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AVR16EB32T-I/PT AVR16EB32T-I/PT Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 27
auf Bestellung 1484 Stücke:
Lieferzeit 10-14 Tag (e)
11+1.67 EUR
25+1.54 EUR
100+1.38 EUR
Mindestbestellmenge: 11
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AVR16EB28T-E/SS AVR16EB28T-E/SS Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
Produkt ist nicht verfügbar
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AVR16EB28T-E/SS AVR16EB28T-E/SS Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
auf Bestellung 1840 Stücke:
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11+1.71 EUR
25+1.55 EUR
100+1.41 EUR
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AVR16EB32T-E/RXB AVR16EB32T-E/RXB Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
Produkt ist nicht verfügbar
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AVR16EB32T-E/RXB AVR16EB32T-E/RXB Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
auf Bestellung 4970 Stücke:
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11+1.72 EUR
25+1.58 EUR
100+1.43 EUR
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LXS201-23-1 LXS201-23-1 Microchip Technology Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
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LXS201-23-1/TR LXS201-23-1/TR Microchip Technology Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
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JANKCA2N3636 JANKCA2N3636 Microchip Technology 14809-military-qualified-die-chip Description: TRANS PNP 175V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 175 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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JANKCA2N3634 JANKCA2N3634 Microchip Technology 14809-military-qualified-die-chip Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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JANKCA2N3635 JANKCA2N3635 Microchip Technology 14809-military-qualified-die-chip Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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UZ5114HR2 UZ5114HR2 Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 230 Ohms
Supplier Device Package: B, Axial
Power - Max: 5 W
Current - Reverse Leakage @ Vr: 5 µA @ 106 V
Produkt ist nicht verfügbar
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PIC32CK1025GC01064-I/3ZB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 1MB/256 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.32 EUR
25+7.57 EUR
100+6.88 EUR
Mindestbestellmenge: 3
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PIC32CK2051GC01064-I/3ZB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 144 Stücke:
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3+8.43 EUR
25+7.66 EUR
100+6.95 EUR
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PIC32CK1025GC01100-I/4SB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 1MB/256 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 87 Stücke:
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2+9.01 EUR
25+8.17 EUR
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PIC32CK2051GC01100-I/4SB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 90 Stücke:
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2+9.1 EUR
25+8.26 EUR
Mindestbestellmenge: 2
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PIC32CK2051GC01064-I/3ZB-SL3 PIC32CK2051GC01064-I/3ZB-SL3 Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 160 Stücke:
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3+7.52 EUR
25+6.83 EUR
100+6.21 EUR
Mindestbestellmenge: 3
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PIC32CK2051GC01100-I/4SB-SL3 PIC32CK2051GC01100-I/4SB-SL3 Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.27 EUR
25+7.5 EUR
Mindestbestellmenge: 3
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PIC32CK1025GC01144-I/4KB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 1MB/256 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 90 Stücke:
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2+11.02 EUR
25+10 EUR
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PIC32CK2051GC01144-I/4KB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.11 EUR
25+10.08 EUR
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PIC32CK2051GC01144-I/4KB-SL3 PIC32CK2051GC01144-I/4KB-SL3 Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 87 Stücke:
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2+10.49 EUR
25+9.53 EUR
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EV44P93A EV44P93A Microchip Technology e762da972dccf73b1c014138c174c6105ea4f226e4ad9402ac4fbd2e5d46ed16.pdf Description: PIC32CK GC01 CURIOSITY ULTRA
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32CK GC01
Platform: Curiosity Ultra
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
1+189.15 EUR
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CEC1736-S0-I/2ZW-PROTO2 Microchip Technology CEC173x_Data_Brief.pdf Description: 2-CHANNEL PFR WITH 4MB FLASH AND
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
auf Bestellung 532 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.42 EUR
25+17.86 EUR
100+17.23 EUR
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EEC1727-I/2GW EEC1727-I/2GW Microchip Technology EEC1727-Data-Sheet-DS00003840A.pdf Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tray
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
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2+13.02 EUR
25+10.86 EUR
100+10.5 EUR
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EEC1727-I/2GW-TR EEC1727-I/2GW-TR Microchip Technology EEC1727-Data-Sheet-DS00003840A.pdf Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tape & Reel (TR)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+10.69 EUR
Mindestbestellmenge: 3000
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EEC1727-I/2GW-TR EEC1727-I/2GW-TR Microchip Technology EEC1727-Data-Sheet-DS00003840A.pdf Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Cut Tape (CT)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
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2+13.27 EUR
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CEC1736-S0-I/2HW-PROTO2 Microchip Technology CEC173x_Data_Brief.pdf Description: MICROCONTROLLER
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 64-VFBGA (5.5x5.5)
Number of I/O: 52
auf Bestellung 358 Stücke:
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1+18.6 EUR
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DSPIC33AK512MPS506-I/PT DSPIC33AK512MPS506-I/PT Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 23x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 45
Qualification: AEC-Q100
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.88 EUR
25+4.44 EUR
100+4.03 EUR
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DSPIC33AK256MPS505T-I/M7 Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK256MPS505-I/M7 DSPIC33AK256MPS505-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 302 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.66 EUR
25+4.24 EUR
100+3.86 EUR
Mindestbestellmenge: 4
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DSPIC33AK256MPS506-I/M7 Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK512MPS506T-I/M7 Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK512MPS506-I/M7 Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505-I/PT Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS505-E/PT Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS508-E/PT Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505-E/M7 Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK256MPS508T-I/PT Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK512MPS508-E/PT Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505-I/M7 DSPIC33AK512MPS505-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 555 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.77 EUR
25+4.33 EUR
100+3.95 EUR
Mindestbestellmenge: 4
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DSPIC33AK256MPS505-E/M7 Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK256MPS508-I/PT Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS506-E/PT Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK512MPS508T-I/PT Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505T-I/PT Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK512MPS506-E/M7 Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK512MPS506-E/PT Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS505T-I/PT Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK256MPS506-I/PT Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505T-I/M7 Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK256MPS506-E/M7 Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK512MPS508-I/PT Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS505-I/PT Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505-E/PT Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS506T-I/M7 Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK256MPS506T-I/PT Microchip Technology Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK512MPS506T-I/PT Microchip Technology Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF200TLS-FCSG325I MPF200TLS-FCSG325I Microchip Technology 136519-ds0141-polarfire-fpga-datasheet Description: IC FPGA 170 I/O 325FPGA
Packaging: Tray
Package / Case: 325-LFBGA, FC
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 192000
Supplier Device Package: 325-FCBGA (11x14.5)
Total RAM Bits: 13619200
Number of I/O: 170
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+988.8 EUR
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M2GL050-FCSG325 M2GL050-FCSG325 Microchip Technology 132042-ds0128-igloo2-and-smartfusion2-datasheet Description: IC FPGA 200 I/O 324CSBGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 2.625V
Number of Logic Elements/Cells: 56340
Supplier Device Package: 325-FCBGA (11x11)
Total RAM Bits: 1869824
Number of I/O: 200
DigiKey Programmable: Not Verified
auf Bestellung 176 Stücke:
Lieferzeit 10-14 Tag (e)
1+132.25 EUR
25+123.45 EUR
100+120.24 EUR
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LM2576WU LM2576WU Microchip Technology lm2576.pdf Description: IC REG BUCK ADJ 3A TO263-5
Packaging: Tube
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Output (Max): 37V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 1.23V
auf Bestellung 398 Stücke:
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7+2.73 EUR
25+2.26 EUR
100+2.05 EUR
Mindestbestellmenge: 7
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MP6KE20A MP6KE20A Microchip Technology 9518-mp6ke-pdf Description: TVS DIODE 17.1VWM 27.7VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 22A
Voltage - Reverse Standoff (Typ): 17.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 27.7V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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AVR16EB32T-I/PT AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB32T-I/PT
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 27
auf Bestellung 1484 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.67 EUR
25+1.54 EUR
100+1.38 EUR
Mindestbestellmenge: 11
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AVR16EB28T-E/SS AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB28T-E/SS
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
Produkt ist nicht verfügbar
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AVR16EB28T-E/SS AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB28T-E/SS
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
auf Bestellung 1840 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.71 EUR
25+1.55 EUR
100+1.41 EUR
Mindestbestellmenge: 11
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AVR16EB32T-E/RXB AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB32T-E/RXB
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
Produkt ist nicht verfügbar
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AVR16EB32T-E/RXB AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB32T-E/RXB
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
auf Bestellung 4970 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.72 EUR
25+1.58 EUR
100+1.43 EUR
Mindestbestellmenge: 11
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LXS201-23-1
LXS201-23-1
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
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LXS201-23-1/TR
LXS201-23-1/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
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JANKCA2N3636 14809-military-qualified-die-chip
JANKCA2N3636
Hersteller: Microchip Technology
Description: TRANS PNP 175V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 175 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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JANKCA2N3634 14809-military-qualified-die-chip
JANKCA2N3634
Hersteller: Microchip Technology
Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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JANKCA2N3635 14809-military-qualified-die-chip
JANKCA2N3635
Hersteller: Microchip Technology
Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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UZ5114HR2
UZ5114HR2
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 230 Ohms
Supplier Device Package: B, Axial
Power - Max: 5 W
Current - Reverse Leakage @ Vr: 5 µA @ 106 V
Produkt ist nicht verfügbar
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PIC32CK1025GC01064-I/3ZB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
Hersteller: Microchip Technology
Description: M33 1MB/256 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.32 EUR
25+7.57 EUR
100+6.88 EUR
Mindestbestellmenge: 3
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PIC32CK2051GC01064-I/3ZB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
Hersteller: Microchip Technology
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 144 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.43 EUR
25+7.66 EUR
100+6.95 EUR
Mindestbestellmenge: 3
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PIC32CK1025GC01100-I/4SB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
Hersteller: Microchip Technology
Description: M33 1MB/256 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.01 EUR
25+8.17 EUR
Mindestbestellmenge: 2
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PIC32CK2051GC01100-I/4SB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
Hersteller: Microchip Technology
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.1 EUR
25+8.26 EUR
Mindestbestellmenge: 2
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PIC32CK2051GC01064-I/3ZB-SL3 PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK2051GC01064-I/3ZB-SL3
Hersteller: Microchip Technology
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.52 EUR
25+6.83 EUR
100+6.21 EUR
Mindestbestellmenge: 3
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PIC32CK2051GC01100-I/4SB-SL3 PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK2051GC01100-I/4SB-SL3
Hersteller: Microchip Technology
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.27 EUR
25+7.5 EUR
Mindestbestellmenge: 3
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PIC32CK1025GC01144-I/4KB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
Hersteller: Microchip Technology
Description: M33 1MB/256 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.02 EUR
25+10 EUR
Mindestbestellmenge: 2
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PIC32CK2051GC01144-I/4KB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
Hersteller: Microchip Technology
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.11 EUR
25+10.08 EUR
Mindestbestellmenge: 2
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PIC32CK2051GC01144-I/4KB-SL3 PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK2051GC01144-I/4KB-SL3
Hersteller: Microchip Technology
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.49 EUR
25+9.53 EUR
Mindestbestellmenge: 2
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EV44P93A e762da972dccf73b1c014138c174c6105ea4f226e4ad9402ac4fbd2e5d46ed16.pdf
EV44P93A
Hersteller: Microchip Technology
Description: PIC32CK GC01 CURIOSITY ULTRA
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32CK GC01
Platform: Curiosity Ultra
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+189.15 EUR
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CEC1736-S0-I/2ZW-PROTO2 CEC173x_Data_Brief.pdf
Hersteller: Microchip Technology
Description: 2-CHANNEL PFR WITH 4MB FLASH AND
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
auf Bestellung 532 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.42 EUR
25+17.86 EUR
100+17.23 EUR
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EEC1727-I/2GW EEC1727-Data-Sheet-DS00003840A.pdf
EEC1727-I/2GW
Hersteller: Microchip Technology
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tray
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.02 EUR
25+10.86 EUR
100+10.5 EUR
Mindestbestellmenge: 2
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EEC1727-I/2GW-TR EEC1727-Data-Sheet-DS00003840A.pdf
EEC1727-I/2GW-TR
Hersteller: Microchip Technology
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tape & Reel (TR)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+10.69 EUR
Mindestbestellmenge: 3000
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EEC1727-I/2GW-TR EEC1727-Data-Sheet-DS00003840A.pdf
EEC1727-I/2GW-TR
Hersteller: Microchip Technology
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Cut Tape (CT)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.27 EUR
25+11.05 EUR
100+10.69 EUR
Mindestbestellmenge: 2
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CEC1736-S0-I/2HW-PROTO2 CEC173x_Data_Brief.pdf
Hersteller: Microchip Technology
Description: MICROCONTROLLER
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 64-VFBGA (5.5x5.5)
Number of I/O: 52
auf Bestellung 358 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.6 EUR
25+15.49 EUR
100+14.97 EUR
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DSPIC33AK512MPS506-I/PT dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
DSPIC33AK512MPS506-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 23x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 45
Qualification: AEC-Q100
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.88 EUR
25+4.44 EUR
100+4.03 EUR
Mindestbestellmenge: 4
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DSPIC33AK256MPS505T-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK256MPS505-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
DSPIC33AK256MPS505-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 302 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.66 EUR
25+4.24 EUR
100+3.86 EUR
Mindestbestellmenge: 4
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DSPIC33AK256MPS506-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK512MPS506T-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK512MPS506-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS505-E/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS508-E/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505-E/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK256MPS508T-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK512MPS508-E/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
DSPIC33AK512MPS505-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 555 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.77 EUR
25+4.33 EUR
100+3.95 EUR
Mindestbestellmenge: 4
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DSPIC33AK256MPS505-E/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK256MPS508-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS506-E/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK512MPS508T-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505T-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK512MPS506-E/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK512MPS506-E/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS505T-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33AK256MPS506-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK512MPS505T-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSPIC33AK256MPS506-E/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK512MPS508-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS505-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSPIC33AK512MPS505-E/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Produkt ist nicht verfügbar
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DSPIC33AK256MPS506T-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSPIC33AK256MPS506T-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSPIC33AK512MPS506T-I/PT
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPF200TLS-FCSG325I 136519-ds0141-polarfire-fpga-datasheet
MPF200TLS-FCSG325I
Hersteller: Microchip Technology
Description: IC FPGA 170 I/O 325FPGA
Packaging: Tray
Package / Case: 325-LFBGA, FC
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 192000
Supplier Device Package: 325-FCBGA (11x14.5)
Total RAM Bits: 13619200
Number of I/O: 170
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+988.8 EUR
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M2GL050-FCSG325 132042-ds0128-igloo2-and-smartfusion2-datasheet
M2GL050-FCSG325
Hersteller: Microchip Technology
Description: IC FPGA 200 I/O 324CSBGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 2.625V
Number of Logic Elements/Cells: 56340
Supplier Device Package: 325-FCBGA (11x11)
Total RAM Bits: 1869824
Number of I/O: 200
DigiKey Programmable: Not Verified
auf Bestellung 176 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+132.25 EUR
25+123.45 EUR
100+120.24 EUR
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LM2576WU lm2576.pdf
LM2576WU
Hersteller: Microchip Technology
Description: IC REG BUCK ADJ 3A TO263-5
Packaging: Tube
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Output (Max): 37V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 1.23V
auf Bestellung 398 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.73 EUR
25+2.26 EUR
100+2.05 EUR
Mindestbestellmenge: 7
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MP6KE20A 9518-mp6ke-pdf
MP6KE20A
Hersteller: Microchip Technology
Description: TVS DIODE 17.1VWM 27.7VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 22A
Voltage - Reverse Standoff (Typ): 17.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 27.7V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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