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PIC32CM6408JH00048-E/Y8X Microchip Technology Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-E/Y8X Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048-E/U5B Microchip Technology Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-E/U5B Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SG2524N SG2524N Microchip Technology sg1524_rev1.2.pdf Description: IC REG CTRLR MULT TOPOLOGY 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Transistor Driver
Mounting Type: Through Hole
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 300kHz
Topology: Buck, Flyback, Push-Pull
Voltage - Supply (Vcc/Vdd): 8V ~ 40V
Supplier Device Package: 16-PDIP
Synchronous Rectifier: Yes
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 49%
Clock Sync: No
Number of Outputs: 2
Produkt ist nicht verfügbar
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M1.5KE250A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 214VWM 344VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5A
Voltage - Reverse Standoff (Typ): 214V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 237V
Voltage - Clamping (Max) @ Ipp: 344V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32CZ4010CA80144-I/LUX PIC32CZ4010CA80144-I/LUX Microchip Technology PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf Description: CM7,4MB FLASH,CONNECTIVITY,144BG
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
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PIC32CZ8110CA80144-I/LUX PIC32CZ8110CA80144-I/LUX Microchip Technology PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf Description: CM7,8MB FLASH,CONNECTIVITY,144BG
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
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DSPIC33CK256MP405-E/M7 DSPIC33CK256MP405-E/M7 Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 48VFQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 89
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TL431AILP TL431AILP Microchip Technology TL431%28A%2CB%29.pdf description Description: IC VREF SHUNT ADJ 1% TO92-3
Tolerance: ±1%
Packaging: Strip
Package / Case: TO-226-3, TO-92-3 Long Body
Temperature Coefficient: 30ppm/°C Typical
Output Type: Adjustable
Mounting Type: Through Hole
Reference Type: Shunt
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: TO-92 (TO-226)
Voltage - Output (Min/Fixed): 2.5V
Current - Cathode: 1 mA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Produkt ist nicht verfügbar
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BZV55C68 BZV55C68 Microchip Technology 150_8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 68V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 68 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
Produkt ist nicht verfügbar
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JANTX1N5526BUR-1 JANTX1N5526BUR-1 Microchip Technology 1N5518BUR-1_1N5546BUR-1.pdf Description: DIODE ZENER 6.8V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 6.2 V
Qualification: MIL-PRF-19500/437
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1N4746A 1N4746A Microchip Technology 1N4728AG_1N4764AG_e3.pdf Description: DIODE ZENER 18V 1W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1 W
Current - Reverse Leakage @ Vr: 5 µA @ 13.7 V
Produkt ist nicht verfügbar
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2N1715S 2N1715S Microchip Technology Description: TRANS NPN 100V 0.75A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 750 mA
Voltage - Collector Emitter Breakdown (Max): 100 V
Produkt ist nicht verfügbar
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2N1715 2N1715 Microchip Technology Description: TRANS NPN 100V 1A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Produkt ist nicht verfügbar
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MSC030SMB120B4N Microchip Technology MSC030SMB120B4N-SiC-MOSFET-Datasheet.pdf Description: MOSFET SIC 1200 V 30 MOHM TO-247
Packaging: Tube
auf Bestellung 120 Stücke:
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1+17.74 EUR
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100+14.24 EUR
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DSC1001DI1-025.0008T DSC1001DI1-025.0008T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0008MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25.0008 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PIC18F97J60T-I/PF PIC18F97J60T-I/PF Microchip Technology 39762f.pdf Description: IC MCU 8BIT 128KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 41.667MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 3808 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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PIC18F97J60T-I/PF PIC18F97J60T-I/PF Microchip Technology 39762f.pdf Description: IC MCU 8BIT 128KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 41.667MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 3808 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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2+12.3 EUR
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100+10.22 EUR
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DSPIC33EP256MU810T-I/PF DSPIC33EP256MU810T-I/PF Microchip Technology 70616g.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSPIC33EP256MU810T-I/PF DSPIC33EP256MU810T-I/PF Microchip Technology 70616g.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
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25+15.19 EUR
100+13.74 EUR
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APT34M60S/TR APT34M60S/TR Microchip Technology APT34M60B_S_C.pdf Description: MOSFET N-CH 600V 36A D3PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Power Dissipation (Max): 624W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
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APT34F60S/TR APT34F60S/TR Microchip Technology 6954-apt34f60b-apt34f60s-datasheet Description: MOSFET N-CH 600V 36A D3PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Power Dissipation (Max): 624W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
Produkt ist nicht verfügbar
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AT91RM9200-QI-002-T AT91RM9200-QI-002-T Microchip Technology 1768s.pdf Description: IC MCU 32BIT 128KB ROM 208PQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM920T
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART, USB
Peripherals: POR
Supplier Device Package: 208-PQFP (28x28)
Number of I/O: 122
DigiKey Programmable: Not Verified
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LM2576BT LM2576BT Microchip Technology lm2576.pdf Description: IC REG BUCK ADJ 3A TO220-5
Packaging: Tube
Package / Case: TO-220-5
Output Type: Adjustable
Mounting Type: Through Hole
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-220-5
Synchronous Rectifier: No
Voltage - Output (Max): 37V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 1.23V
Produkt ist nicht verfügbar
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JANTX1N5639A JANTX1N5639A Microchip Technology LDS-0096-REV3.pdf Description: TVS DIODE 15.3VWM 25.2VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.5A
Voltage - Reverse Standoff (Typ): 15.3V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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1+84.25 EUR
100+78.24 EUR
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1N5645A 1N5645A Microchip Technology LDS-0096-REV3.pdf Description: TVS DIODE 28.2VWM 45.7VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28.2V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
auf Bestellung 83 Stücke:
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EV80L65A EV80L65A Microchip Technology dsPIC33AK512MPS512-General-Purpose-DIM-Info-Sheet-DS70005563.pdf Description: DSPIC33AK512MPS512 GP DIM
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: dsPIC
Utilized IC / Part: dsPIC33AK512MPS512
Platform: Dual-Inline Module (DIM)
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1+20.13 EUR
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MCP1827S-3302E/EBVAO Microchip Technology MCP1827S-3302E.pdf Description: 1.5A LDO REGULATOR
Packaging: Tube
Produkt ist nicht verfügbar
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MCP1827ST-3302E/EBVAO Microchip Technology MCP1827S-3302E.pdf Description: 1.5A LDO REGULATOR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC16F15254-E/SP PIC16F15254-E/SP Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 7KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 25
auf Bestellung 355 Stücke:
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6+3.26 EUR
25+2.96 EUR
100+2.68 EUR
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PIC16F15254-E/STX PIC16F15254-E/STX Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 7KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
auf Bestellung 814 Stücke:
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16+1.14 EUR
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100+0.94 EUR
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MCP1317T-31LE/OT MCP1317T-31LE/OT Microchip Technology MCP131X-2X-Voltage-Supervisor-DS20001985E.pdf Description: IC SUPERVISOR 1 CHANNEL SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 3.1V
Supplier Device Package: SOT-23-5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M5KP75A M5KP75A Microchip Technology rf01010_rb.pdf Description: TVS DIODE 75VWM 121VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 41A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 83.3V
Voltage - Clamping (Max) @ Ipp: 121V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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TC1302B-PFVMF-VAO TC1302B-PFVMF-VAO Microchip Technology 21333C.pdf Description: IC REG LINEAR 1.5V/3.3V 8-DFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA, 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 180 µA
Voltage - Input (Max): 6V
Number of Regulators: 2
Supplier Device Package: 8-DFN (3x3)
Voltage - Output (Min/Fixed): 1.5V, 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 58dB (100Hz)
Voltage Dropout (Max): 0.4V @ 150mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
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DSC1001BL5-095.0000T DSC1001BL5-095.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 95 MHz
Base Resonator: MEMS
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DSC1001BL5-095.0000 DSC1001BL5-095.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 95 MHz
Base Resonator: MEMS
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DSC1001CL5-080.0000T DSC1001CL5-080.0000T Microchip Technology Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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DSC1001CL5-080.0000 DSC1001CL5-080.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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DSC1121CL5-080.0000T DSC1121CL5-080.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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DSC1121CL5-080.0000 DSC1121CL5-080.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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1N5822G Microchip Technology 1n5820-d.pdf Description: DIODE SCHOTTKY B
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Technology: Schottky
Supplier Device Package: B
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AT91M42800A-33AU AT91M42800A-33AU Microchip Technology doc1779.pdf Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 54
DigiKey Programmable: Not Verified
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USB2534D/UDX USB2534D/UDX Microchip Technology USB2534D-Data-Sheet-DS00005422.pdf Description: USB 2.0 HI-SPEED FOUR PORT HUB C
Packaging: Tray
Package / Case: 36-VFQFN Exposed Pad
Function: Hub Controller
Interface: USB, GPIO, I2C, SMBus
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 36-SQFN (6x6)
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ATF22V10C-10SC ATF22V10C-10SC Microchip Technology doc0735.pdf Description: IC PLD 10MC 10NS 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V
Programmable Type: EE PLD
Number of Macrocells: 10
Supplier Device Package: 24-SOIC
Speed: 10 ns
DigiKey Programmable: Verified
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ATF22V10CQZ-20SC ATF22V10CQZ-20SC Microchip Technology doc0778.pdf Description: IC PLD 10MC 20NS 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V
Programmable Type: EE PLD
Number of Macrocells: 10
Supplier Device Package: 24-SOIC
Speed: 20 ns
DigiKey Programmable: Not Verified
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1N5231 1N5231 Microchip Technology LDS-0232.pdf Description: DIODE ZENER 5.1V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1.9 V
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BZV55C3V3 BZV55C3V3 Microchip Technology 8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 3.3V DO213AA
Tolerance: ±6.06%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
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DSC1123CI2-333.3300T DSC1123CI2-333.3300T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 333.3300MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 333.33 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1123CI2-333.3333T DSC1123CI2-333.3333T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 333.3333MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 333.3333 MHz
Base Resonator: MEMS
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DSC1123CI2-333.3300 DSC1123CI2-333.3300 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 333.3300MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 333.33 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1123CI2-333.3333 DSC1123CI2-333.3333 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 333.3333MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 333.3333 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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1N4732A 1N4732A Microchip Technology 10911-sa5-33-pdf.pdf Description: DIODE ZENER 4.7V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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M5KP30CA M5KP30CA Microchip Technology rf01010_rb.pdf Description: TVS DIODE 30VWM 48.4VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 103A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP28CAE3/TR M5KP28CAE3/TR Microchip Technology rf01010_rb.pdf Description: TVS DIODE 28VWM 45.4VC P600
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 110A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: P600
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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1N5245B 1N5245B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 15V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 16 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11 V
Produkt ist nicht verfügbar
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ATMEGA644P-15AZ ATMEGA644P-15AZ Microchip Technology ATmega164%2C324%2C644P%20Summary.pdf Description: IC MCU 8BIT 64KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Grade: Automotive
Number of I/O: 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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ATMEGA644PV-10PU ATMEGA644PV-10PU Microchip Technology Atmel-42744-ATmega644P_Summary.pdf description Description: IC MCU 8BIT 64KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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DSC6011BA3B-250K000 DSC6011BA3B-250K000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
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DSC6011BA3B-250K000T DSC6011BA3B-250K000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PIC32CM6408JH00048-E/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
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PIC32CM6408JH00048T-E/Y8X PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048-E/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
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PIC32CM6408JH00048T-E/U5B PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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SG2524N sg1524_rev1.2.pdf
SG2524N
Hersteller: Microchip Technology
Description: IC REG CTRLR MULT TOPOLOGY 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Transistor Driver
Mounting Type: Through Hole
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 300kHz
Topology: Buck, Flyback, Push-Pull
Voltage - Supply (Vcc/Vdd): 8V ~ 40V
Supplier Device Package: 16-PDIP
Synchronous Rectifier: Yes
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 49%
Clock Sync: No
Number of Outputs: 2
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M1.5KE250A RF01008_rE.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 214VWM 344VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5A
Voltage - Reverse Standoff (Typ): 214V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 237V
Voltage - Clamping (Max) @ Ipp: 344V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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PIC32CZ4010CA80144-I/LUX PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf
PIC32CZ4010CA80144-I/LUX
Hersteller: Microchip Technology
Description: CM7,4MB FLASH,CONNECTIVITY,144BG
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
auf Bestellung 184 Stücke:
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Anzahl Preis
2+13.22 EUR
25+11.99 EUR
100+10.9 EUR
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PIC32CZ8110CA80144-I/LUX PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf
PIC32CZ8110CA80144-I/LUX
Hersteller: Microchip Technology
Description: CM7,8MB FLASH,CONNECTIVITY,144BG
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
auf Bestellung 189 Stücke:
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Anzahl Preis
2+15.58 EUR
25+14.14 EUR
100+12.86 EUR
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DSPIC33CK256MP405-E/M7 dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP405-E/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VFQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 89
auf Bestellung 183 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.47 EUR
25+4.06 EUR
100+3.69 EUR
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TL431AILP description TL431%28A%2CB%29.pdf
TL431AILP
Hersteller: Microchip Technology
Description: IC VREF SHUNT ADJ 1% TO92-3
Tolerance: ±1%
Packaging: Strip
Package / Case: TO-226-3, TO-92-3 Long Body
Temperature Coefficient: 30ppm/°C Typical
Output Type: Adjustable
Mounting Type: Through Hole
Reference Type: Shunt
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: TO-92 (TO-226)
Voltage - Output (Min/Fixed): 2.5V
Current - Cathode: 1 mA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Produkt ist nicht verfügbar
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BZV55C68 150_8298-bzv55-c2v4-c75-pdf.pdf
BZV55C68
Hersteller: Microchip Technology
Description: DIODE ZENER 68V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 68 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
Produkt ist nicht verfügbar
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JANTX1N5526BUR-1 1N5518BUR-1_1N5546BUR-1.pdf
JANTX1N5526BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 6.2 V
Qualification: MIL-PRF-19500/437
Produkt ist nicht verfügbar
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1N4746A 1N4728AG_1N4764AG_e3.pdf
1N4746A
Hersteller: Microchip Technology
Description: DIODE ZENER 18V 1W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1 W
Current - Reverse Leakage @ Vr: 5 µA @ 13.7 V
Produkt ist nicht verfügbar
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2N1715S
2N1715S
Hersteller: Microchip Technology
Description: TRANS NPN 100V 0.75A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 750 mA
Voltage - Collector Emitter Breakdown (Max): 100 V
Produkt ist nicht verfügbar
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2N1715
2N1715
Hersteller: Microchip Technology
Description: TRANS NPN 100V 1A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Produkt ist nicht verfügbar
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MSC030SMB120B4N MSC030SMB120B4N-SiC-MOSFET-Datasheet.pdf
Hersteller: Microchip Technology
Description: MOSFET SIC 1200 V 30 MOHM TO-247
Packaging: Tube
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+17.74 EUR
25+16.36 EUR
100+14.24 EUR
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DSC1001DI1-025.0008T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DI1-025.0008T
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0008MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25.0008 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PIC18F97J60T-I/PF 39762f.pdf
PIC18F97J60T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 41.667MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 3808 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC18F97J60T-I/PF 39762f.pdf
PIC18F97J60T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 41.667MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 3808 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 930 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.3 EUR
25+11.28 EUR
100+10.22 EUR
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DSPIC33EP256MU810T-I/PF 70616g.pdf
DSPIC33EP256MU810T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSPIC33EP256MU810T-I/PF 70616g.pdf
DSPIC33EP256MU810T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 650 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.58 EUR
25+15.19 EUR
100+13.74 EUR
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APT34M60S/TR APT34M60B_S_C.pdf
APT34M60S/TR
Hersteller: Microchip Technology
Description: MOSFET N-CH 600V 36A D3PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Power Dissipation (Max): 624W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
Produkt ist nicht verfügbar
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APT34F60S/TR 6954-apt34f60b-apt34f60s-datasheet
APT34F60S/TR
Hersteller: Microchip Technology
Description: MOSFET N-CH 600V 36A D3PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Power Dissipation (Max): 624W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
Produkt ist nicht verfügbar
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AT91RM9200-QI-002-T 1768s.pdf
AT91RM9200-QI-002-T
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB ROM 208PQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM920T
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART, USB
Peripherals: POR
Supplier Device Package: 208-PQFP (28x28)
Number of I/O: 122
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LM2576BT lm2576.pdf
LM2576BT
Hersteller: Microchip Technology
Description: IC REG BUCK ADJ 3A TO220-5
Packaging: Tube
Package / Case: TO-220-5
Output Type: Adjustable
Mounting Type: Through Hole
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-220-5
Synchronous Rectifier: No
Voltage - Output (Max): 37V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 1.23V
Produkt ist nicht verfügbar
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JANTX1N5639A LDS-0096-REV3.pdf
JANTX1N5639A
Hersteller: Microchip Technology
Description: TVS DIODE 15.3VWM 25.2VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.5A
Voltage - Reverse Standoff (Typ): 15.3V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
auf Bestellung 100 Stücke:
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1+84.25 EUR
100+78.24 EUR
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1N5645A LDS-0096-REV3.pdf
1N5645A
Hersteller: Microchip Technology
Description: TVS DIODE 28.2VWM 45.7VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28.2V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
auf Bestellung 83 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.96 EUR
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EV80L65A dsPIC33AK512MPS512-General-Purpose-DIM-Info-Sheet-DS70005563.pdf
EV80L65A
Hersteller: Microchip Technology
Description: DSPIC33AK512MPS512 GP DIM
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: dsPIC
Utilized IC / Part: dsPIC33AK512MPS512
Platform: Dual-Inline Module (DIM)
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Anzahl Preis
1+20.13 EUR
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MCP1827S-3302E/EBVAO MCP1827S-3302E.pdf
Hersteller: Microchip Technology
Description: 1.5A LDO REGULATOR
Packaging: Tube
Produkt ist nicht verfügbar
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MCP1827ST-3302E/EBVAO MCP1827S-3302E.pdf
Hersteller: Microchip Technology
Description: 1.5A LDO REGULATOR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC16F15254-E/SP PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15254-E/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 25
auf Bestellung 355 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.26 EUR
25+2.96 EUR
100+2.68 EUR
Mindestbestellmenge: 6
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PIC16F15254-E/STX PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15254-E/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
auf Bestellung 814 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
16+1.14 EUR
25+1.03 EUR
100+0.94 EUR
Mindestbestellmenge: 16
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MCP1317T-31LE/OT MCP131X-2X-Voltage-Supervisor-DS20001985E.pdf
MCP1317T-31LE/OT
Hersteller: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 3.1V
Supplier Device Package: SOT-23-5
DigiKey Programmable: Not Verified
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M5KP75A rf01010_rb.pdf
M5KP75A
Hersteller: Microchip Technology
Description: TVS DIODE 75VWM 121VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 41A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 83.3V
Voltage - Clamping (Max) @ Ipp: 121V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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TC1302B-PFVMF-VAO 21333C.pdf
TC1302B-PFVMF-VAO
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.5V/3.3V 8-DFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA, 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 180 µA
Voltage - Input (Max): 6V
Number of Regulators: 2
Supplier Device Package: 8-DFN (3x3)
Voltage - Output (Min/Fixed): 1.5V, 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 58dB (100Hz)
Voltage Dropout (Max): 0.4V @ 150mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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DSC1001BL5-095.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BL5-095.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 95 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BL5-095.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BL5-095.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 95 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CL5-080.0000T
DSC1001CL5-080.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CL5-080.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CL5-080.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121CL5-080.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121CL5-080.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121CL5-080.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121CL5-080.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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1N5822G 1n5820-d.pdf
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY B
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Technology: Schottky
Supplier Device Package: B
Produkt ist nicht verfügbar
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AT91M42800A-33AU doc1779.pdf
AT91M42800A-33AU
Hersteller: Microchip Technology
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 138 Stücke:
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Anzahl Preis
1+18.46 EUR
25+16.8 EUR
100+15.22 EUR
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USB2534D/UDX USB2534D-Data-Sheet-DS00005422.pdf
USB2534D/UDX
Hersteller: Microchip Technology
Description: USB 2.0 HI-SPEED FOUR PORT HUB C
Packaging: Tray
Package / Case: 36-VFQFN Exposed Pad
Function: Hub Controller
Interface: USB, GPIO, I2C, SMBus
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 36-SQFN (6x6)
auf Bestellung 154 Stücke:
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Anzahl Preis
3+8.11 EUR
25+6.76 EUR
100+6.54 EUR
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ATF22V10C-10SC doc0735.pdf
ATF22V10C-10SC
Hersteller: Microchip Technology
Description: IC PLD 10MC 10NS 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V
Programmable Type: EE PLD
Number of Macrocells: 10
Supplier Device Package: 24-SOIC
Speed: 10 ns
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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ATF22V10CQZ-20SC doc0778.pdf
ATF22V10CQZ-20SC
Hersteller: Microchip Technology
Description: IC PLD 10MC 20NS 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V
Programmable Type: EE PLD
Number of Macrocells: 10
Supplier Device Package: 24-SOIC
Speed: 20 ns
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1N5231 LDS-0232.pdf
1N5231
Hersteller: Microchip Technology
Description: DIODE ZENER 5.1V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1.9 V
auf Bestellung 313 Stücke:
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Anzahl Preis
5+3.85 EUR
100+3.59 EUR
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BZV55C3V3 8298-bzv55-c2v4-c75-pdf.pdf
BZV55C3V3
Hersteller: Microchip Technology
Description: DIODE ZENER 3.3V DO213AA
Tolerance: ±6.06%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
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DSC1123CI2-333.3300T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CI2-333.3300T
Hersteller: Microchip Technology
Description: MEMS OSC XO 333.3300MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 333.33 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1123CI2-333.3333T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CI2-333.3333T
Hersteller: Microchip Technology
Description: MEMS OSC XO 333.3333MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 333.3333 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1123CI2-333.3300 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CI2-333.3300
Hersteller: Microchip Technology
Description: MEMS OSC XO 333.3300MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 333.33 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1123CI2-333.3333 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CI2-333.3333
Hersteller: Microchip Technology
Description: MEMS OSC XO 333.3333MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 333.3333 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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1N4732A 10911-sa5-33-pdf.pdf
1N4732A
Hersteller: Microchip Technology
Description: DIODE ZENER 4.7V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
Produkt ist nicht verfügbar
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M5KP30CA rf01010_rb.pdf
M5KP30CA
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 103A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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Anzahl Preis
2+10.24 EUR
Mindestbestellmenge: 2
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M5KP28CAE3/TR rf01010_rb.pdf
M5KP28CAE3/TR
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 45.4VC P600
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 110A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: P600
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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1N5245B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5245B
Hersteller: Microchip Technology
Description: DIODE ZENER 15V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 16 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11 V
Produkt ist nicht verfügbar
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ATMEGA644P-15AZ ATmega164%2C324%2C644P%20Summary.pdf
ATMEGA644P-15AZ
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Grade: Automotive
Number of I/O: 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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ATMEGA644PV-10PU description Atmel-42744-ATmega644P_Summary.pdf
ATMEGA644PV-10PU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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Anzahl Preis
2+11.39 EUR
Mindestbestellmenge: 2
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DSC6011BA3B-250K000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011BA3B-250K000
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011BA3B-250K000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011BA3B-250K000T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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