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1N5225BUR-1/TR 1N5225BUR-1/TR Microchip Technology 1N5221BUR-1%20thru%201N5281BUR-1.pdf Description: DIODE ZENER 3V 500MW DO213AA
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 3 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
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MV31020-150A/TR Microchip Technology Description: GAAS TVAR NON HERMETIC EPSM SMT
Capacitance Ratio: 11.3
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.3pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MV31020-129A MV31020-129A Microchip Technology Description: GAAS TVAR HERMETIC MICROSTRIP
Capacitance Ratio: 11.3
Voltage - Peak Reverse (Max): 22 V
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.3pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: 2-SMD, Flat Lead
Packaging: Tray
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MV31020-P00 Microchip Technology Description: GAAS TVAR NON HERMETIC CHIP
Package / Case: Die
Packaging: Tray
Mounting Type: Surface Mount
Capacitance Ratio: 11.3
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.3pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
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MV31023-P00 Microchip Technology Description: GAAS TVAR NON HERMETIC CHIP
Capacitance Ratio: 12.3
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 1500 @ 4V, 50MHz
Capacitance @ Vr, F: 5.6pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MV31024-150A/TR Microchip Technology Description: GAAS TVAR NON HERMETIC EPSM SMT
Capacitance Ratio: 12.6
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 1500 @ 4V, 50MHz
Capacitance @ Vr, F: 6.8pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MV31021-150A/TR Microchip Technology Description: GAAS TVAR NON HERMETIC EPSM SMT
Capacitance Ratio: 11.5
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MV31021-P00 Microchip Technology Description: GAAS TVAR NON HERMETIC CHIP
Capacitance Ratio: 11.5
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MV31021-150A Microchip Technology Description: GAAS TVAR NON HERMETIC EPSM SMT
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Capacitance Ratio: 11.5
Voltage - Peak Reverse (Max): 22 V
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MV31024-150A Microchip Technology Description: GAAS TVAR NON HERMETIC EPSM SMT
Capacitance Ratio: 12.6
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 1500 @ 4V, 50MHz
Capacitance @ Vr, F: 6.8pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
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MV31020-150A Microchip Technology Description: GAAS TVAR NON HERMETIC EPSM SMT
Capacitance Ratio: 11.3
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.3pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
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JAN1N4153UR-1/TR JAN1N4153UR-1/TR Microchip Technology 5812-1n4153ur-pdf.pdf Description: DIODE STANDARD 75V 150MA DO213AA
Current - Reverse Leakage @ Vr: 50 nA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 20 mA
Supplier Device Package: DO-213AA
Current - Average Rectified (Io): 150mA
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: DO-213AA
Packaging: Tape & Reel (TR)
Voltage - DC Reverse (Vr) (Max): 75 V
Operating Temperature - Junction: -65°C ~ 175°C
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AT24C16-10PC-1.8 AT24C16-10PC-1.8 Microchip Technology AT24C01A%2C02%2C04%2C08%2C16%20%282001%29.pdf Description: IC EEPROM 16KBIT I2C 400KHZ 8DIP
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Non-Volatile
Memory Size: 16Kbit
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
DigiKey Programmable: Not Verified
Memory Organization: 2K x 8
Access Time: 900 ns
Memory Interface: I2C
Write Cycle Time - Word, Page: 5ms
Supplier Device Package: 8-PDIP
Memory Format: EEPROM
Clock Frequency: 400 kHz
Technology: EEPROM
Voltage - Supply: 1.8V ~ 5.5V
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DSC1121AE1-041.5000T DSC1121AE1-041.5000T Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSCILLATOR LOW JITTER
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 41.5 MHz
Base Resonator: MEMS
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DSC1121AE1-041.5000 DSC1121AE1-041.5000 Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSCILLATOR LOW JITTER
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 41.5 MHz
Base Resonator: MEMS
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ATMEGA168-20MQ ATMEGA168-20MQ Microchip Technology Atmel-2545-8-bit-AVR-Microcontroller-ATmega48-88-168_Summary.pdf Description: IC MCU 8BIT 16KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 23
DigiKey Programmable: Not Verified
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ATMEGA168P-20AN ATMEGA168P-20AN Microchip Technology ATmega48P_88P_168P-DS40002065A.pdf Description: IC MCU 8BIT 16KB FLASH 32TQFP
Packaging: Tray
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 23
DigiKey Programmable: Not Verified
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MXLLCE8.5A Microchip Technology 9498-mlce-pdf Description: TVS DIODE 8.5VWM 14.4VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 100pF @ 1MHz
Current - Peak Pulse (10/1000µs): 100A
Voltage - Reverse Standoff (Typ): 8.5V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 9.44V
Voltage - Clamping (Max) @ Ipp: 14.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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AT88SC0204CA-SH AT88SC0204CA-SH Microchip Technology Atmel-5202S-CryptoMem-AT88SC0204CA-Datasheet-Summary.pdf Description: IC SECURE MEMORY 8SOIC
DigiKey Programmable: Not Verified
Supplier Device Package: 8-SOIC
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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AT88SC0204CA-Y6H-T AT88SC0204CA-Y6H-T Microchip Technology Atmel-5202S-CryptoMem-AT88SC0204CA-Datasheet-Summary.pdf Description: IC SECURE MEMORY 8MINI MAP
DigiKey Programmable: Not Verified
Supplier Device Package: 8-Mini Map (2x3)
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AT88SC0204CA-Y6H-T AT88SC0204CA-Y6H-T Microchip Technology Atmel-5202S-CryptoMem-AT88SC0204CA-Datasheet-Summary.pdf Description: IC SECURE MEMORY 8MINI MAP
DigiKey Programmable: Not Verified
Supplier Device Package: 8-Mini Map (2x3)
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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AT88SC0204C-CI AT88SC0204C-CI Microchip Technology AT88SC0204C_Rev.0403.pdf Description: IC SECURE MEMORY 8LAP
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-TDFN
Packaging: Tube
DigiKey Programmable: Not Verified
Supplier Device Package: 8-LAP (8x5)
Applications: Embedded, Smart Card
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AT88SC0404C-CI AT88SC0404C-CI Microchip Technology AT88SC0404C_Rev.0403.pdf Description: IC SECURE MEMORY 8LAP
DigiKey Programmable: Not Verified
Supplier Device Package: 8-LAP (8x5)
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-TDFN
Packaging: Tube
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AT88SC12816C-CI AT88SC12816C-CI Microchip Technology AT88SC12816C_Rev.0403.pdf Description: IC SECURE MEMORY 8LAP
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-TDFN
Packaging: Tube
DigiKey Programmable: Not Verified
Supplier Device Package: 8-LAP (8x5)
Applications: Embedded, Smart Card
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AT88SC3216C-CI AT88SC3216C-CI Microchip Technology AT88SC3216C_Rev0403.pdf Description: IC SECURE MEMORY 8LAP
DigiKey Programmable: Not Verified
Supplier Device Package: 8-LAP (8x5)
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-TDFN
Packaging: Tube
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AT88SC0204C-SU AT88SC0204C-SU Microchip Technology Atmel-2022S-CryptoMem-AT88SC0204C-Datasheet-Summary.pdf Description: IC SECURE MEMORY 8SOIC
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Supplier Device Package: 8-SOIC
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
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MSMBG60CAe3 MSMBG60CAe3 Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 60VWM 96.8VC DO214AA
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 96.8V
Voltage - Breakdown (Min): 66.7V
Bidirectional Channels: 1
Supplier Device Package: DO-214AA (SMBG)
Voltage - Reverse Standoff (Typ): 60V
Current - Peak Pulse (10/1000µs): 6.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-215AA, SMB Gull Wing
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
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MSMCG13CAe3 MSMCG13CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 13VWM 21.5VC SMCG
Voltage - Reverse Standoff (Typ): 13V
Current - Peak Pulse (10/1000µs): 69.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-215AB, SMC Gull Wing
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 21.5V
Voltage - Breakdown (Min): 14.4V
Bidirectional Channels: 1
Supplier Device Package: SMCG (DO-215AB)
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MSMCG6.0CAe3 MSMCG6.0CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 6VWM 10.3VC SMCG
Voltage - Reverse Standoff (Typ): 6V
Current - Peak Pulse (10/1000µs): 145.6A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-215AB, SMC Gull Wing
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 10.3V
Voltage - Breakdown (Min): 6.67V
Bidirectional Channels: 1
Supplier Device Package: SMCG (DO-215AB)
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MXL5KP6.0CAe3 MXL5KP6.0CAe3 Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 6VWM 10.3VC CASE 5A
Bidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 6V
Current - Peak Pulse (10/1000µs): 485A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 10.3V
Voltage - Breakdown (Min): 6.67V
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MXL5KP6.5A MXL5KP6.5A Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 11.2V
Voltage - Breakdown (Min): 7.22V
Unidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 6.5V
Current - Peak Pulse (10/1000µs): 447A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
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MXL5KP6.5Ae3 MXL5KP6.5Ae3 Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 11.2V
Voltage - Breakdown (Min): 7.22V
Unidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 6.5V
Current - Peak Pulse (10/1000µs): 447A
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MXL5KP6.5CA MXL5KP6.5CA Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 11.2V
Voltage - Breakdown (Min): 7.22V
Bidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 6.5V
Current - Peak Pulse (10/1000µs): 447A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MXL5KP6.5CAe3 MXL5KP6.5CAe3 Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 11.2V
Voltage - Breakdown (Min): 7.22V
Bidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 6.5V
Current - Peak Pulse (10/1000µs): 447A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
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MXL5KP60A MXL5KP60A Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 60VWM 96.8VC CASE 5A
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 96.8V
Voltage - Breakdown (Min): 66.7V
Unidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 60V
Current - Peak Pulse (10/1000µs): 52A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MXL5KP60Ae3 MXL5KP60Ae3 Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 60VWM 96.8VC CASE 5A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 96.8V
Voltage - Breakdown (Min): 66.7V
Unidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 60V
Current - Peak Pulse (10/1000µs): 52A
Produkt ist nicht verfügbar
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MXLPLAD30KP28CA MXLPLAD30KP28CA Microchip Technology 9523-mplad30kp-datasheet Description: TVS DIODE 28VWM 46.4VC PLAD
Supplier Device Package: PLAD
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 645A
Applications: General Purpose
Operating Temperature: -55°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: Nonstandard SMD
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 30000W (30kW)
Voltage - Clamping (Max) @ Ipp: 46.4V
Voltage - Breakdown (Min): 31.1V
Bidirectional Channels: 1
Produkt ist nicht verfügbar
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MVR2N2222AUB/TR MVR2N2222AUB/TR Microchip Technology Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
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MVR2N2222AUBC/TR MVR2N2222AUBC/TR Microchip Technology Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Supplier Device Package: UBC
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
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JANSR2N2222AUB/E10 JANSR2N2222AUB/E10 Microchip Technology Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANSP2N2222AUB JANSP2N2222AUB Microchip Technology Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
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JANSM2N2222AUB/TR JANSM2N2222AUB/TR Microchip Technology 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf Description: TRANS NPN 50V 0.8A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Grade: Military
Qualification: MIL-PRF-19500/255
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JANS2N2222AUA JANS2N2222AUA Microchip Technology MIL-PRF-19500_255AA_wAmendment1_5-19-16.pdf Description: TRANS NPN 50V 0.8A UA
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Grade: Military
Qualification: MIL-PRF-19500/255
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1N1613R 1N1613R Microchip Technology S%2CR20.pdf Description: DIODE STANDARD REV 100V 7A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 7A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N1613 1N1613 Microchip Technology S%2CR20.pdf Description: DIODE STANDARD 100V 16A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 16A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N1613A 1N1613A Microchip Technology S%2CR20.pdf Description: DIODE STANDARD 100V 5A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
Produkt ist nicht verfügbar
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PIC16F18156-I/STX PIC16F18156-I/STX Microchip Technology PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf Description: IC MCU 8BIT 28KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
auf Bestellung 546 Stücke:
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25+2.77 EUR
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PIC16F17155-I/SS PIC16F17155-I/SS Microchip Technology PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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10+2.26 EUR
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PIC16F18156-I/SS PIC16F18156-I/SS Microchip Technology PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf Description: IC MCU 8BIT 28KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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PIC16F17156-I/STX PIC16F17156-I/STX Microchip Technology PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf Description: IC MCU 8BIT 28KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
auf Bestellung 391 Stücke:
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12+1.82 EUR
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PIC16F17174-I/PT PIC16F17174-I/PT Microchip Technology PIC16F17154-55-74-75-Microcontroller-Data-Sheet-DS40002490.pdf Description: IC MCU 8BIT 7KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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7+3.17 EUR
25+2.9 EUR
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PIC18F25Q71-I/SO PIC18F25Q71-I/SO Microchip Technology PIC18F24-25Q71-Microcontroller-XLP-Data-Sheet-DS40002350.pdf Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 26
auf Bestellung 369 Stücke:
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8+2.83 EUR
25+2.58 EUR
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PIC16F17156-I/SS PIC16F17156-I/SS Microchip Technology PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf Description: IC MCU 8BIT 28KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
auf Bestellung 238 Stücke:
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9+2.48 EUR
25+2.27 EUR
100+2.05 EUR
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PIC16F17175-I/PT PIC16F17175-I/PT Microchip Technology PIC16F17156-76-Microcontroller-Data-Sheet-DS40002485.pdf Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 480 Stücke:
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7+3.33 EUR
25+3.05 EUR
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PIC18F24Q71-I/SP PIC18F24Q71-I/SP Microchip Technology PIC18F24-25Q71-Microcontroller-Data-Sheet-DS40002350.pdf Description: IC MCU 8BIT 16KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 64MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 26
auf Bestellung 279 Stücke:
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7+3.27 EUR
25+2.99 EUR
100+2.7 EUR
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PIC16F17154-I/SP PIC16F17154-I/SP Microchip Technology PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf Description: IC MCU 8BIT 7KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 24
auf Bestellung 412 Stücke:
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100+2.82 EUR
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PIC16F17176-I/PT PIC16F17176-I/PT Microchip Technology PIC16F17156-76-Microcontroller-Data-Sheet-DS40002485.pdf Description: IC MCU 8BIT 28KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 475 Stücke:
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25+3.32 EUR
100+3.02 EUR
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PIC18F25Q71-I/SP PIC18F25Q71-I/SP Microchip Technology PIC18F24-25Q71-Microcontroller-XLP-Data-Sheet-DS40002350.pdf Description: IC MCU 8BIT 32KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 26
auf Bestellung 381 Stücke:
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25+3.53 EUR
100+3.19 EUR
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PIC16F17176-I/MP PIC16F17176-I/MP Microchip Technology PIC16F17156-76-Microcontroller-Data-Sheet-DS40002485.pdf Description: IC MCU 8BIT 28KB FLASH 48VFQFN
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 35
auf Bestellung 438 Stücke:
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6+3.75 EUR
25+3.44 EUR
100+3.12 EUR
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PIC16F18176-I/PT PIC16F18176-I/PT Microchip Technology PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf Description: IC MCU 8BIT 28KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 480 Stücke:
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6+3.8 EUR
25+3.47 EUR
100+3.15 EUR
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1N5225BUR-1/TR 1N5221BUR-1%20thru%201N5281BUR-1.pdf
1N5225BUR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 3V 500MW DO213AA
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 3 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
auf Bestellung 282 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.03 EUR
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MV31020-150A/TR
Hersteller: Microchip Technology
Description: GAAS TVAR NON HERMETIC EPSM SMT
Capacitance Ratio: 11.3
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.3pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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MV31020-129A
MV31020-129A
Hersteller: Microchip Technology
Description: GAAS TVAR HERMETIC MICROSTRIP
Capacitance Ratio: 11.3
Voltage - Peak Reverse (Max): 22 V
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.3pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: 2-SMD, Flat Lead
Packaging: Tray
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MV31020-P00
Hersteller: Microchip Technology
Description: GAAS TVAR NON HERMETIC CHIP
Package / Case: Die
Packaging: Tray
Mounting Type: Surface Mount
Capacitance Ratio: 11.3
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.3pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
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MV31023-P00
Hersteller: Microchip Technology
Description: GAAS TVAR NON HERMETIC CHIP
Capacitance Ratio: 12.3
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 1500 @ 4V, 50MHz
Capacitance @ Vr, F: 5.6pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MV31024-150A/TR
Hersteller: Microchip Technology
Description: GAAS TVAR NON HERMETIC EPSM SMT
Capacitance Ratio: 12.6
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 1500 @ 4V, 50MHz
Capacitance @ Vr, F: 6.8pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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MV31021-150A/TR
Hersteller: Microchip Technology
Description: GAAS TVAR NON HERMETIC EPSM SMT
Capacitance Ratio: 11.5
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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MV31021-P00
Hersteller: Microchip Technology
Description: GAAS TVAR NON HERMETIC CHIP
Capacitance Ratio: 11.5
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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MV31021-150A
Hersteller: Microchip Technology
Description: GAAS TVAR NON HERMETIC EPSM SMT
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Capacitance Ratio: 11.5
Voltage - Peak Reverse (Max): 22 V
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MV31024-150A
Hersteller: Microchip Technology
Description: GAAS TVAR NON HERMETIC EPSM SMT
Capacitance Ratio: 12.6
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 1500 @ 4V, 50MHz
Capacitance @ Vr, F: 6.8pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MV31020-150A
Hersteller: Microchip Technology
Description: GAAS TVAR NON HERMETIC EPSM SMT
Capacitance Ratio: 11.3
Voltage - Peak Reverse (Max): 22 V
Supplier Device Package: Chip
Capacitance Ratio Condition: C2/C20
Q @ Vr, F: 2000 @ 4V, 50MHz
Capacitance @ Vr, F: 3.3pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 175°C
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JAN1N4153UR-1/TR 5812-1n4153ur-pdf.pdf
JAN1N4153UR-1/TR
Hersteller: Microchip Technology
Description: DIODE STANDARD 75V 150MA DO213AA
Current - Reverse Leakage @ Vr: 50 nA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 20 mA
Supplier Device Package: DO-213AA
Current - Average Rectified (Io): 150mA
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: DO-213AA
Packaging: Tape & Reel (TR)
Voltage - DC Reverse (Vr) (Max): 75 V
Operating Temperature - Junction: -65°C ~ 175°C
Produkt ist nicht verfügbar
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AT24C16-10PC-1.8 AT24C01A%2C02%2C04%2C08%2C16%20%282001%29.pdf
AT24C16-10PC-1.8
Hersteller: Microchip Technology
Description: IC EEPROM 16KBIT I2C 400KHZ 8DIP
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Non-Volatile
Memory Size: 16Kbit
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
DigiKey Programmable: Not Verified
Memory Organization: 2K x 8
Access Time: 900 ns
Memory Interface: I2C
Write Cycle Time - Word, Page: 5ms
Supplier Device Package: 8-PDIP
Memory Format: EEPROM
Clock Frequency: 400 kHz
Technology: EEPROM
Voltage - Supply: 1.8V ~ 5.5V
Produkt ist nicht verfügbar
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DSC1121AE1-041.5000T MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121AE1-041.5000T
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR LOW JITTER
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 41.5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121AE1-041.5000 MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121AE1-041.5000
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR LOW JITTER
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 41.5 MHz
Base Resonator: MEMS
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ATMEGA168-20MQ Atmel-2545-8-bit-AVR-Microcontroller-ATmega48-88-168_Summary.pdf
ATMEGA168-20MQ
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATMEGA168P-20AN ATmega48P_88P_168P-DS40002065A.pdf
ATMEGA168P-20AN
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 32TQFP
Packaging: Tray
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 23
DigiKey Programmable: Not Verified
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MXLLCE8.5A 9498-mlce-pdf
Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.4VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 100pF @ 1MHz
Current - Peak Pulse (10/1000µs): 100A
Voltage - Reverse Standoff (Typ): 8.5V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 9.44V
Voltage - Clamping (Max) @ Ipp: 14.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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AT88SC0204CA-SH Atmel-5202S-CryptoMem-AT88SC0204CA-Datasheet-Summary.pdf
AT88SC0204CA-SH
Hersteller: Microchip Technology
Description: IC SECURE MEMORY 8SOIC
DigiKey Programmable: Not Verified
Supplier Device Package: 8-SOIC
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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AT88SC0204CA-Y6H-T Atmel-5202S-CryptoMem-AT88SC0204CA-Datasheet-Summary.pdf
AT88SC0204CA-Y6H-T
Hersteller: Microchip Technology
Description: IC SECURE MEMORY 8MINI MAP
DigiKey Programmable: Not Verified
Supplier Device Package: 8-Mini Map (2x3)
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AT88SC0204CA-Y6H-T Atmel-5202S-CryptoMem-AT88SC0204CA-Datasheet-Summary.pdf
AT88SC0204CA-Y6H-T
Hersteller: Microchip Technology
Description: IC SECURE MEMORY 8MINI MAP
DigiKey Programmable: Not Verified
Supplier Device Package: 8-Mini Map (2x3)
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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AT88SC0204C-CI AT88SC0204C_Rev.0403.pdf
AT88SC0204C-CI
Hersteller: Microchip Technology
Description: IC SECURE MEMORY 8LAP
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-TDFN
Packaging: Tube
DigiKey Programmable: Not Verified
Supplier Device Package: 8-LAP (8x5)
Applications: Embedded, Smart Card
Produkt ist nicht verfügbar
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AT88SC0404C-CI AT88SC0404C_Rev.0403.pdf
AT88SC0404C-CI
Hersteller: Microchip Technology
Description: IC SECURE MEMORY 8LAP
DigiKey Programmable: Not Verified
Supplier Device Package: 8-LAP (8x5)
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-TDFN
Packaging: Tube
Produkt ist nicht verfügbar
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AT88SC12816C-CI AT88SC12816C_Rev.0403.pdf
AT88SC12816C-CI
Hersteller: Microchip Technology
Description: IC SECURE MEMORY 8LAP
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-TDFN
Packaging: Tube
DigiKey Programmable: Not Verified
Supplier Device Package: 8-LAP (8x5)
Applications: Embedded, Smart Card
Produkt ist nicht verfügbar
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AT88SC3216C-CI AT88SC3216C_Rev0403.pdf
AT88SC3216C-CI
Hersteller: Microchip Technology
Description: IC SECURE MEMORY 8LAP
DigiKey Programmable: Not Verified
Supplier Device Package: 8-LAP (8x5)
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Package / Case: 8-TDFN
Packaging: Tube
Produkt ist nicht verfügbar
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AT88SC0204C-SU Atmel-2022S-CryptoMem-AT88SC0204C-Datasheet-Summary.pdf
AT88SC0204C-SU
Hersteller: Microchip Technology
Description: IC SECURE MEMORY 8SOIC
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Supplier Device Package: 8-SOIC
Applications: Embedded, Smart Card
Type: Secure Memory
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MSMBG60CAe3 RF01000+%283%29.pdf
MSMBG60CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC DO214AA
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 96.8V
Voltage - Breakdown (Min): 66.7V
Bidirectional Channels: 1
Supplier Device Package: DO-214AA (SMBG)
Voltage - Reverse Standoff (Typ): 60V
Current - Peak Pulse (10/1000µs): 6.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-215AA, SMB Gull Wing
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
Produkt ist nicht verfügbar
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MSMCG13CAe3 10561-msmc-datasheet
MSMCG13CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 13VWM 21.5VC SMCG
Voltage - Reverse Standoff (Typ): 13V
Current - Peak Pulse (10/1000µs): 69.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-215AB, SMC Gull Wing
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 21.5V
Voltage - Breakdown (Min): 14.4V
Bidirectional Channels: 1
Supplier Device Package: SMCG (DO-215AB)
Produkt ist nicht verfügbar
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MSMCG6.0CAe3 10561-msmc-datasheet
MSMCG6.0CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 6VWM 10.3VC SMCG
Voltage - Reverse Standoff (Typ): 6V
Current - Peak Pulse (10/1000µs): 145.6A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-215AB, SMC Gull Wing
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 10.3V
Voltage - Breakdown (Min): 6.67V
Bidirectional Channels: 1
Supplier Device Package: SMCG (DO-215AB)
Produkt ist nicht verfügbar
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MXL5KP6.0CAe3 9461-m5kp-pdf
MXL5KP6.0CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 6VWM 10.3VC CASE 5A
Bidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 6V
Current - Peak Pulse (10/1000µs): 485A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 10.3V
Voltage - Breakdown (Min): 6.67V
Produkt ist nicht verfügbar
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MXL5KP6.5A 9461-m5kp-pdf
MXL5KP6.5A
Hersteller: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 11.2V
Voltage - Breakdown (Min): 7.22V
Unidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 6.5V
Current - Peak Pulse (10/1000µs): 447A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MXL5KP6.5Ae3 9461-m5kp-pdf
MXL5KP6.5Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 11.2V
Voltage - Breakdown (Min): 7.22V
Unidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 6.5V
Current - Peak Pulse (10/1000µs): 447A
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MXL5KP6.5CA 9461-m5kp-pdf
MXL5KP6.5CA
Hersteller: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 11.2V
Voltage - Breakdown (Min): 7.22V
Bidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 6.5V
Current - Peak Pulse (10/1000µs): 447A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MXL5KP6.5CAe3 9461-m5kp-pdf
MXL5KP6.5CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 11.2V
Voltage - Breakdown (Min): 7.22V
Bidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 6.5V
Current - Peak Pulse (10/1000µs): 447A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MXL5KP60A 9461-m5kp-pdf
MXL5KP60A
Hersteller: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC CASE 5A
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 96.8V
Voltage - Breakdown (Min): 66.7V
Unidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 60V
Current - Peak Pulse (10/1000µs): 52A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MXL5KP60Ae3 9461-m5kp-pdf
MXL5KP60Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC CASE 5A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 96.8V
Voltage - Breakdown (Min): 66.7V
Unidirectional Channels: 1
Supplier Device Package: Case 5A (DO-204AR)
Voltage - Reverse Standoff (Typ): 60V
Current - Peak Pulse (10/1000µs): 52A
Produkt ist nicht verfügbar
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MXLPLAD30KP28CA 9523-mplad30kp-datasheet
MXLPLAD30KP28CA
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 46.4VC PLAD
Supplier Device Package: PLAD
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 645A
Applications: General Purpose
Operating Temperature: -55°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: Nonstandard SMD
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 30000W (30kW)
Voltage - Clamping (Max) @ Ipp: 46.4V
Voltage - Breakdown (Min): 31.1V
Bidirectional Channels: 1
Produkt ist nicht verfügbar
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MVR2N2222AUB/TR
MVR2N2222AUB/TR
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MVR2N2222AUBC/TR
MVR2N2222AUBC/TR
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Supplier Device Package: UBC
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANSR2N2222AUB/E10
JANSR2N2222AUB/E10
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANSP2N2222AUB
JANSP2N2222AUB
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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JANSM2N2222AUB/TR 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf
JANSM2N2222AUB/TR
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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JANS2N2222AUA MIL-PRF-19500_255AA_wAmendment1_5-19-16.pdf
JANS2N2222AUA
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UA
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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1N1613R S%2CR20.pdf
1N1613R
Hersteller: Microchip Technology
Description: DIODE STANDARD REV 100V 7A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 7A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
Produkt ist nicht verfügbar
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1N1613 S%2CR20.pdf
1N1613
Hersteller: Microchip Technology
Description: DIODE STANDARD 100V 16A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 16A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
Produkt ist nicht verfügbar
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1N1613A S%2CR20.pdf
1N1613A
Hersteller: Microchip Technology
Description: DIODE STANDARD 100V 5A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
Produkt ist nicht verfügbar
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PIC16F18156-I/STX PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf
PIC16F18156-I/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
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7+3.01 EUR
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PIC16F17155-I/SS PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf
PIC16F17155-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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10+2.26 EUR
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PIC16F18156-I/SS PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf
PIC16F18156-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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9+2.39 EUR
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PIC16F17156-I/STX PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf
PIC16F17156-I/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
auf Bestellung 391 Stücke:
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12+1.82 EUR
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PIC16F17174-I/PT PIC16F17154-55-74-75-Microcontroller-Data-Sheet-DS40002490.pdf
PIC16F17174-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 480 Stücke:
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7+3.17 EUR
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PIC18F25Q71-I/SO PIC18F24-25Q71-Microcontroller-XLP-Data-Sheet-DS40002350.pdf
PIC18F25Q71-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 26
auf Bestellung 369 Stücke:
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8+2.83 EUR
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PIC16F17156-I/SS PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf
PIC16F17156-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
auf Bestellung 238 Stücke:
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9+2.48 EUR
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PIC16F17175-I/PT PIC16F17156-76-Microcontroller-Data-Sheet-DS40002485.pdf
PIC16F17175-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 480 Stücke:
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7+3.33 EUR
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PIC18F24Q71-I/SP PIC18F24-25Q71-Microcontroller-Data-Sheet-DS40002350.pdf
PIC18F24Q71-I/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 64MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 26
auf Bestellung 279 Stücke:
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PIC16F17154-I/SP PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf
PIC16F17154-I/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 24
auf Bestellung 412 Stücke:
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7+3.39 EUR
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PIC16F17176-I/PT PIC16F17156-76-Microcontroller-Data-Sheet-DS40002485.pdf
PIC16F17176-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 475 Stücke:
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6+3.62 EUR
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PIC18F25Q71-I/SP PIC18F24-25Q71-Microcontroller-XLP-Data-Sheet-DS40002350.pdf
PIC18F25Q71-I/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 26
auf Bestellung 381 Stücke:
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6+3.86 EUR
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PIC16F17176-I/MP PIC16F17156-76-Microcontroller-Data-Sheet-DS40002485.pdf
PIC16F17176-I/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 48VFQFN
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 35
auf Bestellung 438 Stücke:
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6+3.75 EUR
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PIC16F18176-I/PT PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf
PIC16F18176-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 480 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.8 EUR
25+3.47 EUR
100+3.15 EUR
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