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VT-704-EFE-5070-40M0000000 Microchip Technology VT-704.pdf Description: TCXO +3.3 VDC +/-5% CLIPPED SINE
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GC4491-115-2 Microchip Technology Description: SI PIN HERMETIC MICROSTRIP
Packaging: Tray
Package / Case: Module
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.25pF @ 50V, 1MHz
Resistance @ If, F: 1.2Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 750V
Current - Max: 50 mA
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GC4750-42 Microchip Technology Description: SI LIMITER HERMETIC STUD
Packaging: Bag
Package / Case: Stud
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.25pF @ 50V, 1MHz
Resistance @ If, F: 3Ohm @ 50mA, 100MHz
Voltage - Peak Reverse (Max): 250V
Power Dissipation (Max): 50 W
Produkt ist nicht verfügbar
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KV3201 KV3201 Microchip Technology Description: SI TVAR NON HERMETIC CHIP
Packaging: Bulk
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Diode Type: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 2.3pF @ 25V, 1MHz
Q @ Vr, F: 415 @ 3V, 50MHz
Supplier Device Package: DO-34
Voltage - Peak Reverse (Max): 30 V
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DSC1103CL5-212.5000T DSC1103CL5-212.5000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: OSC MEMS LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
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DSC1123DL5-212.5000T DSC1123DL5-212.5000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 212.5000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
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DSC1123DL5-212.5000 DSC1123DL5-212.5000 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 212.5000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
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DSC1103CL5-212.5000T DSC1103CL5-212.5000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: OSC MEMS LVDS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
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DSC1103CL5-212.5000 DSC1103CL5-212.5000 Microchip Technology Description: OSC MEMS LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
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PLA133-67OAVAO PLA133-67OAVAO Microchip Technology PLA133-67-Low-Power-DC-to-160MHz-1-6-Fanout-Buffer-IC-for-Automotive-DS20006358C.pdf Description: IC FANOUT BUFFER 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 150MHz
Type: Fanout Buffer (Distribution)
Input: LVCMOS
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.71V ~ 3.63V
Ratio - Input:Output: 1:6
Differential - Input:Output: No/No
Supplier Device Package: 16-TSSOP
PLL: No
Divider/Multiplier: No/No
Grade: Automotive
Number of Circuits: 1
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MUPT12 MUPT12 Microchip Technology Description: TVS DIODE 12VWM 21.6VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.94A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.8V
Voltage - Clamping (Max) @ Ipp: 21.6V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
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MUPT12E3 MUPT12E3 Microchip Technology Description: TVS DIODE 12VWM 21.6VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.94A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.8V
Voltage - Clamping (Max) @ Ipp: 21.6V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
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MUPT5E3 MUPT5E3 Microchip Technology Description: TVS DIODE 5VWM 9.5VC POWERMITE 1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 15.7A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
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MUPTB5E3 MUPTB5E3 Microchip Technology Description: TVS DIODE 5VWM 9.5VC POWERMITE 1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 15.7A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: Powermite 1 (DO216-AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
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MUPTB5E3/TR MUPTB5E3/TR Microchip Technology Description: UNI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 15.7A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: Powermite 1 (DO216-AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V
Power - Peak Pulse: 150W
Power Line Protection: No
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NX2147CMTR NX2147CMTR Microchip Technology 10592-nx2147ds-pdf Description: IC REG CTRLR BUCK MLPQ-16L
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -10°C ~ 100°C (TA)
Output Configuration: Positive
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 22V
Supplier Device Package: 16-MLPQ (4x4)
Synchronous Rectifier: Yes
Control Features: Enable, On Time Control
Output Phases: 1
Clock Sync: No
Number of Outputs: 1
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NX2147CMTR NX2147CMTR Microchip Technology 10592-nx2147ds-pdf Description: IC REG CTRLR BUCK MLPQ-16L
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -10°C ~ 100°C (TA)
Output Configuration: Positive
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 22V
Supplier Device Package: 16-MLPQ (4x4)
Synchronous Rectifier: Yes
Control Features: Enable, On Time Control
Output Phases: 1
Clock Sync: No
Number of Outputs: 1
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NX9415CMTR NX9415CMTR Microchip Technology 133687-nx9415-datasheet.pdf Description: IC REG BUCK ADJ 5A 24MCM
Voltage - Output (Min/Fixed): 0.8V
Voltage - Input (Min): 9V
Voltage - Output (Max): 15.62V
Synchronous Rectifier: Yes
Supplier Device Package: 24-MCM (4x4)
Topology: Buck
Voltage - Input (Max): 22V
Frequency - Switching: 200kHz ~ 2.2MHz
Output Configuration: Positive
Operating Temperature: 0°C ~ 70°C (TA)
Current - Output: 5A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 24-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
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NX9415CMTR NX9415CMTR Microchip Technology 133687-nx9415-datasheet.pdf Description: IC REG BUCK ADJ 5A 24MCM
Voltage - Output (Min/Fixed): 0.8V
Voltage - Input (Min): 9V
Voltage - Output (Max): 15.62V
Synchronous Rectifier: Yes
Supplier Device Package: 24-MCM (4x4)
Topology: Buck
Voltage - Input (Max): 22V
Frequency - Switching: 200kHz ~ 2.2MHz
Output Configuration: Positive
Operating Temperature: 0°C ~ 70°C (TA)
Current - Output: 5A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 24-VQFN Exposed Pad
Packaging: Cut Tape (CT)
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MP6KE200A MP6KE200A Microchip Technology rf01007_rb.pdf Description: TVS DIODE 171VWM 274VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 2.2A
Voltage - Reverse Standoff (Typ): 171V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 274V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32MZ2064DAB288-I/4J PIC32MZ2064DAB288-I/4J Microchip Technology PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf Description: IC MCU 32BIT 2MB FLASH 288LFBGA
Packaging: Tray
Package / Case: 288-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 288-LFBGA (15x15)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PM8310A-FEI PM8310A-FEI Microchip Technology PM8310A-FEI.pdf Description: IC TELECOM INTERFACE
Packaging: Tray
Package / Case: 896-BGA, FCBGA
Mounting Type: Surface Mount
Function: Framer
Interface: 4-Wire, Serial, TDM
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 896-FCBGA (31x31)
Number of Circuits: 1
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MCP3912A1T-E/SSVAO MCP3912A1T-E/SSVAO Microchip Technology MCP3912-3V-Four-Channel-Analog-Front-End-DS20005348C.pdf Description: FOUR CHANNEL ENERGY METER FRONT
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 16, 24
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 2.7V ~ 3.6V
Supplier Device Package: 28-SSOP
Number of Channels: 4
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MCP3912A1-E/SSVAO MCP3912A1-E/SSVAO Microchip Technology MCP3912-3V-Four-Channel-Analog-Front-End-DS20005348C.pdf Description: FOUR CHANNEL ENERGY METER FRONT
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 16, 24
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 2.7V ~ 3.6V
Supplier Device Package: 28-SSOP
Number of Channels: 4
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EV45V72A Microchip Technology Description: BOARD EVAL
Packaging: Bulk
Number of Bits: 18
Contents: Board(s)
Data Interface: I2C
Sampling Rate (Per Second): 240
Utilized IC / Part: MCP3422
Supplied Contents: Board(s)
Number of A/D Converters: 2
Input Range: ±VREF
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1N6050A 1N6050A Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 25VWM 41.4VC DO13
Packaging: Bulk
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 36A
Voltage - Reverse Standoff (Typ): 25V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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MCP1792T-3302H/DBVAO MCP1792T-3302H/DBVAO Microchip Technology MCP1792-Family-Data-Sheet-DS20006229D.pdf Description: IC REG LIN 3.3V 100MA SOT-223-3
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 150°C (TA)
Output Configuration: Positive
Current - Quiescent (Iq): 45 µA
Voltage - Input (Max): 55V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3.3V
Grade: Automotive
PSRR: 80dB ~ 55dB (100Hz ~ 100kHz)
Voltage Dropout (Max): 1.2V @ 100mA
Protection Features: Over Current, Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Current - Supply (Max): 150 µA
Qualification: AEC-Q100
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MCP1792T-5002H/DBVAO MCP1792T-5002H/DBVAO Microchip Technology MCP1792-Family-Data-Sheet-DS20006229D.pdf Description: IC REG LINEAR 5V 100MA SOT-223-3
Qualification: AEC-Q100
Current - Supply (Max): 150 µA
Protection Features: Over Current, Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Voltage Dropout (Max): 0.25V @ 100mA
PSRR: 80dB ~ 55dB (100Hz ~ 100kHz)
Grade: Automotive
Control Features: Shutdown
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: SOT-223-3
Number of Regulators: 1
Voltage - Input (Max): 55V
Current - Quiescent (Iq): 45 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 150°C (TA)
Current - Output: 100mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: TO-261-4, TO-261AA
Packaging: Cut Tape (CT)
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AVR16EB32T-E/PT AVR16EB32T-E/PT Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 27
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AVR16EB32T-E/PT AVR16EB32T-E/PT Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 27
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EV73J36A EV73J36A Microchip Technology AVR16EB32-CNANO-UserGuide-DS50003605.pdf Description: AVR16EB32-CNANO
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: AVR
Utilized IC / Part: AVR16EB32
Platform: Curiosity Nano
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AVR16EB20T-I/REB AVR16EB20T-I/REB Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AVR16EB28T-I/STX AVR16EB28T-I/STX Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 23
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AVR16EB20T-E/REB AVR16EB20T-E/REB Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AVR16EB28T-E/STX AVR16EB28T-E/STX Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 23
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AVR16EB28T-I/SS AVR16EB28T-I/SS Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AVR16EB32T-I/RXB AVR16EB32T-I/RXB Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AVR16EB32T-I/PT AVR16EB32T-I/PT Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 27
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1600 Stücke
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AVR16EB32T-I/PT AVR16EB32T-I/PT Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 27
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AVR16EB28T-E/SS AVR16EB28T-E/SS Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2100 Stücke
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AVR16EB28T-E/SS AVR16EB28T-E/SS Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AVR16EB32T-E/RXB AVR16EB32T-E/RXB Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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AVR16EB32T-E/RXB AVR16EB32T-E/RXB Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
Produkt ist nicht verfügbar
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LXS201-23-1 LXS201-23-1 Microchip Technology Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
 Mindestbestellmenge: 500 Stücke
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LXS201-23-1/TR LXS201-23-1/TR Microchip Technology Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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JANKCA2N3636 JANKCA2N3636 Microchip Technology 14809-military-qualified-die-chip Description: TRANS PNP 175V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 175 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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JANKCA2N3634 JANKCA2N3634 Microchip Technology 14809-military-qualified-die-chip Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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JANKCA2N3635 JANKCA2N3635 Microchip Technology 14809-military-qualified-die-chip Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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UZ5114HR2 UZ5114HR2 Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 230 Ohms
Supplier Device Package: B, Axial
Power - Max: 5 W
Current - Reverse Leakage @ Vr: 5 µA @ 106 V
Produkt ist nicht verfügbar
 Mindestbestellmenge: 100 Stücke
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PIC32CK1025GC01064-I/3ZB PIC32CK1025GC01064-I/3ZB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 1MB/256 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
Produkt ist nicht verfügbar
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PIC32CK2051GC01064-I/3ZB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 144 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.43 EUR
25+7.66 EUR
100+6.95 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
PIC32CK1025GC01100-I/4SB PIC32CK1025GC01100-I/4SB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 1MB/256 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.67 EUR
Mindestbestellmenge: 4 Stücke
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PIC32CK2051GC01100-I/4SB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.1 EUR
25+8.26 EUR
Mindestbestellmenge: 2 Stücke
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PIC32CK2051GC01064-I/3ZB-SL3 PIC32CK2051GC01064-I/3ZB-SL3 Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.52 EUR
25+6.83 EUR
100+6.21 EUR
Mindestbestellmenge: 3 Stücke
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PIC32CK2051GC01100-I/4SB-SL3 PIC32CK2051GC01100-I/4SB-SL3 Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.27 EUR
25+7.5 EUR
Mindestbestellmenge: 3 Stücke
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PIC32CK1025GC01144-I/4KB PIC32CK1025GC01144-I/4KB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 1MB/256 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.27 EUR
Mindestbestellmenge: 3 Stücke
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PIC32CK2051GC01144-I/4KB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
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PIC32CK2051GC01144-I/4KB-SL3 PIC32CK2051GC01144-I/4KB-SL3 Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
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EV44P93A EV44P93A Microchip Technology e762da972dccf73b1c014138c174c6105ea4f226e4ad9402ac4fbd2e5d46ed16.pdf Description: PIC32CK GC01 CURIOSITY ULTRA
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32CK GC01
Platform: Curiosity Ultra
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CEC1736-S0-I/2ZW-PROTO2 Microchip Technology CEC173x_Data_Brief.pdf Description: 2-CHANNEL PFR WITH 4MB FLASH AND
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
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25+17.86 EUR
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VT-704-EFE-5070-40M0000000 VT-704.pdf
Hersteller: Microchip Technology
Description: TCXO +3.3 VDC +/-5% CLIPPED SINE
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GC4491-115-2
Hersteller: Microchip Technology
Description: SI PIN HERMETIC MICROSTRIP
Packaging: Tray
Package / Case: Module
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.25pF @ 50V, 1MHz
Resistance @ If, F: 1.2Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 750V
Current - Max: 50 mA
Produkt ist nicht verfügbar
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GC4750-42
Hersteller: Microchip Technology
Description: SI LIMITER HERMETIC STUD
Packaging: Bag
Package / Case: Stud
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.25pF @ 50V, 1MHz
Resistance @ If, F: 3Ohm @ 50mA, 100MHz
Voltage - Peak Reverse (Max): 250V
Power Dissipation (Max): 50 W
Produkt ist nicht verfügbar
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KV3201
KV3201
Hersteller: Microchip Technology
Description: SI TVAR NON HERMETIC CHIP
Packaging: Bulk
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Diode Type: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 2.3pF @ 25V, 1MHz
Q @ Vr, F: 415 @ 3V, 50MHz
Supplier Device Package: DO-34
Voltage - Peak Reverse (Max): 30 V
Produkt ist nicht verfügbar
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DSC1103CL5-212.5000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103CL5-212.5000T
Hersteller: Microchip Technology
Description: OSC MEMS LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1123DL5-212.5000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123DL5-212.5000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 212.5000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1123DL5-212.5000 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123DL5-212.5000
Hersteller: Microchip Technology
Description: MEMS OSC XO 212.5000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1103CL5-212.5000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103CL5-212.5000T
Hersteller: Microchip Technology
Description: OSC MEMS LVDS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1103CL5-212.5000
DSC1103CL5-212.5000
Hersteller: Microchip Technology
Description: OSC MEMS LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PLA133-67OAVAO PLA133-67-Low-Power-DC-to-160MHz-1-6-Fanout-Buffer-IC-for-Automotive-DS20006358C.pdf
PLA133-67OAVAO
Hersteller: Microchip Technology
Description: IC FANOUT BUFFER 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 150MHz
Type: Fanout Buffer (Distribution)
Input: LVCMOS
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.71V ~ 3.63V
Ratio - Input:Output: 1:6
Differential - Input:Output: No/No
Supplier Device Package: 16-TSSOP
PLL: No
Divider/Multiplier: No/No
Grade: Automotive
Number of Circuits: 1
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 288 Stücke:
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AnzahlPreis
2+11.16 EUR
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MUPT12
MUPT12
Hersteller: Microchip Technology
Description: TVS DIODE 12VWM 21.6VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.94A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.8V
Voltage - Clamping (Max) @ Ipp: 21.6V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MUPT12E3
MUPT12E3
Hersteller: Microchip Technology
Description: TVS DIODE 12VWM 21.6VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.94A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.8V
Voltage - Clamping (Max) @ Ipp: 21.6V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MUPT5E3
MUPT5E3
Hersteller: Microchip Technology
Description: TVS DIODE 5VWM 9.5VC POWERMITE 1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 15.7A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MUPTB5E3
MUPTB5E3
Hersteller: Microchip Technology
Description: TVS DIODE 5VWM 9.5VC POWERMITE 1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 15.7A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: Powermite 1 (DO216-AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MUPTB5E3/TR
MUPTB5E3/TR
Hersteller: Microchip Technology
Description: UNI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 15.7A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: Powermite 1 (DO216-AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V
Power - Peak Pulse: 150W
Power Line Protection: No
Produkt ist nicht verfügbar
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NX2147CMTR 10592-nx2147ds-pdf
NX2147CMTR
Hersteller: Microchip Technology
Description: IC REG CTRLR BUCK MLPQ-16L
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -10°C ~ 100°C (TA)
Output Configuration: Positive
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 22V
Supplier Device Package: 16-MLPQ (4x4)
Synchronous Rectifier: Yes
Control Features: Enable, On Time Control
Output Phases: 1
Clock Sync: No
Number of Outputs: 1
Produkt ist nicht verfügbar
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NX2147CMTR 10592-nx2147ds-pdf
NX2147CMTR
Hersteller: Microchip Technology
Description: IC REG CTRLR BUCK MLPQ-16L
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -10°C ~ 100°C (TA)
Output Configuration: Positive
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 22V
Supplier Device Package: 16-MLPQ (4x4)
Synchronous Rectifier: Yes
Control Features: Enable, On Time Control
Output Phases: 1
Clock Sync: No
Number of Outputs: 1
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6+3.36 EUR
10+2.49 EUR
25+2.27 EUR
100+2.03 EUR
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NX9415CMTR 133687-nx9415-datasheet.pdf
NX9415CMTR
Hersteller: Microchip Technology
Description: IC REG BUCK ADJ 5A 24MCM
Voltage - Output (Min/Fixed): 0.8V
Voltage - Input (Min): 9V
Voltage - Output (Max): 15.62V
Synchronous Rectifier: Yes
Supplier Device Package: 24-MCM (4x4)
Topology: Buck
Voltage - Input (Max): 22V
Frequency - Switching: 200kHz ~ 2.2MHz
Output Configuration: Positive
Operating Temperature: 0°C ~ 70°C (TA)
Current - Output: 5A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 24-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX9415CMTR 133687-nx9415-datasheet.pdf
NX9415CMTR
Hersteller: Microchip Technology
Description: IC REG BUCK ADJ 5A 24MCM
Voltage - Output (Min/Fixed): 0.8V
Voltage - Input (Min): 9V
Voltage - Output (Max): 15.62V
Synchronous Rectifier: Yes
Supplier Device Package: 24-MCM (4x4)
Topology: Buck
Voltage - Input (Max): 22V
Frequency - Switching: 200kHz ~ 2.2MHz
Output Configuration: Positive
Operating Temperature: 0°C ~ 70°C (TA)
Current - Output: 5A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 24-VQFN Exposed Pad
Packaging: Cut Tape (CT)
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7+2.85 EUR
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MP6KE200A rf01007_rb.pdf
MP6KE200A
Hersteller: Microchip Technology
Description: TVS DIODE 171VWM 274VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 2.2A
Voltage - Reverse Standoff (Typ): 171V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 190V
Voltage - Clamping (Max) @ Ipp: 274V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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PIC32MZ2064DAB288-I/4J PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf
PIC32MZ2064DAB288-I/4J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 288LFBGA
Packaging: Tray
Package / Case: 288-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 288-LFBGA (15x15)
Number of I/O: 120
DigiKey Programmable: Not Verified
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1+36.36 EUR
25+33.35 EUR
100+30.16 EUR
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PM8310A-FEI PM8310A-FEI.pdf
PM8310A-FEI
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE
Packaging: Tray
Package / Case: 896-BGA, FCBGA
Mounting Type: Surface Mount
Function: Framer
Interface: 4-Wire, Serial, TDM
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 896-FCBGA (31x31)
Number of Circuits: 1
Produkt ist nicht verfügbar
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MCP3912A1T-E/SSVAO MCP3912-3V-Four-Channel-Analog-Front-End-DS20005348C.pdf
MCP3912A1T-E/SSVAO
Hersteller: Microchip Technology
Description: FOUR CHANNEL ENERGY METER FRONT
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 16, 24
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 2.7V ~ 3.6V
Supplier Device Package: 28-SSOP
Number of Channels: 4
Produkt ist nicht verfügbar
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MCP3912A1-E/SSVAO MCP3912-3V-Four-Channel-Analog-Front-End-DS20005348C.pdf
MCP3912A1-E/SSVAO
Hersteller: Microchip Technology
Description: FOUR CHANNEL ENERGY METER FRONT
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 16, 24
Voltage - Supply, Analog: 2.7V ~ 3.6V
Voltage - Supply, Digital: 2.7V ~ 3.6V
Supplier Device Package: 28-SSOP
Number of Channels: 4
Produkt ist nicht verfügbar
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EV45V72A
Hersteller: Microchip Technology
Description: BOARD EVAL
Packaging: Bulk
Number of Bits: 18
Contents: Board(s)
Data Interface: I2C
Sampling Rate (Per Second): 240
Utilized IC / Part: MCP3422
Supplied Contents: Board(s)
Number of A/D Converters: 2
Input Range: ±VREF
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1+24.8 EUR
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1N6050A 8923-lds-0097-datasheet
1N6050A
Hersteller: Microchip Technology
Description: TVS DIODE 25VWM 41.4VC DO13
Packaging: Bulk
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 36A
Voltage - Reverse Standoff (Typ): 25V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MCP1792T-3302H/DBVAO MCP1792-Family-Data-Sheet-DS20006229D.pdf
MCP1792T-3302H/DBVAO
Hersteller: Microchip Technology
Description: IC REG LIN 3.3V 100MA SOT-223-3
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 150°C (TA)
Output Configuration: Positive
Current - Quiescent (Iq): 45 µA
Voltage - Input (Max): 55V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3.3V
Grade: Automotive
PSRR: 80dB ~ 55dB (100Hz ~ 100kHz)
Voltage Dropout (Max): 1.2V @ 100mA
Protection Features: Over Current, Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Current - Supply (Max): 150 µA
Qualification: AEC-Q100
auf Bestellung 3252 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
12+1.57 EUR
25+1.3 EUR
100+1.16 EUR
Mindestbestellmenge: 12 Stücke
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MCP1792T-5002H/DBVAO MCP1792-Family-Data-Sheet-DS20006229D.pdf
MCP1792T-5002H/DBVAO
Hersteller: Microchip Technology
Description: IC REG LINEAR 5V 100MA SOT-223-3
Qualification: AEC-Q100
Current - Supply (Max): 150 µA
Protection Features: Over Current, Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Voltage Dropout (Max): 0.25V @ 100mA
PSRR: 80dB ~ 55dB (100Hz ~ 100kHz)
Grade: Automotive
Control Features: Shutdown
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: SOT-223-3
Number of Regulators: 1
Voltage - Input (Max): 55V
Current - Quiescent (Iq): 45 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 150°C (TA)
Current - Output: 100mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: TO-261-4, TO-261AA
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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AVR16EB32T-E/PT AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB32T-E/PT
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 27
Produkt ist nicht verfügbar
Mindestbestellmenge: 1600 Stücke
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AVR16EB32T-E/PT AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB32T-E/PT
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 27
Produkt ist nicht verfügbar
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EV73J36A AVR16EB32-CNANO-UserGuide-DS50003605.pdf
EV73J36A
Hersteller: Microchip Technology
Description: AVR16EB32-CNANO
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: AVR
Utilized IC / Part: AVR16EB32
Platform: Curiosity Nano
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+24.83 EUR
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AVR16EB20T-I/REB AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB20T-I/REB
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
Produkt ist nicht verfügbar
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AVR16EB28T-I/STX AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB28T-I/STX
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 23
Produkt ist nicht verfügbar
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AVR16EB20T-E/REB AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB20T-E/REB
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
Produkt ist nicht verfügbar
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AVR16EB28T-E/STX AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB28T-E/STX
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 23
Produkt ist nicht verfügbar
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AVR16EB28T-I/SS AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB28T-I/SS
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
Produkt ist nicht verfügbar
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AVR16EB32T-I/RXB AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB32T-I/RXB
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
Produkt ist nicht verfügbar
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AVR16EB32T-I/PT AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB32T-I/PT
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 27
Produkt ist nicht verfügbar
Mindestbestellmenge: 1600 Stücke
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AVR16EB32T-I/PT AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB32T-I/PT
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 27
Produkt ist nicht verfügbar
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AVR16EB28T-E/SS AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB28T-E/SS
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
Produkt ist nicht verfügbar
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AVR16EB28T-E/SS AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB28T-E/SS
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 20x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 23
Produkt ist nicht verfügbar
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AVR16EB32T-E/RXB AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB32T-E/RXB
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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AVR16EB32T-E/RXB AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB32T-E/RXB
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 27
Produkt ist nicht verfügbar
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LXS201-23-1
LXS201-23-1
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
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LXS201-23-1/TR
LXS201-23-1/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY NON HERMETIC SMT
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.3pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 3V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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JANKCA2N3636 14809-military-qualified-die-chip
JANKCA2N3636
Hersteller: Microchip Technology
Description: TRANS PNP 175V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 175 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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JANKCA2N3634 14809-military-qualified-die-chip
JANKCA2N3634
Hersteller: Microchip Technology
Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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JANKCA2N3635 14809-military-qualified-die-chip
JANKCA2N3635
Hersteller: Microchip Technology
Description: TRANS PNP 140V 1A TO39
Packaging: Tape & Reel (TR)
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 140 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/357
Produkt ist nicht verfügbar
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UZ5114HR2
UZ5114HR2
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 230 Ohms
Supplier Device Package: B, Axial
Power - Max: 5 W
Current - Reverse Leakage @ Vr: 5 µA @ 106 V
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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PIC32CK1025GC01064-I/3ZB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025GC01064-I/3ZB
Hersteller: Microchip Technology
Description: M33 1MB/256 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
Produkt ist nicht verfügbar
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PIC32CK2051GC01064-I/3ZB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
Hersteller: Microchip Technology
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 144 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.43 EUR
25+7.66 EUR
100+6.95 EUR
Mindestbestellmenge: 3 Stücke
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PIC32CK1025GC01100-I/4SB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025GC01100-I/4SB
Hersteller: Microchip Technology
Description: M33 1MB/256 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.67 EUR
Mindestbestellmenge: 4 Stücke
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PIC32CK2051GC01100-I/4SB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
Hersteller: Microchip Technology
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.1 EUR
25+8.26 EUR
Mindestbestellmenge: 2 Stücke
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PIC32CK2051GC01064-I/3ZB-SL3 PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK2051GC01064-I/3ZB-SL3
Hersteller: Microchip Technology
Description: M33 2MB/512 64 TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 50
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.52 EUR
25+6.83 EUR
100+6.21 EUR
Mindestbestellmenge: 3 Stücke
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PIC32CK2051GC01100-I/4SB-SL3 PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK2051GC01100-I/4SB-SL3
Hersteller: Microchip Technology
Description: M33 2MB/512 100 TQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 72
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.27 EUR
25+7.5 EUR
Mindestbestellmenge: 3 Stücke
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PIC32CK1025GC01144-I/4KB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025GC01144-I/4KB
Hersteller: Microchip Technology
Description: M33 1MB/256 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.27 EUR
Mindestbestellmenge: 3 Stücke
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PIC32CK2051GC01144-I/4KB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
Hersteller: Microchip Technology
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+11.11 EUR
25+10.08 EUR
Mindestbestellmenge: 2 Stücke
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PIC32CK2051GC01144-I/4KB-SL3 PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK2051GC01144-I/4KB-SL3
Hersteller: Microchip Technology
Description: M33 2MB/512 144 TQFP
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, IR, LVD, LVR, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 108
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+10.49 EUR
25+9.53 EUR
Mindestbestellmenge: 2 Stücke
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EV44P93A e762da972dccf73b1c014138c174c6105ea4f226e4ad9402ac4fbd2e5d46ed16.pdf
EV44P93A
Hersteller: Microchip Technology
Description: PIC32CK GC01 CURIOSITY ULTRA
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32CK GC01
Platform: Curiosity Ultra
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+189.15 EUR
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CEC1736-S0-I/2ZW-PROTO2 CEC173x_Data_Brief.pdf
Hersteller: Microchip Technology
Description: 2-CHANNEL PFR WITH 4MB FLASH AND
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
auf Bestellung 532 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+21.42 EUR
25+17.86 EUR
100+17.23 EUR
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