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LXS101-23-3 LXS101-23-3 Microchip Technology 150_LSX100_LSX700_Series.pdf Description: RF DIODE SCHOTTKY 8V 1A SOT23-3
Power Dissipation (Max): 250 mW
Current - Max: 1 A
Supplier Device Package: SOT-23-3
Voltage - Peak Reverse (Max): 8V
Capacitance @ Vr, F: 1pF @ 0V, 1MHz
Operating Temperature: -55°C ~ 125°C
Diode Type: Schottky - 1 Pair Common Anode
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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MCP6141T-E/OTVAO MCP6141T-E/OTVAO Microchip Technology 20001668E.pdf Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
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MCP6141T-E/OTVAO MCP6141T-E/OTVAO Microchip Technology 20001668E.pdf Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
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MCP6141T-E/SNVAO MCP6141T-E/SNVAO Microchip Technology 20001668E.pdf Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Voltage - Supply Span (Max): 6 V
Voltage - Supply Span (Min): 1.4 V
Current - Output / Channel: 20 mA
Number of Circuits: 1
Supplier Device Package: 8-SOIC
Voltage - Input Offset: 3 mV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 100 kHz
Slew Rate: 0.024V/µs
Current - Supply: 600nA
Operating Temperature: -40°C ~ 125°C (TA)
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single-Ended
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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ATA6502T-4BWVAO ATA6502T-4BWVAO Microchip Technology ATA6500T-4CWVAO.pdf Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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ATA6502T-4BWVAO ATA6502T-4BWVAO Microchip Technology ATA6500T-4CWVAO.pdf Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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JANTX1N5310UR-1 JANTX1N5310UR-1 Microchip Technology 1N5283UR-1_1N5314UR-1.pdf Description: DIODE CUR REG 100V 3.63MA 500MW
Qualification: MIL-PRF-19500/463
Voltage - Limiting (Max): 2.35V
Regulator Current (Max): 3.63mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Packaging: Bulk
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AT80C51SND1C-ROTUL AT80C51SND1C-ROTUL Microchip Technology doc4109s.pdf Description: IC MCU 8BIT ROMLESS 80TQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 80C51
Data Converters: A/D 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Connectivity: I2C, IDE/ATAPI, Memory Card, SPI, UART/USART, USB
Peripherals: Audio, I2S, MP3, PCM, POR, WDT
Supplier Device Package: 80-TQFP (14x14)
Number of I/O: 44
DigiKey Programmable: Not Verified
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PIC32CM3204JH00048-I/Y8X PIC32CM3204JH00048-I/Y8X Microchip Technology PIC32CM-JH00-JH01-Family-Data-Sheet-DS60001632.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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PIC32CM3204JH00048-I/U5B PIC32CM3204JH00048-I/U5B Microchip Technology PIC32CM-JH00-JH01-Family-Data-Sheet-DS60001632.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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PIC32CX5109BZ36048-V/ZWX PIC32CX5109BZ36048-V/ZWX Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
Current - Receiving: 14.5mA ~ 20mA
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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PIC32CX5109BZ36048T-V/ZWX Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Current - Receiving: 14.5mA ~ 20mA
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
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PIC32CX5109BZ36048T-V/ZWX Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
Current - Receiving: 14.5mA ~ 20mA
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PIC32CM3204JH00048T-I/Y8X PIC32CM3204JH00048T-I/Y8X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
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PIC32CM3204JH00048T-I/U5B PIC32CM3204JH00048T-I/U5B Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048T-I/Y8X Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048T-I/U5B Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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PIC32CM3204JH00048-E/Y8X PIC32CM3204JH00048-E/Y8X Microchip Technology Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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PIC32CM3204JH00048T-E/Y8X PIC32CM3204JH00048T-E/Y8X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
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PIC32CM3204JH00048-E/U5B PIC32CM3204JH00048-E/U5B Microchip Technology Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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PIC32CM3204JH00048T-E/U5B PIC32CM3204JH00048T-E/U5B Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048-E/Y8X Microchip Technology Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
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PIC32CM6408JH00048T-E/Y8X Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048-E/U5B Microchip Technology Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
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PIC32CM6408JH00048T-E/U5B Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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M1.5KE250A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 214VWM 344VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5A
Voltage - Reverse Standoff (Typ): 214V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 237V
Voltage - Clamping (Max) @ Ipp: 344V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32CZ4010CA80144-I/LUX PIC32CZ4010CA80144-I/LUX Microchip Technology PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf Description: CM7,4MB FLASH,CONNECTIVITY,144BG
Number of I/O: 108
Supplier Device Package: 144-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-TFBGA
Packaging: Tray
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PIC32CZ8110CA80144-I/LUX PIC32CZ8110CA80144-I/LUX Microchip Technology PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf Description: CM7,8MB FLASH,CONNECTIVITY,144BG
Number of I/O: 108
Supplier Device Package: 144-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 8MB (8M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-TFBGA
Packaging: Tray
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DSPIC33CK256MP405-E/M7 DSPIC33CK256MP405-E/M7 Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 48VFQFN
Number of I/O: 89
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
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BZV55C68 BZV55C68 Microchip Technology 150_8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 68V DO213AA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Supplier Device Package: DO-213AA
Voltage - Zener (Nom) (Vz): 68 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±6%
Packaging: Bulk
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JANTX1N5526BUR-1 JANTX1N5526BUR-1 Microchip Technology 1N5518BUR-1_1N5546BUR-1.pdf Description: DIODE ZENER 6.8V 500MW DO213AA
Qualification: MIL-PRF-19500/437
Current - Reverse Leakage @ Vr: 1 µA @ 6.2 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
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2N1715S 2N1715S Microchip Technology Description: TRANS NPN 100V 0.75A TO39
Voltage - Collector Emitter Breakdown (Max): 100 V
Current - Collector (Ic) (Max): 750 mA
Supplier Device Package: TO-39 (TO-205AD)
Operating Temperature: -65°C ~ 175°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AD, TO-39-3 Metal Can
Packaging: Bulk
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2N1715 2N1715 Microchip Technology Description: TRANS NPN 100V 1A TO-5AA
Voltage - Collector Emitter Breakdown (Max): 100 V
Current - Collector (Ic) (Max): 1 A
Supplier Device Package: TO-5AA
Operating Temperature: -65°C ~ 175°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AA, TO-5-3 Metal Can
Packaging: Bulk
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MSC030SMB120B4N Microchip Technology MSC030SMB120B4N-SiC-MOSFET-Datasheet.pdf Description: MOSFET SIC 1200 V 30 MOHM TO-247
Packaging: Tube
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DSC1001DI1-025.0008T DSC1001DI1-025.0008T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0008MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25.0008 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PIC18F97J60T-I/PF PIC18F97J60T-I/PF Microchip Technology 39762f.pdf Description: IC MCU 8BIT 128KB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 3808 x 8
Program Memory Size: 128KB (64K x 16)
Speed: 41.667MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tape & Reel (TR)
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PIC18F97J60T-I/PF PIC18F97J60T-I/PF Microchip Technology 39762f.pdf Description: IC MCU 8BIT 128KB FLASH 100TQFP
RAM Size: 3808 x 8
Program Memory Size: 128KB (64K x 16)
Speed: 41.667MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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DSPIC33EP256MU810T-I/PF DSPIC33EP256MU810T-I/PF Microchip Technology 70616g.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
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DSPIC33EP256MU810T-I/PF DSPIC33EP256MU810T-I/PF Microchip Technology 70616g.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
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APT34M60S/TR APT34M60S/TR Microchip Technology APT34M60B_S_C.pdf Description: MOSFET N-CH 600V 36A D3PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Power Dissipation (Max): 624W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
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APT34F60S/TR APT34F60S/TR Microchip Technology 6954-apt34f60b-apt34f60s-datasheet Description: MOSFET N-CH 600V 36A D3PAK
Supplier Device Package: D3Pak
Vgs(th) (Max) @ Id: 5V @ 1mA
Power Dissipation (Max): 624W (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
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AT91RM9200-QI-002-T AT91RM9200-QI-002-T Microchip Technology 1768s.pdf Description: IC MCU 32BIT 128KB ROM 208PQFP
DigiKey Programmable: Not Verified
Number of I/O: 122
Supplier Device Package: 208-PQFP (28x28)
Peripherals: POR
Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 16/32-Bit
Core Processor: ARM920T
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tape & Reel (TR)
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JANTX1N5639A JANTX1N5639A Microchip Technology LDS-0096-REV3.pdf Description: TVS DIODE 15.3VWM 25.2VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.5A
Voltage - Reverse Standoff (Typ): 15.3V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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1N5645A 1N5645A Microchip Technology LDS-0096-REV3.pdf Description: TVS DIODE 28.2VWM 45.7VC DO13
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 45.7V
Voltage - Breakdown (Min): 31.4V
Unidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 28.2V
Current - Peak Pulse (10/1000µs): 33A
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EV80L65A EV80L65A Microchip Technology dsPIC33AK512MPS512-General-Purpose-DIM-Info-Sheet-DS70005563.pdf Description: DSPIC33AK512MPS512 GP DIM
Platform: Dual-Inline Module (DIM)
Utilized IC / Part: dsPIC33AK512MPS512
Core Processor: dsPIC
Contents: Board(s)
Type: MCU 16-Bit
Mounting Type: Fixed
Packaging: Bulk
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MCP1827S-3302E/EBVAO Microchip Technology MCP1827S-3302E.pdf Description: 1.5A LDO REGULATOR
Packaging: Tube
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MCP1827ST-3302E/EBVAO Microchip Technology MCP1827S-3302E.pdf Description: 1.5A LDO REGULATOR
Packaging: Tape & Reel (TR)
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PIC16F15254-E/SP PIC16F15254-E/SP Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 7KB FLASH 28DIP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Number of I/O: 25
Supplier Device Package: 28-SPDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x10b SAR
Core Processor: PIC
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PIC16F15254-E/STX PIC16F15254-E/STX Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 7KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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MCP1317T-31LE/OT MCP1317T-31LE/OT Microchip Technology MCP131X-2X-Voltage-Supervisor-DS20001985E.pdf Description: IC SUPERVISOR 1 CHANNEL SOT23-5
DigiKey Programmable: Not Verified
Supplier Device Package: SOT-23-5
Voltage - Threshold: 3.1V
Reset Timeout: 140ms Minimum
Number of Voltages Monitored: 1
Operating Temperature: -40°C ~ 125°C (TA)
Reset: Active High
Type: Simple Reset/Power-On Reset
Output: Push-Pull, Totem Pole
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Packaging: Tape & Reel (TR)
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M5KP75A M5KP75A Microchip Technology rf01010_rb.pdf Description: TVS DIODE 75VWM 121VC DO204AR
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 121V
Voltage - Breakdown (Min): 83.3V
Unidirectional Channels: 1
Supplier Device Package: DO-204AR
Voltage - Reverse Standoff (Typ): 75V
Current - Peak Pulse (10/1000µs): 41A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
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TC1302B-PFVMF-VAO TC1302B-PFVMF-VAO Microchip Technology 21333C.pdf Description: IC REG LINEAR 1.5V/3.3V 8-DFN
Qualification: AEC-Q100
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.4V @ 150mA
PSRR: 58dB (100Hz)
Grade: Automotive
Control Features: Enable
Voltage - Output (Min/Fixed): 1.5V, 3.3V
Supplier Device Package: 8-DFN (3x3)
Number of Regulators: 2
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 180 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 300mA, 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-VDFN Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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DSC1001BL5-095.0000T DSC1001BL5-095.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 95 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
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DSC1001BL5-095.0000 DSC1001BL5-095.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 95 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 16.6mA
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DSC1001CL5-080.0000T DSC1001CL5-080.0000T Microchip Technology Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Supplier Device Package: 4-VDFN (3.2x2.5)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
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DSC1001CL5-080.0000 DSC1001CL5-080.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (3.2x2.5)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
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DSC1121CL5-080.0000T DSC1121CL5-080.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 35mA
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1121CL5-080.0000 DSC1121CL5-080.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Package / Case: 6-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 35mA
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Produkt ist nicht verfügbar
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AT91M42800A-33AU AT91M42800A-33AU Microchip Technology doc1779.pdf Description: IC MCU 16/32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 144-LQFP (20x20)
Peripherals: WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 16/32-Bit
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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USB2534D/UDX USB2534D/UDX Microchip Technology USB2534D-Data-Sheet-DS00005422.pdf Description: USB 2.0 HI-SPEED FOUR PORT HUB C
Supplier Device Package: 36-SQFN (6x6)
Standards: USB 2.0
Protocol: USB
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Interface: USB, GPIO, I2C, SMBus
Function: Hub Controller
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tray
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LXS101-23-3 150_LSX100_LSX700_Series.pdf
LXS101-23-3
Hersteller: Microchip Technology
Description: RF DIODE SCHOTTKY 8V 1A SOT23-3
Power Dissipation (Max): 250 mW
Current - Max: 1 A
Supplier Device Package: SOT-23-3
Voltage - Peak Reverse (Max): 8V
Capacitance @ Vr, F: 1pF @ 0V, 1MHz
Operating Temperature: -55°C ~ 125°C
Diode Type: Schottky - 1 Pair Common Anode
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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3+10.16 EUR
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MCP6141T-E/OTVAO 20001668E.pdf
MCP6141T-E/OTVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
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MCP6141T-E/OTVAO 20001668E.pdf
MCP6141T-E/OTVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
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MCP6141T-E/SNVAO 20001668E.pdf
MCP6141T-E/SNVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Voltage - Supply Span (Max): 6 V
Voltage - Supply Span (Min): 1.4 V
Current - Output / Channel: 20 mA
Number of Circuits: 1
Supplier Device Package: 8-SOIC
Voltage - Input Offset: 3 mV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 100 kHz
Slew Rate: 0.024V/µs
Current - Supply: 600nA
Operating Temperature: -40°C ~ 125°C (TA)
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single-Ended
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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ATA6502T-4BWVAO ATA6500T-4CWVAO.pdf
ATA6502T-4BWVAO
Hersteller: Microchip Technology
Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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ATA6502T-4BWVAO ATA6500T-4CWVAO.pdf
ATA6502T-4BWVAO
Hersteller: Microchip Technology
Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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JANTX1N5310UR-1 1N5283UR-1_1N5314UR-1.pdf
JANTX1N5310UR-1
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 3.63MA 500MW
Qualification: MIL-PRF-19500/463
Voltage - Limiting (Max): 2.35V
Regulator Current (Max): 3.63mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Packaging: Bulk
Produkt ist nicht verfügbar
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AT80C51SND1C-ROTUL doc4109s.pdf
AT80C51SND1C-ROTUL
Hersteller: Microchip Technology
Description: IC MCU 8BIT ROMLESS 80TQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 80C51
Data Converters: A/D 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Connectivity: I2C, IDE/ATAPI, Memory Card, SPI, UART/USART, USB
Peripherals: Audio, I2S, MP3, PCM, POR, WDT
Supplier Device Package: 80-TQFP (14x14)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-I/Y8X PIC32CM-JH00-JH01-Family-Data-Sheet-DS60001632.pdf
PIC32CM3204JH00048-I/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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10+2.09 EUR
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PIC32CM3204JH00048-I/U5B PIC32CM-JH00-JH01-Family-Data-Sheet-DS60001632.pdf
PIC32CM3204JH00048-I/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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PIC32CX5109BZ36048-V/ZWX PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
PIC32CX5109BZ36048-V/ZWX
Hersteller: Microchip Technology
Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
Current - Receiving: 14.5mA ~ 20mA
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 435 Stücke:
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PIC32CX5109BZ36048T-V/ZWX PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
Hersteller: Microchip Technology
Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Current - Receiving: 14.5mA ~ 20mA
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
Produkt ist nicht verfügbar
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PIC32CX5109BZ36048T-V/ZWX PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
Hersteller: Microchip Technology
Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
Current - Receiving: 14.5mA ~ 20mA
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PIC32CM3204JH00048T-I/Y8X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-I/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-I/U5B PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-I/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-I/Y8X PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-I/U5B PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-E/Y8X
PIC32CM3204JH00048-E/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-E/Y8X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-E/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-E/U5B
PIC32CM3204JH00048-E/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-E/U5B PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-E/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048-E/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-E/Y8X PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048-E/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-E/U5B PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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M1.5KE250A RF01008_rE.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 214VWM 344VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5A
Voltage - Reverse Standoff (Typ): 214V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 237V
Voltage - Clamping (Max) @ Ipp: 344V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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PIC32CZ4010CA80144-I/LUX PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf
PIC32CZ4010CA80144-I/LUX
Hersteller: Microchip Technology
Description: CM7,4MB FLASH,CONNECTIVITY,144BG
Number of I/O: 108
Supplier Device Package: 144-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-TFBGA
Packaging: Tray
auf Bestellung 184 Stücke:
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2+15.73 EUR
25+14.27 EUR
100+12.97 EUR
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PIC32CZ8110CA80144-I/LUX PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf
PIC32CZ8110CA80144-I/LUX
Hersteller: Microchip Technology
Description: CM7,8MB FLASH,CONNECTIVITY,144BG
Number of I/O: 108
Supplier Device Package: 144-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 8MB (8M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-TFBGA
Packaging: Tray
auf Bestellung 189 Stücke:
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2+18.54 EUR
25+16.83 EUR
100+15.3 EUR
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DSPIC33CK256MP405-E/M7 dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP405-E/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VFQFN
Number of I/O: 89
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 183 Stücke:
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4+5.32 EUR
25+4.83 EUR
100+4.39 EUR
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BZV55C68 150_8298-bzv55-c2v4-c75-pdf.pdf
BZV55C68
Hersteller: Microchip Technology
Description: DIODE ZENER 68V DO213AA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Supplier Device Package: DO-213AA
Voltage - Zener (Nom) (Vz): 68 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±6%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N5526BUR-1 1N5518BUR-1_1N5546BUR-1.pdf
JANTX1N5526BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO213AA
Qualification: MIL-PRF-19500/437
Current - Reverse Leakage @ Vr: 1 µA @ 6.2 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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2N1715S
2N1715S
Hersteller: Microchip Technology
Description: TRANS NPN 100V 0.75A TO39
Voltage - Collector Emitter Breakdown (Max): 100 V
Current - Collector (Ic) (Max): 750 mA
Supplier Device Package: TO-39 (TO-205AD)
Operating Temperature: -65°C ~ 175°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AD, TO-39-3 Metal Can
Packaging: Bulk
Produkt ist nicht verfügbar
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2N1715
2N1715
Hersteller: Microchip Technology
Description: TRANS NPN 100V 1A TO-5AA
Voltage - Collector Emitter Breakdown (Max): 100 V
Current - Collector (Ic) (Max): 1 A
Supplier Device Package: TO-5AA
Operating Temperature: -65°C ~ 175°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AA, TO-5-3 Metal Can
Packaging: Bulk
Produkt ist nicht verfügbar
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MSC030SMB120B4N MSC030SMB120B4N-SiC-MOSFET-Datasheet.pdf
Hersteller: Microchip Technology
Description: MOSFET SIC 1200 V 30 MOHM TO-247
Packaging: Tube
auf Bestellung 120 Stücke:
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1+21.11 EUR
25+19.47 EUR
100+16.95 EUR
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DSC1001DI1-025.0008T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DI1-025.0008T
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0008MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25.0008 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PIC18F97J60T-I/PF 39762f.pdf
PIC18F97J60T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 3808 x 8
Program Memory Size: 128KB (64K x 16)
Speed: 41.667MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC18F97J60T-I/PF 39762f.pdf
PIC18F97J60T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 100TQFP
RAM Size: 3808 x 8
Program Memory Size: 128KB (64K x 16)
Speed: 41.667MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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DSPIC33EP256MU810T-I/PF 70616g.pdf
DSPIC33EP256MU810T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSPIC33EP256MU810T-I/PF 70616g.pdf
DSPIC33EP256MU810T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
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APT34M60S/TR APT34M60B_S_C.pdf
APT34M60S/TR
Hersteller: Microchip Technology
Description: MOSFET N-CH 600V 36A D3PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Power Dissipation (Max): 624W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
Produkt ist nicht verfügbar
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APT34F60S/TR 6954-apt34f60b-apt34f60s-datasheet
APT34F60S/TR
Hersteller: Microchip Technology
Description: MOSFET N-CH 600V 36A D3PAK
Supplier Device Package: D3Pak
Vgs(th) (Max) @ Id: 5V @ 1mA
Power Dissipation (Max): 624W (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Produkt ist nicht verfügbar
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AT91RM9200-QI-002-T 1768s.pdf
AT91RM9200-QI-002-T
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB ROM 208PQFP
DigiKey Programmable: Not Verified
Number of I/O: 122
Supplier Device Package: 208-PQFP (28x28)
Peripherals: POR
Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 16/32-Bit
Core Processor: ARM920T
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANTX1N5639A LDS-0096-REV3.pdf
JANTX1N5639A
Hersteller: Microchip Technology
Description: TVS DIODE 15.3VWM 25.2VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.5A
Voltage - Reverse Standoff (Typ): 15.3V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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1N5645A LDS-0096-REV3.pdf
1N5645A
Hersteller: Microchip Technology
Description: TVS DIODE 28.2VWM 45.7VC DO13
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 45.7V
Voltage - Breakdown (Min): 31.4V
Unidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 28.2V
Current - Peak Pulse (10/1000µs): 33A
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EV80L65A dsPIC33AK512MPS512-General-Purpose-DIM-Info-Sheet-DS70005563.pdf
EV80L65A
Hersteller: Microchip Technology
Description: DSPIC33AK512MPS512 GP DIM
Platform: Dual-Inline Module (DIM)
Utilized IC / Part: dsPIC33AK512MPS512
Core Processor: dsPIC
Contents: Board(s)
Type: MCU 16-Bit
Mounting Type: Fixed
Packaging: Bulk
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MCP1827S-3302E/EBVAO MCP1827S-3302E.pdf
Hersteller: Microchip Technology
Description: 1.5A LDO REGULATOR
Packaging: Tube
Produkt ist nicht verfügbar
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MCP1827ST-3302E/EBVAO MCP1827S-3302E.pdf
Hersteller: Microchip Technology
Description: 1.5A LDO REGULATOR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC16F15254-E/SP PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15254-E/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28DIP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Number of I/O: 25
Supplier Device Package: 28-SPDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x10b SAR
Core Processor: PIC
auf Bestellung 355 Stücke:
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PIC16F15254-E/STX PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15254-E/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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16+1.36 EUR
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MCP1317T-31LE/OT MCP131X-2X-Voltage-Supervisor-DS20001985E.pdf
MCP1317T-31LE/OT
Hersteller: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT23-5
DigiKey Programmable: Not Verified
Supplier Device Package: SOT-23-5
Voltage - Threshold: 3.1V
Reset Timeout: 140ms Minimum
Number of Voltages Monitored: 1
Operating Temperature: -40°C ~ 125°C (TA)
Reset: Active High
Type: Simple Reset/Power-On Reset
Output: Push-Pull, Totem Pole
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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M5KP75A rf01010_rb.pdf
M5KP75A
Hersteller: Microchip Technology
Description: TVS DIODE 75VWM 121VC DO204AR
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 121V
Voltage - Breakdown (Min): 83.3V
Unidirectional Channels: 1
Supplier Device Package: DO-204AR
Voltage - Reverse Standoff (Typ): 75V
Current - Peak Pulse (10/1000µs): 41A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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TC1302B-PFVMF-VAO 21333C.pdf
TC1302B-PFVMF-VAO
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.5V/3.3V 8-DFN
Qualification: AEC-Q100
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.4V @ 150mA
PSRR: 58dB (100Hz)
Grade: Automotive
Control Features: Enable
Voltage - Output (Min/Fixed): 1.5V, 3.3V
Supplier Device Package: 8-DFN (3x3)
Number of Regulators: 2
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 180 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 300mA, 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-VDFN Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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DSC1001BL5-095.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BL5-095.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 95 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
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DSC1001BL5-095.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BL5-095.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 95 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 16.6mA
Produkt ist nicht verfügbar
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DSC1001CL5-080.0000T
DSC1001CL5-080.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Supplier Device Package: 4-VDFN (3.2x2.5)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1001CL5-080.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CL5-080.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (3.2x2.5)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1121CL5-080.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121CL5-080.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 35mA
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1121CL5-080.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121CL5-080.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Package / Case: 6-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 35mA
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Produkt ist nicht verfügbar
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AT91M42800A-33AU doc1779.pdf
AT91M42800A-33AU
Hersteller: Microchip Technology
Description: IC MCU 16/32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 144-LQFP (20x20)
Peripherals: WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 16/32-Bit
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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1+21.97 EUR
25+19.99 EUR
100+18.11 EUR
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USB2534D/UDX USB2534D-Data-Sheet-DS00005422.pdf
USB2534D/UDX
Hersteller: Microchip Technology
Description: USB 2.0 HI-SPEED FOUR PORT HUB C
Supplier Device Package: 36-SQFN (6x6)
Standards: USB 2.0
Protocol: USB
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Interface: USB, GPIO, I2C, SMBus
Function: Hub Controller
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 154 Stücke:
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3+9.65 EUR
25+8.04 EUR
100+7.78 EUR
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