Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (358248) > Seite 1858 nach 5971
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MCP1790T-3002E/DB | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: TO-261-4, TO-261AA Output Type: Fixed Mounting Type: Surface Mount Current - Output: 70mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 130 µA Voltage - Input (Max): 30V Number of Regulators: 1 Supplier Device Package: SOT-223-3 Voltage - Output (Min/Fixed): 3V PSRR: 90dB ~ 80dB (100Hz ~ 1kHz) Voltage Dropout (Max): 1.3V @ 70mA Protection Features: Over Temperature, Short Circuit Current - Supply (Max): 210 µA |
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SA50-28-5-15T-C-P | Microchip Technology |
![]() Packaging: Bulk Package / Case: Module Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm) Mounting Type: Chassis Mount Type: Isolated Module Operating Temperature: -55°C ~ 125°C Applications: ITE (Commercial) Voltage - Input (Max): 40V Efficiency: 84% Current - Output (Max): 4A Voltage - Input (Min): 20V Voltage - Output 1: 5V Power (Watts): 15 W Number of Outputs: 1 |
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SA50-28-3R3-12T-C-P | Microchip Technology |
![]() Packaging: Bulk Package / Case: Module Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm) Mounting Type: Chassis Mount Type: Isolated Module Operating Temperature: -55°C ~ 125°C Applications: ITE (Commercial) Voltage - Input (Max): 40V Efficiency: 84% Current - Output (Max): 4A Voltage - Input (Min): 20V Voltage - Output 1: 3.3V Power (Watts): 15 W Number of Outputs: 1 |
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SA50-28-5-12T-C-P | Microchip Technology |
![]() Packaging: Bulk Package / Case: Module Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm) Mounting Type: Chassis Mount Type: Isolated Module Operating Temperature: -55°C ~ 125°C Applications: ITE (Commercial) Voltage - Input (Max): 40V Efficiency: 84% Current - Output (Max): 4A Voltage - Input (Min): 20V Voltage - Output 1: 5V Power (Watts): 15 W Number of Outputs: 1 |
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SA50-28-3R3-15T-C-P | Microchip Technology |
![]() Packaging: Bulk Package / Case: Module Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm) Mounting Type: Chassis Mount Type: Isolated Module Operating Temperature: -55°C ~ 125°C Applications: ITE (Commercial) Voltage - Input (Max): 40V Efficiency: 84% Current - Output (Max): 4A Voltage - Input (Min): 20V Voltage - Output 1: 3.3V Power (Watts): 18 W Number of Outputs: 1 |
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VCC6-VCD-163M840000 | Microchip Technology |
![]() Packaging: Tape & Reel (TR) |
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VCC1-B1D-100M000000 | Microchip Technology |
![]() Packaging: Tape & Reel (TR) |
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EV11K09A | Microchip Technology |
![]() Packaging: Bulk For Use With/Related Products: PIC32CXMTG Frequency: 200MHz Type: Transceiver; Bluetooth® 5.x (BLE) Supplied Contents: Board(s), Cable(s) Contents: Board(s), Cable(s) Utilized IC / Part: PIC32CXMTG |
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ATSAM4LC2AA-AUR | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-TQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 3x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 48-TQFP (7x7) Number of I/O: 27 DigiKey Programmable: Not Verified |
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ATSAM4LC2AA-AUR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 48-TQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 3x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 48-TQFP (7x7) Number of I/O: 27 DigiKey Programmable: Not Verified |
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ATSAM4LS4AA-AUR | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-TQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 3x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-TQFP (7x7) Number of I/O: 32 DigiKey Programmable: Not Verified |
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ATSAM4LS4AA-AUR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 48-TQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 3x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-TQFP (7x7) Number of I/O: 32 DigiKey Programmable: Not Verified |
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ATSAM4LC4AA-AUR | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-TQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 3x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 48-TQFP (7x7) Number of I/O: 27 DigiKey Programmable: Not Verified |
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ATSAM4LC4AA-AUR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 48-TQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 3x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 48-TQFP (7x7) Number of I/O: 27 DigiKey Programmable: Not Verified |
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ATSAM4LC2AA-AU | Microchip Technology |
![]() Packaging: Tray Package / Case: 48-TQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 3x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 48-TQFP (7x7) Number of I/O: 27 DigiKey Programmable: Not Verified |
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VT-841-JFE-507A-40M0000000 | Microchip Technology |
Description: OSCILLATOR CMOS SMD Packaging: Tape & Reel (TR) Package / Case: 4-SMD, No Lead Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: Clipped Sine Wave Type: TCXO Operating Temperature: -40°C ~ 85°C Frequency Stability: ±500ppb Voltage - Supply: 1.8V Current - Supply (Max): 2.5mA Height - Seated (Max): 0.035" (0.90mm) Absolute Pull Range (APR): ±5ppm Frequency: 40 MHz Base Resonator: Crystal |
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VCC6-VCC-106M250000 | Microchip Technology |
![]() Packaging: Tape & Reel (TR) |
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VCC4-F3F-66M0000000 | Microchip Technology |
![]() Packaging: Tape & Reel (TR) |
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MIC2537-2BM | Microchip Technology |
![]() Features: Slew Rate Controlled, Status Flag Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 425mOhm Input Type: Non-Inverting Voltage - Load: 3V ~ 5.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 150mA Ratio - Input:Output: 1:4 Supplier Device Package: 16-SOIC Fault Protection: Current Limiting (Fixed), Over Temperature |
auf Bestellung 2723 Stücke: Lieferzeit 10-14 Tag (e) |
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MIC2042-1BTS | Microchip Technology |
![]() Features: Slew Rate Controlled, Status Flag Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: General Purpose Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 40mOhm Input Type: Non-Inverting Voltage - Load: 0.8V ~ 5.5V Voltage - Supply (Vcc/Vdd): 1.6V ~ 5.5V Current - Output (Max): 3A Ratio - Input:Output: 1:1 Supplier Device Package: 14-TSSOP Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, UVLO |
auf Bestellung 1812 Stücke: Lieferzeit 10-14 Tag (e) |
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UES706R | Microchip Technology |
Description: DIODE GEN PURP 400V 20A DO203AA Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Stud Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 50 ns Technology: Standard, Reverse Polarity Current - Average Rectified (Io): 20A Supplier Device Package: DO-203AA (DO-4) Voltage - DC Reverse (Vr) (Max): 400 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 20 A |
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1N5803 | Microchip Technology |
![]() Packaging: Bulk Package / Case: A, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 25 ns Technology: Standard Capacitance @ Vr, F: 25pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: A, Axial Operating Temperature - Junction: -65°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 75 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A Current - Reverse Leakage @ Vr: 1 µA @ 75 V |
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1N5803/TR | Microchip Technology |
Description: DIODE GEN PURP 75V 1A Packaging: Tape & Reel (TR) Package / Case: A, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 25 ns Technology: Standard Capacitance @ Vr, F: 25pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: A, Axial Operating Temperature - Junction: -65°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 75 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A Current - Reverse Leakage @ Vr: 1 µA @ 75 V |
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1N5803E3 | Microchip Technology |
Description: DIODE GEN PURP 80V 1A AXIAL Packaging: Bulk Package / Case: Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 25 ns Technology: Standard Capacitance @ Vr, F: 25pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: Axial Operating Temperature - Junction: -65°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 80 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A Current - Reverse Leakage @ Vr: 1 µA @ 75 V |
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1N5803E3/TR | Microchip Technology |
Description: DIODE GEN PURP REV 80V 1A AXIAL Packaging: Tape & Reel (TR) Package / Case: Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 25 ns Technology: Standard, Reverse Polarity Capacitance @ Vr, F: 25pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: Axial Operating Temperature - Junction: -65°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 80 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A Current - Reverse Leakage @ Vr: 1 µA @ 75 V |
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1N5803US | Microchip Technology |
Description: DIODE GEN PURP 80V 1A D-5A Packaging: Bulk Package / Case: SQ-MELF, A Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 25 ns Technology: Standard Capacitance @ Vr, F: 25pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: D-5A Operating Temperature - Junction: -65°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 80 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A Current - Reverse Leakage @ Vr: 1 µA @ 75 V |
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1N5803US/TR | Microchip Technology |
Description: DIODE GEN PURP 80V 1A D-5A Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, A Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 25 ns Technology: Standard Capacitance @ Vr, F: 25pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: D-5A Operating Temperature - Junction: -65°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 80 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A Current - Reverse Leakage @ Vr: 1 µA @ 75 V |
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MIC24054YJL-TR | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 28-PowerVQFN Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 9A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 600kHz Voltage - Input (Max): 19V Topology: Buck Supplier Device Package: 28-QFN (5x6) Synchronous Rectifier: Yes Voltage - Output (Max): 5.5V Voltage - Input (Min): 4.5V Voltage - Output (Min/Fixed): 0.8V |
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MIC24054YJL-TR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 28-PowerVQFN Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 9A Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Positive Frequency - Switching: 600kHz Voltage - Input (Max): 19V Topology: Buck Supplier Device Package: 28-QFN (5x6) Synchronous Rectifier: Yes Voltage - Output (Max): 5.5V Voltage - Input (Min): 4.5V Voltage - Output (Min/Fixed): 0.8V |
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UES1106SM | Microchip Technology |
Description: DIODE GEN PURP 400V 2A A SQ-MELF Packaging: Bulk Package / Case: SQ-MELF, A Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 50 ns Technology: Standard Current - Average Rectified (Io): 2A Supplier Device Package: A, SQ-MELF Voltage - DC Reverse (Vr) (Max): 400 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A |
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UES1106SM-1 | Microchip Technology |
Description: DIODE GEN PURP 400V 2A A SQ-MELF Packaging: Bulk Package / Case: SQ-MELF, A Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 50 ns Technology: Standard Current - Average Rectified (Io): 2A Supplier Device Package: A, SQ-MELF Operating Temperature - Junction: -55°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 400 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A Current - Reverse Leakage @ Vr: 10 µA @ 400 V |
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UES1106SM/TR | Microchip Technology |
Description: DIODE GEN PURP 400V 2A A SQ-MELF Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, A Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 50 ns Technology: Standard Current - Average Rectified (Io): 2A Supplier Device Package: A, SQ-MELF Voltage - DC Reverse (Vr) (Max): 400 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A |
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UES1106SM-1/TR | Microchip Technology |
Description: DIODE GEN PURP 400V 2A A SQ-MELF Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, A Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 50 ns Technology: Standard Current - Average Rectified (Io): 2A Supplier Device Package: A, SQ-MELF Operating Temperature - Junction: -55°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 400 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A Current - Reverse Leakage @ Vr: 10 µA @ 400 V |
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VC-709-ECE-KAAN-125M000000 | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 6-SMD, No Lead Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±50ppm Voltage - Supply: 3.3V Current - Supply (Max): 45mA Height - Seated (Max): 0.067" (1.70mm) Frequency: 125 MHz Base Resonator: Crystal |
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VC-709-HDE-FAAN-125M000000 | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 6-SMD, No Lead Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVDS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.5V Current - Supply (Max): 14mA Height - Seated (Max): 0.067" (1.70mm) Frequency: 125 MHz Base Resonator: Crystal |
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VV-701-EAW-KNAB-10M0000000 | Microchip Technology |
![]() Packaging: Tape & Reel (TR) |
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JANTXV1N5531BUR-1 | Microchip Technology |
![]() Tolerance: ±5% Packaging: Bulk Package / Case: DO-213AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 11 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: DO-213AA Grade: Military Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V Qualification: MIL-PRF-19500/437 |
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DSC1101AE3-084.6720T | Microchip Technology |
![]() Packaging: Strip Package / Case: 6-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±20ppm Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 35mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 84.672 MHz Base Resonator: MEMS |
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AT28C256-90JI | Microchip Technology |
![]() Packaging: Tube Package / Case: 32-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 256Kbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TC) Voltage - Supply: 4.5V ~ 5.5V Technology: EEPROM Memory Format: EEPROM Supplier Device Package: 32-PLCC (13.97x11.43) Write Cycle Time - Word, Page: 10ms Memory Interface: Parallel Access Time: 90 ns Memory Organization: 32K x 8 DigiKey Programmable: Not Verified |
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DSC6011MI2A-000.0000T | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 4-VFLGA Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm) Mounting Type: Surface Mount Output: CMOS Function: Standby Programmable Type: Blank (User Must Program) Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 1.3mA (Typ) Height - Seated (Max): 0.035" (0.89mm) Frequency Stability (Total): ±25ppm Available Frequency Range: 1 MHz ~ 80 MHz Base Resonator: MEMS |
auf Bestellung 988 Stücke: Lieferzeit 10-14 Tag (e) |
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PD39210C-010019-TR | Microchip Technology |
Description: MCU FOR PD392XX FAMILY, BASED PD Packaging: Tape & Reel (TR) |
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SY88307BLEY | Microchip Technology |
![]() Packaging: Tube Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 10-MSOP-EP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MIC5282-5.0YMM-TR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Fixed Mounting Type: Surface Mount Current - Output: 50mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 11 µA Voltage - Input (Max): 120V Number of Regulators: 1 Supplier Device Package: 8-MSOP Voltage - Output (Min/Fixed): 5V PSRR: 90dB ~ 65dB (40kHz ~ 1kHz) Voltage Dropout (Max): 3V @ 50mA Protection Features: Over Current, Over Temperature |
auf Bestellung 2179 Stücke: Lieferzeit 10-14 Tag (e) |
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MIC2225-G4YMT-TR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 10-UFDFN, 10-TMLF® Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Frequency - Switching: 2MHz Topology: Step-Down (Buck) (1), Linear (LDO) (1) Supplier Device Package: 10-TMLF® (2x2) Voltage/Current - Output 1: 1.8V, 600mA Voltage/Current - Output 2: 1.2V, 300mA w/LED Driver: No w/Supervisor: No w/Sequencer: No Number of Outputs: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MIC2225-GFYMT-TR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 10-UFDFN, 10-TMLF® Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Frequency - Switching: 2MHz Topology: Step-Down (Buck) (1), Linear (LDO) (1) Supplier Device Package: 10-TMLF® (2x2) Voltage/Current - Output 1: 1.8V, 600mA Voltage/Current - Output 2: 1.5V, 300mA w/LED Driver: No w/Supervisor: No w/Sequencer: No Number of Outputs: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MIC2225-GJYMT-TR | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 10-UFDFN, 10-TMLF® Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Frequency - Switching: 2MHz Topology: Step-Down (Buck) (1), Linear (LDO) (1) Supplier Device Package: 10-TMLF® (2x2) Voltage/Current - Output 1: 1.8V, 600mA Voltage/Current - Output 2: 2.5V, 300mA w/LED Driver: No w/Supervisor: No w/Sequencer: No Number of Outputs: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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EV12F76A | Microchip Technology |
![]() Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: dsPIC33CK Supplied Contents: Board(s) Primary Attributes: Motors (BLDC) Embedded: Yes, DSC |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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DSC1221CI3-24M57600 | Microchip Technology |
Description: OSC MEMS LOW PWR LVCMOS Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±20ppm Voltage - Supply: 2.25V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 27mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 24.576 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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DSC1224DI1-100M0000 | Microchip Technology |
Description: OSC MEMS HCSL SMD Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: HCSL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 40mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 100 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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DSC1222NI1-50M00000 | Microchip Technology |
Description: OSC MEMS LVPECL SMD Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 50mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 50 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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DSC1223CI2-180M0000 | Microchip Technology |
![]() Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: LVDS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 180 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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DSC1223BI2-50M00000 | Microchip Technology |
Description: OSC MEMS LVDS SMD Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: LVDS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 85°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 32mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 50 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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ATA6625C-GAQW | Microchip Technology |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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ATA6625C-GAQW | Microchip Technology |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N1612 | Microchip Technology |
![]() Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Stud Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 5A Supplier Device Package: DO-4 (DO-203AA) Operating Temperature - Junction: -65°C ~ 200°C Voltage - DC Reverse (Vr) (Max): 50 V Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A Current - Reverse Leakage @ Vr: 10 µA @ 50 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N1612A | Microchip Technology |
![]() Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Stud Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 5A Supplier Device Package: DO-4 (DO-203AA) Operating Temperature - Junction: -65°C ~ 200°C Voltage - DC Reverse (Vr) (Max): 50 V Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A Current - Reverse Leakage @ Vr: 10 µA @ 50 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N1612R | Microchip Technology |
![]() Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Stud Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard, Reverse Polarity Current - Average Rectified (Io): 7A Supplier Device Package: DO-4 (DO-203AA) Operating Temperature - Junction: -65°C ~ 200°C Voltage - DC Reverse (Vr) (Max): 50 V Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A Current - Reverse Leakage @ Vr: 10 µA @ 50 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
1N1671 | Microchip Technology |
![]() Packaging: Bulk Package / Case: DO-205AB, DO-9, Stud Mounting Type: Stud Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 275A Supplier Device Package: DO-205AB (DO-9) Operating Temperature - Junction: -65°C ~ 190°C Voltage - DC Reverse (Vr) (Max): 100 V Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A Current - Reverse Leakage @ Vr: 75 µA @ 100 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
1N1672 | Microchip Technology |
![]() Packaging: Bulk Package / Case: DO-205AB, DO-9, Stud Mounting Type: Stud Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 275A Supplier Device Package: DO-205AB (DO-9) Operating Temperature - Junction: -65°C ~ 190°C Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A Current - Reverse Leakage @ Vr: 75 µA @ 150 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
1N1670 | Microchip Technology |
![]() Packaging: Bulk Package / Case: DO-205AB, DO-9, Stud Mounting Type: Stud Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 275A Supplier Device Package: DO-205AB (DO-9) Operating Temperature - Junction: -65°C ~ 190°C Voltage - DC Reverse (Vr) (Max): 50 V Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A Current - Reverse Leakage @ Vr: 75 µA @ 50 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
MCP1790T-3002E/DB |
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Hersteller: Microchip Technology
Description: IC REG LINEAR 3V 70MA SOT-223-3
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 70mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 130 µA
Voltage - Input (Max): 30V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3V
PSRR: 90dB ~ 80dB (100Hz ~ 1kHz)
Voltage Dropout (Max): 1.3V @ 70mA
Protection Features: Over Temperature, Short Circuit
Current - Supply (Max): 210 µA
Description: IC REG LINEAR 3V 70MA SOT-223-3
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 70mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 130 µA
Voltage - Input (Max): 30V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3V
PSRR: 90dB ~ 80dB (100Hz ~ 1kHz)
Voltage Dropout (Max): 1.3V @ 70mA
Protection Features: Over Temperature, Short Circuit
Current - Supply (Max): 210 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SA50-28-5-15T-C-P |
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Hersteller: Microchip Technology
Description: POWER CONVERTER, 28V INPUT, TRIP
Packaging: Bulk
Package / Case: Module
Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm)
Mounting Type: Chassis Mount
Type: Isolated Module
Operating Temperature: -55°C ~ 125°C
Applications: ITE (Commercial)
Voltage - Input (Max): 40V
Efficiency: 84%
Current - Output (Max): 4A
Voltage - Input (Min): 20V
Voltage - Output 1: 5V
Power (Watts): 15 W
Number of Outputs: 1
Description: POWER CONVERTER, 28V INPUT, TRIP
Packaging: Bulk
Package / Case: Module
Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm)
Mounting Type: Chassis Mount
Type: Isolated Module
Operating Temperature: -55°C ~ 125°C
Applications: ITE (Commercial)
Voltage - Input (Max): 40V
Efficiency: 84%
Current - Output (Max): 4A
Voltage - Input (Min): 20V
Voltage - Output 1: 5V
Power (Watts): 15 W
Number of Outputs: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SA50-28-3R3-12T-C-P |
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Hersteller: Microchip Technology
Description: POWER CONVERTER, 28V INPUT, TRIP
Packaging: Bulk
Package / Case: Module
Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm)
Mounting Type: Chassis Mount
Type: Isolated Module
Operating Temperature: -55°C ~ 125°C
Applications: ITE (Commercial)
Voltage - Input (Max): 40V
Efficiency: 84%
Current - Output (Max): 4A
Voltage - Input (Min): 20V
Voltage - Output 1: 3.3V
Power (Watts): 15 W
Number of Outputs: 1
Description: POWER CONVERTER, 28V INPUT, TRIP
Packaging: Bulk
Package / Case: Module
Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm)
Mounting Type: Chassis Mount
Type: Isolated Module
Operating Temperature: -55°C ~ 125°C
Applications: ITE (Commercial)
Voltage - Input (Max): 40V
Efficiency: 84%
Current - Output (Max): 4A
Voltage - Input (Min): 20V
Voltage - Output 1: 3.3V
Power (Watts): 15 W
Number of Outputs: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SA50-28-5-12T-C-P |
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Hersteller: Microchip Technology
Description: POWER CONVERTER, 28V INPUT, TRIP
Packaging: Bulk
Package / Case: Module
Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm)
Mounting Type: Chassis Mount
Type: Isolated Module
Operating Temperature: -55°C ~ 125°C
Applications: ITE (Commercial)
Voltage - Input (Max): 40V
Efficiency: 84%
Current - Output (Max): 4A
Voltage - Input (Min): 20V
Voltage - Output 1: 5V
Power (Watts): 15 W
Number of Outputs: 1
Description: POWER CONVERTER, 28V INPUT, TRIP
Packaging: Bulk
Package / Case: Module
Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm)
Mounting Type: Chassis Mount
Type: Isolated Module
Operating Temperature: -55°C ~ 125°C
Applications: ITE (Commercial)
Voltage - Input (Max): 40V
Efficiency: 84%
Current - Output (Max): 4A
Voltage - Input (Min): 20V
Voltage - Output 1: 5V
Power (Watts): 15 W
Number of Outputs: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SA50-28-3R3-15T-C-P |
![]() |
Hersteller: Microchip Technology
Description: POWER CONVERTER, 28V INPUT, TRIP
Packaging: Bulk
Package / Case: Module
Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm)
Mounting Type: Chassis Mount
Type: Isolated Module
Operating Temperature: -55°C ~ 125°C
Applications: ITE (Commercial)
Voltage - Input (Max): 40V
Efficiency: 84%
Current - Output (Max): 4A
Voltage - Input (Min): 20V
Voltage - Output 1: 3.3V
Power (Watts): 18 W
Number of Outputs: 1
Description: POWER CONVERTER, 28V INPUT, TRIP
Packaging: Bulk
Package / Case: Module
Size / Dimension: 3.05" L x 2.05" W x 0.50" H (77.5mm x 52.1mm x 12.7mm)
Mounting Type: Chassis Mount
Type: Isolated Module
Operating Temperature: -55°C ~ 125°C
Applications: ITE (Commercial)
Voltage - Input (Max): 40V
Efficiency: 84%
Current - Output (Max): 4A
Voltage - Input (Min): 20V
Voltage - Output 1: 3.3V
Power (Watts): 18 W
Number of Outputs: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
VCC6-VCD-163M840000 |
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Hersteller: Microchip Technology
Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
VCC1-B1D-100M000000 |
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Hersteller: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EV11K09A |
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Hersteller: Microchip Technology
Description: PIC32CXMTG-EK
Packaging: Bulk
For Use With/Related Products: PIC32CXMTG
Frequency: 200MHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s), Cable(s)
Contents: Board(s), Cable(s)
Utilized IC / Part: PIC32CXMTG
Description: PIC32CXMTG-EK
Packaging: Bulk
For Use With/Related Products: PIC32CXMTG
Frequency: 200MHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s), Cable(s)
Contents: Board(s), Cable(s)
Utilized IC / Part: PIC32CXMTG
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATSAM4LC2AA-AUR |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 27
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 27
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATSAM4LC2AA-AUR |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 27
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 27
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATSAM4LS4AA-AUR |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ATSAM4LS4AA-AUR |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATSAM4LC4AA-AUR |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 27
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 27
DigiKey Programmable: Not Verified
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ATSAM4LC4AA-AUR |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 27
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 27
DigiKey Programmable: Not Verified
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ATSAM4LC2AA-AU |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 27
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.68V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 27
DigiKey Programmable: Not Verified
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VT-841-JFE-507A-40M0000000 |
Hersteller: Microchip Technology
Description: OSCILLATOR CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: Clipped Sine Wave
Type: TCXO
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±500ppb
Voltage - Supply: 1.8V
Current - Supply (Max): 2.5mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±5ppm
Frequency: 40 MHz
Base Resonator: Crystal
Description: OSCILLATOR CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: Clipped Sine Wave
Type: TCXO
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±500ppb
Voltage - Supply: 1.8V
Current - Supply (Max): 2.5mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±5ppm
Frequency: 40 MHz
Base Resonator: Crystal
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VCC6-VCC-106M250000 |
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Hersteller: Microchip Technology
Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
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VCC4-F3F-66M0000000 |
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Hersteller: Microchip Technology
Description: CMOS XO +3.3 VDC 50PF -40C TO +8
Packaging: Tape & Reel (TR)
Description: CMOS XO +3.3 VDC 50PF -40C TO +8
Packaging: Tape & Reel (TR)
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MIC2537-2BM |
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Hersteller: Microchip Technology
Description: QUAD POWER DISTRIBUTION SWITCH
Features: Slew Rate Controlled, Status Flag
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 425mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 150mA
Ratio - Input:Output: 1:4
Supplier Device Package: 16-SOIC
Fault Protection: Current Limiting (Fixed), Over Temperature
Description: QUAD POWER DISTRIBUTION SWITCH
Features: Slew Rate Controlled, Status Flag
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 425mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 150mA
Ratio - Input:Output: 1:4
Supplier Device Package: 16-SOIC
Fault Protection: Current Limiting (Fixed), Over Temperature
auf Bestellung 2723 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
286+ | 1.71 EUR |
MIC2042-1BTS |
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Hersteller: Microchip Technology
Description: POWER DISTRIBUTION SWITCH
Features: Slew Rate Controlled, Status Flag
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 40mOhm
Input Type: Non-Inverting
Voltage - Load: 0.8V ~ 5.5V
Voltage - Supply (Vcc/Vdd): 1.6V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:1
Supplier Device Package: 14-TSSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, UVLO
Description: POWER DISTRIBUTION SWITCH
Features: Slew Rate Controlled, Status Flag
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 40mOhm
Input Type: Non-Inverting
Voltage - Load: 0.8V ~ 5.5V
Voltage - Supply (Vcc/Vdd): 1.6V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:1
Supplier Device Package: 14-TSSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, UVLO
auf Bestellung 1812 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
237+ | 2.06 EUR |
UES706R |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 400V 20A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 20A
Supplier Device Package: DO-203AA (DO-4)
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 20 A
Description: DIODE GEN PURP 400V 20A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 20A
Supplier Device Package: DO-203AA (DO-4)
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 20 A
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1N5803 |
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Hersteller: Microchip Technology
Description: DIODE GEN PURP 75V 1A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
Description: DIODE GEN PURP 75V 1A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
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1N5803/TR |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 75V 1A
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
Description: DIODE GEN PURP 75V 1A
Packaging: Tape & Reel (TR)
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
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1N5803E3 |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 80V 1A AXIAL
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
Description: DIODE GEN PURP 80V 1A AXIAL
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
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1N5803E3/TR |
Hersteller: Microchip Technology
Description: DIODE GEN PURP REV 80V 1A AXIAL
Packaging: Tape & Reel (TR)
Package / Case: Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard, Reverse Polarity
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
Description: DIODE GEN PURP REV 80V 1A AXIAL
Packaging: Tape & Reel (TR)
Package / Case: Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard, Reverse Polarity
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
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1N5803US |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 80V 1A D-5A
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
Description: DIODE GEN PURP 80V 1A D-5A
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
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1N5803US/TR |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 80V 1A D-5A
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
Description: DIODE GEN PURP 80V 1A D-5A
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 75 V
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MIC24054YJL-TR |
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Hersteller: Microchip Technology
Description: IC REG BUCK ADJ 9A 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 9A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz
Voltage - Input (Max): 19V
Topology: Buck
Supplier Device Package: 28-QFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 5.5V
Voltage - Input (Min): 4.5V
Voltage - Output (Min/Fixed): 0.8V
Description: IC REG BUCK ADJ 9A 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 9A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz
Voltage - Input (Max): 19V
Topology: Buck
Supplier Device Package: 28-QFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 5.5V
Voltage - Input (Min): 4.5V
Voltage - Output (Min/Fixed): 0.8V
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MIC24054YJL-TR |
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Hersteller: Microchip Technology
Description: IC REG BUCK ADJ 9A 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 9A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz
Voltage - Input (Max): 19V
Topology: Buck
Supplier Device Package: 28-QFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 5.5V
Voltage - Input (Min): 4.5V
Voltage - Output (Min/Fixed): 0.8V
Description: IC REG BUCK ADJ 9A 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 9A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz
Voltage - Input (Max): 19V
Topology: Buck
Supplier Device Package: 28-QFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 5.5V
Voltage - Input (Min): 4.5V
Voltage - Output (Min/Fixed): 0.8V
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UES1106SM |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 400V 2A A SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A
Description: DIODE GEN PURP 400V 2A A SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A
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UES1106SM-1 |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 400V 2A A SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
Description: DIODE GEN PURP 400V 2A A SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
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UES1106SM/TR |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 400V 2A A SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A
Description: DIODE GEN PURP 400V 2A A SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A
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UES1106SM-1/TR |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 400V 2A A SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
Description: DIODE GEN PURP 400V 2A A SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, SQ-MELF
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
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VC-709-ECE-KAAN-125M000000 |
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Hersteller: Microchip Technology
Description: LOW POWER DIFFERENTIAL XO +3.3 V
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 45mA
Height - Seated (Max): 0.067" (1.70mm)
Frequency: 125 MHz
Base Resonator: Crystal
Description: LOW POWER DIFFERENTIAL XO +3.3 V
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 45mA
Height - Seated (Max): 0.067" (1.70mm)
Frequency: 125 MHz
Base Resonator: Crystal
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VC-709-HDE-FAAN-125M000000 |
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Hersteller: Microchip Technology
Description: LOW POWER DIFFERENTIAL XO +2.5 V
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.5V
Current - Supply (Max): 14mA
Height - Seated (Max): 0.067" (1.70mm)
Frequency: 125 MHz
Base Resonator: Crystal
Description: LOW POWER DIFFERENTIAL XO +2.5 V
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.5V
Current - Supply (Max): 14mA
Height - Seated (Max): 0.067" (1.70mm)
Frequency: 125 MHz
Base Resonator: Crystal
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VV-701-EAW-KNAB-10M0000000 |
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Hersteller: Microchip Technology
Description: LOW FREQUENCY CERAMIC VCXO +3.3
Packaging: Tape & Reel (TR)
Description: LOW FREQUENCY CERAMIC VCXO +3.3
Packaging: Tape & Reel (TR)
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JANTXV1N5531BUR-1 |
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Hersteller: Microchip Technology
Description: DIODE ZENER 11V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Qualification: MIL-PRF-19500/437
Description: DIODE ZENER 11V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Qualification: MIL-PRF-19500/437
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DSC1101AE3-084.6720T |
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Hersteller: Microchip Technology
Description: MEMS OSC LOW JITTER 84.672MHZ LV
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 84.672 MHz
Base Resonator: MEMS
Description: MEMS OSC LOW JITTER 84.672MHZ LV
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 84.672 MHz
Base Resonator: MEMS
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AT28C256-90JI |
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Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 32PLCC
Packaging: Tube
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 32-PLCC (13.97x11.43)
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 256KBIT PAR 32PLCC
Packaging: Tube
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 32-PLCC (13.97x11.43)
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
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DSC6011MI2A-000.0000T |
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Hersteller: Microchip Technology
Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±25ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±25ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
auf Bestellung 988 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
8+ | 2.48 EUR |
25+ | 2.09 EUR |
100+ | 1.90 EUR |
PD39210C-010019-TR |
Hersteller: Microchip Technology
Description: MCU FOR PD392XX FAMILY, BASED PD
Packaging: Tape & Reel (TR)
Description: MCU FOR PD392XX FAMILY, BASED PD
Packaging: Tape & Reel (TR)
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SY88307BLEY |
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Hersteller: Microchip Technology
Description: IC LIMITING 1 CIRCUIT 10MSOP
Packaging: Tube
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 10-MSOP-EP
Description: IC LIMITING 1 CIRCUIT 10MSOP
Packaging: Tube
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 10-MSOP-EP
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MIC5282-5.0YMM-TR |
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Hersteller: Microchip Technology
Description: IC REG LINEAR 5V 50MA 8MSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 11 µA
Voltage - Input (Max): 120V
Number of Regulators: 1
Supplier Device Package: 8-MSOP
Voltage - Output (Min/Fixed): 5V
PSRR: 90dB ~ 65dB (40kHz ~ 1kHz)
Voltage Dropout (Max): 3V @ 50mA
Protection Features: Over Current, Over Temperature
Description: IC REG LINEAR 5V 50MA 8MSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 11 µA
Voltage - Input (Max): 120V
Number of Regulators: 1
Supplier Device Package: 8-MSOP
Voltage - Output (Min/Fixed): 5V
PSRR: 90dB ~ 65dB (40kHz ~ 1kHz)
Voltage Dropout (Max): 3V @ 50mA
Protection Features: Over Current, Over Temperature
auf Bestellung 2179 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
7+ | 2.62 EUR |
25+ | 2.17 EUR |
100+ | 1.99 EUR |
MIC2225-G4YMT-TR |
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Hersteller: Microchip Technology
Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 1.2V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 1.2V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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MIC2225-GFYMT-TR |
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Hersteller: Microchip Technology
Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 1.5V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 1.5V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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MIC2225-GJYMT-TR |
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Hersteller: Microchip Technology
Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 2.5V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 2.5V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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EV12F76A |
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Hersteller: Microchip Technology
Description: DSPIC MOTOR CONTROL STARTERKIT
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: dsPIC33CK
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
Embedded: Yes, DSC
Description: DSPIC MOTOR CONTROL STARTERKIT
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: dsPIC33CK
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
Embedded: Yes, DSC
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 477.15 EUR |
DSC1221CI3-24M57600 |
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24.576 MHz
Base Resonator: MEMS
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24.576 MHz
Base Resonator: MEMS
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DSC1224DI1-100M0000 |
Hersteller: Microchip Technology
Description: OSC MEMS HCSL SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
Description: OSC MEMS HCSL SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
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DSC1222NI1-50M00000 |
Hersteller: Microchip Technology
Description: OSC MEMS LVPECL SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Description: OSC MEMS LVPECL SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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DSC1223CI2-180M0000 |
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Hersteller: Microchip Technology
Description: MEMS OSC SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 180 MHz
Base Resonator: MEMS
Description: MEMS OSC SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 180 MHz
Base Resonator: MEMS
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DSC1223BI2-50M00000 |
Hersteller: Microchip Technology
Description: OSC MEMS LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Description: OSC MEMS LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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ATA6625C-GAQW |
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Hersteller: Microchip Technology
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
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ATA6625C-GAQW |
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Hersteller: Microchip Technology
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
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1N1612 |
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Hersteller: Microchip Technology
Description: DIODE GEN PURP 50V 5A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
Description: DIODE GEN PURP 50V 5A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1612A |
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Hersteller: Microchip Technology
Description: DIODE GEN PURP 50V 5A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
Description: DIODE GEN PURP 50V 5A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1612R |
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Hersteller: Microchip Technology
Description: DIODE GEN PURP 50V 7A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 7A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
Description: DIODE GEN PURP 50V 7A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 7A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1671 |
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Hersteller: Microchip Technology
Description: DIODE GP 100V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 100 V
Description: DIODE GP 100V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 100 V
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1N1672 |
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Hersteller: Microchip Technology
Description: DIODE GP 150V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 150 V
Description: DIODE GP 150V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 150 V
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1N1670 |
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Hersteller: Microchip Technology
Description: DIODE GP 50V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 50 V
Description: DIODE GP 50V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 50 V
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