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JANSF2N2222AUB/TR JANSF2N2222AUB/TR Microchip Technology 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf Description: TRANS NPN 50V 0.8A UB
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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JANSD2N2222AUA/TR JANSD2N2222AUA/TR Microchip Technology 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf Description: TRANS NPN 50V 0.8A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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MSR2N2222AUA MSR2N2222AUA Microchip Technology Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANSM2N2222AUA/TR JANSM2N2222AUA/TR Microchip Technology 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf Description: TRANS NPN 50V 0.8A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Grade: Military
Qualification: MIL-PRF-19500/255
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JANSM2N2222AUBC/TR JANSM2N2222AUBC/TR Microchip Technology Description: RH SMALL-SIGNAL BJT
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UBC
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
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JANSF2N2222AUB JANSF2N2222AUB Microchip Technology 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf Description: TRANS NPN 50V 0.8A UB
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Grade: Military
Qualification: MIL-PRF-19500/255
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JANSM2N2222AUA JANSM2N2222AUA Microchip Technology Description: RH SMALL-SIGNAL BJT
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Power - Max: 650 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXVR2N2222AUB JANTXVR2N2222AUB Microchip Technology Description: RH SMALL-SIGNAL BJT _ UB
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANSD2N2222AL JANSD2N2222AL Microchip Technology Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: TO-18 (TO-206AA)
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-206AA, TO-18-3 Metal Can
Packaging: Bulk
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Produkt ist nicht verfügbar
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JANS2N2222AUBC/TR JANS2N2222AUBC/TR Microchip Technology Description: TRANS NPN 50V 0.8A UBC
Qualification: MIL-PRF-19500/255
Grade: Military
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UBC
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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MCP3919A1T-E/SS MCP3919A1T-E/SS Microchip Technology MCP3919-3V-Three-Channel-Analog-Front-End-DS20005347C.pdf Description: IC ENERGY METER FRONT 3CH 28SSOP
Voltage - Supply: 2.7 V ~ 3.6 V
Part Status: Active
Supplier Device Package: 28-SSOP
Meter Type: 3 Phase
Voltage - I/O Low: 0.3V
Voltage - I/O High: 0.7V
Measurement Error: 0.1%
Current - Supply: 2.1mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCP3919A1T-E/SS MCP3919A1T-E/SS Microchip Technology MCP3919-3V-Three-Channel-Analog-Front-End-DS20005347C.pdf Description: IC ENERGY METER FRONT 3CH 28SSOP
Part Status: Active
Supplier Device Package: 28-SSOP
Meter Type: 3 Phase
Voltage - I/O Low: 0.3V
Voltage - I/O High: 0.7V
Voltage - Supply: 2.7 V ~ 3.6 V
Current - Supply: 2.1mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
Measurement Error: 0.1%
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25+3.18 EUR
100+2.9 EUR
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MEC1521H-B0-I/TF-TR MEC1521H-B0-I/TF-TR Microchip Technology MEC152x-Data-Sheet-DS00003427F.pdf Description: EMBEDDED CONTROLLER, 256KB SRAM
Packaging: Cut Tape (CT)
Package / Case: 128-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PS/2, QSPI, SMBus, SPI, UART
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.465V
Controller Series: MEC152x
Program Memory Type: SRAM (224kB)
Applications: Keyboard and Embedded Controller
Core Processor: ARM® Cortex®-M4
Supplier Device Package: 128-WFBGA (7x7)
Part Status: Active
Number of I/O: 108
DigiKey Programmable: Not Verified
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25+7.22 EUR
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MCP47CMB04T-E/ML MCP47CMB04T-E/ML Microchip Technology MCP47CXBXX-Data-Sheet-DS20006089B.pdf Description: IC DAC 8BIT V-OUT 20QFN
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): ±0.1, ±0.1
Number of D/A Converters: 4
Architecture: R-2R
Supplier Device Package: 20-QFN (4x4)
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: I2C
Number of Bits: 8
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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25+8.11 EUR
100+7.39 EUR
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MCP47CMB14T-E/ML MCP47CMB14T-E/ML Microchip Technology MCP47CXBXX-Data-Sheet-DS20006089B.pdf Description: IC DAC 10BIT V-OUT 20QFN
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: I2C
Number of Bits: 10
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): ±0.25, ±0.25
Number of D/A Converters: 4
Architecture: R-2R
Supplier Device Package: 20-QFN (4x4)
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
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MCP47CVB28T-E/ML MCP47CVB28T-E/ML Microchip Technology MCP47CXBXX-Data-Sheet-DS20006089B.pdf Description: IC DAC 12BIT V-OUT 20QFN
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): -, ±1 (Max)
Number of D/A Converters: 8
Architecture: R-2R
Supplier Device Package: 20-QFN (4x4)
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: I²C
Number of Bits: 12
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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25+17.85 EUR
100+16.24 EUR
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MCP47CVB24T-20E/ST MCP47CVB24T-20E/ST Microchip Technology MCP47CXBX4_8-Data-Sheet-20006537B.pdf Description: IC DAC 12BIT V-OUT 20TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): -, ±1 (Max)
Number of D/A Converters: 4
Architecture: R-2R
Supplier Device Package: 20-TSSOP
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: I2C
Number of Bits: 12
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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25+10.16 EUR
100+9.23 EUR
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MCP47CVB14T-E/ML MCP47CVB14T-E/ML Microchip Technology MCP47CXBX4_8-Data-Sheet-20006537B.pdf Description: IC DAC 10BIT V-OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-QFN (4x4)
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CVB18T-E/ML MCP47CVB18T-E/ML Microchip Technology MCP47CXBXX-Data-Sheet-DS20006089B.pdf Description: IC DAC 10BIT V-OUT 20QFN
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): ±0.25, ±0.25
Number of D/A Converters: 8
Architecture: R-2R
Supplier Device Package: 20-QFN (4x4)
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: I²C
Number of Bits: 10
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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100+15 EUR
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MCP47CMB24T-E/ML MCP47CMB24T-E/ML Microchip Technology MCP47CXBX4_8-Data-Sheet-20006537B.pdf Description: IC DAC 12BIT V-OUT 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-QFN (4x4)
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CMB24T-E/ML MCP47CMB24T-E/ML Microchip Technology MCP47CXBX4_8-Data-Sheet-20006537B.pdf Description: IC DAC 12BIT V-OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-QFN (4x4)
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CVB08T-E/ML MCP47CVB08T-E/ML Microchip Technology Description: IC DAC 8BIT V-OUT 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Settling Time: 6µs
Supplier Device Package: 20-QFN (4x4)
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CVB08T-E/ML MCP47CVB08T-E/ML Microchip Technology Description: IC DAC 8BIT V-OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Settling Time: 6µs
Supplier Device Package: 20-QFN (4x4)
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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25+14.03 EUR
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MCP47CMB24T-20E/ST MCP47CMB24T-20E/ST Microchip Technology MCP47CXBXX-Data-Sheet-DS20006089B.pdf Description: IC DAC 12BIT V-OUT 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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100+9.67 EUR
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MCP47CVB04T-E/ML MCP47CVB04T-E/ML Microchip Technology Description: IC DAC 8BIT V-OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Settling Time: 6µs
Supplier Device Package: 20-QFN (4x4)
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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25+7.67 EUR
100+6.97 EUR
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MCP47CVB24T-E/ML MCP47CVB24T-E/ML Microchip Technology MCP47CXBX4_8-Data-Sheet-20006537B.pdf Description: IC DAC 12BIT V-OUT 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-QFN (4x4)
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CVB24T-E/ML MCP47CVB24T-E/ML Microchip Technology MCP47CXBX4_8-Data-Sheet-20006537B.pdf Description: IC DAC 12BIT V-OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-QFN (4x4)
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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2N6246 2N6246 Microchip Technology Description: TRANS PNP 60V 5A TO204AA
Power - Max: 125 W
Voltage - Collector Emitter Breakdown (Max): 60 V
Current - Collector (Ic) (Max): 5 A
Part Status: Active
Supplier Device Package: TO-204AA (TO-3)
Transistor Type: PNP
Mounting Type: Through Hole
Package / Case: TO-204AA, TO-3
Packaging: Bulk
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SST39VF020-70-4C-NHE-T SST39VF020-70-4C-NHE-T Microchip Technology 20005023B.pdf Description: IC FLASH 2MBIT PARALLEL 32PLCC
DigiKey Programmable: Not Verified
Memory Organization: 256K x 8
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 20µs
Part Status: Active
Supplier Device Package: 32-PLCC (11.43x13.97)
Memory Format: FLASH
Technology: FLASH
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Mbit
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Packaging: Tape & Reel (TR)
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SST39VF020-70-4C-NHE-T SST39VF020-70-4C-NHE-T Microchip Technology 20005023B.pdf Description: IC FLASH 2MBIT PARALLEL 32PLCC
DigiKey Programmable: Not Verified
Memory Organization: 256K x 8
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 20µs
Part Status: Active
Supplier Device Package: 32-PLCC (11.43x13.97)
Memory Format: FLASH
Technology: FLASH
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Mbit
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Packaging: Cut Tape (CT)
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ATSAM3S2BA-MU ATSAM3S2BA-MU Microchip Technology Atmel-6500-32-bit-Cortex-M3-Microcontroller-SAM3S4-SAM3S2-SAM3S1_Datasheet.pdf Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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ATSAM3S4AA-AU ATSAM3S4AA-AU Microchip Technology SAM3S_Series.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10/12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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ATSAM3S4BA-AU ATSAM3S4BA-AU Microchip Technology SAM3S_Series.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Verified
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TC33025VPE TC33025VPE Microchip Technology TCSIS00317-1.pdf?t.download=true&u=5oefqw Description: HIGH SPEED DOUBLE-ENDED PWM CONT
Voltage - Supply (Vcc/Vdd): 0.8V ~ 30V
Topology: Push-Pull
Output Isolation: Isolated
Internal Switch(s): Yes
Frequency - Switching: 400kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 80°C
Supplier Device Package: 16-PDIP
Packaging: Bulk
Mounting Type: Through Hole
Package / Case: 16-DIP (0.400", 10.16mm)
Part Status: Active
Control Features: Frequency Control, Soft Start
Voltage - Start Up: 9.2 V
Fault Protection: Current Limiting, Over Voltage, UVLO
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SMAJ18AE3/TR13 SMAJ18AE3/TR13 Microchip Technology SMAJ5.0-170CA%2Ce3.pdf Description: TVS DIODE 18VWM 29.2VC DO214AC
Packaging: Tape & Reel (TR)
Package / Case: DO-214AC, SMA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-214AC (SMA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 500W
Power Line Protection: No
Part Status: Active
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SMAJ18AE3/TR13 SMAJ18AE3/TR13 Microchip Technology SMAJ5.0-170CA%2Ce3.pdf Description: TVS DIODE 18VWM 29.2VC DO214AC
Packaging: Cut Tape (CT)
Package / Case: DO-214AC, SMA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-214AC (SMA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 500W
Power Line Protection: No
Part Status: Active
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DSA1103CL2-100.0000VAO DSA1103CL2-100.0000VAO Microchip Technology DSA1103-23-Low-Jitter-Precision-LVDS-Oscillator-for-Automotive-20005891A.pdf Description: MEMS OSC AUTO LOWPWR -40C-105C
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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DSA1223CL2-100M0000VAO DSA1223CL2-100M0000VAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378C.pdf Description: MEMS OSC, AUTOMOTIVE, 100MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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DSA1124CL2-100.0000VAO DSA1124CL2-100.0000VAO Microchip Technology DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf Description: MEMS OSC AUTO LOWPWR -40C-105C
Function: Enable/Disable
Output: HCSL
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tube
Base Resonator: MEMS
Frequency: 100 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 42mA
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
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DSA1223CL2-100M0000TVAO DSA1223CL2-100M0000TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378C.pdf Description: MEMS OSC, AUTOMOTIVE, 100MHZ, LV
Base Resonator: MEMS
Frequency: 100 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSA1124CL2-100.0000TVAO DSA1124CL2-100.0000TVAO Microchip Technology DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf Description: MEMS OSC AUTO LOWPWR -40C-105C
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: HCSL
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tape & Reel (TR)
Base Resonator: MEMS
Frequency: 100 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 42mA
Ratings: AEC-Q100
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2N4860 2N4860 Microchip Technology 6078-2n4856-pdf Description: JFET N-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 6 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 100 mA @ 15 V
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MQ2N4860UB/TR MQ2N4860UB/TR Microchip Technology Description: JFET N-CH 30V UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Qualification: MIL-PRF-19500/385
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MQ2N4860UB MQ2N4860UB Microchip Technology Description: JFET N-CH 30V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Qualification: MIL-PRF-19500/385
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MQ2N4860 MQ2N4860 Microchip Technology Description: JFET N-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Qualification: MIL-PRF-19500/385
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MX1.5KE9.1CAe3 Microchip Technology 9459-m1-5ke-datasheet Description: TVS DIODE 7.78VWM 13.4VC CASE-1
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 13.4V
Voltage - Breakdown (Min): 8.65V
Bidirectional Channels: 1
Supplier Device Package: CASE-1
Voltage - Reverse Standoff (Typ): 7.78V
Current - Peak Pulse (10/1000µs): 112A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-201AA, DO-27, Axial
Qualification: MIL-PRF-19500
Grade: Military
Packaging: Bulk
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JANTXV1N5551 JANTXV1N5551 Microchip Technology LDS-0230%2C+1N5550+thru+1N5554%2C+MIL-PRF-19500-420.pdf Description: DIODE STANDARD 400V 5A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 400 V
Grade: Military
Qualification: MIL-PRF-19500/420
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JANS1N5551US JANS1N5551US Microchip Technology 10966-sa7-43-pdf.pdf Description: DIODE STANDARD 400V 3A B SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Grade: Military
Qualification: MIL-PRF-19500/420
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JANS1N5551 JANS1N5551 Microchip Technology 11519-lds-0230-pdf.pdf Description: DIODE STANDARD 400V 5A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Grade: Military
Qualification: MIL-PRF-19500/420
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AT32UC3B0512AU-Z2UR AT32UC3B0512AU-Z2UR Microchip Technology doc32174.pdf Description: IC MCU 32BIT 512KB FLASH 64QFN
DigiKey Programmable: Not Verified
Number of I/O: 44
Part Status: Obsolete
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: AVR
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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AT32UC3B0512AU-Z2UR AT32UC3B0512AU-Z2UR Microchip Technology doc32174.pdf Description: IC MCU 32BIT 512KB FLASH 64QFN
DigiKey Programmable: Not Verified
Number of I/O: 44
Part Status: Obsolete
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: AVR
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATTINY426-MUR ATTINY426-MUR Microchip Technology ATtiny424-426-427-824-826-827-DataSheet-DS40002311A.pdf Description: IC MCU 8BIT 4KB FLASH 20VQFN
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-VQFN (3x3)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x12b
Core Processor: AVR
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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15+1.2 EUR
25+1.09 EUR
100+0.98 EUR
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PIC24FJ256GA606T-I/PT PIC24FJ256GA606T-I/PT Microchip Technology PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
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PIC24FJ256GA606T-I/PT PIC24FJ256GA606T-I/PT Microchip Technology PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 1409 Stücke:
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3+8.68 EUR
25+7.97 EUR
100+7.19 EUR
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PIC24FJ32GB002T-I/ML PIC24FJ32GB002T-I/ML Microchip Technology 39940d.pdf Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (11K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
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PIC24FJ32GB002T-I/ML PIC24FJ32GB002T-I/ML Microchip Technology 39940d.pdf Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (11K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 3675 Stücke:
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3+7.22 EUR
25+6.64 EUR
100+5.98 EUR
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JANSD2N2222AUA JANSD2N2222AUA Microchip Technology Description: RH SMALL-SIGNAL BJT
Power - Max: 650 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANSD2N2222AUBC/TR JANSD2N2222AUBC/TR Microchip Technology Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UBC
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MNS2N2222AUBP MNS2N2222AUBP Microchip Technology 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf Description: TRANS NPN 50V 0.8A UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
 Mindestbestellmenge: 57 Stücke
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JANSF2N2222AUBC Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UBC
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
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JANSF2N2222AUB/TR 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf
JANSF2N2222AUB/TR
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UB
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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JANSD2N2222AUA/TR 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf
JANSD2N2222AUA/TR
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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MSR2N2222AUA
MSR2N2222AUA
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANSM2N2222AUA/TR 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf
JANSM2N2222AUA/TR
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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JANSM2N2222AUBC/TR
JANSM2N2222AUBC/TR
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UBC
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Produkt ist nicht verfügbar
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JANSF2N2222AUB 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf
JANSF2N2222AUB
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UB
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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JANSM2N2222AUA
JANSM2N2222AUA
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Power - Max: 650 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXVR2N2222AUB
JANTXVR2N2222AUB
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT _ UB
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANSD2N2222AL
JANSD2N2222AL
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: TO-18 (TO-206AA)
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-206AA, TO-18-3 Metal Can
Packaging: Bulk
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Produkt ist nicht verfügbar
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JANS2N2222AUBC/TR
JANS2N2222AUBC/TR
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UBC
Qualification: MIL-PRF-19500/255
Grade: Military
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UBC
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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MCP3919A1T-E/SS MCP3919-3V-Three-Channel-Analog-Front-End-DS20005347C.pdf
MCP3919A1T-E/SS
Hersteller: Microchip Technology
Description: IC ENERGY METER FRONT 3CH 28SSOP
Voltage - Supply: 2.7 V ~ 3.6 V
Part Status: Active
Supplier Device Package: 28-SSOP
Meter Type: 3 Phase
Voltage - I/O Low: 0.3V
Voltage - I/O High: 0.7V
Measurement Error: 0.1%
Current - Supply: 2.1mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCP3919A1T-E/SS MCP3919-3V-Three-Channel-Analog-Front-End-DS20005347C.pdf
MCP3919A1T-E/SS
Hersteller: Microchip Technology
Description: IC ENERGY METER FRONT 3CH 28SSOP
Part Status: Active
Supplier Device Package: 28-SSOP
Meter Type: 3 Phase
Voltage - I/O Low: 0.3V
Voltage - I/O High: 0.7V
Voltage - Supply: 2.7 V ~ 3.6 V
Current - Supply: 2.1mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
Measurement Error: 0.1%
auf Bestellung 1959 Stücke:
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AnzahlPreis
5+3.82 EUR
25+3.18 EUR
100+2.9 EUR
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MEC1521H-B0-I/TF-TR MEC152x-Data-Sheet-DS00003427F.pdf
MEC1521H-B0-I/TF-TR
Hersteller: Microchip Technology
Description: EMBEDDED CONTROLLER, 256KB SRAM
Packaging: Cut Tape (CT)
Package / Case: 128-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PS/2, QSPI, SMBus, SPI, UART
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.465V
Controller Series: MEC152x
Program Memory Type: SRAM (224kB)
Applications: Keyboard and Embedded Controller
Core Processor: ARM® Cortex®-M4
Supplier Device Package: 128-WFBGA (7x7)
Part Status: Active
Number of I/O: 108
DigiKey Programmable: Not Verified
auf Bestellung 2895 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.68 EUR
25+7.22 EUR
100+6.98 EUR
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MCP47CMB04T-E/ML MCP47CXBXX-Data-Sheet-DS20006089B.pdf
MCP47CMB04T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 8BIT V-OUT 20QFN
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): ±0.1, ±0.1
Number of D/A Converters: 4
Architecture: R-2R
Supplier Device Package: 20-QFN (4x4)
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: I2C
Number of Bits: 8
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 3291 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.73 EUR
25+8.11 EUR
100+7.39 EUR
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MCP47CMB14T-E/ML MCP47CXBXX-Data-Sheet-DS20006089B.pdf
MCP47CMB14T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20QFN
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: I2C
Number of Bits: 10
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): ±0.25, ±0.25
Number of D/A Converters: 4
Architecture: R-2R
Supplier Device Package: 20-QFN (4x4)
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
auf Bestellung 3295 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+11.26 EUR
25+9.37 EUR
100+8.53 EUR
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MCP47CVB28T-E/ML MCP47CXBXX-Data-Sheet-DS20006089B.pdf
MCP47CVB28T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20QFN
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): -, ±1 (Max)
Number of D/A Converters: 8
Architecture: R-2R
Supplier Device Package: 20-QFN (4x4)
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: I²C
Number of Bits: 12
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+21.42 EUR
25+17.85 EUR
100+16.24 EUR
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MCP47CVB24T-20E/ST MCP47CXBX4_8-Data-Sheet-20006537B.pdf
MCP47CVB24T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): -, ±1 (Max)
Number of D/A Converters: 4
Architecture: R-2R
Supplier Device Package: 20-TSSOP
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: I2C
Number of Bits: 12
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 2497 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+12.2 EUR
25+10.16 EUR
100+9.23 EUR
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MCP47CVB14T-E/ML MCP47CXBX4_8-Data-Sheet-20006537B.pdf
MCP47CVB14T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-QFN (4x4)
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CVB18T-E/ML MCP47CXBXX-Data-Sheet-DS20006089B.pdf
MCP47CVB18T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20QFN
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): ±0.25, ±0.25
Number of D/A Converters: 8
Architecture: R-2R
Supplier Device Package: 20-QFN (4x4)
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: I²C
Number of Bits: 10
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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MCP47CMB24T-E/ML MCP47CXBX4_8-Data-Sheet-20006537B.pdf
MCP47CMB24T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-QFN (4x4)
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CMB24T-E/ML MCP47CXBX4_8-Data-Sheet-20006537B.pdf
MCP47CMB24T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-QFN (4x4)
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CVB08T-E/ML
MCP47CVB08T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 8BIT V-OUT 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Settling Time: 6µs
Supplier Device Package: 20-QFN (4x4)
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CVB08T-E/ML
MCP47CVB08T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 8BIT V-OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Settling Time: 6µs
Supplier Device Package: 20-QFN (4x4)
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CMB24T-20E/ST MCP47CXBXX-Data-Sheet-DS20006089B.pdf
MCP47CMB24T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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MCP47CVB04T-E/ML
MCP47CVB04T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 8BIT V-OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Settling Time: 6µs
Supplier Device Package: 20-QFN (4x4)
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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2+9.22 EUR
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MCP47CVB24T-E/ML MCP47CXBX4_8-Data-Sheet-20006537B.pdf
MCP47CVB24T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-QFN (4x4)
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCP47CVB24T-E/ML MCP47CXBX4_8-Data-Sheet-20006537B.pdf
MCP47CVB24T-E/ML
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-QFN (4x4)
Architecture: R-2R
Number of D/A Converters: 4
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
Part Status: Active
DigiKey Programmable: Not Verified
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2+12.2 EUR
25+10.16 EUR
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2N6246
2N6246
Hersteller: Microchip Technology
Description: TRANS PNP 60V 5A TO204AA
Power - Max: 125 W
Voltage - Collector Emitter Breakdown (Max): 60 V
Current - Collector (Ic) (Max): 5 A
Part Status: Active
Supplier Device Package: TO-204AA (TO-3)
Transistor Type: PNP
Mounting Type: Through Hole
Package / Case: TO-204AA, TO-3
Packaging: Bulk
Produkt ist nicht verfügbar
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SST39VF020-70-4C-NHE-T 20005023B.pdf
SST39VF020-70-4C-NHE-T
Hersteller: Microchip Technology
Description: IC FLASH 2MBIT PARALLEL 32PLCC
DigiKey Programmable: Not Verified
Memory Organization: 256K x 8
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 20µs
Part Status: Active
Supplier Device Package: 32-PLCC (11.43x13.97)
Memory Format: FLASH
Technology: FLASH
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Mbit
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SST39VF020-70-4C-NHE-T 20005023B.pdf
SST39VF020-70-4C-NHE-T
Hersteller: Microchip Technology
Description: IC FLASH 2MBIT PARALLEL 32PLCC
DigiKey Programmable: Not Verified
Memory Organization: 256K x 8
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 20µs
Part Status: Active
Supplier Device Package: 32-PLCC (11.43x13.97)
Memory Format: FLASH
Technology: FLASH
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Mbit
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Packaging: Cut Tape (CT)
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ATSAM3S2BA-MU Atmel-6500-32-bit-Cortex-M3-Microcontroller-SAM3S4-SAM3S2-SAM3S1_Datasheet.pdf
ATSAM3S2BA-MU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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3+8.29 EUR
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ATSAM3S4AA-AU SAM3S_Series.pdf
ATSAM3S4AA-AU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10/12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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2+10.38 EUR
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ATSAM3S4BA-AU SAM3S_Series.pdf
ATSAM3S4BA-AU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Verified
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TC33025VPE TCSIS00317-1.pdf?t.download=true&u=5oefqw
TC33025VPE
Hersteller: Microchip Technology
Description: HIGH SPEED DOUBLE-ENDED PWM CONT
Voltage - Supply (Vcc/Vdd): 0.8V ~ 30V
Topology: Push-Pull
Output Isolation: Isolated
Internal Switch(s): Yes
Frequency - Switching: 400kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 80°C
Supplier Device Package: 16-PDIP
Packaging: Bulk
Mounting Type: Through Hole
Package / Case: 16-DIP (0.400", 10.16mm)
Part Status: Active
Control Features: Frequency Control, Soft Start
Voltage - Start Up: 9.2 V
Fault Protection: Current Limiting, Over Voltage, UVLO
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SMAJ18AE3/TR13 SMAJ5.0-170CA%2Ce3.pdf
SMAJ18AE3/TR13
Hersteller: Microchip Technology
Description: TVS DIODE 18VWM 29.2VC DO214AC
Packaging: Tape & Reel (TR)
Package / Case: DO-214AC, SMA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-214AC (SMA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 500W
Power Line Protection: No
Part Status: Active
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SMAJ18AE3/TR13 SMAJ5.0-170CA%2Ce3.pdf
SMAJ18AE3/TR13
Hersteller: Microchip Technology
Description: TVS DIODE 18VWM 29.2VC DO214AC
Packaging: Cut Tape (CT)
Package / Case: DO-214AC, SMA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-214AC (SMA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 500W
Power Line Protection: No
Part Status: Active
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DSA1103CL2-100.0000VAO DSA1103-23-Low-Jitter-Precision-LVDS-Oscillator-for-Automotive-20005891A.pdf
DSA1103CL2-100.0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-105C
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1223CL2-100M0000VAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378C.pdf
DSA1223CL2-100M0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 100MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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DSA1124CL2-100.0000VAO DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf
DSA1124CL2-100.0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-105C
Function: Enable/Disable
Output: HCSL
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tube
Base Resonator: MEMS
Frequency: 100 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 42mA
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
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DSA1223CL2-100M0000TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378C.pdf
DSA1223CL2-100M0000TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 100MHZ, LV
Base Resonator: MEMS
Frequency: 100 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSA1124CL2-100.0000TVAO DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf
DSA1124CL2-100.0000TVAO
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-105C
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: HCSL
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tape & Reel (TR)
Base Resonator: MEMS
Frequency: 100 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 42mA
Ratings: AEC-Q100
Produkt ist nicht verfügbar
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2N4860 6078-2n4856-pdf
2N4860
Hersteller: Microchip Technology
Description: JFET N-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 6 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 100 mA @ 15 V
Produkt ist nicht verfügbar
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MQ2N4860UB/TR
MQ2N4860UB/TR
Hersteller: Microchip Technology
Description: JFET N-CH 30V UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Qualification: MIL-PRF-19500/385
Produkt ist nicht verfügbar
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MQ2N4860UB
MQ2N4860UB
Hersteller: Microchip Technology
Description: JFET N-CH 30V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Qualification: MIL-PRF-19500/385
Produkt ist nicht verfügbar
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MQ2N4860
MQ2N4860
Hersteller: Microchip Technology
Description: JFET N-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Qualification: MIL-PRF-19500/385
Produkt ist nicht verfügbar
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MX1.5KE9.1CAe3 9459-m1-5ke-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 7.78VWM 13.4VC CASE-1
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 13.4V
Voltage - Breakdown (Min): 8.65V
Bidirectional Channels: 1
Supplier Device Package: CASE-1
Voltage - Reverse Standoff (Typ): 7.78V
Current - Peak Pulse (10/1000µs): 112A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-201AA, DO-27, Axial
Qualification: MIL-PRF-19500
Grade: Military
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N5551 LDS-0230%2C+1N5550+thru+1N5554%2C+MIL-PRF-19500-420.pdf
JANTXV1N5551
Hersteller: Microchip Technology
Description: DIODE STANDARD 400V 5A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 400 V
Grade: Military
Qualification: MIL-PRF-19500/420
Produkt ist nicht verfügbar
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JANS1N5551US 10966-sa7-43-pdf.pdf
JANS1N5551US
Hersteller: Microchip Technology
Description: DIODE STANDARD 400V 3A B SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Grade: Military
Qualification: MIL-PRF-19500/420
Produkt ist nicht verfügbar
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JANS1N5551 11519-lds-0230-pdf.pdf
JANS1N5551
Hersteller: Microchip Technology
Description: DIODE STANDARD 400V 5A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Grade: Military
Qualification: MIL-PRF-19500/420
Produkt ist nicht verfügbar
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AT32UC3B0512AU-Z2UR doc32174.pdf
AT32UC3B0512AU-Z2UR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64QFN
DigiKey Programmable: Not Verified
Number of I/O: 44
Part Status: Obsolete
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: AVR
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AT32UC3B0512AU-Z2UR doc32174.pdf
AT32UC3B0512AU-Z2UR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64QFN
DigiKey Programmable: Not Verified
Number of I/O: 44
Part Status: Obsolete
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: AVR
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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ATTINY426-MUR ATtiny424-426-427-824-826-827-DataSheet-DS40002311A.pdf
ATTINY426-MUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 20VQFN
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-VQFN (3x3)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x12b
Core Processor: AVR
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 11265 Stücke:
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AnzahlPreis
15+1.2 EUR
25+1.09 EUR
100+0.98 EUR
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PIC24FJ256GA606T-I/PT PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf
PIC24FJ256GA606T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 1200 Stücke:
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AnzahlPreis
1200+7.19 EUR
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PIC24FJ256GA606T-I/PT PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf
PIC24FJ256GA606T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 1409 Stücke:
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AnzahlPreis
3+8.68 EUR
25+7.97 EUR
100+7.19 EUR
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PIC24FJ32GB002T-I/ML 39940d.pdf
PIC24FJ32GB002T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (11K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 1600 Stücke:
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AnzahlPreis
1600+5.98 EUR
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PIC24FJ32GB002T-I/ML 39940d.pdf
PIC24FJ32GB002T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (11K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 3675 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.22 EUR
25+6.64 EUR
100+5.98 EUR
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JANSD2N2222AUA
JANSD2N2222AUA
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Power - Max: 650 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANSD2N2222AUBC/TR
JANSD2N2222AUBC/TR
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UBC
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MNS2N2222AUBP 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf
MNS2N2222AUBP
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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JANSF2N2222AUBC
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UBC
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
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