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DSC1100CL3-PROGT DSC1100CL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1100CL3-PROGT DSC1100CL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1100BL3-PROGT DSC1100BL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100BL3-PROGT DSC1100BL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100AL3-PROGT DSC1100AL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1100AL3-PROGT DSC1100AL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1100CL5-PROGT DSC1100CL5-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1100CL5-PROGT DSC1100CL5-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1100BL5-PROGT DSC1100BL5-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1100BL5-PROGT DSC1100BL5-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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MIC4127YME-TR MIC4127YME-TR Microchip Technology MIC4126-27-28-Data-Sheet-20006084A.pdf Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC-EP
Rise / Fall Time (Typ): 20ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 1.5A, 1.5A
DigiKey Programmable: Not Verified
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MIC4127YMME-TR MIC4127YMME-TR Microchip Technology MIC4126-27-28-Data-Sheet-20006084A.pdf Description: IC GATE DRVR LOW-SIDE 8MSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-MSOP-EP
Rise / Fall Time (Typ): 20ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 1.5A, 1.5A
DigiKey Programmable: Not Verified
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MASMLG100A Microchip Technology 10563-msml-datasheet Description: TVS DIODE 100VWM 162VC SMLG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 18.6A
Voltage - Reverse Standoff (Typ): 100V
Supplier Device Package: SMLG (DO-215AB)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 111V
Voltage - Clamping (Max) @ Ipp: 162V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MAP4KE24CAe3 MAP4KE24CAe3 Microchip Technology 9517-mp4ke-pdf Description: TVS DIODE 20.5VWM 33.2VC DO204AL
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 20.5V
Supplier Device Package: DO-204AL (DO-41)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 22.8V
Voltage - Clamping (Max) @ Ipp: 33.2V
Power - Peak Pulse: 400W
Power Line Protection: No
Produkt ist nicht verfügbar
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JANTXV1N4576AUR-1 JANTXV1N4576AUR-1 Microchip Technology 5821-1n4565aur-1n4584aur-datasheet Description: DIODE ZENER 6.4V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 50 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Produkt ist nicht verfügbar
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JAN1N6122AUS JAN1N6122AUS Microchip Technology 127892-lds-0277-1-datasheet Description: TVS DIODE 35.8VWM 64.6VC SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.7A
Voltage - Reverse Standoff (Typ): 35.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.7V
Voltage - Clamping (Max) @ Ipp: 64.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Produkt ist nicht verfügbar
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MXSMBJSAC45e3 MXSMBJSAC45e3 Microchip Technology 123594-msmbjsac5-0-thru-msmbjsac75-e3-datasheet Description: TVS DIODE 45VWM 77VC DO214AA
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 30pF @ 1MHz
Current - Peak Pulse (10/1000µs): 6.8A
Voltage - Reverse Standoff (Typ): 45V
Supplier Device Package: DO-214AA (SMBJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 50V
Voltage - Clamping (Max) @ Ipp: 77V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLLCE43Ae3 Microchip Technology 9498-mlce-pdf Description: TVS DIODE 43VWM 69.4VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 100pF @ 1MHz
Current - Peak Pulse (10/1000µs): 21.6A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MXPLAD15KP12Ae3 MXPLAD15KP12Ae3 Microchip Technology 9522-mplad15kp-datasheet Description: TVS DIODE 12VWM 19.9VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 753A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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ATA5790-P3QW 18 ATA5790-P3QW 18 Microchip Technology ATA5790.pdf Description: IC PASS ENTRY 125KHZ 38VQFN
Packaging: Tape & Reel (TR)
Package / Case: 38-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 125kHz
Interface: SPI
Type: Passive Entry/Start
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 4.2V
Supplier Device Package: 38-VQFN (5x7)
Produkt ist nicht verfügbar
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ATA5790N-P3QW 18 ATA5790N-P3QW 18 Microchip Technology Description: IC PASS ENTRY 125KHZ 38VQFN
Packaging: Tape & Reel (TR)
Package / Case: 38-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 125kHz
Interface: SPI
Type: Passive Entry/Start
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 4.2V
Supplier Device Package: 38-VQFN (5x7)
Produkt ist nicht verfügbar
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2280300-R 2280300-R Microchip Technology 135874-adaptec-6-gbps-sas-hd-cables-flyer Description: ADAPTEC E-HDMSAS-E-MSAS-2M
Packaging: Bulk
For Use With/Related Products: 7, 7H, 7He Series
Accessory Type: Cable
Specifications: 2 Meters
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PIC16LF18856T-I/SO PIC16LF18856T-I/SO Microchip Technology PIC16(L)F18856-76-Data-Sheet-40001824F.pdf Description: IC MCU 8BIT 28KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (16K x 14)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC16LF18856T-I/SO PIC16LF18856T-I/SO Microchip Technology PIC16(L)F18856-76-Data-Sheet-40001824F.pdf Description: IC MCU 8BIT 28KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (16K x 14)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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DSC1121CI1-024.0000T DSC1121CI1-024.0000T Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121CI1-024.0000T DSC1121CI1-024.0000T Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121CL1-024.0000T DSC1121CL1-024.0000T Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121CL1-027.0000T DSC1121CL1-027.0000T Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121BI2-025.0007 DSC1121BI2-025.0007 Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 25.0007MHZ CMOS SMD
Packaging: Tube
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25.0007 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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1200UP32IX2S 1200UP32IX2S Microchip Technology Description: HBA ULTRA 1200P-32I SINGLE
Packaging: Bulk
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+1548.04 EUR
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1200U16EXS 1200U16EXS Microchip Technology Description: HBA ULTRA 1200-16E SGL
Packaging: Bulk
Interface: PCI Express
Type: PCIe Adapter
Number of Ports: 16
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1+1550.01 EUR
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1200UP16IX2S Microchip Technology Description: HBA ULTRA 1200P-16I SINGLE
Packaging: Bulk
auf Bestellung 9 Stücke:
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1200U16EX2S 1200U16EX2S Microchip Technology Description: HBA ULTRA 1200-16E SINGLE
Packaging: Bulk
auf Bestellung 19 Stücke:
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1+1487.08 EUR
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JANTX1N4983US JANTX1N4983US Microchip Technology 11059-sd44a-datasheet Description: DIODE ZENER 110V 5W D5B
Packaging: Bulk
Tolerance: ±5%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 110 V
Impedance (Max) (Zzt): 125 Ohms
Supplier Device Package: D-5B
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 83.6 V
Grade: Military
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANTX1N977D-1 Microchip Technology 125314-lds-0287-datasheet Description: DIODE ZENER 47V 500MW DO35
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-35 (DO-204AH)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 36 V
Produkt ist nicht verfügbar
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2N5541 2N5541 Microchip Technology Description: POWER BJT
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 5 A
Voltage - Collector Emitter Breakdown (Max): 130 V
Power - Max: 7 W
Produkt ist nicht verfügbar
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2N5546 Microchip Technology Description: JFET - DUAL
Packaging: Bulk
Produkt ist nicht verfügbar
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2N5545 Microchip Technology Description: JFET - DUAL
Packaging: Bulk
Produkt ist nicht verfügbar
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2N5547 Microchip Technology Description: JFET - DUAL
Packaging: Bulk
Produkt ist nicht verfügbar
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2N5597 Microchip Technology Description: POWER BJT
Packaging: Bulk
Package / Case: TO-213AA, TO-66-2
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-66 (TO-213AA)
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 20 W
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2N5599 Microchip Technology Description: POWER BJT
Packaging: Bulk
Package / Case: TO-213AA, TO-66-2
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 850mV @ 200µA, 1mA
Supplier Device Package: TO-66 (TO-213AA)
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 20 W
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2N5575 Microchip Technology Description: POWER BJT
Packaging: Bulk
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2N5542 Microchip Technology Description: POWER BJT
Packaging: Bulk
Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud
Mounting Type: Stud Mount
Transistor Type: PNP
Supplier Device Package: TO-61
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 130 V
Power - Max: 87.5 W
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MIC826RYMT-TR MIC826RYMT-TR Microchip Technology MIC826.pdf Description: IC SUPERVISOR 1 CHANNEL 6TDFN
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High/Active Low
Operating Temperature: -40°C ~ 125°C (TJ)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 2.625V
Supplier Device Package: 6-TDFN (1.6x1.6)
DigiKey Programmable: Not Verified
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Le9651PQCT Le9651PQCT Microchip Technology 134340-le9651-product-brief Description: IC TELECOM INTERFACE 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 4-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Current - Supply: 25mA
Supplier Device Package: 48-QFN (7x7)
Number of Circuits: 1
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Le9651PQCT Le9651PQCT Microchip Technology 134340-le9651-product-brief Description: IC TELECOM INTERFACE 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 4-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Current - Supply: 25mA
Supplier Device Package: 48-QFN (7x7)
Number of Circuits: 1
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LE9622RQCT LE9622RQCT Microchip Technology LE9622.pdf Description: IC TELECOM INTERFACE 53QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCM, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Supplier Device Package: 53-QFN (7x7)
Number of Circuits: 1
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LE9622RQCT LE9622RQCT Microchip Technology LE9622.pdf Description: IC TELECOM INTERFACE 53QFN
Packaging: Cut Tape (CT)
Package / Case: 53-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCM, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Supplier Device Package: 53-QFN (7x7)
Number of Circuits: 1
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Le9652PQCT Le9652PQCT Microchip Technology 134342-le9652-product-brief Description: IC TELECOM INTERFACE 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 4-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Current - Supply: 25mA
Supplier Device Package: 48-QFN (7x7)
Number of Circuits: 2
Produkt ist nicht verfügbar
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Le9652PQCT Le9652PQCT Microchip Technology 134342-le9652-product-brief Description: IC TELECOM INTERFACE 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 4-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Current - Supply: 25mA
Supplier Device Package: 48-QFN (7x7)
Number of Circuits: 2
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LE9632RQCT LE9632RQCT Microchip Technology 111115932621.pdf Description: IC TELECOM INTERFACE 53QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCM, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Supplier Device Package: 53-QFN (7x7)
Number of Circuits: 1
Produkt ist nicht verfügbar
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LE9632RQCT LE9632RQCT Microchip Technology 111115932621.pdf Description: IC TELECOM INTERFACE 53QFN
Packaging: Cut Tape (CT)
Package / Case: 53-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCM, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Supplier Device Package: 53-QFN (7x7)
Number of Circuits: 1
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LE9622RQC LE9622RQC Microchip Technology 111115932621.pdf Description: IC TELECOM INTERFACE 53QFN
Packaging: Tray
Package / Case: 53-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCM, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Supplier Device Package: 53-QFN (7x7)
Number of Circuits: 1
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JAN1N4961C JAN1N4961C Microchip Technology 10913-sa5-37-datasheet Description: DIODE ZENER 13V 5W E AXIAL
Packaging: Bulk
Tolerance: ±2%
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
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CDLL4931/TR Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER TEMP COMPENSATED
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 36 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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ATF16V8CZ-15PC ATF16V8CZ-15PC Microchip Technology ATF16V8CZ.pdf Description: IC PLD 8MC 15NS 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Voltage - Input: 5V
Programmable Type: EE PLD
Number of Macrocells: 8
Supplier Device Package: 20-PDIP
Speed: 15 ns
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT32UC3C164C-AUT AT32UC3C164C-AUT Microchip Technology 32117S.pdf Description: IC MCU 32BIT 64KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 16x12b; D/A 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
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85C82E/P 85C82E/P Microchip Technology MCHPS03919-1.pdf?t.download=true&u=5oefqw Description: IC EEPROM 2KBIT I2C 100KHZ 8DIP
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-PDIP
Memory Interface: I²C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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SY58607UMG-TR SY58607UMG-TR Microchip Technology SY58607U-3-2Gbps-Precision-1-2-LVPECL-Fanout-Buffer-DS20006227A.pdf Description: IC CLK BUFFER 1:2 3GHZ 16MLF
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution)
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Frequency - Max: 3 GHz
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SY58607UMG-TR SY58607UMG-TR Microchip Technology SY58607U-3-2Gbps-Precision-1-2-LVPECL-Fanout-Buffer-DS20006227A.pdf Description: IC CLK BUFFER 1:2 3GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution)
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Frequency - Max: 3 GHz
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DSC1100CL3-PROGT DSC1100_Web.pdf
DSC1100CL3-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100CL3-PROGT DSC1100_Web.pdf
DSC1100CL3-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100BL3-PROGT DSC1100_Web.pdf
DSC1100BL3-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
auf Bestellung 1000 Stücke:
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DSC1100BL3-PROGT DSC1100_Web.pdf
DSC1100BL3-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
auf Bestellung 1000 Stücke:
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DSC1100AL3-PROGT DSC1100_Web.pdf
DSC1100AL3-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100AL3-PROGT DSC1100_Web.pdf
DSC1100AL3-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1100CL5-PROGT DSC1100_Web.pdf
DSC1100CL5-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100CL5-PROGT DSC1100_Web.pdf
DSC1100CL5-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100BL5-PROGT DSC1100_Web.pdf
DSC1100BL5-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1100BL5-PROGT DSC1100_Web.pdf
DSC1100BL5-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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MIC4127YME-TR MIC4126-27-28-Data-Sheet-20006084A.pdf
MIC4127YME-TR
Hersteller: Microchip Technology
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC-EP
Rise / Fall Time (Typ): 20ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 1.5A, 1.5A
DigiKey Programmable: Not Verified
auf Bestellung 4600 Stücke:
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11+1.74 EUR
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MIC4127YMME-TR MIC4126-27-28-Data-Sheet-20006084A.pdf
MIC4127YMME-TR
Hersteller: Microchip Technology
Description: IC GATE DRVR LOW-SIDE 8MSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-MSOP-EP
Rise / Fall Time (Typ): 20ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 1.5A, 1.5A
DigiKey Programmable: Not Verified
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10+1.92 EUR
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MASMLG100A 10563-msml-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 100VWM 162VC SMLG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 18.6A
Voltage - Reverse Standoff (Typ): 100V
Supplier Device Package: SMLG (DO-215AB)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 111V
Voltage - Clamping (Max) @ Ipp: 162V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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MAP4KE24CAe3 9517-mp4ke-pdf
MAP4KE24CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 20.5VWM 33.2VC DO204AL
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 20.5V
Supplier Device Package: DO-204AL (DO-41)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 22.8V
Voltage - Clamping (Max) @ Ipp: 33.2V
Power - Peak Pulse: 400W
Power Line Protection: No
Produkt ist nicht verfügbar
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JANTXV1N4576AUR-1 5821-1n4565aur-1n4584aur-datasheet
JANTXV1N4576AUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 6.4V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 50 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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JAN1N6122AUS 127892-lds-0277-1-datasheet
JAN1N6122AUS
Hersteller: Microchip Technology
Description: TVS DIODE 35.8VWM 64.6VC SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.7A
Voltage - Reverse Standoff (Typ): 35.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.7V
Voltage - Clamping (Max) @ Ipp: 64.6V
Power - Peak Pulse: 500W
Power Line Protection: No
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MXSMBJSAC45e3 123594-msmbjsac5-0-thru-msmbjsac75-e3-datasheet
MXSMBJSAC45e3
Hersteller: Microchip Technology
Description: TVS DIODE 45VWM 77VC DO214AA
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 30pF @ 1MHz
Current - Peak Pulse (10/1000µs): 6.8A
Voltage - Reverse Standoff (Typ): 45V
Supplier Device Package: DO-214AA (SMBJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 50V
Voltage - Clamping (Max) @ Ipp: 77V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLLCE43Ae3 9498-mlce-pdf
Hersteller: Microchip Technology
Description: TVS DIODE 43VWM 69.4VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 100pF @ 1MHz
Current - Peak Pulse (10/1000µs): 21.6A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MXPLAD15KP12Ae3 9522-mplad15kp-datasheet
MXPLAD15KP12Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 12VWM 19.9VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 753A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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ATA5790-P3QW 18 ATA5790.pdf
ATA5790-P3QW 18
Hersteller: Microchip Technology
Description: IC PASS ENTRY 125KHZ 38VQFN
Packaging: Tape & Reel (TR)
Package / Case: 38-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 125kHz
Interface: SPI
Type: Passive Entry/Start
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 4.2V
Supplier Device Package: 38-VQFN (5x7)
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ATA5790N-P3QW 18
ATA5790N-P3QW 18
Hersteller: Microchip Technology
Description: IC PASS ENTRY 125KHZ 38VQFN
Packaging: Tape & Reel (TR)
Package / Case: 38-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 125kHz
Interface: SPI
Type: Passive Entry/Start
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 4.2V
Supplier Device Package: 38-VQFN (5x7)
Produkt ist nicht verfügbar
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2280300-R 135874-adaptec-6-gbps-sas-hd-cables-flyer
2280300-R
Hersteller: Microchip Technology
Description: ADAPTEC E-HDMSAS-E-MSAS-2M
Packaging: Bulk
For Use With/Related Products: 7, 7H, 7He Series
Accessory Type: Cable
Specifications: 2 Meters
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1+164.21 EUR
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PIC16LF18856T-I/SO PIC16(L)F18856-76-Data-Sheet-40001824F.pdf
PIC16LF18856T-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (16K x 14)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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Anzahl Preis
1600+2.50 EUR
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PIC16LF18856T-I/SO PIC16(L)F18856-76-Data-Sheet-40001824F.pdf
PIC16LF18856T-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (16K x 14)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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Anzahl Preis
6+3.03 EUR
25+2.78 EUR
100+2.50 EUR
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DSC1121CI1-024.0000T MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121CI1-024.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1121CI1-024.0000T MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121CI1-024.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1121CL1-024.0000T MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121CL1-024.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1121CL1-027.0000T MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121CL1-027.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC1121BI2-025.0007 MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121BI2-025.0007
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0007MHZ CMOS SMD
Packaging: Tube
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25.0007 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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1200UP32IX2S
1200UP32IX2S
Hersteller: Microchip Technology
Description: HBA ULTRA 1200P-32I SINGLE
Packaging: Bulk
auf Bestellung 19 Stücke:
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Anzahl Preis
1+1548.04 EUR
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1200U16EXS
1200U16EXS
Hersteller: Microchip Technology
Description: HBA ULTRA 1200-16E SGL
Packaging: Bulk
Interface: PCI Express
Type: PCIe Adapter
Number of Ports: 16
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1200UP16IX2S
Hersteller: Microchip Technology
Description: HBA ULTRA 1200P-16I SINGLE
Packaging: Bulk
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1+1304.25 EUR
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1200U16EX2S
1200U16EX2S
Hersteller: Microchip Technology
Description: HBA ULTRA 1200-16E SINGLE
Packaging: Bulk
auf Bestellung 19 Stücke:
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1+1487.08 EUR
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JANTX1N4983US 11059-sd44a-datasheet
JANTX1N4983US
Hersteller: Microchip Technology
Description: DIODE ZENER 110V 5W D5B
Packaging: Bulk
Tolerance: ±5%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 110 V
Impedance (Max) (Zzt): 125 Ohms
Supplier Device Package: D-5B
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 83.6 V
Grade: Military
Qualification: MIL-PRF-19500/356
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JANTX1N977D-1 125314-lds-0287-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 47V 500MW DO35
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-35 (DO-204AH)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 36 V
Produkt ist nicht verfügbar
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2N5541
2N5541
Hersteller: Microchip Technology
Description: POWER BJT
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 5 A
Voltage - Collector Emitter Breakdown (Max): 130 V
Power - Max: 7 W
Produkt ist nicht verfügbar
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2N5546
Hersteller: Microchip Technology
Description: JFET - DUAL
Packaging: Bulk
Produkt ist nicht verfügbar
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2N5545
Hersteller: Microchip Technology
Description: JFET - DUAL
Packaging: Bulk
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2N5547
Hersteller: Microchip Technology
Description: JFET - DUAL
Packaging: Bulk
Produkt ist nicht verfügbar
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2N5597
Hersteller: Microchip Technology
Description: POWER BJT
Packaging: Bulk
Package / Case: TO-213AA, TO-66-2
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-66 (TO-213AA)
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 20 W
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2N5599
Hersteller: Microchip Technology
Description: POWER BJT
Packaging: Bulk
Package / Case: TO-213AA, TO-66-2
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 850mV @ 200µA, 1mA
Supplier Device Package: TO-66 (TO-213AA)
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 20 W
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2N5575
Hersteller: Microchip Technology
Description: POWER BJT
Packaging: Bulk
Produkt ist nicht verfügbar
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2N5542
Hersteller: Microchip Technology
Description: POWER BJT
Packaging: Bulk
Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud
Mounting Type: Stud Mount
Transistor Type: PNP
Supplier Device Package: TO-61
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 130 V
Power - Max: 87.5 W
Produkt ist nicht verfügbar
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MIC826RYMT-TR MIC826.pdf
MIC826RYMT-TR
Hersteller: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL 6TDFN
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High/Active Low
Operating Temperature: -40°C ~ 125°C (TJ)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 2.625V
Supplier Device Package: 6-TDFN (1.6x1.6)
DigiKey Programmable: Not Verified
auf Bestellung 3152 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
26+0.69 EUR
31+0.57 EUR
100+0.54 EUR
Mindestbestellmenge: 26
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Le9651PQCT 134340-le9651-product-brief
Le9651PQCT
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 4-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Current - Supply: 25mA
Supplier Device Package: 48-QFN (7x7)
Number of Circuits: 1
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Le9651PQCT 134340-le9651-product-brief
Le9651PQCT
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 4-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Current - Supply: 25mA
Supplier Device Package: 48-QFN (7x7)
Number of Circuits: 1
auf Bestellung 2950 Stücke:
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Anzahl Preis
5+4.24 EUR
25+3.52 EUR
100+3.41 EUR
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LE9622RQCT LE9622.pdf
LE9622RQCT
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 53QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCM, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Supplier Device Package: 53-QFN (7x7)
Number of Circuits: 1
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+4.93 EUR
Mindestbestellmenge: 3000
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LE9622RQCT LE9622.pdf
LE9622RQCT
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 53QFN
Packaging: Cut Tape (CT)
Package / Case: 53-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCM, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Supplier Device Package: 53-QFN (7x7)
Number of Circuits: 1
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.12 EUR
25+5.10 EUR
100+4.93 EUR
Mindestbestellmenge: 3
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Le9652PQCT 134342-le9652-product-brief
Le9652PQCT
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 4-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Current - Supply: 25mA
Supplier Device Package: 48-QFN (7x7)
Number of Circuits: 2
Produkt ist nicht verfügbar
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Le9652PQCT 134342-le9652-product-brief
Le9652PQCT
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 4-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Current - Supply: 25mA
Supplier Device Package: 48-QFN (7x7)
Number of Circuits: 2
auf Bestellung 2975 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.18 EUR
25+5.15 EUR
100+4.97 EUR
Mindestbestellmenge: 3
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LE9632RQCT 111115932621.pdf
LE9632RQCT
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 53QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCM, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Supplier Device Package: 53-QFN (7x7)
Number of Circuits: 1
Produkt ist nicht verfügbar
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LE9632RQCT 111115932621.pdf
LE9632RQCT
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 53QFN
Packaging: Cut Tape (CT)
Package / Case: 53-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCM, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Supplier Device Package: 53-QFN (7x7)
Number of Circuits: 1
auf Bestellung 2915 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.35 EUR
25+5.29 EUR
100+5.11 EUR
Mindestbestellmenge: 3
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LE9622RQC 111115932621.pdf
LE9622RQC
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 53QFN
Packaging: Tray
Package / Case: 53-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCM, SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Supplier Device Package: 53-QFN (7x7)
Number of Circuits: 1
auf Bestellung 1224 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+5.97 EUR
25+4.98 EUR
100+4.81 EUR
Mindestbestellmenge: 3
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JAN1N4961C 10913-sa5-37-datasheet
JAN1N4961C
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 5W E AXIAL
Packaging: Bulk
Tolerance: ±2%
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
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CDLL4931/TR 8393-cdll4916-4932a-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 36 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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ATF16V8CZ-15PC ATF16V8CZ.pdf
ATF16V8CZ-15PC
Hersteller: Microchip Technology
Description: IC PLD 8MC 15NS 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Voltage - Input: 5V
Programmable Type: EE PLD
Number of Macrocells: 8
Supplier Device Package: 20-PDIP
Speed: 15 ns
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT32UC3C164C-AUT 32117S.pdf
AT32UC3C164C-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 16x12b; D/A 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.96 EUR
25+14.54 EUR
Mindestbestellmenge: 2
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85C82E/P MCHPS03919-1.pdf?t.download=true&u=5oefqw
85C82E/P
Hersteller: Microchip Technology
Description: IC EEPROM 2KBIT I2C 100KHZ 8DIP
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-PDIP
Memory Interface: I²C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
auf Bestellung 13436 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
198+2.68 EUR
Mindestbestellmenge: 198
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SY58607UMG-TR SY58607U-3-2Gbps-Precision-1-2-LVPECL-Fanout-Buffer-DS20006227A.pdf
SY58607UMG-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 3GHZ 16MLF
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution)
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Frequency - Max: 3 GHz
Produkt ist nicht verfügbar
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SY58607UMG-TR SY58607U-3-2Gbps-Precision-1-2-LVPECL-Fanout-Buffer-DS20006227A.pdf
SY58607UMG-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 3GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution)
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Frequency - Max: 3 GHz
auf Bestellung 1266 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.51 EUR
25+8.76 EUR
100+8.46 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
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