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JANTXV1N4467CUS/TR JANTXV1N4467CUS/TR Microchip Technology 1N4460US-1N4496US.1N6485US-1NN6491US.pdf Description: DIODE ZENER 12V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 200 nA @ 9.6 V
Qualification: MIL-PRF-19500/406
Produkt ist nicht verfügbar
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JANS1N4467CUS/TR JANS1N4467CUS/TR Microchip Technology 1N4460US-1N4496US.1N6485US-1NN6491US.pdf Description: DIODE ZENER 12V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 200 nA @ 9.6 V
Qualification: MIL-PRF-19500/406
Produkt ist nicht verfügbar
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SY58018UMG-TR SY58018UMG-TR Microchip Technology SY58018U-Ultra-Precision-Differential-LVPECL-2-1-MUX-DS20006286A.pdf Description: IC MULTIPLEXER 1 X 2:1 16-QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V, 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-QFN (3x3)
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SY58018UMG-TR SY58018UMG-TR Microchip Technology SY58018U-Ultra-Precision-Differential-LVPECL-2-1-MUX-DS20006286A.pdf Description: IC MULTIPLEXER 1 X 2:1 16-QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V, 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-QFN (3x3)
auf Bestellung 604 Stücke:
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2+14.64 EUR
25+14.42 EUR
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DSPIC33AK32MC103-I/M7 DSPIC33AK32MC103-I/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 27x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 36-VQFN (5x5)
Number of I/O: 27
auf Bestellung 682 Stücke:
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7+2.53 EUR
25+2.31 EUR
100+2.1 EUR
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DSPIC33AK32MC102-I/SS DSPIC33AK32MC102-I/SS Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 19
auf Bestellung 597 Stücke:
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7+2.57 EUR
25+2.33 EUR
100+2.13 EUR
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DSPIC33AK64MC103-I/M7 DSPIC33AK64MC103-I/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 15x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 36-VQFN (5x5)
Number of I/O: 27
auf Bestellung 664 Stücke:
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7+2.68 EUR
25+2.43 EUR
100+2.22 EUR
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DSPIC33AK64MC102-I/SS DSPIC33AK64MC102-I/SS Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 19
auf Bestellung 658 Stücke:
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7+2.73 EUR
25+2.48 EUR
100+2.26 EUR
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dsPIC33AK32MC102-E/M7 dsPIC33AK32MC102-E/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
auf Bestellung 445 Stücke:
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7+2.71 EUR
25+2.46 EUR
100+2.23 EUR
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DSPIC33AK32MC105-I/PT DSPIC33AK32MC105-I/PT Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 35
auf Bestellung 735 Stücke:
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7+2.76 EUR
25+2.51 EUR
100+2.28 EUR
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DSPIC33AK32MC105-I/M7 DSPIC33AK32MC105-I/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 35
auf Bestellung 606 Stücke:
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7+2.8 EUR
25+2.54 EUR
100+2.31 EUR
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dsPIC33AK32MC103-E/M7 dsPIC33AK32MC103-E/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 27x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 36-VQFN (5x5)
Grade: Automotive
Number of I/O: 27
Qualification: AEC-Q100
auf Bestellung 438 Stücke:
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7+2.8 EUR
25+2.54 EUR
100+2.31 EUR
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dsPIC33AK32MC102-E/SS dsPIC33AK32MC102-E/SS Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
auf Bestellung 376 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.83 EUR
25+2.57 EUR
100+2.33 EUR
Mindestbestellmenge: 7
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DSPIC33AK64MC105-I/PT DSPIC33AK64MC105-I/PT Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 35
auf Bestellung 736 Stücke:
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7+2.9 EUR
25+2.63 EUR
100+2.4 EUR
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DSPIC33AK64MC105-I/M7 DSPIC33AK64MC105-I/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 35
auf Bestellung 616 Stücke:
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6+2.94 EUR
25+2.66 EUR
100+2.42 EUR
Mindestbestellmenge: 6
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dsPIC33AK64MC103-E/M7 dsPIC33AK64MC103-E/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 15x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 36-VQFN (5x5)
Grade: Automotive
Number of I/O: 27
Qualification: AEC-Q100
auf Bestellung 433 Stücke:
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6+2.96 EUR
25+2.68 EUR
100+2.43 EUR
Mindestbestellmenge: 6
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dsPIC33AK64MC102-E/SS dsPIC33AK64MC102-E/SS Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
auf Bestellung 374 Stücke:
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6+2.96 EUR
25+2.68 EUR
100+2.43 EUR
Mindestbestellmenge: 6
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dsPIC33AK32MC105-E/PT dsPIC33AK32MC105-E/PT Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Grade: Automotive
Number of I/O: 35
Qualification: AEC-Q100
auf Bestellung 500 Stücke:
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6+3.04 EUR
25+2.77 EUR
100+2.51 EUR
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dsPIC33AK32MC105-E/M7 dsPIC33AK32MC105-E/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 35
Qualification: AEC-Q100
auf Bestellung 366 Stücke:
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6+3.06 EUR
25+2.78 EUR
100+2.54 EUR
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dsPIC33AK64MC105-E/PT dsPIC33AK64MC105-E/PT Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Grade: Automotive
Number of I/O: 35
Qualification: AEC-Q100
auf Bestellung 468 Stücke:
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6+3.19 EUR
25+2.9 EUR
100+2.63 EUR
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dsPIC33AK64MC105-E/M7 dsPIC33AK64MC105-E/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 35
Qualification: AEC-Q100
auf Bestellung 316 Stücke:
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6+3.22 EUR
25+2.92 EUR
100+2.66 EUR
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EV78U65A Microchip Technology Description: MCHV-230VAC-1.5KW DEVELOPMENT BO
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: dsPIC33AK128MC106
Embedded: Yes, MCU
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DSPIC33AK32MC103T-I/M7 DSPIC33AK32MC103T-I/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 27x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 36-VQFN (5x5)
Number of I/O: 27
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DSPIC33AK32MC102T-I/SS DSPIC33AK32MC102T-I/SS Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 19
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SY89540UMY-TR SY89540UMY-TR Microchip Technology sy89540u.pdf Description: IC CROSSPOINT SWITCH 1X4:4 44MLF
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Mounting Type: Surface Mount
Circuit: 1 x 4:4
Type: Crosspoint Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 44-MLF® (7x7)
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SY89540UMY-TR SY89540UMY-TR Microchip Technology sy89540u.pdf Description: IC CROSSPOINT SWITCH 1X4:4 44MLF
Packaging: Cut Tape (CT)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Mounting Type: Surface Mount
Circuit: 1 x 4:4
Type: Crosspoint Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 44-MLF® (7x7)
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SY89852UMG-TR SY89852UMG-TR Microchip Technology sy89852u.pdf Description: IC MULTIPLEXER 1 X 2:1 16-QFN
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V, 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-QFN (3x3)
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AT17C020-10JC AT17C020-10JC Microchip Technology AT17C%28LV%29020%20.pdf Description: IC SERIAL CONFIG PROM 2M 20PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: Serial EEPROM
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M1.5KE62A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 53VWM 85VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.7A
Voltage - Reverse Standoff (Typ): 53V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC6003MA3B-032.0000 DSC6003MA3B-032.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 32.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32 MHz
Base Resonator: MEMS
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DSC6003MA3B-080.0000 DSC6003MA3B-080.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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DSC6003MA3B-080.0000T DSC6003MA3B-080.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: OSC MEMS AUTO -40C-125C SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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DSC6003MA3B-032.0000T DSC6003MA3B-032.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: OSC MEMS AUTO -40C-125C SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32 MHz
Base Resonator: MEMS
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DSC6003MA3B-100K000 DSC6003MA3B-100K000 Microchip Technology Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 100 kHz
Base Resonator: MEMS
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DSC6003MA3B-100K000T DSC6003MA3B-100K000T Microchip Technology Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 100 kHz
Base Resonator: MEMS
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MAPLAD6.5KP11CAe3 Microchip Technology rf01083_rev_b.pdf Description: TVS DIODE 11VWM 18.2VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 358A
Voltage - Reverse Standoff (Typ): 11V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 12.2V
Voltage - Clamping (Max) @ Ipp: 18.2V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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1N5275BUR-1/TR 1N5275BUR-1/TR Microchip Technology 1N5221BUR-1%20thru%201N5281BUR-1.pdf Description: DIODE ZENER 140V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 1300 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 106 V
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1N5275BUR-1/TR 1N5275BUR-1/TR Microchip Technology 1N5221BUR-1%20thru%201N5281BUR-1.pdf Description: DIODE ZENER 140V 500MW DO213AA
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 1300 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 106 V
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LAN8840T/PSA LAN8840T/PSA Microchip Technology LAN8840-HW-Design-Checklist-DS00004680.pdf Description: IC TRANSCEIVER FULL 4/4 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.1V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
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LAN8840T/PSA LAN8840T/PSA Microchip Technology LAN8840-HW-Design-Checklist-DS00004680.pdf Description: IC TRANSCEIVER FULL 4/4 48VQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.1V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
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1N4699 1N4699 Microchip Technology 1N4678_1N4717.pdf Description: DIODE ZENER 12V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 12 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.1 V
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DSC1001DL1-037.1250T DSC1001DL1-037.1250T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
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DSC1001DL2-023.0000T DSC1001DL2-023.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 23.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 23 MHz
Base Resonator: MEMS
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DSC1001DL2-066.0000T DSC1001DL2-066.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 66.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 66 MHz
Base Resonator: MEMS
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DSC1001DL2-150.0000T DSC1001DL2-150.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 150.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
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MSMCG64Ae3 MSMCG64Ae3 Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 64VWM 103VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCG70Ae3 MSMCG70Ae3 Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 70VWM 113VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.3A
Voltage - Reverse Standoff (Typ): 70V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 77.8V
Voltage - Clamping (Max) @ Ipp: 113V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCG6.5CA MSMCG6.5CA Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 6.5VWM 11.2V DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 133.9A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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LAN8650B1T-E/LMX LAN8650B1T-E/LMX Microchip Technology LAN8650-1-Data-Sheet-60001734.pdf Description: IC TRANSCEIVER HALF 1/1 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 32-VQFN (5x5)
Receiver Hysteresis: 230 mV
Duplex: Half
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LAN8650B1T-E/LMX LAN8650B1T-E/LMX Microchip Technology LAN8650-1-Data-Sheet-60001734.pdf Description: IC TRANSCEIVER HALF 1/1 32VQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 32-VQFN (5x5)
Receiver Hysteresis: 230 mV
Duplex: Half
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APT100GN120J APT100GN120J Microchip Technology 5643-apt100gn120j-datasheet Description: IGBT MOD 1200V 153A 446W ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: ISOTOP®
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 153 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 446 W
Current - Collector Cutoff (Max): 100 µA
Input Capacitance (Cies) @ Vce: 6.5 nF @ 25 V
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APT100GN120JDQ4 APT100GN120JDQ4 Microchip Technology 6563-apt100gn120jdq4-b-pdf.pdf Description: IGBT MOD 1200V 153A 446W ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: ISOTOP®
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 153 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 446 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 6.5 nF @ 25 V
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1N5258B 1N5258B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 36V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 27 V
Produkt ist nicht verfügbar
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DSC1121CM2-003.1152T DSC1121CM2-003.1152T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613C.pdf Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±25ppm
Frequency: 3.1152 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JANTX1N5538BUR-1 JANTX1N5538BUR-1 Microchip Technology 1N5518BUR-1_1N5546BUR-1.pdf Description: DIODE ZENER 18V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 16.2 V
Qualification: MIL-PRF-19500/437
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JAN1N5529D-1 JAN1N5529D-1 Microchip Technology 1N5518B_1N5546B-1.pdf Description: DIODE ZENER 9.1V 500MW DO204AH
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8.2 V
Qualification: MIL-PRF-19500/437
Produkt ist nicht verfügbar
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JANTX1N5533DUR-1 JANTX1N5533DUR-1 Microchip Technology 1N5518BUR-1_1N5546BUR-1.pdf Description: DIODE ZENER 13V 500MW DO213AA
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
Qualification: MIL-PRF-19500/437
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JANTXV1N5534B-1 JANTXV1N5534B-1 Microchip Technology 1N5518B_1N5546B-1.pdf Description: DIODE ZENER 14V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 12.6 V
Qualification: MIL-PRF-19500/437
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JANTXV1N5529BUR-1 JANTXV1N5529BUR-1 Microchip Technology 1N5518BUR-1_1N5546BUR-1.pdf Description: DIODE ZENER 9.1V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8.2 V
Qualification: MIL-PRF-19500/437
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JAN1N5529C-1 JAN1N5529C-1 Microchip Technology 1N5518B_1N5546B-1.pdf Description: DIODE ZENER 9.1V 500MW DO204AH
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8.2 V
Qualification: MIL-PRF-19500/437
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JANTXV1N4467CUS/TR 1N4460US-1N4496US.1N6485US-1NN6491US.pdf
JANTXV1N4467CUS/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 200 nA @ 9.6 V
Qualification: MIL-PRF-19500/406
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JANS1N4467CUS/TR 1N4460US-1N4496US.1N6485US-1NN6491US.pdf
JANS1N4467CUS/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 1.5W D5A
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: D-5A
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 200 nA @ 9.6 V
Qualification: MIL-PRF-19500/406
Produkt ist nicht verfügbar
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SY58018UMG-TR SY58018U-Ultra-Precision-Differential-LVPECL-2-1-MUX-DS20006286A.pdf
SY58018UMG-TR
Hersteller: Microchip Technology
Description: IC MULTIPLEXER 1 X 2:1 16-QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V, 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-QFN (3x3)
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SY58018UMG-TR SY58018U-Ultra-Precision-Differential-LVPECL-2-1-MUX-DS20006286A.pdf
SY58018UMG-TR
Hersteller: Microchip Technology
Description: IC MULTIPLEXER 1 X 2:1 16-QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V, 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-QFN (3x3)
auf Bestellung 604 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.64 EUR
25+14.42 EUR
Mindestbestellmenge: 2
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DSPIC33AK32MC103-I/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK32MC103-I/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 27x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 36-VQFN (5x5)
Number of I/O: 27
auf Bestellung 682 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.53 EUR
25+2.31 EUR
100+2.1 EUR
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DSPIC33AK32MC102-I/SS dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK32MC102-I/SS
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 19
auf Bestellung 597 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.57 EUR
25+2.33 EUR
100+2.13 EUR
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DSPIC33AK64MC103-I/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK64MC103-I/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 15x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 36-VQFN (5x5)
Number of I/O: 27
auf Bestellung 664 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.68 EUR
25+2.43 EUR
100+2.22 EUR
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DSPIC33AK64MC102-I/SS dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK64MC102-I/SS
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 19
auf Bestellung 658 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.73 EUR
25+2.48 EUR
100+2.26 EUR
Mindestbestellmenge: 7
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dsPIC33AK32MC102-E/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
dsPIC33AK32MC102-E/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
auf Bestellung 445 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.71 EUR
25+2.46 EUR
100+2.23 EUR
Mindestbestellmenge: 7
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DSPIC33AK32MC105-I/PT dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK32MC105-I/PT
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 35
auf Bestellung 735 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.76 EUR
25+2.51 EUR
100+2.28 EUR
Mindestbestellmenge: 7
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DSPIC33AK32MC105-I/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK32MC105-I/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 35
auf Bestellung 606 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.8 EUR
25+2.54 EUR
100+2.31 EUR
Mindestbestellmenge: 7
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dsPIC33AK32MC103-E/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
dsPIC33AK32MC103-E/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 27x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 36-VQFN (5x5)
Grade: Automotive
Number of I/O: 27
Qualification: AEC-Q100
auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.8 EUR
25+2.54 EUR
100+2.31 EUR
Mindestbestellmenge: 7
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dsPIC33AK32MC102-E/SS dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
dsPIC33AK32MC102-E/SS
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
auf Bestellung 376 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.83 EUR
25+2.57 EUR
100+2.33 EUR
Mindestbestellmenge: 7
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DSPIC33AK64MC105-I/PT dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK64MC105-I/PT
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 35
auf Bestellung 736 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.9 EUR
25+2.63 EUR
100+2.4 EUR
Mindestbestellmenge: 7
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DSPIC33AK64MC105-I/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK64MC105-I/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 35
auf Bestellung 616 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+2.94 EUR
25+2.66 EUR
100+2.42 EUR
Mindestbestellmenge: 6
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dsPIC33AK64MC103-E/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
dsPIC33AK64MC103-E/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 15x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 36-VQFN (5x5)
Grade: Automotive
Number of I/O: 27
Qualification: AEC-Q100
auf Bestellung 433 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+2.96 EUR
25+2.68 EUR
100+2.43 EUR
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dsPIC33AK64MC102-E/SS dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
dsPIC33AK64MC102-E/SS
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
auf Bestellung 374 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+2.96 EUR
25+2.68 EUR
100+2.43 EUR
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dsPIC33AK32MC105-E/PT dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
dsPIC33AK32MC105-E/PT
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Grade: Automotive
Number of I/O: 35
Qualification: AEC-Q100
auf Bestellung 500 Stücke:
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Anzahl Preis
6+3.04 EUR
25+2.77 EUR
100+2.51 EUR
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dsPIC33AK32MC105-E/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
dsPIC33AK32MC105-E/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 35
Qualification: AEC-Q100
auf Bestellung 366 Stücke:
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Anzahl Preis
6+3.06 EUR
25+2.78 EUR
100+2.54 EUR
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dsPIC33AK64MC105-E/PT dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
dsPIC33AK64MC105-E/PT
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Grade: Automotive
Number of I/O: 35
Qualification: AEC-Q100
auf Bestellung 468 Stücke:
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Anzahl Preis
6+3.19 EUR
25+2.9 EUR
100+2.63 EUR
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dsPIC33AK64MC105-E/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
dsPIC33AK64MC105-E/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 35
Qualification: AEC-Q100
auf Bestellung 316 Stücke:
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Anzahl Preis
6+3.22 EUR
25+2.92 EUR
100+2.66 EUR
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EV78U65A
Hersteller: Microchip Technology
Description: MCHV-230VAC-1.5KW DEVELOPMENT BO
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: dsPIC33AK128MC106
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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DSPIC33AK32MC103T-I/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK32MC103T-I/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 27x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 36-VQFN (5x5)
Number of I/O: 27
Produkt ist nicht verfügbar
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DSPIC33AK32MC102T-I/SS dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK32MC102T-I/SS
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 11x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 19
Produkt ist nicht verfügbar
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SY89540UMY-TR sy89540u.pdf
SY89540UMY-TR
Hersteller: Microchip Technology
Description: IC CROSSPOINT SWITCH 1X4:4 44MLF
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Mounting Type: Surface Mount
Circuit: 1 x 4:4
Type: Crosspoint Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 44-MLF® (7x7)
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Anzahl Preis
1000+21.94 EUR
Mindestbestellmenge: 1000
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SY89540UMY-TR sy89540u.pdf
SY89540UMY-TR
Hersteller: Microchip Technology
Description: IC CROSSPOINT SWITCH 1X4:4 44MLF
Packaging: Cut Tape (CT)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Mounting Type: Surface Mount
Circuit: 1 x 4:4
Type: Crosspoint Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 44-MLF® (7x7)
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Anzahl Preis
1+28.95 EUR
25+24.12 EUR
100+21.94 EUR
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SY89852UMG-TR sy89852u.pdf
SY89852UMG-TR
Hersteller: Microchip Technology
Description: IC MULTIPLEXER 1 X 2:1 16-QFN
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V, 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-QFN (3x3)
auf Bestellung 8627 Stücke:
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Anzahl Preis
110+4.24 EUR
Mindestbestellmenge: 110
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AT17C020-10JC AT17C%28LV%29020%20.pdf
AT17C020-10JC
Hersteller: Microchip Technology
Description: IC SERIAL CONFIG PROM 2M 20PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: Serial EEPROM
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M1.5KE62A RF01008_rE.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 53VWM 85VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.7A
Voltage - Reverse Standoff (Typ): 53V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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DSC6003MA3B-032.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MA3B-032.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 32.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MA3B-080.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MA3B-080.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MA3B-080.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MA3B-080.0000T
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-125C SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MA3B-032.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MA3B-032.0000T
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-125C SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MA3B-100K000
DSC6003MA3B-100K000
Hersteller: Microchip Technology
Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 100 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MA3B-100K000T
DSC6003MA3B-100K000T
Hersteller: Microchip Technology
Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 100 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MAPLAD6.5KP11CAe3 rf01083_rev_b.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 11VWM 18.2VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 358A
Voltage - Reverse Standoff (Typ): 11V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 12.2V
Voltage - Clamping (Max) @ Ipp: 18.2V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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1N5275BUR-1/TR 1N5221BUR-1%20thru%201N5281BUR-1.pdf
1N5275BUR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 140V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 1300 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 106 V
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1N5275BUR-1/TR 1N5221BUR-1%20thru%201N5281BUR-1.pdf
1N5275BUR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 140V 500MW DO213AA
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 140 V
Impedance (Max) (Zzt): 1300 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 106 V
Produkt ist nicht verfügbar
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LAN8840T/PSA LAN8840-HW-Design-Checklist-DS00004680.pdf
LAN8840T/PSA
Hersteller: Microchip Technology
Description: IC TRANSCEIVER FULL 4/4 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.1V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
Produkt ist nicht verfügbar
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LAN8840T/PSA LAN8840-HW-Design-Checklist-DS00004680.pdf
LAN8840T/PSA
Hersteller: Microchip Technology
Description: IC TRANSCEIVER FULL 4/4 48VQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.1V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
auf Bestellung 918 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.29 EUR
25+6.08 EUR
100+5.88 EUR
Mindestbestellmenge: 3
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1N4699 1N4678_1N4717.pdf
1N4699
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 12 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.1 V
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.11 EUR
100+5.69 EUR
Mindestbestellmenge: 3
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DSC1001DL1-037.1250T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-037.1250T
Hersteller: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
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DSC1001DL2-023.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-023.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 23.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 23 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001DL2-066.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-066.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 66.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 66 MHz
Base Resonator: MEMS
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DSC1001DL2-150.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-150.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 150.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
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MSMCG64Ae3 rf01001_rev_b_final-pd-000307351.pdf
MSMCG64Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 64VWM 103VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCG70Ae3 rf01001_rev_b_final-pd-000307351.pdf
MSMCG70Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 70VWM 113VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.3A
Voltage - Reverse Standoff (Typ): 70V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 77.8V
Voltage - Clamping (Max) @ Ipp: 113V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCG6.5CA rf01001_rev_b_final-pd-000307351.pdf
MSMCG6.5CA
Hersteller: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2V DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 133.9A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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LAN8650B1T-E/LMX LAN8650-1-Data-Sheet-60001734.pdf
LAN8650B1T-E/LMX
Hersteller: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 32-VQFN (5x5)
Receiver Hysteresis: 230 mV
Duplex: Half
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LAN8650B1T-E/LMX LAN8650-1-Data-Sheet-60001734.pdf
LAN8650B1T-E/LMX
Hersteller: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 32VQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 32-VQFN (5x5)
Receiver Hysteresis: 230 mV
Duplex: Half
auf Bestellung 4608 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.5 EUR
25+6.25 EUR
100+6.03 EUR
Mindestbestellmenge: 3
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APT100GN120J 5643-apt100gn120j-datasheet
APT100GN120J
Hersteller: Microchip Technology
Description: IGBT MOD 1200V 153A 446W ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: ISOTOP®
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 153 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 446 W
Current - Collector Cutoff (Max): 100 µA
Input Capacitance (Cies) @ Vce: 6.5 nF @ 25 V
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APT100GN120JDQ4 6563-apt100gn120jdq4-b-pdf.pdf
APT100GN120JDQ4
Hersteller: Microchip Technology
Description: IGBT MOD 1200V 153A 446W ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: ISOTOP®
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 153 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 446 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 6.5 nF @ 25 V
Produkt ist nicht verfügbar
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1N5258B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5258B
Hersteller: Microchip Technology
Description: DIODE ZENER 36V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 27 V
Produkt ist nicht verfügbar
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DSC1121CM2-003.1152T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613C.pdf
DSC1121CM2-003.1152T
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±25ppm
Frequency: 3.1152 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JANTX1N5538BUR-1 1N5518BUR-1_1N5546BUR-1.pdf
JANTX1N5538BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 18V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 16.2 V
Qualification: MIL-PRF-19500/437
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JAN1N5529D-1 1N5518B_1N5546B-1.pdf
JAN1N5529D-1
Hersteller: Microchip Technology
Description: DIODE ZENER 9.1V 500MW DO204AH
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8.2 V
Qualification: MIL-PRF-19500/437
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JANTX1N5533DUR-1 1N5518BUR-1_1N5546BUR-1.pdf
JANTX1N5533DUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 500MW DO213AA
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
Qualification: MIL-PRF-19500/437
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JANTXV1N5534B-1 1N5518B_1N5546B-1.pdf
JANTXV1N5534B-1
Hersteller: Microchip Technology
Description: DIODE ZENER 14V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 12.6 V
Qualification: MIL-PRF-19500/437
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JANTXV1N5529BUR-1 1N5518BUR-1_1N5546BUR-1.pdf
JANTXV1N5529BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 9.1V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8.2 V
Qualification: MIL-PRF-19500/437
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JAN1N5529C-1 1N5518B_1N5546B-1.pdf
JAN1N5529C-1
Hersteller: Microchip Technology
Description: DIODE ZENER 9.1V 500MW DO204AH
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8.2 V
Qualification: MIL-PRF-19500/437
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