Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (339334) > Seite 1833 nach 5656
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UZ5114HR2 | Microchip Technology |
Description: VOLTAGE REGULATOR Packaging: Bulk Tolerance: ±5% Package / Case: B, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 140 V Impedance (Max) (Zzt): 230 Ohms Supplier Device Package: B, Axial Power - Max: 5 W Current - Reverse Leakage @ Vr: 5 µA @ 106 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| PIC32CK1025GC01064-I/3ZB | Microchip Technology |
Description: M33 1MB/256 64 TQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 50 |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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| PIC32CK2051GC01064-I/3ZB | Microchip Technology |
Description: M33 2MB/512 64 TQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 50 |
auf Bestellung 144 Stücke: Lieferzeit 10-14 Tag (e) |
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| PIC32CK1025GC01100-I/4SB | Microchip Technology |
Description: M33 1MB/256 100 TQFPPackaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 72 |
auf Bestellung 87 Stücke: Lieferzeit 10-14 Tag (e) |
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| PIC32CK2051GC01100-I/4SB | Microchip Technology |
Description: M33 2MB/512 100 TQFPPackaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 72 |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32CK2051GC01064-I/3ZB-SL3 | Microchip Technology |
Description: M33 2MB/512 64 TQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 50 |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32CK2051GC01100-I/4SB-SL3 | Microchip Technology |
Description: M33 2MB/512 100 TQFPPackaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 72 |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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| PIC32CK1025GC01144-I/4KB | Microchip Technology |
Description: M33 1MB/256 144 TQFPPackaging: Tray Package / Case: 144-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 144-TQFP (16x16) Number of I/O: 108 |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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| PIC32CK2051GC01144-I/4KB | Microchip Technology |
Description: M33 2MB/512 144 TQFPPackaging: Tray Package / Case: 144-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 144-TQFP (16x16) Number of I/O: 108 |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32CK2051GC01144-I/4KB-SL3 | Microchip Technology |
Description: M33 2MB/512 144 TQFPPackaging: Tray Package / Case: 144-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 15x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT Supplier Device Package: 144-TQFP (16x16) Number of I/O: 108 |
auf Bestellung 87 Stücke: Lieferzeit 10-14 Tag (e) |
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EV44P93A | Microchip Technology |
Description: PIC32CK GC01 CURIOSITY ULTRAPackaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: PIC32 Utilized IC / Part: PIC32CK GC01 Platform: Curiosity Ultra |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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| CEC1736-S0-I/2ZW-PROTO2 | Microchip Technology |
Description: 2-CHANNEL PFR WITH 4MB FLASH ANDPackaging: Tray Package / Case: 84-WFBGA Mounting Type: Surface Mount RAM Size: 384K x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.465V Controller Series: CEC173X Program Memory Type: OTP (1kB) Core Processor: ARM® Cortex®-M4F Supplier Device Package: 84-WFBGA (7x7) Number of I/O: 71 |
auf Bestellung 532 Stücke: Lieferzeit 10-14 Tag (e) |
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EEC1727-I/2GW | Microchip Technology |
Description: EMBEDDED CONTROLLER, 416KB SRAM,Packaging: Tray Package / Case: 68-WFBGA Mounting Type: Surface Mount Interface: I2C, PWM, SMBus, SPI, UART RAM Size: 416K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.135V ~ 3.465V Controller Series: EEC1727 Program Memory Type: OTP (512B) Applications: Embedded Controller Core Processor: ARM® Cortex®-M4F Supplier Device Package: 68-WFBGA (6x6) Number of I/O: 55 DigiKey Programmable: Not Verified |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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EEC1727-I/2GW-TR | Microchip Technology |
Description: EMBEDDED CONTROLLER, 416KB SRAM,Packaging: Tape & Reel (TR) Package / Case: 68-WFBGA Mounting Type: Surface Mount Interface: I2C, PWM, SMBus, SPI, UART RAM Size: 416K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.135V ~ 3.465V Controller Series: EEC1727 Program Memory Type: OTP (512B) Applications: Embedded Controller Core Processor: ARM® Cortex®-M4F Supplier Device Package: 68-WFBGA (6x6) Number of I/O: 55 DigiKey Programmable: Not Verified |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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EEC1727-I/2GW-TR | Microchip Technology |
Description: EMBEDDED CONTROLLER, 416KB SRAM,Packaging: Cut Tape (CT) Package / Case: 68-WFBGA Mounting Type: Surface Mount Interface: I2C, PWM, SMBus, SPI, UART RAM Size: 416K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.135V ~ 3.465V Controller Series: EEC1727 Program Memory Type: OTP (512B) Applications: Embedded Controller Core Processor: ARM® Cortex®-M4F Supplier Device Package: 68-WFBGA (6x6) Number of I/O: 55 DigiKey Programmable: Not Verified |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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| CEC1736-S0-I/2HW-PROTO2 | Microchip Technology |
Description: MICROCONTROLLERPackaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Interface: I2C, PWM, SMBus, SPI, UART RAM Size: 384K x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.465V Controller Series: CEC173X Program Memory Type: OTP (1kB) Applications: Real Time Platform Root Core Processor: ARM® Cortex®-M4F Supplier Device Package: 64-VFBGA (5.5x5.5) Number of I/O: 52 |
auf Bestellung 358 Stücke: Lieferzeit 10-14 Tag (e) |
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DSPIC33AK512MPS506-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPLPackaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC33A Data Converters: A/D 23x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, QEI, SENT, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Grade: Automotive Number of I/O: 45 Qualification: AEC-Q100 |
auf Bestellung 393 Stücke: Lieferzeit 10-14 Tag (e) |
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| DSPIC33AK256MPS505T-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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DSPIC33AK256MPS505-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPLPackaging: Tube Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC33A Data Converters: A/D 18x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, QEI, SENT, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Grade: Automotive Number of I/O: 31 Qualification: AEC-Q100 |
auf Bestellung 302 Stücke: Lieferzeit 10-14 Tag (e) |
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| DSPIC33AK256MPS506-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS506T-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS506-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS505-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS505-E/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS508-E/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS505-E/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS508T-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS508-E/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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DSPIC33AK512MPS505-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPLPackaging: Tube Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC33A Data Converters: A/D 18x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, QEI, SENT, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Grade: Automotive Number of I/O: 31 Qualification: AEC-Q100 |
auf Bestellung 555 Stücke: Lieferzeit 10-14 Tag (e) |
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| DSPIC33AK256MPS505-E/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS508-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS506-E/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS508T-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS505T-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS506-E/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS506-E/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS505T-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS506-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS505T-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS506-E/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS508-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS505-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS505-E/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS506T-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK256MPS506T-I/PT | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSPIC33AK512MPS506T-I/PT | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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MPF200TLS-FCSG325I | Microchip Technology |
Description: IC FPGA 170 I/O 325FPGAPackaging: Tray Package / Case: 325-LFBGA, FC Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.08V Number of Logic Elements/Cells: 192000 Supplier Device Package: 325-FCBGA (11x14.5) Total RAM Bits: 13619200 Number of I/O: 170 DigiKey Programmable: Not Verified |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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M2GL050-FCSG325 | Microchip Technology |
Description: IC FPGA 200 I/O 324CSBGAPackaging: Tray Package / Case: 325-TFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 2.625V Number of Logic Elements/Cells: 56340 Supplier Device Package: 325-FCBGA (11x11) Total RAM Bits: 1869824 Number of I/O: 200 DigiKey Programmable: Not Verified |
auf Bestellung 176 Stücke: Lieferzeit 10-14 Tag (e) |
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LM2576WU | Microchip Technology |
Description: IC REG BUCK ADJ 3A TO263-5Packaging: Tube Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 3A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 52kHz Voltage - Input (Max): 40V Topology: Buck Supplier Device Package: TO-263-5 Synchronous Rectifier: No Voltage - Output (Max): 37V Voltage - Input (Min): 4V Voltage - Output (Min/Fixed): 1.23V |
auf Bestellung 673 Stücke: Lieferzeit 10-14 Tag (e) |
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MP6KE20A | Microchip Technology |
Description: TVS DIODE 17.1VWM 27.7VC T18Packaging: Bulk Package / Case: T-18, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 22A Voltage - Reverse Standoff (Typ): 17.1V Supplier Device Package: T-18 Unidirectional Channels: 1 Voltage - Breakdown (Min): 19V Voltage - Clamping (Max) @ Ipp: 27.7V Power - Peak Pulse: 600W Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| 2N5386 | Microchip Technology |
Description: TRANS PNP 80V 12A TO-61 Packaging: Bulk Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud Mounting Type: Stud Mount Transistor Type: PNP Operating Temperature: -65°C ~ 200°C (TJ) Supplier Device Package: TO-61 Current - Collector (Ic) (Max): 12 A Voltage - Collector Emitter Breakdown (Max): 80 V Power - Max: 50 W |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| JANTX1N6148A | Microchip Technology |
Description: TVS DIODE 13.7VWM 25.1VC C AXIALPackaging: Bulk Package / Case: G, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 59.8A Voltage - Reverse Standoff (Typ): 13.7V Supplier Device Package: C, Axial Bidirectional Channels: 1 Voltage - Breakdown (Min): 17.1V Voltage - Clamping (Max) @ Ipp: 25.1V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500/516 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
|
DSC1103CE2-200.0000T | Microchip Technology |
Description: MEMS OSC XO 200.0000MHZ LVDS SMDPackaging: Strip Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: LVDS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 200 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
|
DSC1103CE2-200.0000 | Microchip Technology |
Description: MEMS OSC XO 200.0000MHZ LVDS SMDPackaging: Strip Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: LVDS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 200 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
|
MIC2940A-12BU TR | Microchip Technology |
Description: IC REG LINEAR 12V 1.25A TO263-3Packaging: Tape & Reel (TR) Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA Output Type: Fixed Mounting Type: Surface Mount Current - Output: 1.25A Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 500 µA Voltage - Input (Max): 26V Number of Regulators: 1 Supplier Device Package: TO-263-3 Voltage - Output (Min/Fixed): 12V Voltage Dropout (Max): 0.6V @ 1.25A Protection Features: Over Current, Over Temperature, Reverse Polarity Current - Supply (Max): 70 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| VT-700-EAE-2060-13M0000000 | Microchip Technology |
Description: TCXO +3.3 VDC +/-5% CMOS -40C TOPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
|
|
UZ8710 | Microchip Technology |
Description: VOLTAGE REGULATOR Tolerance: ±5% Packaging: Bulk Package / Case: A, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 10 V Impedance (Max) (Zzt): 7 Ohms Supplier Device Package: A, Axial Power - Max: 1 W Current - Reverse Leakage @ Vr: 2 µA @ 7.6 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
|
|
JANTX1N4984DUS | Microchip Technology |
Description: DIODE ZENER 120V 5W D5BTolerance: ±1% Packaging: Bulk Package / Case: SQ-MELF, E Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 120 V Impedance (Max) (Zzt): 170 Ohms Supplier Device Package: D-5B Grade: Military Power - Max: 5 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A Current - Reverse Leakage @ Vr: 2 µA @ 91.2 V Qualification: MIL-PRF-19500/435 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
|
CDLL4739A/TR | Microchip Technology |
Description: VOLTAGE REGULATORTolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: DO-213AB, MELF Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 9.1 V Impedance (Max) (Zzt): 5 Ohms Supplier Device Package: DO-213AB Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 3 µA @ 7 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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|
SY55855VKG-TR | Microchip Technology |
Description: IC TRANSLATOR UNIDIR 10MSOPPackaging: Cut Tape (CT) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Output Type: Differential Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 1.5Gbps Supplier Device Package: 10-MSOP Channel Type: Unidirectional Output Signal: LVDS Translator Type: Mixed Signal Channels per Circuit: 2 Input Signal: CML, PECL, LVPECL Number of Circuits: 1 |
auf Bestellung 2443 Stücke: Lieferzeit 10-14 Tag (e) |
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| UZ5114HR2 |
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
Tolerance: ±5%
Package / Case: B, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 230 Ohms
Supplier Device Package: B, Axial
Power - Max: 5 W
Current - Reverse Leakage @ Vr: 5 µA @ 106 V
Description: VOLTAGE REGULATOR
Packaging: Bulk
Tolerance: ±5%
Package / Case: B, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 230 Ohms
Supplier Device Package: B, Axial
Power - Max: 5 W
Current - Reverse Leakage @ Vr: 5 µA @ 106 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32CK1025GC01064-I/3ZB |
![]() |
Hersteller: Microchip Technology
Description: M33 1MB/256 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
Description: M33 1MB/256 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.32 EUR |
| 25+ | 7.57 EUR |
| 100+ | 6.88 EUR |
| PIC32CK2051GC01064-I/3ZB |
![]() |
Hersteller: Microchip Technology
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 144 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.43 EUR |
| 25+ | 7.66 EUR |
| 100+ | 6.95 EUR |
| PIC32CK1025GC01100-I/4SB |
![]() |
Hersteller: Microchip Technology
Description: M33 1MB/256 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
Description: M33 1MB/256 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.01 EUR |
| 25+ | 8.17 EUR |
| PIC32CK2051GC01100-I/4SB |
![]() |
Hersteller: Microchip Technology
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.1 EUR |
| 25+ | 8.26 EUR |
| PIC32CK2051GC01064-I/3ZB-SL3 |
![]() |
Hersteller: Microchip Technology
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.52 EUR |
| 25+ | 6.83 EUR |
| 100+ | 6.21 EUR |
| PIC32CK2051GC01100-I/4SB-SL3 |
![]() |
Hersteller: Microchip Technology
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.27 EUR |
| 25+ | 7.5 EUR |
| PIC32CK1025GC01144-I/4KB |
![]() |
Hersteller: Microchip Technology
Description: M33 1MB/256 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
Description: M33 1MB/256 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.02 EUR |
| 25+ | 10 EUR |
| PIC32CK2051GC01144-I/4KB |
![]() |
Hersteller: Microchip Technology
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.11 EUR |
| 25+ | 10.08 EUR |
| PIC32CK2051GC01144-I/4KB-SL3 |
![]() |
Hersteller: Microchip Technology
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.49 EUR |
| 25+ | 9.53 EUR |
| EV44P93A |
![]() |
Hersteller: Microchip Technology
Description: PIC32CK GC01 CURIOSITY ULTRA
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32CK GC01
Platform: Curiosity Ultra
Description: PIC32CK GC01 CURIOSITY ULTRA
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32CK GC01
Platform: Curiosity Ultra
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 189.15 EUR |
| CEC1736-S0-I/2ZW-PROTO2 |
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Hersteller: Microchip Technology
Description: 2-CHANNEL PFR WITH 4MB FLASH AND
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
Description: 2-CHANNEL PFR WITH 4MB FLASH AND
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
auf Bestellung 532 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 21.42 EUR |
| 25+ | 17.86 EUR |
| 100+ | 17.23 EUR |
| EEC1727-I/2GW |
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Hersteller: Microchip Technology
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tray
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tray
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.02 EUR |
| 25+ | 10.86 EUR |
| 100+ | 10.5 EUR |
| EEC1727-I/2GW-TR |
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Hersteller: Microchip Technology
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tape & Reel (TR)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Tape & Reel (TR)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3000+ | 10.69 EUR |
| EEC1727-I/2GW-TR |
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Hersteller: Microchip Technology
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Cut Tape (CT)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: EMBEDDED CONTROLLER, 416KB SRAM,
Packaging: Cut Tape (CT)
Package / Case: 68-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 416K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: EEC1727
Program Memory Type: OTP (512B)
Applications: Embedded Controller
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 68-WFBGA (6x6)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.27 EUR |
| 25+ | 11.05 EUR |
| 100+ | 10.69 EUR |
| CEC1736-S0-I/2HW-PROTO2 |
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Hersteller: Microchip Technology
Description: MICROCONTROLLER
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 64-VFBGA (5.5x5.5)
Number of I/O: 52
Description: MICROCONTROLLER
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 64-VFBGA (5.5x5.5)
Number of I/O: 52
auf Bestellung 358 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 18.6 EUR |
| 25+ | 15.49 EUR |
| 100+ | 14.97 EUR |
| DSPIC33AK512MPS506-I/PT |
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Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 23x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 45
Qualification: AEC-Q100
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 23x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 45
Qualification: AEC-Q100
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 4.88 EUR |
| 25+ | 4.44 EUR |
| 100+ | 4.03 EUR |
| DSPIC33AK256MPS505T-I/M7 |
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSPIC33AK256MPS505-I/M7 |
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Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 302 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 4.66 EUR |
| 25+ | 4.24 EUR |
| 100+ | 3.86 EUR |
| DSPIC33AK512MPS506T-I/M7 |
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSPIC33AK256MPS508T-I/PT |
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSPIC33AK512MPS505-I/M7 |
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Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 555 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 4.77 EUR |
| 25+ | 4.33 EUR |
| 100+ | 3.95 EUR |
| DSPIC33AK512MPS508T-I/PT |
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSPIC33AK512MPS505T-I/PT |
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSPIC33AK256MPS505T-I/PT |
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSPIC33AK512MPS505T-I/M7 |
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSPIC33AK256MPS506T-I/M7 |
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSPIC33AK256MPS506T-I/PT |
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSPIC33AK512MPS506T-I/PT |
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPF200TLS-FCSG325I |
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Hersteller: Microchip Technology
Description: IC FPGA 170 I/O 325FPGA
Packaging: Tray
Package / Case: 325-LFBGA, FC
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 192000
Supplier Device Package: 325-FCBGA (11x14.5)
Total RAM Bits: 13619200
Number of I/O: 170
DigiKey Programmable: Not Verified
Description: IC FPGA 170 I/O 325FPGA
Packaging: Tray
Package / Case: 325-LFBGA, FC
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 192000
Supplier Device Package: 325-FCBGA (11x14.5)
Total RAM Bits: 13619200
Number of I/O: 170
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 988.8 EUR |
| M2GL050-FCSG325 |
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Hersteller: Microchip Technology
Description: IC FPGA 200 I/O 324CSBGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 2.625V
Number of Logic Elements/Cells: 56340
Supplier Device Package: 325-FCBGA (11x11)
Total RAM Bits: 1869824
Number of I/O: 200
DigiKey Programmable: Not Verified
Description: IC FPGA 200 I/O 324CSBGA
Packaging: Tray
Package / Case: 325-TFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 2.625V
Number of Logic Elements/Cells: 56340
Supplier Device Package: 325-FCBGA (11x11)
Total RAM Bits: 1869824
Number of I/O: 200
DigiKey Programmable: Not Verified
auf Bestellung 176 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 132.25 EUR |
| 25+ | 123.45 EUR |
| 100+ | 120.24 EUR |
| LM2576WU |
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Hersteller: Microchip Technology
Description: IC REG BUCK ADJ 3A TO263-5
Packaging: Tube
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Output (Max): 37V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 1.23V
Description: IC REG BUCK ADJ 3A TO263-5
Packaging: Tube
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Output (Max): 37V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 1.23V
auf Bestellung 673 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 7+ | 2.68 EUR |
| 25+ | 2.22 EUR |
| 100+ | 2.02 EUR |
| MP6KE20A |
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Hersteller: Microchip Technology
Description: TVS DIODE 17.1VWM 27.7VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 22A
Voltage - Reverse Standoff (Typ): 17.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 27.7V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 17.1VWM 27.7VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 22A
Voltage - Reverse Standoff (Typ): 17.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 27.7V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 2N5386 |
Hersteller: Microchip Technology
Description: TRANS PNP 80V 12A TO-61
Packaging: Bulk
Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud
Mounting Type: Stud Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Supplier Device Package: TO-61
Current - Collector (Ic) (Max): 12 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 50 W
Description: TRANS PNP 80V 12A TO-61
Packaging: Bulk
Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud
Mounting Type: Stud Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Supplier Device Package: TO-61
Current - Collector (Ic) (Max): 12 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 50 W
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JANTX1N6148A |
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Hersteller: Microchip Technology
Description: TVS DIODE 13.7VWM 25.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.8A
Voltage - Reverse Standoff (Typ): 13.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Description: TVS DIODE 13.7VWM 25.1VC C AXIAL
Packaging: Bulk
Package / Case: G, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.8A
Voltage - Reverse Standoff (Typ): 13.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSC1103CE2-200.0000T |
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Hersteller: Microchip Technology
Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSC1103CE2-200.0000 |
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Hersteller: Microchip Technology
Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
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| MIC2940A-12BU TR |
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Hersteller: Microchip Technology
Description: IC REG LINEAR 12V 1.25A TO263-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1.25A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 500 µA
Voltage - Input (Max): 26V
Number of Regulators: 1
Supplier Device Package: TO-263-3
Voltage - Output (Min/Fixed): 12V
Voltage Dropout (Max): 0.6V @ 1.25A
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 70 mA
Description: IC REG LINEAR 12V 1.25A TO263-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1.25A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 500 µA
Voltage - Input (Max): 26V
Number of Regulators: 1
Supplier Device Package: TO-263-3
Voltage - Output (Min/Fixed): 12V
Voltage Dropout (Max): 0.6V @ 1.25A
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 70 mA
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| VT-700-EAE-2060-13M0000000 |
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Hersteller: Microchip Technology
Description: TCXO +3.3 VDC +/-5% CMOS -40C TO
Packaging: Tape & Reel (TR)
Description: TCXO +3.3 VDC +/-5% CMOS -40C TO
Packaging: Tape & Reel (TR)
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| UZ8710 |
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: A, Axial
Power - Max: 1 W
Current - Reverse Leakage @ Vr: 2 µA @ 7.6 V
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: A, Axial
Power - Max: 1 W
Current - Reverse Leakage @ Vr: 2 µA @ 7.6 V
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| JANTX1N4984DUS |
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Hersteller: Microchip Technology
Description: DIODE ZENER 120V 5W D5B
Tolerance: ±1%
Packaging: Bulk
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 120 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: D-5B
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 91.2 V
Qualification: MIL-PRF-19500/435
Description: DIODE ZENER 120V 5W D5B
Tolerance: ±1%
Packaging: Bulk
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 120 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: D-5B
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 91.2 V
Qualification: MIL-PRF-19500/435
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| CDLL4739A/TR |
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Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AB
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 7 V
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AB
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 7 V
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| SY55855VKG-TR |
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Hersteller: Microchip Technology
Description: IC TRANSLATOR UNIDIR 10MSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 1.5Gbps
Supplier Device Package: 10-MSOP
Channel Type: Unidirectional
Output Signal: LVDS
Translator Type: Mixed Signal
Channels per Circuit: 2
Input Signal: CML, PECL, LVPECL
Number of Circuits: 1
Description: IC TRANSLATOR UNIDIR 10MSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 1.5Gbps
Supplier Device Package: 10-MSOP
Channel Type: Unidirectional
Output Signal: LVDS
Translator Type: Mixed Signal
Channels per Circuit: 2
Input Signal: CML, PECL, LVPECL
Number of Circuits: 1
auf Bestellung 2443 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.99 EUR |
| 25+ | 11.67 EUR |
| 100+ | 10.6 EUR |













