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MSMCJ75A MSMCJ75A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 75VWM 121VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 83.3V
Voltage - Clamping (Max) @ Ipp: 121V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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AT86RF232-ZX AT86RF232-ZX Microchip Technology doc8321.pdf Description: IC RF TXRX+MCU 802.15.4 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128B SRAM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 11.3mA ~ 11.8mA
Data Rate (Max): 250kbps
Current - Transmitting: 7.2mA ~ 13.8mA
Supplier Device Package: 32-QFN (5x5)
Modulation: O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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ATMEGA128RFA1-ZU00 ATMEGA128RFA1-ZU00 Microchip Technology Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
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DSC1001CE5-025.0000 DSC1001CE5-025.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC1001BE5-020.0000 DSC1001BE5-020.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC1001BE5-024.0000 DSC1001BE5-024.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001AE5-020.0000 DSC1001AE5-020.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-DFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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MASMCJ15A/TR MASMCJ15A/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 15VWM 24.4VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 61.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 24.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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MASMCJ15A/TR MASMCJ15A/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 15VWM 24.4VC DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 61.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 24.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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MASMCJ7.5A/TR MASMCJ7.5A/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 7.5VWM 12.9V DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 116.3A
Voltage - Reverse Standoff (Typ): 7.5V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.33V
Voltage - Clamping (Max) @ Ipp: 12.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ7.5A/TR MASMCJ7.5A/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 7.5VWM 12.9V DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 116.3A
Voltage - Reverse Standoff (Typ): 7.5V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.33V
Voltage - Clamping (Max) @ Ipp: 12.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ10CA/TR MASMCJ10CA/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 10VWM 17VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 88.2A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ10CA/TR MASMCJ10CA/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 10VWM 17VC DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 88.2A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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APTDX300A120D16AG APTDX300A120D16AG Microchip Technology APTDX300A120D16AG-Si-Diode-Module-Datasheet.pdf Description: DIODE MODULE GEN PURP 1200V 485A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 485A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 300 A
Current - Reverse Leakage @ Vr: 20 µA @ 1200 V
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APTDX300KK120D16AG APTDX300KK120D16AG Microchip Technology APTDX300KK120D16AG-Si-Diode-Module-Datasheet.pdf Description: DIODE MODULE GEN PURP 1200V 485A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 485A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 300 A
Current - Reverse Leakage @ Vr: 20 µA @ 1200 V
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APTDX300A170D16AG APTDX300A170D16AG Microchip Technology APTDX300A170D16AG-Si-Diode-Module-Datasheet.pdf Description: DIODE MODULE GEN PURP 1700V 345A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 345A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 2.7 V @ 300 A
Current - Reverse Leakage @ Vr: 25 µA @ 1700 V
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DSC6101JL2B-026.0000 DSC6101JL2B-026.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MI2B-026.0000 DSC6003MI2B-026.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JI2B-026.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JE1B-026.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
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DSC6011JI2B-026.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
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DSC6101JI2B-026.0000 DSC6101JI2B-026.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111JI1B-026.0000 DSC6111JI1B-026.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101MA3B-026.0000 DSC6101MA3B-026.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
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DSC6003MI3B-026.0000T DSC6003MI3B-026.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: OSC MEMS AUTO -40C-85C SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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AVR16EB14T-I/SL AVR16EB14T-I/SL Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB14T-I/SL AVR16EB14T-I/SL Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB14T-E/SL AVR16EB14T-E/SL Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB14T-E/SL AVR16EB14T-E/SL Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB20T-I/SS AVR16EB20T-I/SS Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
Produkt ist nicht verfügbar
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AVR16EB20T-I/SS AVR16EB20T-I/SS Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
Produkt ist nicht verfügbar
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MCP41HV51T-104E/ST MCP41HV51T-104E/ST Microchip Technology MCP41HVX1-Data-Sheet-20005207.pdf Description: IC DIG POT 100K 14-TSSOP
Resistance (Ohms): 100k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: SPI
Configuration: Potentiometer
Operating Temperature: -40°C ~ 125°C
Number of Taps: 256
Voltage - Supply: 1.8V ~ 5.5V, 10V ~ 36V, ±5V ~ 18V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 145
Temperature Coefficient (Typ): 100ppm/°C
Number of Circuits: 1
DigiKey Programmable: Not Verified
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MCP41HV51T-104E/ST MCP41HV51T-104E/ST Microchip Technology MCP41HVX1-Data-Sheet-20005207.pdf Description: IC DIG POT 100K 14-TSSOP
Resistance (Ohms): 100k
Tolerance: ±20%
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: SPI
Configuration: Potentiometer
Operating Temperature: -40°C ~ 125°C
Number of Taps: 256
Voltage - Supply: 1.8V ~ 5.5V, 10V ~ 36V, ±5V ~ 18V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 145
Temperature Coefficient (Typ): 100ppm/°C
Number of Circuits: 1
DigiKey Programmable: Not Verified
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ATMEGA8L-8PI ATMEGA8L-8PI Microchip Technology ATmega8%28L%29%20Complete.pdf description Description: IC MCU 8BIT 8KB FLASH 28DIP
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: AVR
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (4K x 16)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Produkt ist nicht verfügbar
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AVR32SD20T-I/SS Microchip Technology Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Produkt ist nicht verfügbar
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AVR32SD20-E/SS AVR32SD20-E/SS Microchip Technology Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Produkt ist nicht verfügbar
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AVR32SD20T-E/SS AVR32SD20T-E/SS Microchip Technology Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Produkt ist nicht verfügbar
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MML4402-GM3 MML4402-GM3 Microchip Technology 136336-mml4400-series-datasheet Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
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MML4402-GM3/TR MML4402-GM3/TR Microchip Technology MML4400.pdf Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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MML4403-GM3/TR MML4403-GM3/TR Microchip Technology MML4400.pdf Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Resistance @ If, F: 1Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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DSC1001DL2-016.0000 DSC1001DL2-016.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC1001DL5-027.0000 DSC1001DL5-027.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
auf Bestellung 482 Stücke:
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DSC1001DL5-030.0000 DSC1001DL5-030.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 30.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 30 MHz
Base Resonator: MEMS
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DSC1001DL5-025.0000T DSC1001DL5-025.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC1001DL5-010.0000 DSC1001DL5-010.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC1001DL5-012.2880 DSC1001DL5-012.2880 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
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DSC1001DL5-128.0000 DSC1001DL5-128.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 128.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 128 MHz
Base Resonator: MEMS
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DSC1001DL2-027.0000 DSC1001DL2-027.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC1001DL2-003.9000 DSC1001DL2-003.9000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 3.9000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.9 MHz
Base Resonator: MEMS
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DSC1001DL2-066.0000 DSC1001DL2-066.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 66.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 66 MHz
Base Resonator: MEMS
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DSC1001DL2-090.0000 DSC1001DL2-090.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
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DSC1001DL1-037.1250 DSC1001DL1-037.1250 Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001DL2-020.0000T DSC1001DL2-020.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JAN1N5619 JAN1N5619 Microchip Technology 10968-sa7-47-datasheet Description: DIODE STANDARD 600V 1A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 250 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 800 V
Qualification: MIL-PRF-19500/429
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SY75576LKY-TR SY75576LKY-TR Microchip Technology SY75576L.pdf Description: IC CLK BUFFER 2:4 267MHZ 20TSSOP
Frequency - Max: 267 MHz
Supplier Device Package: 20-TSSOP
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 2:4
Voltage - Supply: 3.135V ~ 3.465V
Operating Temperature: -40°C ~ 85°C
Input: HCSL, LVDS
Type: Fanout Buffer (Distribution), Multiplexer
Output: HCSL, LVDS
Mounting Type: Surface Mount
Number of Circuits: 1
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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CDLL5529A/TR CDLL5529A/TR Microchip Technology Description: DIODE ZENER 9.1V 500MW DO213AB
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-213AB
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 7 V
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MCP22350T-1I/Q8X MCP22350T-1I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350T-1I/Q8X MCP22350T-1I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350T-2I/Q8X MCP22350T-2I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350T-2I/Q8X MCP22350T-2I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MSMCJ75A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ75A
Hersteller: Microchip Technology
Description: TVS DIODE 75VWM 121VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 83.3V
Voltage - Clamping (Max) @ Ipp: 121V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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AT86RF232-ZX doc8321.pdf
AT86RF232-ZX
Hersteller: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128B SRAM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 11.3mA ~ 11.8mA
Data Rate (Max): 250kbps
Current - Transmitting: 7.2mA ~ 13.8mA
Supplier Device Package: 32-QFN (5x5)
Modulation: O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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ATMEGA128RFA1-ZU00 Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf
ATMEGA128RFA1-ZU00
Hersteller: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSC1001CE5-025.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CE5-025.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC1001BE5-020.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE5-020.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC1001BE5-024.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE5-024.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001AE5-020.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AE5-020.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-DFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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MASMCJ15A/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ15A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 15VWM 24.4VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 61.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 24.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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MASMCJ15A/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ15A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 15VWM 24.4VC DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 61.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 24.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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MASMCJ7.5A/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ7.5A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 7.5VWM 12.9V DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 116.3A
Voltage - Reverse Standoff (Typ): 7.5V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.33V
Voltage - Clamping (Max) @ Ipp: 12.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ7.5A/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ7.5A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 7.5VWM 12.9V DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 116.3A
Voltage - Reverse Standoff (Typ): 7.5V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.33V
Voltage - Clamping (Max) @ Ipp: 12.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ10CA/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ10CA/TR
Hersteller: Microchip Technology
Description: TVS DIODE 10VWM 17VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 88.2A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ10CA/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ10CA/TR
Hersteller: Microchip Technology
Description: TVS DIODE 10VWM 17VC DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 88.2A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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APTDX300A120D16AG APTDX300A120D16AG-Si-Diode-Module-Datasheet.pdf
APTDX300A120D16AG
Hersteller: Microchip Technology
Description: DIODE MODULE GEN PURP 1200V 485A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 485A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 300 A
Current - Reverse Leakage @ Vr: 20 µA @ 1200 V
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APTDX300KK120D16AG APTDX300KK120D16AG-Si-Diode-Module-Datasheet.pdf
APTDX300KK120D16AG
Hersteller: Microchip Technology
Description: DIODE MODULE GEN PURP 1200V 485A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 485A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 300 A
Current - Reverse Leakage @ Vr: 20 µA @ 1200 V
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APTDX300A170D16AG APTDX300A170D16AG-Si-Diode-Module-Datasheet.pdf
APTDX300A170D16AG
Hersteller: Microchip Technology
Description: DIODE MODULE GEN PURP 1700V 345A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 345A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 2.7 V @ 300 A
Current - Reverse Leakage @ Vr: 25 µA @ 1700 V
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DSC6101JL2B-026.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101JL2B-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MI2B-026.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MI2B-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JI2B-026.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JE1B-026.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JI2B-026.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JI2B-026.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101JI2B-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111JI1B-026.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JI1B-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101MA3B-026.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101MA3B-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MI3B-026.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MI3B-026.0000T
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-85C SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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AVR16EB14T-I/SL AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB14T-I/SL
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB14T-I/SL AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB14T-I/SL
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB14T-E/SL AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB14T-E/SL
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB14T-E/SL AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB14T-E/SL
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB20T-I/SS AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB20T-I/SS
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
Produkt ist nicht verfügbar
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AVR16EB20T-I/SS AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB20T-I/SS
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
Produkt ist nicht verfügbar
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MCP41HV51T-104E/ST MCP41HVX1-Data-Sheet-20005207.pdf
MCP41HV51T-104E/ST
Hersteller: Microchip Technology
Description: IC DIG POT 100K 14-TSSOP
Resistance (Ohms): 100k
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: SPI
Configuration: Potentiometer
Operating Temperature: -40°C ~ 125°C
Number of Taps: 256
Voltage - Supply: 1.8V ~ 5.5V, 10V ~ 36V, ±5V ~ 18V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 145
Temperature Coefficient (Typ): 100ppm/°C
Number of Circuits: 1
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
2500+2.71 EUR
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MCP41HV51T-104E/ST MCP41HVX1-Data-Sheet-20005207.pdf
MCP41HV51T-104E/ST
Hersteller: Microchip Technology
Description: IC DIG POT 100K 14-TSSOP
Resistance (Ohms): 100k
Tolerance: ±20%
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: SPI
Configuration: Potentiometer
Operating Temperature: -40°C ~ 125°C
Number of Taps: 256
Voltage - Supply: 1.8V ~ 5.5V, 10V ~ 36V, ±5V ~ 18V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 145
Temperature Coefficient (Typ): 100ppm/°C
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 4309 Stücke:
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AnzahlPrivatkunde
6+3.58 EUR
25+2.98 EUR
100+2.96 EUR
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ATMEGA8L-8PI description ATmega8%28L%29%20Complete.pdf
ATMEGA8L-8PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 28DIP
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: AVR
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (4K x 16)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Produkt ist nicht verfügbar
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AVR32SD20T-I/SS
Hersteller: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Produkt ist nicht verfügbar
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AVR32SD20-E/SS
AVR32SD20-E/SS
Hersteller: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Produkt ist nicht verfügbar
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AVR32SD20T-E/SS
AVR32SD20T-E/SS
Hersteller: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Produkt ist nicht verfügbar
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MML4402-GM3 136336-mml4400-series-datasheet
MML4402-GM3
Hersteller: Microchip Technology
Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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MML4402-GM3/TR MML4400.pdf
MML4402-GM3/TR
Hersteller: Microchip Technology
Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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MML4403-GM3/TR MML4400.pdf
MML4403-GM3/TR
Hersteller: Microchip Technology
Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Resistance @ If, F: 1Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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DSC1001DL2-016.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-016.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
auf Bestellung 90 Stücke:
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16+1.32 EUR
17+1.3 EUR
50+1.27 EUR
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DSC1001DL5-027.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-027.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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8+2.81 EUR
10+2.75 EUR
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DSC1001DL5-030.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-030.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 30.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 30 MHz
Base Resonator: MEMS
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8+2.81 EUR
10+2.75 EUR
50+2.7 EUR
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DSC1001DL5-025.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-025.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC1001DL5-010.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-010.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC1001DL5-012.2880 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-012.2880
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
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DSC1001DL5-128.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-128.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 128.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 128 MHz
Base Resonator: MEMS
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DSC1001DL2-027.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-027.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC1001DL2-003.9000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-003.9000
Hersteller: Microchip Technology
Description: MEMS OSC XO 3.9000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.9 MHz
Base Resonator: MEMS
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DSC1001DL2-066.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-066.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 66.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 66 MHz
Base Resonator: MEMS
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DSC1001DL2-090.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-090.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
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DSC1001DL1-037.1250 DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1001DL1-037.1250
Hersteller: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001DL2-020.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-020.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JAN1N5619 10968-sa7-47-datasheet
JAN1N5619
Hersteller: Microchip Technology
Description: DIODE STANDARD 600V 1A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 250 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 800 V
Qualification: MIL-PRF-19500/429
Produkt ist nicht verfügbar
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SY75576LKY-TR SY75576L.pdf
SY75576LKY-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 2:4 267MHZ 20TSSOP
Frequency - Max: 267 MHz
Supplier Device Package: 20-TSSOP
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 2:4
Voltage - Supply: 3.135V ~ 3.465V
Operating Temperature: -40°C ~ 85°C
Input: HCSL, LVDS
Type: Fanout Buffer (Distribution), Multiplexer
Output: HCSL, LVDS
Mounting Type: Surface Mount
Number of Circuits: 1
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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CDLL5529A/TR
CDLL5529A/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 9.1V 500MW DO213AB
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-213AB
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 7 V
Produkt ist nicht verfügbar
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MCP22350T-1I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-1I/Q8X
Hersteller: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350T-1I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-1I/Q8X
Hersteller: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350T-2I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-2I/Q8X
Hersteller: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350T-2I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-2I/Q8X
Hersteller: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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