A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Produkt ist nicht verfügbar
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ST6020 Microchip Technology Description: DIODE GEN PURP 200V 20A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 20A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Produkt ist nicht verfügbar
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ATMEGA168PB-ANR ATMEGA168PB-ANR Microchip Technology ATmega48PB-88PB-168PB-DataSheet-DS40001909B.pdf Description: IC MCU 8BIT 16KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATMEGA168PB-ANR ATMEGA168PB-ANR Microchip Technology ATmega48PB-88PB-168PB-DataSheet-DS40001909B.pdf Description: IC MCU 8BIT 16KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
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VC-801-EAE-KAAN-60M0000000 Microchip Technology 1243787-vc-801 Description: VC-801-EAE-KAAN-60M0000000
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 30mA
Height - Seated (Max): 0.055" (1.40mm)
Part Status: Active
Frequency: 60 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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dsPIC33EP128MU206-H/PT Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-I/MR Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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dsPIC33EP128MU206-E/MR Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-H/MR Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206T-I/PT Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206T-I/MR Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-E/PT Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-I/PT Microchip Technology Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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MXLPLAD30KP33Ae3 Microchip Technology 9523-mplad30kp-datasheet Description: TVS DIODE 33VWM 53.3VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 564A
Voltage - Reverse Standoff (Typ): 33V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 36.7V
Voltage - Clamping (Max) @ Ipp: 53.3V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MASMCG30CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MSMCG30CAe3 MSMCG30CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MXSMCG30CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MXSMCG30CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MXLSMCG30CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MXLSMCG30CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MASMCG30CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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24AA256T-E/SN 24AA256T-E/SN Microchip Technology 24AA256-24LC256-24FC256-256K-I2C-Serial-EEPROM-DS20001203.pdf Description: IC EEPROM 256KBIT I2C 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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24AA256T-E/SN 24AA256T-E/SN Microchip Technology 24AA256-24LC256-24FC256-256K-I2C-Serial-EEPROM-DS20001203.pdf Description: IC EEPROM 256KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
auf Bestellung 2449 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.78 EUR
25+1.70 EUR
100+1.68 EUR
Mindestbestellmenge: 10
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SM0502-M1 Microchip Technology 11207-sm0500-sm1000-series-datasheet Description: RF DIODE PIN 500V M1
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 700mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
Produkt ist nicht verfügbar
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SM0512-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 50V, 1MHz
Resistance @ If, F: 250mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
Produkt ist nicht verfügbar
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SM0509-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.2pF @ 50V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
Produkt ist nicht verfügbar
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SM0504-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.6pF @ 50V, 1MHz
Resistance @ If, F: 600mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
Produkt ist nicht verfügbar
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SMX0512MR-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 50V, 1MHz
Resistance @ If, F: 250mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
Produkt ist nicht verfügbar
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SMX0502-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 700mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
Produkt ist nicht verfügbar
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SM1002-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Bulk
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.2pF @ 50V, 1MHz
Resistance @ If, F: 200mOhm @ 200mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
Produkt ist nicht verfügbar
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SM0511-M1/TR Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.25pF @ 50V, 1MHz
Resistance @ If, F: 300mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
Produkt ist nicht verfügbar
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SM0511-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.25pF @ 50V, 1MHz
Resistance @ If, F: 300mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
Produkt ist nicht verfügbar
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GC4432-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 1Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 300V
Supplier Device Package: M1
Part Status: Active
Current - Max: 50 mA
Produkt ist nicht verfügbar
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SM0504-M1 Microchip Technology Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.6pF @ 50V, 1MHz
Resistance @ If, F: 600mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
Produkt ist nicht verfügbar
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1N2129A S%2CR35.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP 100V 70A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 70A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 100 V
Produkt ist nicht verfügbar
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1N2129R S%2CR35.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP REV 100V 70A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 70A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 100 V
Produkt ist nicht verfügbar
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1N2129RA S%2CR35.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP REV 100V 70A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 70A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 100 V
Produkt ist nicht verfügbar
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1N2129 S%2CR35.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP 100V 70A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 70A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 100 V
Produkt ist nicht verfügbar
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1N2283 S,R304.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP 400V 20A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 µs
Technology: Standard
Current - Average Rectified (Io): 20A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
Produkt ist nicht verfügbar
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1N2283R S,R304.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP 400V 35A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 µs
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
Produkt ist nicht verfügbar
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1N2159 S,R304.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP 500V 25A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 µs
Technology: Standard
Current - Average Rectified (Io): 25A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Current - Reverse Leakage @ Vr: 10 µA @ 500 V
Produkt ist nicht verfügbar
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UTR2360
UTR2360
Hersteller: Microchip Technology
Description: DIODE GEN PURP 600V 2A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 400 ns
Technology: Standard
Capacitance @ Vr, F: 160pF @ 0V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 2 A
Current - Reverse Leakage @ Vr: 5 µA @ 600 V
Produkt ist nicht verfügbar
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PIC16F18146-I/6N PIC16F18126-46-Full-Featured-Microcontrollers-Data-Sheet-40002339C.pdf
PIC16F18146-I/6N
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 20VQFN
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 41x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (4x4)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 586 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.83 EUR
25+1.68 EUR
100+1.61 EUR
Mindestbestellmenge: 10
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PIC16F18146-I/SS PIC16F18126-46-Full-Featured-Microcontrollers-Data-Sheet-40002339C.pdf
PIC16F18146-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 41x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 11202 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.92 EUR
25+1.76 EUR
100+1.63 EUR
Mindestbestellmenge: 10
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AT27C400-90PC AT27C400%20%28May00%29.pdf
AT27C400-90PC
Hersteller: Microchip Technology
Description: IC EPROM 4MBIT PARALLEL 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EPROM - OTP
Memory Format: EPROM
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SMBJ12CAE3/TR13 SA3-37.pdf
SMBJ12CAE3/TR13
Hersteller: Microchip Technology
Description: TVS DIODE 12VWM 19.9VC DO214AA
Packaging: Tape & Reel (TR)
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 30.2A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: DO-214AA (SMBJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
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SMBJ12CAE3/TR13 SA3-37.pdf
SMBJ12CAE3/TR13
Hersteller: Microchip Technology
Description: TVS DIODE 12VWM 19.9VC DO214AA
Packaging: Cut Tape (CT)
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 30.2A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: DO-214AA (SMBJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
auf Bestellung 2990 Stücke:
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GCX1211-23-0 8722-gcx1200-series-datasheet
GCX1211-23-0
Hersteller: Microchip Technology
Description: SI TVAR NON HERMETIC PLASTIC SMT
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 6.8pF @ 4V, 1MHz
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance Ratio Condition: C0/C30
Supplier Device Package: SOT-23-3
Part Status: Active
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 4.0
Produkt ist nicht verfügbar
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JAN1N4474CUS 1N4460US-1N4496US.1N6485US-1NN6491US.pdf
JAN1N4474CUS
Hersteller: Microchip Technology
Description: DIODE ZENER 24V 1.5W D5A
Tolerance: ±2%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 16 Ohms
Supplier Device Package: D-5A
Grade: Military
Part Status: Active
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19.2 V
Qualification: MIL-PRF-19500/406
Produkt ist nicht verfügbar
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2N5759
Hersteller: Microchip Technology
Description: POWER BJT
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-204AD (TO-3)
Part Status: Active
Current - Collector (Ic) (Max): 6 A
Voltage - Collector Emitter Breakdown (Max): 120 V
Power - Max: 150 W
Produkt ist nicht verfügbar
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MSASC100W100HX/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Tape & Reel (TR)
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
Current - Reverse Leakage @ Vr: 1 mA @ 100 V
Produkt ist nicht verfügbar
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MSASC100W100HS/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Tape & Reel (TR)
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
Current - Reverse Leakage @ Vr: 1 mA @ 100 V
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MSASC100W100H/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Tape & Reel (TR)
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
Produkt ist nicht verfügbar
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MSASC100W100H
Hersteller: Microchip Technology
Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Bulk
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
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MSASC100W100HR
Hersteller: Microchip Technology
Description: DIODE SCHOTT 100V 100A THINKEY1
Packaging: Bulk
Package / Case: ThinKey™1
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 100A
Supplier Device Package: ThinKey™1
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 950 mV @ 80 A
Produkt ist nicht verfügbar
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LND150N3-G-P002 LND150%20C041114.pdf
LND150N3-G-P002
Hersteller: Microchip Technology
Description: MOSFET N-CH 500V 30MA TO92-3
Packaging: Tape & Reel (TR)
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel, Depletion Mode
Current - Continuous Drain (Id) @ 25°C: 30mA (Tj)
Rds On (Max) @ Id, Vgs: 1000Ohm @ 500µA, 0V
Power Dissipation (Max): 740mW (Ta)
Supplier Device Package: TO-92-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 0V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Input Capacitance (Ciss) (Max) @ Vds: 10 pF @ 25 V
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LND150N3-G-P002 LND150%20C041114.pdf
LND150N3-G-P002
Hersteller: Microchip Technology
Description: MOSFET N-CH 500V 30MA TO92-3
Packaging: Cut Tape (CT)
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel, Depletion Mode
Current - Continuous Drain (Id) @ 25°C: 30mA (Tj)
Rds On (Max) @ Id, Vgs: 1000Ohm @ 500µA, 0V
Power Dissipation (Max): 740mW (Ta)
Supplier Device Package: TO-92-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 0V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Input Capacitance (Ciss) (Max) @ Vds: 10 pF @ 25 V
auf Bestellung 1804 Stücke:
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17+1.06 EUR
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24LC512T-E/SN 24AA512-24LC512-24FC512-512K-Bit-I2C-Serial-EEPROM-20001754Q.pdf
24LC512T-E/SN
Hersteller: Microchip Technology
Description: IC EEPROM 512KBIT I2C 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 64K x 8
DigiKey Programmable: Verified
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24LC512T-E/SN 24AA512-24LC512-24FC512-512K-Bit-I2C-Serial-EEPROM-20001754Q.pdf
24LC512T-E/SN
Hersteller: Microchip Technology
Description: IC EEPROM 512KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 64K x 8
DigiKey Programmable: Verified
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Anzahl Preis
6+3.19 EUR
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ST6020A
Hersteller: Microchip Technology
Description: DIODE GEN PURP 200V 40A TO204AD
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 µs
Technology: Standard
Current - Average Rectified (Io): 40A
Supplier Device Package: TO-204AD (TO-3)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 A
Current - Reverse Leakage @ Vr: 5 µA @ 200 V
Produkt ist nicht verfügbar
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ST6020D
Hersteller: Microchip Technology
Description: STD RECTIFIER
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 20A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Produkt ist nicht verfügbar
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ST6020
Hersteller: Microchip Technology
Description: DIODE GEN PURP 200V 20A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 20A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Produkt ist nicht verfügbar
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ATMEGA168PB-ANR ATmega48PB-88PB-168PB-DataSheet-DS40001909B.pdf
ATMEGA168PB-ANR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
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ATMEGA168PB-ANR ATmega48PB-88PB-168PB-DataSheet-DS40001909B.pdf
ATMEGA168PB-ANR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
auf Bestellung 1525 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.52 EUR
25+2.31 EUR
100+2.09 EUR
Mindestbestellmenge: 7
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VC-801-EAE-KAAN-60M0000000 1243787-vc-801
Hersteller: Microchip Technology
Description: VC-801-EAE-KAAN-60M0000000
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 30mA
Height - Seated (Max): 0.055" (1.40mm)
Part Status: Active
Frequency: 60 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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dsPIC33EP128MU206-H/PT
Hersteller: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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dsPIC33EP128MU206-I/MR
Hersteller: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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dsPIC33EP128MU206-E/MR
Hersteller: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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dsPIC33EP128MU206-H/MR
Hersteller: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tube
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206T-I/PT
Hersteller: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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dsPIC33EP128MU206T-I/MR
Hersteller: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-E/PT
Hersteller: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
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dsPIC33EP128MU206-I/PT
Hersteller: Microchip Technology
Description: IC DSC 16BIT 128KB FLASH
Packaging: Tray
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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MXLPLAD30KP33Ae3 9523-mplad30kp-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 33VWM 53.3VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 564A
Voltage - Reverse Standoff (Typ): 33V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 36.7V
Voltage - Clamping (Max) @ Ipp: 53.3V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MASMCG30CAe3 10561-msmc-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MSMCG30CAe3 10561-msmc-datasheet
MSMCG30CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MXSMCG30CAe3 10561-msmc-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MXSMCG30CA 10561-msmc-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MXLSMCG30CA 10561-msmc-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MXLSMCG30CAe3 10561-msmc-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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MASMCG30CA 10561-msmc-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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24AA256T-E/SN 24AA256-24LC256-24FC256-256K-I2C-Serial-EEPROM-DS20001203.pdf
24AA256T-E/SN
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT I2C 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
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24AA256T-E/SN 24AA256-24LC256-24FC256-256K-I2C-Serial-EEPROM-DS20001203.pdf
24AA256T-E/SN
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
auf Bestellung 2449 Stücke:
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Anzahl Preis
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25+1.70 EUR
100+1.68 EUR
Mindestbestellmenge: 10
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SM0502-M1 11207-sm0500-sm1000-series-datasheet
Hersteller: Microchip Technology
Description: RF DIODE PIN 500V M1
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 700mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0512-M1/TR
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 50V, 1MHz
Resistance @ If, F: 250mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0509-M1/TR
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.2pF @ 50V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0504-M1/TR
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.6pF @ 50V, 1MHz
Resistance @ If, F: 600mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SMX0512MR-M1
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 50V, 1MHz
Resistance @ If, F: 250mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SMX0502-M1
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 700mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM1002-M1
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Bulk
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.2pF @ 50V, 1MHz
Resistance @ If, F: 200mOhm @ 200mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0511-M1/TR
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.25pF @ 50V, 1MHz
Resistance @ If, F: 300mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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SM0511-M1
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.25pF @ 50V, 1MHz
Resistance @ If, F: 300mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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GC4432-M1
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.5pF @ 50V, 1MHz
Resistance @ If, F: 1Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 300V
Supplier Device Package: M1
Part Status: Active
Current - Max: 50 mA
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SM0504-M1
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: 1208 (3020 Metric)
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.6pF @ 50V, 1MHz
Resistance @ If, F: 600mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 500V
Supplier Device Package: M1
Part Status: Active
Current - Max: 1 A
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