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MASMBG7.0A MASMBG7.0A Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 7VWM 12VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 50A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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LAN9694TSN-V/3KW LAN9694TSN-V/3KW Microchip Technology LAN969x-Ethernet-Switch-Family-00005274.pdf Description: 46G INDUSTRIAL ETHERNET SWITCH
Packaging: Tray
Package / Case: 356-LFBGA, FCCSPBGA
Function: Switch
Interface: SGMII
Operating Temperature: -40°C ~ 110°C (TJ)
Voltage - Supply: 0.9V
Protocol: Ethernet
Supplier Device Package: 356-FCCSP (17x17)
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LAN9698RED-V/3KW LAN9698RED-V/3KW Microchip Technology LAN969x-Ethernet-Switch-Family-00005274.pdf Description: 102G INDUSTRIAL ETHERNET SWITCH
Packaging: Tray
Package / Case: 356-LFBGA, FCCSPBGA
Function: Switch
Interface: SGMII
Operating Temperature: -40°C ~ 110°C (TJ)
Voltage - Supply: 0.9V
Protocol: Ethernet
Supplier Device Package: 356-FCCSP (17x17)
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LAN9696-V/3KW LAN9696-V/3KW Microchip Technology LAN969x-Ethernet-Switch-Family-00005274.pdf Description: 66G ENTERPRISE ETHERNET SWITCH
Packaging: Tray
Package / Case: 356-LFBGA, FCCSPBGA
Function: Switch
Interface: SGMII
Operating Temperature: 0°C ~ 105°C (TJ)
Voltage - Supply: 0.9V
Protocol: Ethernet
Supplier Device Package: 356-FCCSP (17x17)
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LAN9698-V/3KW LAN9698-V/3KW Microchip Technology LAN969x-Ethernet-Switch-Family-00005274.pdf Description: 102G ENTERPRISE ETHERNET SWITCH
Packaging: Tray
Package / Case: 356-LFBGA, FCCSPBGA
Function: Switch
Interface: SGMII
Operating Temperature: 0°C ~ 105°C (TJ)
Voltage - Supply: 0.9V
Protocol: Ethernet
Supplier Device Package: 356-FCCSP (17x17)
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LAN8870T-I/PUA LAN8870T-I/PUA Microchip Technology LAN8870-LAN8871-LAN8872-Product-Brief-DS00004469.pdf Description: 100/1000BASE-T1 RGMII/SGMII PHY
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
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LAN96455S-I/8MW LAN96455S-I/8MW Microchip Technology LAN9645xS-Data-Sheet-DS00006066.pdf Description: 5 PORT ETHERNET SWITCH WITH STAN
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 128-TQFP (14x14)
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LAN96455F-I/8MW LAN96455F-I/8MW Microchip Technology LAN9645xF-Data-Sheet-DS00006065.pdf Description: 5 PORT ETHERNET SWITCH WITH FULL
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 128-TQFP (14x14)
Produkt ist nicht verfügbar
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LAN96455F-I/8NW Microchip Technology LAN9645xF-Data-Sheet-DS00006065.pdf Description: 5 PORT ETHERNET SWITCH WITH FULL
Packaging: Tray
Package / Case: 156-VFQFN Dual Rows, Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 156-VQFN-DR (12x12)
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LAN96457S-I/8NW Microchip Technology LAN9645xS-Data-Sheet-DS00006066.pdf Description: 7 PORT ETHERNET SWITCH WITH STAN
Packaging: Tray
Package / Case: 156-VFQFN Dual Rows, Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 156-VQFN-DR (12x12)
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LAN96459S-I/8NW Microchip Technology LAN9645xS-Data-Sheet-DS00006066.pdf Description: 9 PORT ETHERNET SWITCH WITH STAN
Packaging: Tray
Package / Case: 156-VFQFN Dual Rows, Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 156-VQFN-DR (12x12)
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LAN96459F-I/8NW Microchip Technology LAN9645xF-Data-Sheet-DS00006065.pdf Description: 9 PORT ETHERNET SWITCH WITH FULL
Packaging: Tray
Package / Case: 156-VFQFN Dual Rows, Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 156-VQFN-DR (12x12)
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1N6857-1 1N6857-1 Microchip Technology LDS-0040_r4%2C+1N5711-12_1N6857-58_DSB2810_5712%2C+MIL-PRF-19500-444.pdf Description: DIODE SCHOTTKY 20V 150MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 4.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 750 mV @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
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1N6857-1/TR 1N6857-1/TR Microchip Technology 8865-lds-0040-pdf.pdf Description: DIODE SCHOTTKY 20V 150MA DO204AH
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 4.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 750 mV @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
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1N6857UR-1 1N6857UR-1 Microchip Technology 1N5711-12UR-1_1N6857-58UR-1_CDLL.pdf Description: DIODE SCHOTTKY 16V 150MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 4.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 750 mV @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
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1N6857UR-1/TR 1N6857UR-1/TR Microchip Technology 131890-lds-0040-1.pdf Description: DIODE SCHOTTKY 16V 150MA DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 4.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 750 mV @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
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ATMEGA324A-CU ATMEGA324A-CU Microchip Technology Atmel-42714-ATmega324A_Datasheet.pdf Description: IC MCU 8BIT 32KB FLASH 49VFBGA
Packaging: Tray
Package / Case: 49-VFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-VFBGA (5x5)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA324P-15MT ATMEGA324P-15MT Microchip Technology ATmega164%2C324%2C644P%20Summary.pdf Description: IC MCU 8BIT 32KB FLASH 44VQFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-VQFN (7x7)
Grade: Automotive
Number of I/O: 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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1N4732A 1N4732A Microchip Technology 10911-sa5-33-pdf.pdf Description: DIODE ZENER 4.7V 1W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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2294600-R 2294600-R Microchip Technology 00003031A.pdf Description: 24 PORT SAS/SATA
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 24
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DSC1001DC2-025.0000T DSC1001DC2-025.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001DC2-025.0000 DSC1001DC2-025.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MASMCG8.0A MASMCG8.0A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 8VWM 13.6VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 110.3A
Voltage - Reverse Standoff (Typ): 8V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 8.89V
Voltage - Clamping (Max) @ Ipp: 13.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG8.0Ae3 MASMCG8.0Ae3 Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 8VWM 13.6VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 110.3A
Voltage - Reverse Standoff (Typ): 8V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 8.89V
Voltage - Clamping (Max) @ Ipp: 13.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG8.5A MASMCG8.5A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 8.5VWM 14.4V DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 104.2A
Voltage - Reverse Standoff (Typ): 8.5V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 9.44V
Voltage - Clamping (Max) @ Ipp: 14.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG8.5Ae3 MASMCG8.5Ae3 Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 8.5VWM 14.4V DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 104.2A
Voltage - Reverse Standoff (Typ): 8.5V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 9.44V
Voltage - Clamping (Max) @ Ipp: 14.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG78CAe3 MASMCG78CAe3 Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 78VWM 126VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11.4A
Voltage - Reverse Standoff (Typ): 78V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 86.7V
Voltage - Clamping (Max) @ Ipp: 126V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG8.0CAE3 MASMCG8.0CAE3 Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 8VWM 13.6VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 110.3A
Voltage - Reverse Standoff (Typ): 8V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.89V
Voltage - Clamping (Max) @ Ipp: 13.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG8.0CA MASMCG8.0CA Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 8VWM 13.6VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 110.3A
Voltage - Reverse Standoff (Typ): 8V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.89V
Voltage - Clamping (Max) @ Ipp: 13.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC16F18856T-I/SO PIC16F18856T-I/SO Microchip Technology PIC16(L)F18856-76-Data-Sheet-40001824F.pdf Description: IC MCU 8BIT 28KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (16K x 14)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1600 Stücke
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PIC16F18856-E/ML PIC16F18856-E/ML Microchip Technology PIC16(L)F18856-76-Data-Sheet-40001824F.pdf Description: IC MCU 8BIT 28KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (16K x 14)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 488 Stücke
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MIC5209-3.6YU MIC5209-3.6YU Microchip Technology MCRL-S-A0001014164-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR 3.6V 500MA TO263-5
Packaging: Bulk
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 170 µA
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: TO-263-5
Voltage - Output (Min/Fixed): 3.6V
Control Features: Enable
PSRR: 75dB (120Hz)
Voltage Dropout (Max): 0.6V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 25 mA
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DSC1001DI1-098.3040 DSC1001DI1-098.3040 Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC XO 98.3040MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 98.304 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CI1-090.0000T DSC1001CI1-090.0000T Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1003CL1-095.0000T DSC1003CL1-095.0000T Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 95 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BI1-099.0000T DSC1001BI1-099.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC LP 99MHZ LVCMOS -40C-85
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 99 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSC1001CI1-090.0000 DSC1001CI1-090.0000 Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSC1003CL1-095.0000 DSC1003CL1-095.0000 Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 95 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSC1001BI1-099.0000 DSC1001BI1-099.0000 Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC XO 99.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 99 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSC1001AE1-098.0000T DSC1001AE1-098.0000T Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC XO 98.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 98 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSC1001AE1-099.0000T Microchip Technology Description: MEMS OSC XO 99.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 99 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1004AI1-090.0000T DSC1004AI1-090.0000T Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC., LOW POWER, 90MHZ, LVC
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSC1001AE1-098.0000 DSC1001AE1-098.0000 Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC XO 98.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 98 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSC1001AE1-099.0000 DSC1001AE1-099.0000 Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC XO 99.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 99 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSC1004AI1-090.0000 DSC1004AI1-090.0000 Microchip Technology DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121AI1-090.0000T DSC1121AI1-090.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613.pdf Description: MEMS OSC LOW JITTET 90MHZ LVCMOS
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1101AE1-090.0000T DSC1101AE1-090.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613.pdf Description: MEMS OSC LOW JITTET 90MHZ LVCMOS
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1101AE1-090.0000 DSC1101AE1-090.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613.pdf Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSC1121AI1-090.0000 DSC1121AI1-090.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613.pdf Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1122DI2-121.1090T DSC1122DI2-121.1090T Microchip Technology DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 121.109 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1122DI2-121.1090 DSC1122DI2-121.1090 Microchip Technology DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254.pdf Description: MEMS OSC XO 121.1090MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 121.109 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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24FC16T-E/Q4B 24FC16T-E/Q4B Microchip Technology 24AA16-24LC16B-24FC16-16K-I2C-Serial-EEPROM-20001703P.pdf Description: IC EEPROM 16KBIT I2C 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 2K x 8
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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24FC16T-E/Q4B 24FC16T-E/Q4B Microchip Technology 24AA16-24LC16B-24FC16-16K-I2C-Serial-EEPROM-20001703P.pdf Description: IC EEPROM 16KBIT I2C 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 2K x 8
auf Bestellung 3013 Stücke:
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30+0.71 EUR
31+0.69 EUR
100+0.65 EUR
Mindestbestellmenge: 30 Stücke
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1N5822 1N5822 Microchip Technology 1N5820-1N5822%2C1N6864.pdf Description: DIODE SCHOTTKY 40V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
Current - Reverse Leakage @ Vr: 100 µA @ 40 V
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1+25.72 EUR
100+23.88 EUR
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1N5822G Microchip Technology 1N5820-D.PDF Description: DIODE SCHOTTKY B
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Technology: Schottky
Supplier Device Package: B
auf Bestellung 95 Stücke:
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1+25.44 EUR
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BZV55C12 BZV55C12 Microchip Technology BZV55C_ser_minimelf.pdf Description: DIODE ZENER
Packaging: Bulk
Tolerance: ±5.39%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: 175°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 294 Stücke:
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5+5.02 EUR
100+4.66 EUR
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1N5817G 1N5817G Microchip Technology coc-46.pdf Description: DIODE SCHOTTKY 20V 1A DO204AL
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 1A
Supplier Device Package: DO-204AL (DO-41)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Produkt ist nicht verfügbar
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MCP9982T-AE/RW MCP9982T-AE/RW Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3000 Stücke
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MCP9982T-AE/RW MCP9982T-AE/RW Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Cut Tape (CT)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
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MCP9982T-1E/RW MCP9982T-1E/RW Microchip Technology MCP998X-Family-Data-Sheet-DS20006827.pdf Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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MASMBG7.0A RF01000+%283%29.pdf
MASMBG7.0A
Hersteller: Microchip Technology
Description: TVS DIODE 7VWM 12VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 50A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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LAN9694TSN-V/3KW LAN969x-Ethernet-Switch-Family-00005274.pdf
LAN9694TSN-V/3KW
Hersteller: Microchip Technology
Description: 46G INDUSTRIAL ETHERNET SWITCH
Packaging: Tray
Package / Case: 356-LFBGA, FCCSPBGA
Function: Switch
Interface: SGMII
Operating Temperature: -40°C ~ 110°C (TJ)
Voltage - Supply: 0.9V
Protocol: Ethernet
Supplier Device Package: 356-FCCSP (17x17)
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25+67.25 EUR
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LAN9698RED-V/3KW LAN969x-Ethernet-Switch-Family-00005274.pdf
LAN9698RED-V/3KW
Hersteller: Microchip Technology
Description: 102G INDUSTRIAL ETHERNET SWITCH
Packaging: Tray
Package / Case: 356-LFBGA, FCCSPBGA
Function: Switch
Interface: SGMII
Operating Temperature: -40°C ~ 110°C (TJ)
Voltage - Supply: 0.9V
Protocol: Ethernet
Supplier Device Package: 356-FCCSP (17x17)
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LAN9696-V/3KW LAN969x-Ethernet-Switch-Family-00005274.pdf
LAN9696-V/3KW
Hersteller: Microchip Technology
Description: 66G ENTERPRISE ETHERNET SWITCH
Packaging: Tray
Package / Case: 356-LFBGA, FCCSPBGA
Function: Switch
Interface: SGMII
Operating Temperature: 0°C ~ 105°C (TJ)
Voltage - Supply: 0.9V
Protocol: Ethernet
Supplier Device Package: 356-FCCSP (17x17)
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LAN9698-V/3KW LAN969x-Ethernet-Switch-Family-00005274.pdf
LAN9698-V/3KW
Hersteller: Microchip Technology
Description: 102G ENTERPRISE ETHERNET SWITCH
Packaging: Tray
Package / Case: 356-LFBGA, FCCSPBGA
Function: Switch
Interface: SGMII
Operating Temperature: 0°C ~ 105°C (TJ)
Voltage - Supply: 0.9V
Protocol: Ethernet
Supplier Device Package: 356-FCCSP (17x17)
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LAN8870T-I/PUA LAN8870-LAN8871-LAN8872-Product-Brief-DS00004469.pdf
LAN8870T-I/PUA
Hersteller: Microchip Technology
Description: 100/1000BASE-T1 RGMII/SGMII PHY
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
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3+7.35 EUR
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LAN96455S-I/8MW LAN9645xS-Data-Sheet-DS00006066.pdf
LAN96455S-I/8MW
Hersteller: Microchip Technology
Description: 5 PORT ETHERNET SWITCH WITH STAN
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 128-TQFP (14x14)
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25+14.35 EUR
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LAN96455F-I/8MW LAN9645xF-Data-Sheet-DS00006065.pdf
LAN96455F-I/8MW
Hersteller: Microchip Technology
Description: 5 PORT ETHERNET SWITCH WITH FULL
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 128-TQFP (14x14)
Produkt ist nicht verfügbar
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LAN96455F-I/8NW LAN9645xF-Data-Sheet-DS00006065.pdf
Hersteller: Microchip Technology
Description: 5 PORT ETHERNET SWITCH WITH FULL
Packaging: Tray
Package / Case: 156-VFQFN Dual Rows, Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 156-VQFN-DR (12x12)
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2+20.19 EUR
25+16.81 EUR
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LAN96457S-I/8NW LAN9645xS-Data-Sheet-DS00006066.pdf
Hersteller: Microchip Technology
Description: 7 PORT ETHERNET SWITCH WITH STAN
Packaging: Tray
Package / Case: 156-VFQFN Dual Rows, Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 156-VQFN-DR (12x12)
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2+20.19 EUR
25+16.81 EUR
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LAN96459S-I/8NW LAN9645xS-Data-Sheet-DS00006066.pdf
Hersteller: Microchip Technology
Description: 9 PORT ETHERNET SWITCH WITH STAN
Packaging: Tray
Package / Case: 156-VFQFN Dual Rows, Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 156-VQFN-DR (12x12)
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LAN96459F-I/8NW LAN9645xF-Data-Sheet-DS00006065.pdf
Hersteller: Microchip Technology
Description: 9 PORT ETHERNET SWITCH WITH FULL
Packaging: Tray
Package / Case: 156-VFQFN Dual Rows, Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.0743V ~ 1.2257V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 156-VQFN-DR (12x12)
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1+27.45 EUR
25+22.9 EUR
100+22.1 EUR
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1N6857-1 LDS-0040_r4%2C+1N5711-12_1N6857-58_DSB2810_5712%2C+MIL-PRF-19500-444.pdf
1N6857-1
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 150MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 4.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 750 mV @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
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1N6857-1/TR 8865-lds-0040-pdf.pdf
1N6857-1/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 150MA DO204AH
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 4.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 750 mV @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
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1N6857UR-1 1N5711-12UR-1_1N6857-58UR-1_CDLL.pdf
1N6857UR-1
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 16V 150MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 4.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 750 mV @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
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1N6857UR-1/TR 131890-lds-0040-1.pdf
1N6857UR-1/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 16V 150MA DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 4.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 750 mV @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
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ATMEGA324A-CU Atmel-42714-ATmega324A_Datasheet.pdf
ATMEGA324A-CU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 49VFBGA
Packaging: Tray
Package / Case: 49-VFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-VFBGA (5x5)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATMEGA324P-15MT ATmega164%2C324%2C644P%20Summary.pdf
ATMEGA324P-15MT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44VQFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-VQFN (7x7)
Grade: Automotive
Number of I/O: 32
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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1N4732A 10911-sa5-33-pdf.pdf
1N4732A
Hersteller: Microchip Technology
Description: DIODE ZENER 4.7V 1W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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4+5.37 EUR
100+5 EUR
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2294600-R 00003031A.pdf
2294600-R
Hersteller: Microchip Technology
Description: 24 PORT SAS/SATA
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 24
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DSC1001DC2-025.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DC2-025.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001DC2-025.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DC2-025.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MASMCG8.0A rf01001_rev_b_final-pd-000307351.pdf
MASMCG8.0A
Hersteller: Microchip Technology
Description: TVS DIODE 8VWM 13.6VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 110.3A
Voltage - Reverse Standoff (Typ): 8V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 8.89V
Voltage - Clamping (Max) @ Ipp: 13.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCG8.0Ae3 rf01001_rev_b_final-pd-000307351.pdf
MASMCG8.0Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 8VWM 13.6VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 110.3A
Voltage - Reverse Standoff (Typ): 8V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 8.89V
Voltage - Clamping (Max) @ Ipp: 13.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCG8.5A rf01001_rev_b_final-pd-000307351.pdf
MASMCG8.5A
Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.4V DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 104.2A
Voltage - Reverse Standoff (Typ): 8.5V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 9.44V
Voltage - Clamping (Max) @ Ipp: 14.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCG8.5Ae3 rf01001_rev_b_final-pd-000307351.pdf
MASMCG8.5Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.4V DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 104.2A
Voltage - Reverse Standoff (Typ): 8.5V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 9.44V
Voltage - Clamping (Max) @ Ipp: 14.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCG78CAe3 rf01001_rev_b_final-pd-000307351.pdf
MASMCG78CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 78VWM 126VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11.4A
Voltage - Reverse Standoff (Typ): 78V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 86.7V
Voltage - Clamping (Max) @ Ipp: 126V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCG8.0CAE3 rf01001_rev_b_final-pd-000307351.pdf
MASMCG8.0CAE3
Hersteller: Microchip Technology
Description: TVS DIODE 8VWM 13.6VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 110.3A
Voltage - Reverse Standoff (Typ): 8V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.89V
Voltage - Clamping (Max) @ Ipp: 13.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCG8.0CA rf01001_rev_b_final-pd-000307351.pdf
MASMCG8.0CA
Hersteller: Microchip Technology
Description: TVS DIODE 8VWM 13.6VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 110.3A
Voltage - Reverse Standoff (Typ): 8V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.89V
Voltage - Clamping (Max) @ Ipp: 13.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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PIC16F18856T-I/SO PIC16(L)F18856-76-Data-Sheet-40001824F.pdf
PIC16F18856T-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (16K x 14)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC16F18856-E/ML PIC16(L)F18856-76-Data-Sheet-40001824F.pdf
PIC16F18856-E/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (16K x 14)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIC5209-3.6YU MCRL-S-A0001014164-1.pdf?t.download=true&u=5oefqw
MIC5209-3.6YU
Hersteller: Microchip Technology
Description: IC REG LINEAR 3.6V 500MA TO263-5
Packaging: Bulk
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 170 µA
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: TO-263-5
Voltage - Output (Min/Fixed): 3.6V
Control Features: Enable
PSRR: 75dB (120Hz)
Voltage Dropout (Max): 0.6V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 25 mA
auf Bestellung 12003 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
174+3.08 EUR
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DSC1001DI1-098.3040 DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1001DI1-098.3040
Hersteller: Microchip Technology
Description: MEMS OSC XO 98.3040MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 98.304 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CI1-090.0000T DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1001CI1-090.0000T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1003CL1-095.0000T DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1003CL1-095.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 95 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BI1-099.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001BI1-099.0000T
Hersteller: Microchip Technology
Description: MEMS OSC LP 99MHZ LVCMOS -40C-85
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 99 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CI1-090.0000 DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1001CI1-090.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1003CL1-095.0000 DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1003CL1-095.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 95 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BI1-099.0000 DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1001BI1-099.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 99.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 99 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001AE1-098.0000T DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1001AE1-098.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 98.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 98 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001AE1-099.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 99.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 99 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1004AI1-090.0000T DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1004AI1-090.0000T
Hersteller: Microchip Technology
Description: MEMS OSC., LOW POWER, 90MHZ, LVC
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001AE1-098.0000 DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1001AE1-098.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 98.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 98 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001AE1-099.0000 DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1001AE1-099.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 99.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 99 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1004AI1-090.0000 DSC1001-3-4-1-8V-3-3V-Low-Power-Precision-CMOS-Oscillator-DS20005529.pdf
DSC1004AI1-090.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121AI1-090.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613.pdf
DSC1121AI1-090.0000T
Hersteller: Microchip Technology
Description: MEMS OSC LOW JITTET 90MHZ LVCMOS
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1101AE1-090.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613.pdf
DSC1101AE1-090.0000T
Hersteller: Microchip Technology
Description: MEMS OSC LOW JITTET 90MHZ LVCMOS
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1101AE1-090.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613.pdf
DSC1101AE1-090.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121AI1-090.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613.pdf
DSC1121AI1-090.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1122DI2-121.1090T DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254.pdf
DSC1122DI2-121.1090T
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 121.109 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1122DI2-121.1090 DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254.pdf
DSC1122DI2-121.1090
Hersteller: Microchip Technology
Description: MEMS OSC XO 121.1090MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 121.109 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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24FC16T-E/Q4B 24AA16-24LC16B-24FC16-16K-I2C-Serial-EEPROM-20001703P.pdf
24FC16T-E/Q4B
Hersteller: Microchip Technology
Description: IC EEPROM 16KBIT I2C 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 2K x 8
Produkt ist nicht verfügbar
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24FC16T-E/Q4B 24AA16-24LC16B-24FC16-16K-I2C-Serial-EEPROM-20001703P.pdf
24FC16T-E/Q4B
Hersteller: Microchip Technology
Description: IC EEPROM 16KBIT I2C 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 2K x 8
auf Bestellung 3013 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
30+0.71 EUR
31+0.69 EUR
100+0.65 EUR
Mindestbestellmenge: 30 Stücke
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1N5822 1N5820-1N5822%2C1N6864.pdf
1N5822
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
Current - Reverse Leakage @ Vr: 100 µA @ 40 V
auf Bestellung 134 Stücke:
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AnzahlPrivatkunde
1+25.72 EUR
100+23.88 EUR
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1N5822G 1N5820-D.PDF
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY B
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Technology: Schottky
Supplier Device Package: B
auf Bestellung 95 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+25.44 EUR
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BZV55C12 BZV55C_ser_minimelf.pdf
BZV55C12
Hersteller: Microchip Technology
Description: DIODE ZENER
Packaging: Bulk
Tolerance: ±5.39%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: 175°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 294 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+5.02 EUR
100+4.66 EUR
Mindestbestellmenge: 5 Stücke
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1N5817G coc-46.pdf
1N5817G
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 1A DO204AL
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 1A
Supplier Device Package: DO-204AL (DO-41)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Produkt ist nicht verfügbar
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MCP9982T-AE/RW MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982T-AE/RW
Hersteller: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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MCP9982T-AE/RW MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982T-AE/RW
Hersteller: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Cut Tape (CT)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 2990 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
14+1.59 EUR
25+1.55 EUR
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MCP9982T-1E/RW MCP998X-Family-Data-Sheet-DS20006827.pdf
MCP9982T-1E/RW
Hersteller: Microchip Technology
Description: 2 CHANNEL TEMP SENSOR, AUTOMOTIV
Packaging: Tape & Reel (TR)
Features: One-Shot, Shutdown Mode
Package / Case: 8-WFDFN Exposed Pad
Output Type: 2-Wire Serial, I2C/SMBUS
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Digital, Local/Remote
Resolution: 11 b
Supplier Device Package: 8-WDFN (2x2)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2.5°C)
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
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