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JAN1N3028DUR-1/TR JAN1N3028DUR-1/TR Microchip Technology 5787-1n3016bur-datasheet Description: VOLTAGE REGULATOR
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
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JANTXV1N3028CUR-1 JANTXV1N3028CUR-1 Microchip Technology 5787-1n3016bur-datasheet Description: DIODE ZENER 22V 1W DO213AB
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±2%
Packaging: Bulk
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JANTXV1N3028CUR-1/TR JANTXV1N3028CUR-1/TR Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
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JANTX1N3028DUR-1 JANTX1N3028DUR-1 Microchip Technology 5787-1n3016bur-datasheet Description: DIODE ZENER 22V 1W DO213AB
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±1%
Packaging: Bulk
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JANTX1N3028DUR-1/TR JANTX1N3028DUR-1/TR Microchip Technology Description: VOLTAGE REGULATOR
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
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JANTXV1N3028DUR-1 JANTXV1N3028DUR-1 Microchip Technology 5787-1n3016bur-datasheet Description: DIODE ZENER 22V 1W DO213AB
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±1%
Packaging: Bulk
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ATTINY13V-10PQ ATTINY13V-10PQ Microchip Technology 2535S.pdf Description: IC MCU 8BIT 1KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 1KB (512 x 16)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Verified
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UT4020 Microchip Technology Description: DIODE GEN PURP 200V 4A B
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 4A
Supplier Device Package: B
Operating Temperature - Junction: -195°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 3 A
Current - Reverse Leakage @ Vr: 5 µA @ 200 V
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UT4020/TR Microchip Technology Description: DIODE GEN PURP 200V 4A B
Packaging: Tape & Reel (TR)
Package / Case: Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 4A
Supplier Device Package: B
Operating Temperature - Junction: -195°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 3 A
Current - Reverse Leakage @ Vr: 5 µA @ 200 V
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CD4099V Microchip Technology Description: DIODE ZENER 6.8V 500MW DIE
Current - Reverse Leakage @ Vr: 10 µA @ 5.17 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: Die
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: Die
Tolerance: ±5%
Packaging: Bulk
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CDLL4958 Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Bulk
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CDLL4955 Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Bulk
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CDLL4957 Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Bulk
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CDLL4954 Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Bulk
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DSPIC33CK256MP706T-I/PT DSPIC33CK256MP706T-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 64TQFP
Number of I/O: 54
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
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DSPIC33CK256MP706T-I/PT DSPIC33CK256MP706T-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 64TQFP
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
Number of I/O: 54
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
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DSPIC33CK256MP706T-I/MR DSPIC33CK256MP706T-I/MR Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 64VFQFN
Number of I/O: 54
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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DSPIC33CK256MP706T-I/MR DSPIC33CK256MP706T-I/MR Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 64VFQFN
Number of I/O: 54
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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DSPIC33CK256MP705-E/PT DSPIC33CK256MP705-E/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 48TQFP
Number of I/O: 39
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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DSPIC33CK256MP705-E/M7 DSPIC33CK256MP705-E/M7 Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 48VFQFN
Number of I/O: 39
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
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DSPIC33CK256MP706-E/PT DSPIC33CK256MP706-E/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 64TQFP
Number of I/O: 54
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tray
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DSPIC33CK512MP706-E/MR DSPIC33CK512MP706-E/MR Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 512KB FLASH 64VFQFN
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tube
Number of I/O: 54
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
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VXA1-1ET-10-16M0000000 Microchip Technology 1243748-vxa1 Description: VC-827-JDE-KAAN-156M250000
Frequency: 16 MHz
ESR (Equivalent Series Resistance): 25 Ohms
Height - Seated (Max): 0.445" (11.30mm)
Operating Mode: Fundamental
Frequency Tolerance: ±20ppm
Frequency Stability: ±20ppm
Operating Temperature: 0°C ~ 70°C
Type: MHz Crystal
Mounting Type: Through Hole
Size / Dimension: 0.453" L x 0.197" W (11.50mm x 5.00mm)
Load Capacitance: 10pF
Package / Case: HC-49/U
Packaging: Tape & Reel (TR)
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MNS1N4568DUR-1/TR MNS1N4568DUR-1/TR Microchip Technology Description: TEMPERATURE COMPENSATED
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: 0°C ~ 75°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
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MNS1N4568DUR-1 MNS1N4568DUR-1 Microchip Technology Description: TEMPERATURE COMPENSATED
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Packaging: Bulk
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MPLAD18KP16AE3 MPLAD18KP16AE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD18KP16A/TR MPLAD18KP16A/TR Microchip Technology Description: SURFACE MOUNT 18,000 WATT, TVS,
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD18KP16CA MPLAD18KP16CA Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD18KP16CAE3 MPLAD18KP16CAE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16A MAPLAD18KP16A Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MAPLAD18KP16AE3 MAPLAD18KP16AE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16CA MAPLAD18KP16CA Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16CAE3 MAPLAD18KP16CAE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD18KP16A MPLAD18KP16A Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD18KP16A MXLPLAD18KP16A Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLPLAD18KP16CA MXLPLAD18KP16CA Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXPLAD18KP16A MXPLAD18KP16A Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXPLAD18KP16CA MXPLAD18KP16CA Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLPLAD18KP16AE3 MXLPLAD18KP16AE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLPLAD18KP16CAE3 MXLPLAD18KP16CAE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXPLAD18KP16AE3 MXPLAD18KP16AE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD18KP16CAE3 MXPLAD18KP16CAE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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CD4107 CD4107 Microchip Technology 8362-cd4099-cd4135-datasheet Description: VOLTAGE REGULATOR
Current - Reverse Leakage @ Vr: 50 nA @ 9.87 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: Die
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: Die
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANTX1N4130DUR-1 JANTX1N4130DUR-1 Microchip Technology 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf Description: DIODE ZENER 68V 500MW DO213AA
Current - Reverse Leakage @ Vr: 10 nA @ 51.7 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 700 Ohms
Voltage - Zener (Nom) (Vz): 68 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Packaging: Bulk
Qualification: MIL-PRF-19500/435
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JAN1N4130DUR-1 JAN1N4130DUR-1 Microchip Technology 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf Description: DIODE ZENER 68V DO213AA
Qualification: MIL-PRF-19500/435
Current - Reverse Leakage @ Vr: 10 nA @ 51.7 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 700 Ohms
Voltage - Zener (Nom) (Vz): 68 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Packaging: Bulk
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MXLSMLJ11CA MXLSMLJ11CA Microchip Technology 10563-msml-datasheet Description: TVS DIODE 11VWM 18.2VC DO214AB
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 3000W (3kW)
Voltage - Clamping (Max) @ Ipp: 18.2V
Voltage - Breakdown (Min): 12.2V
Bidirectional Channels: 1
Supplier Device Package: DO-214AB
Voltage - Reverse Standoff (Typ): 11V
Current - Peak Pulse (10/1000µs): 164.8A
Applications: General Purpose
Produkt ist nicht verfügbar
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UMX9989AP/TR Microchip Technology umx9989ap_datasheet.pdf Description: SI PPIN HERMETIC MELF
Packaging: Tray
Package / Case: Module
Diode Type: PIN - Anti-Parallel
Operating Temperature: -65°C ~ 150°C
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
Produkt ist nicht verfügbar
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UMX9989AP Microchip Technology umx9989ap_datasheet.pdf Description: SI PPIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: Module
Diode Type: PIN - Anti-Parallel
Operating Temperature: -65°C ~ 150°C
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
Produkt ist nicht verfügbar
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AT80C32X2-SLSUV AT80C32X2-SLSUV Microchip Technology AT80C32x2,AT87C52,TS80C32x2.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-PLCC (16.6x16.6)
Peripherals: POR
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Core Processor: 80C51
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Speed: 60/30MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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ATMEGA128RFA1-ZUR ATMEGA128RFA1-ZUR Microchip Technology Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATMEGA128RFA1-ZUR ATMEGA128RFA1-ZUR Microchip Technology Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
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TC1072-3.3VCH713 TC1072-3.3VCH713 Microchip Technology filehandler.aspx?ddocname=en011421 Description: IC REG LINEAR 3.3V 50MA SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-6
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 64dB (1kHz)
Voltage Dropout (Max): 0.12V @ 50mA
Protection Features: Over Current, Over Temperature
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TC1072-3.3VCH713 TC1072-3.3VCH713 Microchip Technology filehandler.aspx?ddocname=en011421 Description: IC REG LINEAR 3.3V 50MA SOT23-6
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-6
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 64dB (1kHz)
Voltage Dropout (Max): 0.12V @ 50mA
Protection Features: Over Current, Over Temperature
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25+0.72 EUR
31+0.58 EUR
100+0.55 EUR
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2N5339 2N5339 Microchip Technology 8813-lds-0011-datasheet Description: NPN TRANSISTOR
Power - Max: 1 W
Voltage - Collector Emitter Breakdown (Max): 100 V
Current - Collector (Ic) (Max): 5 A
Supplier Device Package: TO-39
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Current - Collector Cutoff (Max): 100µA
Vce Saturation (Max) @ Ib, Ic: 1.2V @ 500mA, 5A
Operating Temperature: -55°C ~ 200°C
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AD, TO-39-3 Metal Can
Packaging: Bulk
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PD69210C-022319-TR PD69210C-022319-TR Microchip Technology Description: MCU FOR PD692XX FAMILY, BASED PD
Packaging: Tray
Number of Channels: 8
Auxiliary Sense: Yes
Supplier Device Package: 32-QFN (5x5)
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Internal Switch(s): Yes
Voltage - Supply: 3V ~ 3.63V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Controller (PSE)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
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PD69210R-022320-TR PD69210R-022320-TR Microchip Technology Description: MCU FOR PD692XX FAMILY, BASED PD
Number of Channels: 8
Auxiliary Sense: Yes
Supplier Device Package: 32-QFN (5x5)
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Internal Switch(s): Yes
Voltage - Supply: 3V ~ 3.63V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Controller (PSE)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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BM71BLES1FC2-0B05BA Microchip Technology BM70-71-Bluetooth-Low-Energy-Module-DS60001372.pdf Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Protocol: Bluetooth v4.2
Current - Receiving: 10mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
auf Bestellung 108 Stücke:
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25+12.8 EUR
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1N4678UR-1/TR 1N4678UR-1/TR Microchip Technology 1N4678UR-1-1N4717UR-1.pdf Description: DIODE ZENER 1.8V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 100 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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1N4678UR-1/TR 1N4678UR-1/TR Microchip Technology 1N4678UR-1-1N4717UR-1.pdf Description: DIODE ZENER 1.8V 500MW DO213AA
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 100 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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1N4678/TR 1N4678/TR Microchip Technology 5827-1n4678-4717-datasheet Description: DIODE ZENER 1.8V 500MW DO204AH
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TA)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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JAN1N3028DUR-1/TR 5787-1n3016bur-datasheet
JAN1N3028DUR-1/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
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JANTXV1N3028CUR-1 5787-1n3016bur-datasheet
JANTXV1N3028CUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 22V 1W DO213AB
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N3028CUR-1/TR
JANTXV1N3028CUR-1/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Produkt ist nicht verfügbar
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JANTX1N3028DUR-1 5787-1n3016bur-datasheet
JANTX1N3028DUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 22V 1W DO213AB
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±1%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N3028DUR-1/TR
JANTX1N3028DUR-1/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
Produkt ist nicht verfügbar
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JANTXV1N3028DUR-1 5787-1n3016bur-datasheet
JANTXV1N3028DUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 22V 1W DO213AB
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 23 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±1%
Packaging: Bulk
Produkt ist nicht verfügbar
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ATTINY13V-10PQ 2535S.pdf
ATTINY13V-10PQ
Hersteller: Microchip Technology
Description: IC MCU 8BIT 1KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 1KB (512 x 16)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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UT4020
Hersteller: Microchip Technology
Description: DIODE GEN PURP 200V 4A B
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 4A
Supplier Device Package: B
Operating Temperature - Junction: -195°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 3 A
Current - Reverse Leakage @ Vr: 5 µA @ 200 V
Produkt ist nicht verfügbar
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UT4020/TR
Hersteller: Microchip Technology
Description: DIODE GEN PURP 200V 4A B
Packaging: Tape & Reel (TR)
Package / Case: Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 4A
Supplier Device Package: B
Operating Temperature - Junction: -195°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 3 A
Current - Reverse Leakage @ Vr: 5 µA @ 200 V
Produkt ist nicht verfügbar
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CD4099V
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DIE
Current - Reverse Leakage @ Vr: 10 µA @ 5.17 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: Die
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: Die
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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CDLL4958
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
Produkt ist nicht verfügbar
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CDLL4955
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
Produkt ist nicht verfügbar
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CDLL4957
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
Produkt ist nicht verfügbar
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CDLL4954
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
Produkt ist nicht verfügbar
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DSPIC33CK256MP706T-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP706T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64TQFP
Number of I/O: 54
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33CK256MP706T-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP706T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64TQFP
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
Number of I/O: 54
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
auf Bestellung 1150 Stücke:
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AnzahlPreis
2+9.26 EUR
25+8.49 EUR
100+7.69 EUR
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DSPIC33CK256MP706T-I/MR dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP706T-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64VFQFN
Number of I/O: 54
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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AnzahlPreis
3300+7.78 EUR
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DSPIC33CK256MP706T-I/MR dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP706T-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64VFQFN
Number of I/O: 54
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 3300 Stücke:
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AnzahlPreis
2+9.36 EUR
25+8.6 EUR
100+7.78 EUR
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DSPIC33CK256MP705-E/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP705-E/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48TQFP
Number of I/O: 39
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
auf Bestellung 250 Stücke:
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AnzahlPreis
2+9.91 EUR
25+9.08 EUR
100+8.21 EUR
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DSPIC33CK256MP705-E/M7 dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP705-E/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VFQFN
Number of I/O: 39
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 183 Stücke:
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AnzahlPreis
4+4.59 EUR
25+4.16 EUR
100+3.79 EUR
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DSPIC33CK256MP706-E/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP706-E/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64TQFP
Number of I/O: 54
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tray
auf Bestellung 135 Stücke:
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AnzahlPreis
2+10.16 EUR
25+9.31 EUR
100+8.43 EUR
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DSPIC33CK512MP706-E/MR dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK512MP706-E/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 512KB FLASH 64VFQFN
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tube
Number of I/O: 54
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Processor: dsPIC
auf Bestellung 115 Stücke:
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AnzahlPreis
2+10.79 EUR
25+9.89 EUR
100+8.94 EUR
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VXA1-1ET-10-16M0000000 1243748-vxa1
Hersteller: Microchip Technology
Description: VC-827-JDE-KAAN-156M250000
Frequency: 16 MHz
ESR (Equivalent Series Resistance): 25 Ohms
Height - Seated (Max): 0.445" (11.30mm)
Operating Mode: Fundamental
Frequency Tolerance: ±20ppm
Frequency Stability: ±20ppm
Operating Temperature: 0°C ~ 70°C
Type: MHz Crystal
Mounting Type: Through Hole
Size / Dimension: 0.453" L x 0.197" W (11.50mm x 5.00mm)
Load Capacitance: 10pF
Package / Case: HC-49/U
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MNS1N4568DUR-1/TR
MNS1N4568DUR-1/TR
Hersteller: Microchip Technology
Description: TEMPERATURE COMPENSATED
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: 0°C ~ 75°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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MNS1N4568DUR-1
MNS1N4568DUR-1
Hersteller: Microchip Technology
Description: TEMPERATURE COMPENSATED
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Packaging: Bulk
Produkt ist nicht verfügbar
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MPLAD18KP16AE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MPLAD18KP16AE3
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MPLAD18KP16A/TR
MPLAD18KP16A/TR
Hersteller: Microchip Technology
Description: SURFACE MOUNT 18,000 WATT, TVS,
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MPLAD18KP16CA MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MPLAD18KP16CA
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MPLAD18KP16CAE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MPLAD18KP16CAE3
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MAPLAD18KP16A MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MAPLAD18KP16A
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MAPLAD18KP16AE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MAPLAD18KP16AE3
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MAPLAD18KP16CA MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MAPLAD18KP16CA
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MAPLAD18KP16CAE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MAPLAD18KP16CAE3
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MPLAD18KP16A MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MPLAD18KP16A
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLPLAD18KP16A MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXLPLAD18KP16A
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLPLAD18KP16CA MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXLPLAD18KP16CA
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXPLAD18KP16A MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXPLAD18KP16A
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXPLAD18KP16CA MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXPLAD18KP16CA
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLPLAD18KP16AE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXLPLAD18KP16AE3
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLPLAD18KP16CAE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXLPLAD18KP16CAE3
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXPLAD18KP16AE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXPLAD18KP16AE3
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXPLAD18KP16CAE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXPLAD18KP16CAE3
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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CD4107 8362-cd4099-cd4135-datasheet
CD4107
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Current - Reverse Leakage @ Vr: 50 nA @ 9.87 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: Die
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: Die
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANTX1N4130DUR-1 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf
JANTX1N4130DUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 68V 500MW DO213AA
Current - Reverse Leakage @ Vr: 10 nA @ 51.7 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 700 Ohms
Voltage - Zener (Nom) (Vz): 68 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Packaging: Bulk
Qualification: MIL-PRF-19500/435
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JAN1N4130DUR-1 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf
JAN1N4130DUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 68V DO213AA
Qualification: MIL-PRF-19500/435
Current - Reverse Leakage @ Vr: 10 nA @ 51.7 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 700 Ohms
Voltage - Zener (Nom) (Vz): 68 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Packaging: Bulk
Produkt ist nicht verfügbar
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MXLSMLJ11CA 10563-msml-datasheet
MXLSMLJ11CA
Hersteller: Microchip Technology
Description: TVS DIODE 11VWM 18.2VC DO214AB
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 3000W (3kW)
Voltage - Clamping (Max) @ Ipp: 18.2V
Voltage - Breakdown (Min): 12.2V
Bidirectional Channels: 1
Supplier Device Package: DO-214AB
Voltage - Reverse Standoff (Typ): 11V
Current - Peak Pulse (10/1000µs): 164.8A
Applications: General Purpose
Produkt ist nicht verfügbar
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UMX9989AP/TR umx9989ap_datasheet.pdf
Hersteller: Microchip Technology
Description: SI PPIN HERMETIC MELF
Packaging: Tray
Package / Case: Module
Diode Type: PIN - Anti-Parallel
Operating Temperature: -65°C ~ 150°C
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
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UMX9989AP umx9989ap_datasheet.pdf
Hersteller: Microchip Technology
Description: SI PPIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: Module
Diode Type: PIN - Anti-Parallel
Operating Temperature: -65°C ~ 150°C
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
Produkt ist nicht verfügbar
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AT80C32X2-SLSUV AT80C32x2,AT87C52,TS80C32x2.pdf
AT80C32X2-SLSUV
Hersteller: Microchip Technology
Description: IC MCU 8BIT ROMLESS 44PLCC
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-PLCC (16.6x16.6)
Peripherals: POR
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Core Processor: 80C51
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Speed: 60/30MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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ATMEGA128RFA1-ZUR Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf
ATMEGA128RFA1-ZUR
Hersteller: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATMEGA128RFA1-ZUR Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf
ATMEGA128RFA1-ZUR
Hersteller: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
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AnzahlPreis
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TC1072-3.3VCH713 filehandler.aspx?ddocname=en011421
TC1072-3.3VCH713
Hersteller: Microchip Technology
Description: IC REG LINEAR 3.3V 50MA SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-6
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 64dB (1kHz)
Voltage Dropout (Max): 0.12V @ 50mA
Protection Features: Over Current, Over Temperature
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TC1072-3.3VCH713 filehandler.aspx?ddocname=en011421
TC1072-3.3VCH713
Hersteller: Microchip Technology
Description: IC REG LINEAR 3.3V 50MA SOT23-6
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-6
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 64dB (1kHz)
Voltage Dropout (Max): 0.12V @ 50mA
Protection Features: Over Current, Over Temperature
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AnzahlPreis
25+0.72 EUR
31+0.58 EUR
100+0.55 EUR
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2N5339 8813-lds-0011-datasheet
2N5339
Hersteller: Microchip Technology
Description: NPN TRANSISTOR
Power - Max: 1 W
Voltage - Collector Emitter Breakdown (Max): 100 V
Current - Collector (Ic) (Max): 5 A
Supplier Device Package: TO-39
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Current - Collector Cutoff (Max): 100µA
Vce Saturation (Max) @ Ib, Ic: 1.2V @ 500mA, 5A
Operating Temperature: -55°C ~ 200°C
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AD, TO-39-3 Metal Can
Packaging: Bulk
Produkt ist nicht verfügbar
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PD69210C-022319-TR
PD69210C-022319-TR
Hersteller: Microchip Technology
Description: MCU FOR PD692XX FAMILY, BASED PD
Packaging: Tray
Number of Channels: 8
Auxiliary Sense: Yes
Supplier Device Package: 32-QFN (5x5)
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Internal Switch(s): Yes
Voltage - Supply: 3V ~ 3.63V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Controller (PSE)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
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PD69210R-022320-TR
PD69210R-022320-TR
Hersteller: Microchip Technology
Description: MCU FOR PD692XX FAMILY, BASED PD
Number of Channels: 8
Auxiliary Sense: Yes
Supplier Device Package: 32-QFN (5x5)
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Internal Switch(s): Yes
Voltage - Supply: 3V ~ 3.63V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Controller (PSE)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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BM71BLES1FC2-0B05BA BM70-71-Bluetooth-Low-Energy-Module-DS60001372.pdf
Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Protocol: Bluetooth v4.2
Current - Receiving: 10mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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AnzahlPreis
2+13.99 EUR
25+12.8 EUR
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1N4678UR-1/TR 1N4678UR-1-1N4717UR-1.pdf
1N4678UR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 1.8V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 100 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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1N4678UR-1/TR 1N4678UR-1-1N4717UR-1.pdf
1N4678UR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 1.8V 500MW DO213AA
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 100 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
Produkt ist nicht verfügbar
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1N4678/TR 5827-1n4678-4717-datasheet
1N4678/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 1.8V 500MW DO204AH
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TA)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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