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PIC32AK6416GC41048-I/M7 PIC32AK6416GC41048-I/M7 Microchip Technology PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
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25+2.66 EUR
100+2.42 EUR
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PIC32AK1216GC41048-I/M7 PIC32AK1216GC41048-I/M7 Microchip Technology PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Number of I/O: 35
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25+2.78 EUR
100+2.54 EUR
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DSPIC33AK32MC105T-I/M7 DSPIC33AK32MC105T-I/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC32AK3208GC41048T-I/M7 PIC32AK3208GC41048T-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
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DSPIC33AK64MC105T-I/M7 DSPIC33AK64MC105T-I/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Packaging: Tape & Reel (TR)
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PIC32AK6416GC41048T-I/M7 PIC32AK6416GC41048T-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC32AK3208GC41048-E/M7 PIC32AK3208GC41048-E/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Qualification: AEC-Q100
Number of I/O: 35
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
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DSPIC33AK32MC105T-E/M7 DSPIC33AK32MC105T-E/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Number of I/O: 35
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
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PIC32AK1216GC41048T-I/M7 PIC32AK1216GC41048T-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC32AK6416GC41048-E/M7 PIC32AK6416GC41048-E/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Qualification: AEC-Q100
Number of I/O: 35
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
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DSPIC33AK64MC105T-E/M7 DSPIC33AK64MC105T-E/M7 Microchip Technology dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Number of I/O: 35
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Packaging: Tape & Reel (TR)
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PIC32AK1216GC41048-E/M7 PIC32AK1216GC41048-E/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Qualification: AEC-Q100
Number of I/O: 35
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
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MCP73833-96I/MF Microchip Technology MCP73833-4-Stand-Alone-Linear-Li-Ion-Li-Polymer-Charge-Management-Controller-DS20002005.pdf Description: 1A ADVANCED SINGLE CELL, FULLY I
Packaging: Tube
Package / Case: 10-VFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 10-DFN (3x3)
Charge Current - Max: 1.1A
Programmable Features: Current
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.45V
Current - Charging: Constant - Programmable
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25+1.4 EUR
100+1.27 EUR
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MCP73833T-96I/MF Microchip Technology MCP73833 Description: 1A ADVANCED SINGLE CELL, FULLY I
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 10-DFN (3x3)
Charge Current - Max: 1A
Programmable Features: Current
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.45V
Current - Charging: Constant - Programmable
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DSA1001CL1-049.1520VAO DSA1001CL1-049.1520VAO Microchip Technology DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889A.pdf Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 7.1mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 49.152 MHz
Base Resonator: MEMS
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DSA1001CL1-040.0000VAO DSA1001CL1-040.0000VAO Microchip Technology DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889A.pdf Description: MEMS OSC, AUTO, LVCMOS, 40MHZ, 5
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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DSA1001CL1-049.1520TVAO DSA1001CL1-049.1520TVAO Microchip Technology DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889A.pdf Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 7.1mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 49.152 MHz
Base Resonator: MEMS
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DSA1001CL1-040.0000TVAO DSA1001CL1-040.0000TVAO Microchip Technology DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889A.pdf Description: MEMS OSC, AUTO, LVCMOS, 40MHZ, 5
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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2N5884 2N5884 Microchip Technology 2n5883-d.pdf Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
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DSPIC33CK256MC105-I/M7 DSPIC33CK256MC105-I/M7 Microchip Technology dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf Description: IC MCU 16BIT 256KB FLASH 48VQFN
DigiKey Programmable: Not Verified
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, IrDA, LINbus, SmartCard, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
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25+2.28 EUR
100+2.08 EUR
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dsPIC33CK256MC105T-I/M7 dsPIC33CK256MC105T-I/M7 Microchip Technology dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf Description: IC MCU 16BIT 256KB FLASH 48VQFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, IrDA, LINbus, SmartCard, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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dsPIC33CK256MC505T-I/M7 dsPIC33CK256MC505T-I/M7 Microchip Technology dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf Description: IC MCU 16BIT 256KB FLASH 48VQFN
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
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dsPIC33CK256MC505-E/M7 dsPIC33CK256MC505-E/M7 Microchip Technology dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf Description: IC MCU 16BIT 256KB FLASH 48VQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
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ATSAM3S1AA-MUR ATSAM3S1AA-MUR Microchip Technology SAM3S_Series.pdf Description: IC MCU 32BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-QFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10/12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC32CM2532LE00048-E/U5B PIC32CM2532LE00048-E/U5B Microchip Technology 60001615E.pdf Description: CM23, ULP, TOUCH, 256K FLASH, 48
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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PIC32CM2532LE00048T-E/U5B PIC32CM2532LE00048T-E/U5B Microchip Technology 60001615E.pdf Description: CM23, ULP, TOUCH, 256K FLASH, 48
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
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PIC32CM2532LS00048-E/U5B PIC32CM2532LS00048-E/U5B Microchip Technology 60001615E.pdf Description: CM23, ULP, TOUCH, SECURITY, 256K
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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PIC32CM2532LS00048T-E/U5B PIC32CM2532LS00048T-E/U5B Microchip Technology 60001615E.pdf Description: CM23, ULP, TOUCH, SECURITY, 256K
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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1N5246 1N5246 Microchip Technology LDS-0232.pdf Description: DIODE ZENER 16V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11.4 V
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1N759A 1N759A Microchip Technology 1N746A-1-1N759A-1_1N4370A-1-1N4372A-1.pdf Description: DIODE ZENER 12V 500MW DO204AH
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 1 µA @ 9 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 12 V
auf Bestellung 42 Stücke:
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APTGX600SK120T6G APTGX600SK120T6G Microchip Technology APTGX600SK120T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1200V 805A 1.923KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 805 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1923 W
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V
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MO-9150AE-6E-HS-133M000000 Microchip Technology Description: MEMS BASED XO +2.5 VDC -40C TO +
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC18F55Q43-I/6LX PIC18F55Q43-I/6LX Microchip Technology PIC18F25-45-55Q43-Data-Sheet-40002170E.pdf Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
auf Bestellung 284 Stücke:
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7+2.59 EUR
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100+2.14 EUR
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PIC18F55Q43-E/6LX PIC18F55Q43-E/6LX Microchip Technology PIC18F25-45-55Q43-Data-Sheet-40002170E.pdf Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
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7+2.85 EUR
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1N5261B 1N5261B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 47V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 36 V
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UPT17E3/TR7 UPT17E3/TR7 Microchip Technology UPT+RF01103_Rev_B_Final-PD-000177967+%284%29.pdf Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
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MAUPT17 MAUPT17 Microchip Technology Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
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MAUPT17e3 MAUPT17e3 Microchip Technology Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
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JANTX1N4957C Microchip Technology 1N4954-1N4996%2C15968-1N5969%2C1N6632-1N6637.pdf Description: DIODE ZENER 9.1V 5W E-AXIAL
Tolerance: ±2%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 2 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 25 µA @ 6.9 V
Qualification: MIL-PRF-19500/435
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MCP1725-1802E/MCVAO Microchip Technology MCP1725-500-mA%2C-Low-Voltage%2C-Low-Quiescent-Current-LDO-Regulator-20002026C.pdf Description: 500MA, LOW VOLTAGE LDO
Packaging: Tube
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MCP1405T-E/SNVAO MCP1405T-E/SNVAO Microchip Technology 22022b.pdf Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MCP1405T-E/SNVAO MCP1405T-E/SNVAO Microchip Technology 22022b.pdf Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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VCC1-1519-12M28800000 Microchip Technology VCC1-April-2020.pdf Description: CUSTOM CMOS XO
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Height - Seated (Max): 0.075" (1.90mm)
Frequency: 12.288 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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MPFS-ICICLE-KIT MPFS-ICICLE-KIT Microchip Technology microchip_polarfire_soc_fpga_icicle_kit_user_guide_vb.pdf Description: POLARFIRE SOC FPGA ICICLE KIT
Packaging: Bulk
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MPFS250
Platform: PolarFire SoC FPGA SiFive RISC-V Icicle
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1+632.81 EUR
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EV25F14A EV25F14A Microchip Technology RNBD451-Add-On-Board-User-Guide-DS50003476.pdf Description: RNBD451 ADD ON BOARD
Packaging: Box
Function: Bluetooth Low Energy (BLE)
Type: RF
Contents: Board(s)
Utilized IC / Part: RNBD451
Platform: mikroBUS™ Click™
auf Bestellung 27 Stücke:
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dsPIC33AK256MC505-I/M7 dsPIC33AK256MC505-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 305 Stücke:
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5+4.29 EUR
25+3.89 EUR
100+3.54 EUR
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dsPIC33AK512MC205-I/M7 dsPIC33AK512MC205-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 555 Stücke:
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5+4.33 EUR
25+3.94 EUR
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dsPIC33AK512MC505-I/M7 dsPIC33AK512MC505-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 555 Stücke:
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4+4.4 EUR
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dsPIC33AK256MPS205-I/M7 dsPIC33AK256MPS205-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 295 Stücke:
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4+4.59 EUR
25+4.16 EUR
100+3.79 EUR
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dsPIC33AK512MPS205-I/M7 dsPIC33AK512MPS205-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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4+4.7 EUR
25+4.27 EUR
100+3.88 EUR
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DSPIC33AK256MC205-I/M7 DSPIC33AK256MC205-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 244 Stücke:
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5+4.22 EUR
25+3.83 EUR
100+3.5 EUR
Mindestbestellmenge: 5 Stücke
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MO9168 Microchip Technology Description: CLOCK OSCILLATOR
Packaging: Tray
Produkt ist nicht verfügbar
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DSC1001CE1-037.1250T DSC1001CE1-037.1250T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CE1-037.1250 DSC1001CE1-037.1250 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MSC010SDA070S MSC010SDA070S Microchip Technology 00003841A_MSC010SDA070S_SiC_SBD_Datasheet.pdf Description: DIODE SIL CARBIDE 700V 10A D3PAK
Packaging: Bulk
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Current - Average Rectified (Io): 10A
Supplier Device Package: D3Pak
Voltage - DC Reverse (Vr) (Max): 700 V
Produkt ist nicht verfügbar
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EV18H47A EV18H47A Microchip Technology Motor-Control-Low-Voltage-48V-300W-Inverter-Board-Users-Guide-DS50003297.pdf Description: EVAL BOARD FOR ATSAME70N21
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: ATSAME70N21
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
1+356.61 EUR
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EV42J24A EV42J24A Microchip Technology Description: CEC1736 EVALUATION BOARD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: CEC1736
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1+760.69 EUR
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VX-805-ECE-KEXN-204M800000 Microchip Technology VX-805-April-2020.pdf Description: LOW NOISE CERAMIC VCXO +3.3 VDC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANS1N6319CUS JANS1N6319CUS Microchip Technology Description: DIODE ZENER 6.2V 500MW SQ-MELF
Tolerance: ±2%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
Qualification: MIL-PRF-19500/533
Produkt ist nicht verfügbar
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MIC2951-03BN MIC2951-03BN Microchip Technology mic2950.pdf Description: IC REG LIN POS ADJ 150MA 8-PDIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Adjustable (Fixed)
Mounting Type: Through Hole
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 300 µA
Voltage - Input (Max): 30V
Number of Regulators: 1
Supplier Device Package: 8-PDIP
Voltage - Output (Max): 29V
Voltage - Output (Min/Fixed): 1.24V (5V)
Control Features: Enable
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 8 mA
Produkt ist nicht verfügbar
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PIC32AK6416GC41048-I/M7 PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf
PIC32AK6416GC41048-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 250 Stücke:
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AnzahlPreis
6+2.94 EUR
25+2.66 EUR
100+2.42 EUR
Mindestbestellmenge: 6 Stücke
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PIC32AK1216GC41048-I/M7 PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf
PIC32AK1216GC41048-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Number of I/O: 35
auf Bestellung 245 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
6+3.06 EUR
25+2.78 EUR
100+2.54 EUR
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DSPIC33AK32MC105T-I/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK32MC105T-I/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32AK3208GC41048T-I/M7
PIC32AK3208GC41048T-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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DSPIC33AK64MC105T-I/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK64MC105T-I/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32AK6416GC41048T-I/M7
PIC32AK6416GC41048T-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32AK3208GC41048-E/M7
PIC32AK3208GC41048-E/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Qualification: AEC-Q100
Number of I/O: 35
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK32MC105T-E/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK32MC105T-E/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 32K FLASH
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Number of I/O: 35
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Produkt ist nicht verfügbar
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PIC32AK1216GC41048T-I/M7
PIC32AK1216GC41048T-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Number of I/O: 35
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32AK6416GC41048-E/M7
PIC32AK6416GC41048-E/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Qualification: AEC-Q100
Number of I/O: 35
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33AK64MC105T-E/M7 dsPIC33AK128MC106-Family-Data-Sheet-DS70005539.pdf
DSPIC33AK64MC105T-E/M7
Hersteller: Microchip Technology
Description: DSPIC33A, FPU, 200MHZ, 64K FLASH
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Qualification: AEC-Q100
Number of I/O: 35
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32AK1216GC41048-E/M7
PIC32AK1216GC41048-E/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Qualification: AEC-Q100
Number of I/O: 35
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MCP73833-96I/MF MCP73833-4-Stand-Alone-Linear-Li-Ion-Li-Polymer-Charge-Management-Controller-DS20002005.pdf
Hersteller: Microchip Technology
Description: 1A ADVANCED SINGLE CELL, FULLY I
Packaging: Tube
Package / Case: 10-VFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 10-DFN (3x3)
Charge Current - Max: 1.1A
Programmable Features: Current
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.45V
Current - Charging: Constant - Programmable
auf Bestellung 480 Stücke:
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AnzahlPreis
11+1.69 EUR
25+1.4 EUR
100+1.27 EUR
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MCP73833T-96I/MF MCP73833
Hersteller: Microchip Technology
Description: 1A ADVANCED SINGLE CELL, FULLY I
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 10-DFN (3x3)
Charge Current - Max: 1A
Programmable Features: Current
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.45V
Current - Charging: Constant - Programmable
Produkt ist nicht verfügbar
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DSA1001CL1-049.1520VAO DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889A.pdf
DSA1001CL1-049.1520VAO
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 7.1mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 49.152 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1001CL1-040.0000VAO DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889A.pdf
DSA1001CL1-040.0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVCMOS, 40MHZ, 5
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1001CL1-049.1520TVAO DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889A.pdf
DSA1001CL1-049.1520TVAO
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 7.1mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 49.152 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1001CL1-040.0000TVAO DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889A.pdf
DSA1001CL1-040.0000TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVCMOS, 40MHZ, 5
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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2N5884 2n5883-d.pdf
2N5884
Hersteller: Microchip Technology
Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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DSPIC33CK256MC105-I/M7 dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf
DSPIC33CK256MC105-I/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VQFN
DigiKey Programmable: Not Verified
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, IrDA, LINbus, SmartCard, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
auf Bestellung 191 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
7+2.52 EUR
25+2.28 EUR
100+2.08 EUR
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dsPIC33CK256MC105T-I/M7 dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf
dsPIC33CK256MC105T-I/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VQFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, IrDA, LINbus, SmartCard, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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dsPIC33CK256MC505T-I/M7 dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf
dsPIC33CK256MC505T-I/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VQFN
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Produkt ist nicht verfügbar
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dsPIC33CK256MC505-E/M7 dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf
dsPIC33CK256MC505-E/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
Produkt ist nicht verfügbar
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ATSAM3S1AA-MUR SAM3S_Series.pdf
ATSAM3S1AA-MUR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-QFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10/12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM2532LE00048-E/U5B 60001615E.pdf
PIC32CM2532LE00048-E/U5B
Hersteller: Microchip Technology
Description: CM23, ULP, TOUCH, 256K FLASH, 48
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM2532LE00048T-E/U5B 60001615E.pdf
PIC32CM2532LE00048T-E/U5B
Hersteller: Microchip Technology
Description: CM23, ULP, TOUCH, 256K FLASH, 48
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Produkt ist nicht verfügbar
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PIC32CM2532LS00048-E/U5B 60001615E.pdf
PIC32CM2532LS00048-E/U5B
Hersteller: Microchip Technology
Description: CM23, ULP, TOUCH, SECURITY, 256K
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM2532LS00048T-E/U5B 60001615E.pdf
PIC32CM2532LS00048T-E/U5B
Hersteller: Microchip Technology
Description: CM23, ULP, TOUCH, SECURITY, 256K
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N5246 LDS-0232.pdf
1N5246
Hersteller: Microchip Technology
Description: DIODE ZENER 16V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11.4 V
Produkt ist nicht verfügbar
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1N759A 1N746A-1-1N759A-1_1N4370A-1-1N4372A-1.pdf
1N759A
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO204AH
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 1 µA @ 9 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 12 V
auf Bestellung 42 Stücke:
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AnzahlPreis
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APTGX600SK120T6G APTGX600SK120T6G-IGBT-Module-Datasheet.pdf
APTGX600SK120T6G
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 805A 1.923KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 805 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1923 W
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V
auf Bestellung 4 Stücke:
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AnzahlPreis
1+278.54 EUR
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MO-9150AE-6E-HS-133M000000
Hersteller: Microchip Technology
Description: MEMS BASED XO +2.5 VDC -40C TO +
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC18F55Q43-I/6LX PIC18F25-45-55Q43-Data-Sheet-40002170E.pdf
PIC18F55Q43-I/6LX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
auf Bestellung 284 Stücke:
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AnzahlPreis
7+2.59 EUR
25+2.37 EUR
100+2.14 EUR
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PIC18F55Q43-E/6LX PIC18F25-45-55Q43-Data-Sheet-40002170E.pdf
PIC18F55Q43-E/6LX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
auf Bestellung 181 Stücke:
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AnzahlPreis
7+2.85 EUR
25+2.6 EUR
100+2.36 EUR
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1N5261B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5261B
Hersteller: Microchip Technology
Description: DIODE ZENER 47V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 36 V
Produkt ist nicht verfügbar
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UPT17E3/TR7 UPT+RF01103_Rev_B_Final-PD-000177967+%284%29.pdf
UPT17E3/TR7
Hersteller: Microchip Technology
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MAUPT17
MAUPT17
Hersteller: Microchip Technology
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MAUPT17e3
MAUPT17e3
Hersteller: Microchip Technology
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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JANTX1N4957C 1N4954-1N4996%2C15968-1N5969%2C1N6632-1N6637.pdf
Hersteller: Microchip Technology
Description: DIODE ZENER 9.1V 5W E-AXIAL
Tolerance: ±2%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 2 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 25 µA @ 6.9 V
Qualification: MIL-PRF-19500/435
Produkt ist nicht verfügbar
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MCP1725-1802E/MCVAO MCP1725-500-mA%2C-Low-Voltage%2C-Low-Quiescent-Current-LDO-Regulator-20002026C.pdf
Hersteller: Microchip Technology
Description: 500MA, LOW VOLTAGE LDO
Packaging: Tube
Produkt ist nicht verfügbar
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MCP1405T-E/SNVAO 22022b.pdf
MCP1405T-E/SNVAO
Hersteller: Microchip Technology
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP1405T-E/SNVAO 22022b.pdf
MCP1405T-E/SNVAO
Hersteller: Microchip Technology
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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VCC1-1519-12M28800000 VCC1-April-2020.pdf
Hersteller: Microchip Technology
Description: CUSTOM CMOS XO
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Height - Seated (Max): 0.075" (1.90mm)
Frequency: 12.288 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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MPFS-ICICLE-KIT microchip_polarfire_soc_fpga_icicle_kit_user_guide_vb.pdf
MPFS-ICICLE-KIT
Hersteller: Microchip Technology
Description: POLARFIRE SOC FPGA ICICLE KIT
Packaging: Bulk
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MPFS250
Platform: PolarFire SoC FPGA SiFive RISC-V Icicle
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+632.81 EUR
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EV25F14A RNBD451-Add-On-Board-User-Guide-DS50003476.pdf
EV25F14A
Hersteller: Microchip Technology
Description: RNBD451 ADD ON BOARD
Packaging: Box
Function: Bluetooth Low Energy (BLE)
Type: RF
Contents: Board(s)
Utilized IC / Part: RNBD451
Platform: mikroBUS™ Click™
auf Bestellung 27 Stücke:
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AnzahlPreis
1+24.24 EUR
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dsPIC33AK256MC505-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
dsPIC33AK256MC505-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 305 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+4.29 EUR
25+3.89 EUR
100+3.54 EUR
Mindestbestellmenge: 5 Stücke
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dsPIC33AK512MC205-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
dsPIC33AK512MC205-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 555 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+4.33 EUR
25+3.94 EUR
100+3.59 EUR
Mindestbestellmenge: 5 Stücke
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dsPIC33AK512MC505-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
dsPIC33AK512MC505-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 555 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+4.4 EUR
25+3.98 EUR
100+3.63 EUR
Mindestbestellmenge: 4 Stücke
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dsPIC33AK256MPS205-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
dsPIC33AK256MPS205-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 295 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+4.59 EUR
25+4.16 EUR
100+3.79 EUR
Mindestbestellmenge: 4 Stücke
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dsPIC33AK512MPS205-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
dsPIC33AK512MPS205-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 226 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+4.7 EUR
25+4.27 EUR
100+3.88 EUR
Mindestbestellmenge: 4 Stücke
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DSPIC33AK256MC205-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
DSPIC33AK256MC205-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 244 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+4.22 EUR
25+3.83 EUR
100+3.5 EUR
Mindestbestellmenge: 5 Stücke
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MO9168
Hersteller: Microchip Technology
Description: CLOCK OSCILLATOR
Packaging: Tray
Produkt ist nicht verfügbar
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DSC1001CE1-037.1250T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CE1-037.1250T
Hersteller: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CE1-037.1250 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CE1-037.1250
Hersteller: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MSC010SDA070S 00003841A_MSC010SDA070S_SiC_SBD_Datasheet.pdf
MSC010SDA070S
Hersteller: Microchip Technology
Description: DIODE SIL CARBIDE 700V 10A D3PAK
Packaging: Bulk
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Current - Average Rectified (Io): 10A
Supplier Device Package: D3Pak
Voltage - DC Reverse (Vr) (Max): 700 V
Produkt ist nicht verfügbar
Mindestbestellmenge: 270 Stücke
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EV18H47A Motor-Control-Low-Voltage-48V-300W-Inverter-Board-Users-Guide-DS50003297.pdf
EV18H47A
Hersteller: Microchip Technology
Description: EVAL BOARD FOR ATSAME70N21
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: ATSAME70N21
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+356.61 EUR
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EV42J24A
EV42J24A
Hersteller: Microchip Technology
Description: CEC1736 EVALUATION BOARD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: CEC1736
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+760.69 EUR
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VX-805-ECE-KEXN-204M800000 VX-805-April-2020.pdf
Hersteller: Microchip Technology
Description: LOW NOISE CERAMIC VCXO +3.3 VDC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANS1N6319CUS
JANS1N6319CUS
Hersteller: Microchip Technology
Description: DIODE ZENER 6.2V 500MW SQ-MELF
Tolerance: ±2%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
Qualification: MIL-PRF-19500/533
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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MIC2951-03BN mic2950.pdf
MIC2951-03BN
Hersteller: Microchip Technology
Description: IC REG LIN POS ADJ 150MA 8-PDIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Adjustable (Fixed)
Mounting Type: Through Hole
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 300 µA
Voltage - Input (Max): 30V
Number of Regulators: 1
Supplier Device Package: 8-PDIP
Voltage - Output (Max): 29V
Voltage - Output (Min/Fixed): 1.24V (5V)
Control Features: Enable
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 8 mA
Produkt ist nicht verfügbar
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