Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (337875) > Seite 1969 nach 5632
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CDLL5226D | Microchip Technology |
Description: DIODE ZENER 3.3V DO-213AAPackaging: Bulk Tolerance: ±1% Package / Case: DO-213AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 3.3 V Impedance (Max) (Zzt): 28 Ohms Supplier Device Package: DO-213AA Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Current - Reverse Leakage @ Vr: 25 µA @ 1 V |
Produkt ist nicht verfügbar |
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CDLL5226D/TR | Microchip Technology |
Description: DIODE ZENER 3.3V DO-213AAPackaging: Tape & Reel (TR) Tolerance: ±1% Package / Case: DO-213AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 3.3 V Impedance (Max) (Zzt): 28 Ohms Supplier Device Package: DO-213AA Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Current - Reverse Leakage @ Vr: 25 µA @ 1 V |
Produkt ist nicht verfügbar |
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JANSK2N2222AUB | Microchip Technology |
Description: SMALL-SIGNAL BJT _ UBPackaging: Bulk Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -65°C ~ 200°C Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA Current - Collector Cutoff (Max): 50nA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V Supplier Device Package: UB Grade: Military Current - Collector (Ic) (Max): 800 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 500 mW Qualification: MIL-PRF-19500 |
Produkt ist nicht verfügbar |
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JANSU2N2222AUB/TR | Microchip Technology |
Description: SMALL-SIGNAL BJT Packaging: Tape & Reel (TR) Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -65°C ~ 200°C Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA Current - Collector Cutoff (Max): 50nA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V Supplier Device Package: UB Grade: Military Current - Collector (Ic) (Max): 800 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 500 mW Qualification: MIL-PRF-19500 |
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JANSE2N2222AUB | Microchip Technology |
Description: SMALL-SIGNAL BJT _ UBPackaging: Bulk Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -65°C ~ 200°C Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA Current - Collector Cutoff (Max): 50nA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V Supplier Device Package: UB Grade: Military Current - Collector (Ic) (Max): 800 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 500 mW Qualification: MIL-PRF-19500 |
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JAN1N1128RA | Microchip Technology |
Description: DIODE STANDARD REV 600V DO203AAPackaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Stud Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard, Reverse Polarity Supplier Device Package: DO-203AA (DO-4) Operating Temperature - Junction: -65°C ~ 150°C Grade: Military Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 10 A Current - Reverse Leakage @ Vr: 5 µA @ 600 V Qualification: MIL-PRF-19500/260 |
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1N5238B | Microchip Technology |
Description: DIODE ZENER 8.7V 500MW DO204AHPackaging: Bulk Tolerance: ±5% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 8.7 V Impedance (Max) (Zzt): 8 Ohms Supplier Device Package: DO-204AH (DO-35) Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 3 µA @ 6.5 V |
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DSA1121DL1-050.0000TVAO | Microchip Technology |
Description: MEMS OSC., AUTOMOTIVE, -40-105C,Packaging: Tape & Reel (TR) Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 35mA Supplier Device Package: 6-VDFN (2.5x2) Height - Seated (Max): 0.035" (0.90mm) Frequency: 50 MHz Base Resonator: MEMS |
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DSA1121DL1-050.0000VAO | Microchip Technology |
Description: MEMS OSC., AUTOMOTIVE, -40-105C,Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 35mA Supplier Device Package: 6-VDFN (2.5x2) Height - Seated (Max): 0.035" (0.90mm) Frequency: 50 MHz Base Resonator: MEMS |
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DSA1121DL2-014.7456TVAO | Microchip Technology |
Description: MEMS OSC., AUTOMOTIVE, -40-105C,Packaging: Tape & Reel (TR) Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 35mA Supplier Device Package: 6-VDFN (2.5x2) Height - Seated (Max): 0.035" (0.90mm) Frequency: 14.7456 MHz Base Resonator: MEMS |
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DSA1121DL2-011.2896VAO | Microchip Technology |
Description: MEMS OSC., AUTOMOTIVE, -40-105C,Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 35mA Supplier Device Package: 6-VDFN (2.5x2) Height - Seated (Max): 0.035" (0.90mm) Frequency: 11.2896 MHz Base Resonator: MEMS |
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DSA1121DL2-011.2896TVAO | Microchip Technology |
Description: MEMS OSC., AUTOMOTIVE, -40-105C,Packaging: Tape & Reel (TR) Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 35mA Supplier Device Package: 6-VDFN (2.5x2) Height - Seated (Max): 0.035" (0.90mm) Frequency: 11.2896 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSA1121DL2-014.7456VAO | Microchip Technology |
Description: MEMS OSC., AUTOMOTIVE, -40-105C,Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 35mA Supplier Device Package: 6-VDFN (2.5x2) Height - Seated (Max): 0.035" (0.90mm) Frequency: 14.7456 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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MART100KP170CA | Microchip Technology |
Description: TVS DIODE 170VWM 334VC CASE 5APackaging: Bulk Package / Case: DO-204AR, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Voltage - Reverse Standoff (Typ): 170V Supplier Device Package: Case 5A (DO-204AR) Bidirectional Channels: 1 Voltage - Breakdown (Min): 189V Voltage - Clamping (Max) @ Ipp: 334V Power - Peak Pulse: 100000W (100kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500 |
Produkt ist nicht verfügbar |
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1N5246B | Microchip Technology |
Description: DIODE ZENER 16V 500MW DO204AHPackaging: Bulk Tolerance: ±5% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 16 V Impedance (Max) (Zzt): 17 Ohms Supplier Device Package: DO-204AH (DO-35) Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 100 nA @ 12 V |
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MASMCGLCE90Ae3 | Microchip Technology |
Description: TVS DIODE 90VWM 146VC DO214AB Packaging: Bulk Package / Case: DO-215AB, SMC Gull Wing Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Capacitance @ Frequency: 90pF @ 1MHz Current - Peak Pulse (10/1000µs): 10.3A Voltage - Reverse Standoff (Typ): 90V Supplier Device Package: DO-214AB (SMCG) Unidirectional Channels: 1 Voltage - Breakdown (Min): 100V Voltage - Clamping (Max) @ Ipp: 146V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500 |
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1N5822 | Microchip Technology |
Description: DIODE SCHOTTKY 40V 3A B AXIALPackaging: Bulk Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Technology: Schottky Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 125°C Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A Current - Reverse Leakage @ Vr: 100 µA @ 40 V |
auf Bestellung 72 Stücke: Lieferzeit 10-14 Tag (e) |
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JAN1N3032D-1 | Microchip Technology |
Description: DIODE ZENER 33V 1W DO204ALPackaging: Bulk Tolerance: ±1% Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C Voltage - Zener (Nom) (Vz): 33 V Impedance (Max) (Zzt): 45 Ohms Supplier Device Package: DO-204AL (DO-41) Grade: Military Power - Max: 1 W Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 10 µA @ 25.1 V Qualification: MIL-PRF-19500/115 |
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| GC4701-01 | Microchip Technology |
Description: RF DIODE PIN 20V 2W CHIPPackaging: Tray Package / Case: Die Diode Type: PIN - Single Operating Temperature: -55°C ~ 150°C Capacitance @ Vr, F: 0.15pF @ 6V, 1MHz Resistance @ If, F: 1.5Ohm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 20V Supplier Device Package: Chip Power Dissipation (Max): 2 W |
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1N4742A | Microchip Technology |
Description: DIODE ZENER 12V 1W DO204ALPackaging: Bulk Tolerance: ±5% Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 12 V Impedance (Max) (Zzt): 9 Ohms Supplier Device Package: DO-204AL (DO-41) Power - Max: 1 W Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 5 µA @ 9.1 V |
Produkt ist nicht verfügbar |
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MSMCJ5.0A | Microchip Technology |
Description: TVS DIODE 5VWM 9.2VC DO214ABPackaging: Bulk Package / Case: DO-214AB, SMC Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 163A Voltage - Reverse Standoff (Typ): 5V Supplier Device Package: DO-214AB (SMCJ) Unidirectional Channels: 1 Voltage - Breakdown (Min): 6.4V Voltage - Clamping (Max) @ Ipp: 9.2V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500 |
Produkt ist nicht verfügbar |
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| PM42036B1-F3EI | Microchip Technology |
Description: PCIE SWITCH GEN4 X36 PAX 753BBGAPackaging: Tray Package / Case: 753-BBGA Mounting Type: Surface Mount Interface: PCI Applications: PCIe Switch Supplier Device Package: 753-BBGA (29x29) |
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ATMEGA48A-CCU | Microchip Technology |
Description: IC MCU 8BIT 4KB FLASH 32UFBGAPackaging: Tray Package / Case: 32-UFBGA Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (2K x 16) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: AVR Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-UFBGA (4x4) Number of I/O: 23 DigiKey Programmable: Not Verified |
auf Bestellung 805 Stücke: Lieferzeit 10-14 Tag (e) |
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ATMEGA48A-CCU | Microchip Technology |
Description: IC MCU 8BIT 4KB FLASH 32UFBGAPackaging: Tray Package / Case: 32-UFBGA Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (2K x 16) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: AVR Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-UFBGA (4x4) Number of I/O: 23 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SAM9X60D6K-I/4GB-SL3 | Microchip Technology |
Description: ARM926 MPU,BGA,IND TEMP,64MB SDRPackaging: Tray Package / Case: 196-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 196-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART |
Produkt ist nicht verfügbar |
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| SAM9X60D6KT-I/4GB-SL3 | Microchip Technology |
Description: ARM926 MPU,BGA,IND TEMP,64MB SDRPackaging: Tape & Reel (TR) Package / Case: 196-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 196-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART |
Produkt ist nicht verfügbar |
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| SAM9X60D5M-I/4FB-SL3 | Microchip Technology |
Description: ARM926 MPU,BGA,IND TEMP,512MBITPackaging: Tray Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART |
Produkt ist nicht verfügbar |
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| SAM9X60D5MT-I/4FB-SL3 | Microchip Technology |
Description: ARM926 MPU,BGA,IND TEMP,512MBITPackaging: Tape & Reel (TR) Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART |
Produkt ist nicht verfügbar |
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| SAM9X60D1G-I/4FB-SL3 | Microchip Technology |
Description: ARM926 MPU,BGA,IND TEMP,1GBIT DDPackaging: Tray Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART |
Produkt ist nicht verfügbar |
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| SAM9X60D1GT-I/4FB-SL3 | Microchip Technology |
Description: ARM926 MPU,BGA,IND TEMP,1GBIT DDPackaging: Tape & Reel (TR) Package / Case: 233-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 233-TFBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART |
Produkt ist nicht verfügbar |
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| SAM9X60T-V/DWB-SL3 | Microchip Technology |
Description: ARM926 MPU, BGA, EXT. TEMP, T&RPackaging: Tape & Reel (TR) Package / Case: 228-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 228-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART |
Produkt ist nicht verfügbar |
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| SAM9X60-V/DWB-SL3 | Microchip Technology |
Description: ARM926 MPU, BGA, EXT. TEMPPackaging: Tray Package / Case: 228-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 228-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART |
Produkt ist nicht verfügbar |
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1N914 | Microchip Technology |
Description: DIODE STANDARD 75V 200MA DO204AHPackaging: Bulk Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 20 ns Technology: Standard Capacitance @ Vr, F: 4pF @ 0V, 1MHz Current - Average Rectified (Io): 200mA Supplier Device Package: DO-204AH (DO-35) Operating Temperature - Junction: -65°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 75 V Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 50 mA Current - Reverse Leakage @ Vr: 500 nA @ 75 V |
Produkt ist nicht verfügbar |
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TL431AILP | Microchip Technology |
Description: IC VREF SHUNT ADJ 1% TO92-3Packaging: Strip Tolerance: ±1% Package / Case: TO-226-3, TO-92-3 Long Body Temperature Coefficient: 30ppm/°C Typical Output Type: Adjustable Mounting Type: Through Hole Reference Type: Shunt Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: TO-92 (TO-226) Voltage - Output (Min/Fixed): 2.5V Current - Cathode: 1 mA Current - Output: 100 mA Voltage - Output (Max): 36 V |
Produkt ist nicht verfügbar |
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| M1.5KE180A | Microchip Technology |
Description: TVS DIODE 154VWM 246VC CASE-1Packaging: Bulk Package / Case: DO-201AA, DO-27, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 6.1A Voltage - Reverse Standoff (Typ): 154V Supplier Device Package: CASE-1 Unidirectional Channels: 1 Voltage - Breakdown (Min): 171V Voltage - Clamping (Max) @ Ipp: 246V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500 |
Produkt ist nicht verfügbar |
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ATMEGA324PB-AUR | Microchip Technology |
Description: IC MCU 8BIT 32KB FLASH 44TQFPPackaging: Tape & Reel (TR) Package / Case: 44-TQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: AVR Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 44-TQFP (10x10) Number of I/O: 39 DigiKey Programmable: Not Verified |
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ATMEGA324PB-AUR | Microchip Technology |
Description: IC MCU 8BIT 32KB FLASH 44TQFPPackaging: Cut Tape (CT) Package / Case: 44-TQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: AVR Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 44-TQFP (10x10) Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 1545 Stücke: Lieferzeit 10-14 Tag (e) |
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MCP1824T-ADJE/OTVAO | Microchip Technology |
Description: IC REG LIN POS ADJ 300MA SOT23-5Packaging: Tape & Reel (TR) Package / Case: SC-74A, SOT-753 Output Type: Adjustable Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 220 µA Voltage - Input (Max): 6V Number of Regulators: 1 Supplier Device Package: SOT-23-5 Voltage - Output (Max): 5V Voltage - Output (Min/Fixed): 0.8V Control Features: Enable, Power Good Grade: Automotive PSRR: 55dB (100Hz) Voltage Dropout (Max): 0.32V @ 300mA Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO) Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MCP1824T-ADJE/OTVAO | Microchip Technology |
Description: IC REG LIN POS ADJ 300MA SOT23-5Packaging: Cut Tape (CT) Package / Case: SC-74A, SOT-753 Output Type: Adjustable Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 220 µA Voltage - Input (Max): 6V Number of Regulators: 1 Supplier Device Package: SOT-23-5 Voltage - Output (Max): 5V Voltage - Output (Min/Fixed): 0.8V Control Features: Enable, Power Good Grade: Automotive PSRR: 55dB (100Hz) Voltage Dropout (Max): 0.32V @ 300mA Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO) Qualification: AEC-Q100 |
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MCP41U83T-502E/ST | Microchip Technology |
Description: IC DGTL POT 5KOHM 1024TAP 14TSOPPackaging: Tape & Reel (TR) Resistance (Ohms): 5k Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Memory Type: Non-Volatile Interface: SPI Configuration: Potentiometer, Rheostat Operating Temperature: -40°C ~ 125°C Number of Taps: 1024 Voltage - Supply: 2.7V ~ 5.5V Taper: Linear Supplier Device Package: 14-TSSOP Resistance - Wiper (Ohms) (Typ): 19 Temperature Coefficient (Typ): 43ppm/°C Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MCP41U83T-502E/ST | Microchip Technology |
Description: IC DGTL POT 5KOHM 1024TAP 14TSOPPackaging: Cut Tape (CT) Resistance (Ohms): 5k Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Memory Type: Non-Volatile Interface: SPI Configuration: Potentiometer, Rheostat Operating Temperature: -40°C ~ 125°C Number of Taps: 1024 Voltage - Supply: 2.7V ~ 5.5V Taper: Linear Supplier Device Package: 14-TSSOP Resistance - Wiper (Ohms) (Typ): 19 Temperature Coefficient (Typ): 43ppm/°C Number of Circuits: 1 |
auf Bestellung 1936 Stücke: Lieferzeit 10-14 Tag (e) |
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24LC025T/SN | Microchip Technology |
Description: IC EEPROM 2KBIT I2C 400KHZ 8SOICPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 2Kbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.5V ~ 5.5V Technology: EEPROM Clock Frequency: 400 kHz Memory Format: EEPROM Supplier Device Package: 8-SOIC Write Cycle Time - Word, Page: 5ms Memory Interface: I2C Access Time: 900 ns Memory Organization: 256 x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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24LC025T/SN | Microchip Technology |
Description: IC EEPROM 2KBIT I2C 400KHZ 8SOICPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 2Kbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.5V ~ 5.5V Technology: EEPROM Clock Frequency: 400 kHz Memory Format: EEPROM Supplier Device Package: 8-SOIC Write Cycle Time - Word, Page: 5ms Memory Interface: I2C Access Time: 900 ns Memory Organization: 256 x 8 DigiKey Programmable: Not Verified |
auf Bestellung 3100 Stücke: Lieferzeit 10-14 Tag (e) |
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AT89C51IC2-RLTUM | Microchip Technology |
Description: IC MCU 8BIT 32KB FLASH 44VQFPPackaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.25K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 80C51 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-VQFP (10x10) Number of I/O: 34 DigiKey Programmable: Not Verified |
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|
2N2222AUA | Microchip Technology |
Description: TRANS NPN 50V 0.8A 4-SMDPackaging: Bulk Package / Case: 4-SMD Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -65°C ~ 200°C (TJ) Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA Current - Collector Cutoff (Max): 50nA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V Supplier Device Package: 4-SMD Current - Collector (Ic) (Max): 800 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 650 mW |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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VN0104N3-G-P013 | Microchip Technology |
Description: MOSFET N-CH 40V 350MA TO92-3Packaging: Cut Tape (CT) Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 350mA (Tj) Rds On (Max) @ Id, Vgs: 3Ohm @ 1A, 10V Power Dissipation (Max): 1W (Tc) Vgs(th) (Max) @ Id: 2.4V @ 1mA Supplier Device Package: TO-92-3 Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Input Capacitance (Ciss) (Max) @ Vds: 65 pF @ 25 V |
auf Bestellung 1969 Stücke: Lieferzeit 10-14 Tag (e) |
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VN0104N3-G-P013 | Microchip Technology |
Description: MOSFET N-CH 40V 350MA TO92-3Packaging: Tape & Box (TB) Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 350mA (Tj) Rds On (Max) @ Id, Vgs: 3Ohm @ 1A, 10V Power Dissipation (Max): 1W (Tc) Vgs(th) (Max) @ Id: 2.4V @ 1mA Supplier Device Package: TO-92-3 Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Input Capacitance (Ciss) (Max) @ Vds: 65 pF @ 25 V |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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1N5997B/TR | Microchip Technology |
Description: DIODE ZENER 7.5V 500MW DO204AHPackaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 7.5 V Impedance (Max) (Zzt): 7 Ohms Supplier Device Package: DO-204AH (DO-35) Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Current - Reverse Leakage @ Vr: 500 nA @ 6 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| 1N5997UR | Microchip Technology |
Description: DIODE ZENERPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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1N5997UR/TR | Microchip Technology |
Description: DIODE ZENER 7.5V 500MW DO213AAPackaging: Tape & Reel (TR) Package / Case: DO-213AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 7.5 V Supplier Device Package: DO-213AA Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N5997UR-1/TR | Microchip Technology |
Description: DIODE ZENER 7.5V 500MW DO213AAPackaging: Tape & Reel (TR) Package / Case: DO-213AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 7.5 V Supplier Device Package: DO-213AA Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N5997UR-1/TR | Microchip Technology |
Description: DIODE ZENER 7.5V 500MW DO213AAPackaging: Cut Tape (CT) Package / Case: DO-213AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 7.5 V Supplier Device Package: DO-213AA Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
|
1N5997C/TR | Microchip Technology |
Description: DIODE ZENER 7.5V 500MW DO204AHPackaging: Tape & Reel (TR) Tolerance: ±2% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 7.5 V Impedance (Max) (Zzt): 7 Ohms Supplier Device Package: DO-204AH (DO-35) Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Current - Reverse Leakage @ Vr: 500 nA @ 6 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| 1N5997UR-1 | Microchip Technology |
Description: DIODE ZENERPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| 803-1 | Microchip Technology |
Bridge Rectifiers Single Phase Bridge |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| 682-1 | Microchip Technology |
Bridge Rectifiers 3 Phase Bridge |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
|
800-2 | Microchip Technology |
Bridge Rectifiers 3 Phase Bridge |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| 680-5 | Microchip Technology |
Bridge Rectifiers Bridges |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| 803-4 | Microchip Technology |
Bridge Rectifiers Single Phase Bridge |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| 682-2 | Microchip Technology |
Bridge Rectifiers 3 Phase Bridge |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| CDLL5226D |
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Hersteller: Microchip Technology
Description: DIODE ZENER 3.3V DO-213AA
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 28 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 25 µA @ 1 V
Description: DIODE ZENER 3.3V DO-213AA
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 28 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 25 µA @ 1 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CDLL5226D/TR |
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Hersteller: Microchip Technology
Description: DIODE ZENER 3.3V DO-213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 28 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 25 µA @ 1 V
Description: DIODE ZENER 3.3V DO-213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 28 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 25 µA @ 1 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JANSK2N2222AUB |
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Hersteller: Microchip Technology
Description: SMALL-SIGNAL BJT _ UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Description: SMALL-SIGNAL BJT _ UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JANSU2N2222AUB/TR |
Hersteller: Microchip Technology
Description: SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Description: SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| JANSE2N2222AUB |
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Hersteller: Microchip Technology
Description: SMALL-SIGNAL BJT _ UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Description: SMALL-SIGNAL BJT _ UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| JAN1N1128RA |
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Hersteller: Microchip Technology
Description: DIODE STANDARD REV 600V DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 10 A
Current - Reverse Leakage @ Vr: 5 µA @ 600 V
Qualification: MIL-PRF-19500/260
Description: DIODE STANDARD REV 600V DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 10 A
Current - Reverse Leakage @ Vr: 5 µA @ 600 V
Qualification: MIL-PRF-19500/260
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| 1N5238B |
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Hersteller: Microchip Technology
Description: DIODE ZENER 8.7V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 8.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 6.5 V
Description: DIODE ZENER 8.7V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 8.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 6.5 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSA1121DL1-050.0000TVAO |
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Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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| DSA1121DL1-050.0000VAO |
![]() |
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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| DSA1121DL2-014.7456TVAO |
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Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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| DSA1121DL2-011.2896VAO |
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Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
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| DSA1121DL2-011.2896TVAO |
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Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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| DSA1121DL2-014.7456VAO |
![]() |
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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| MART100KP170CA |
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Hersteller: Microchip Technology
Description: TVS DIODE 170VWM 334VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: Case 5A (DO-204AR)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 189V
Voltage - Clamping (Max) @ Ipp: 334V
Power - Peak Pulse: 100000W (100kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 170VWM 334VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: Case 5A (DO-204AR)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 189V
Voltage - Clamping (Max) @ Ipp: 334V
Power - Peak Pulse: 100000W (100kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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| 1N5246B |
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Hersteller: Microchip Technology
Description: DIODE ZENER 16V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 12 V
Description: DIODE ZENER 16V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 12 V
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| MASMCGLCE90Ae3 |
Hersteller: Microchip Technology
Description: TVS DIODE 90VWM 146VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10.3A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 90VWM 146VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10.3A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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| 1N5822 |
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Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
Current - Reverse Leakage @ Vr: 100 µA @ 40 V
Description: DIODE SCHOTTKY 40V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
Current - Reverse Leakage @ Vr: 100 µA @ 40 V
auf Bestellung 72 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 21.16 EUR |
| JAN1N3032D-1 |
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Hersteller: Microchip Technology
Description: DIODE ZENER 33V 1W DO204AL
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 25.1 V
Qualification: MIL-PRF-19500/115
Description: DIODE ZENER 33V 1W DO204AL
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 25.1 V
Qualification: MIL-PRF-19500/115
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| GC4701-01 |
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Hersteller: Microchip Technology
Description: RF DIODE PIN 20V 2W CHIP
Packaging: Tray
Package / Case: Die
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.15pF @ 6V, 1MHz
Resistance @ If, F: 1.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 20V
Supplier Device Package: Chip
Power Dissipation (Max): 2 W
Description: RF DIODE PIN 20V 2W CHIP
Packaging: Tray
Package / Case: Die
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.15pF @ 6V, 1MHz
Resistance @ If, F: 1.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 20V
Supplier Device Package: Chip
Power Dissipation (Max): 2 W
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| 1N4742A |
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Hersteller: Microchip Technology
Description: DIODE ZENER 12V 1W DO204AL
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 9 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 9.1 V
Description: DIODE ZENER 12V 1W DO204AL
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 9 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 9.1 V
Produkt ist nicht verfügbar
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| MSMCJ5.0A |
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Hersteller: Microchip Technology
Description: TVS DIODE 5VWM 9.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 163A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 9.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 5VWM 9.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 163A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 9.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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| PM42036B1-F3EI |
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Hersteller: Microchip Technology
Description: PCIE SWITCH GEN4 X36 PAX 753BBGA
Packaging: Tray
Package / Case: 753-BBGA
Mounting Type: Surface Mount
Interface: PCI
Applications: PCIe Switch
Supplier Device Package: 753-BBGA (29x29)
Description: PCIE SWITCH GEN4 X36 PAX 753BBGA
Packaging: Tray
Package / Case: 753-BBGA
Mounting Type: Surface Mount
Interface: PCI
Applications: PCIe Switch
Supplier Device Package: 753-BBGA (29x29)
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| ATMEGA48A-CCU |
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Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 32UFBGA
Packaging: Tray
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 32UFBGA
Packaging: Tray
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 805 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 16+ | 1.14 EUR |
| 25+ | 1.05 EUR |
| 100+ | 0.95 EUR |
| ATMEGA48A-CCU |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 32UFBGA
Packaging: Tray
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 32UFBGA
Packaging: Tray
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| SAM9X60D6K-I/4GB-SL3 |
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Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,64MB SDR
Packaging: Tray
Package / Case: 196-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Description: ARM926 MPU,BGA,IND TEMP,64MB SDR
Packaging: Tray
Package / Case: 196-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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| SAM9X60D6KT-I/4GB-SL3 |
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Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,64MB SDR
Packaging: Tape & Reel (TR)
Package / Case: 196-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Description: ARM926 MPU,BGA,IND TEMP,64MB SDR
Packaging: Tape & Reel (TR)
Package / Case: 196-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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| SAM9X60D5M-I/4FB-SL3 |
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Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,512MBIT
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Description: ARM926 MPU,BGA,IND TEMP,512MBIT
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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| SAM9X60D5MT-I/4FB-SL3 |
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Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,512MBIT
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Description: ARM926 MPU,BGA,IND TEMP,512MBIT
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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| SAM9X60D1G-I/4FB-SL3 |
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Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,1GBIT DD
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Description: ARM926 MPU,BGA,IND TEMP,1GBIT DD
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SAM9X60D1GT-I/4FB-SL3 |
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Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,1GBIT DD
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Description: ARM926 MPU,BGA,IND TEMP,1GBIT DD
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SAM9X60T-V/DWB-SL3 |
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Hersteller: Microchip Technology
Description: ARM926 MPU, BGA, EXT. TEMP, T&R
Packaging: Tape & Reel (TR)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
Description: ARM926 MPU, BGA, EXT. TEMP, T&R
Packaging: Tape & Reel (TR)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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| SAM9X60-V/DWB-SL3 |
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Hersteller: Microchip Technology
Description: ARM926 MPU, BGA, EXT. TEMP
Packaging: Tray
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
Description: ARM926 MPU, BGA, EXT. TEMP
Packaging: Tray
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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| 1N914 |
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Hersteller: Microchip Technology
Description: DIODE STANDARD 75V 200MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 20 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 50 mA
Current - Reverse Leakage @ Vr: 500 nA @ 75 V
Description: DIODE STANDARD 75V 200MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 20 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 50 mA
Current - Reverse Leakage @ Vr: 500 nA @ 75 V
Produkt ist nicht verfügbar
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| TL431AILP | ![]() |
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Hersteller: Microchip Technology
Description: IC VREF SHUNT ADJ 1% TO92-3
Packaging: Strip
Tolerance: ±1%
Package / Case: TO-226-3, TO-92-3 Long Body
Temperature Coefficient: 30ppm/°C Typical
Output Type: Adjustable
Mounting Type: Through Hole
Reference Type: Shunt
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: TO-92 (TO-226)
Voltage - Output (Min/Fixed): 2.5V
Current - Cathode: 1 mA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Description: IC VREF SHUNT ADJ 1% TO92-3
Packaging: Strip
Tolerance: ±1%
Package / Case: TO-226-3, TO-92-3 Long Body
Temperature Coefficient: 30ppm/°C Typical
Output Type: Adjustable
Mounting Type: Through Hole
Reference Type: Shunt
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: TO-92 (TO-226)
Voltage - Output (Min/Fixed): 2.5V
Current - Cathode: 1 mA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Produkt ist nicht verfügbar
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| M1.5KE180A |
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Hersteller: Microchip Technology
Description: TVS DIODE 154VWM 246VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.1A
Voltage - Reverse Standoff (Typ): 154V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 171V
Voltage - Clamping (Max) @ Ipp: 246V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 154VWM 246VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.1A
Voltage - Reverse Standoff (Typ): 154V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 171V
Voltage - Clamping (Max) @ Ipp: 246V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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| ATMEGA324PB-AUR |
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Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 39
DigiKey Programmable: Not Verified
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| ATMEGA324PB-AUR |
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Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1545 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 3.45 EUR |
| 25+ | 3.16 EUR |
| 100+ | 2.87 EUR |
| MCP1824T-ADJE/OTVAO |
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Hersteller: Microchip Technology
Description: IC REG LIN POS ADJ 300MA SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-5
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good
Grade: Automotive
PSRR: 55dB (100Hz)
Voltage Dropout (Max): 0.32V @ 300mA
Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Qualification: AEC-Q100
Description: IC REG LIN POS ADJ 300MA SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-5
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good
Grade: Automotive
PSRR: 55dB (100Hz)
Voltage Dropout (Max): 0.32V @ 300mA
Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MCP1824T-ADJE/OTVAO |
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Hersteller: Microchip Technology
Description: IC REG LIN POS ADJ 300MA SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-5
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good
Grade: Automotive
PSRR: 55dB (100Hz)
Voltage Dropout (Max): 0.32V @ 300mA
Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Qualification: AEC-Q100
Description: IC REG LIN POS ADJ 300MA SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-5
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good
Grade: Automotive
PSRR: 55dB (100Hz)
Voltage Dropout (Max): 0.32V @ 300mA
Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MCP41U83T-502E/ST |
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Hersteller: Microchip Technology
Description: IC DGTL POT 5KOHM 1024TAP 14TSOP
Packaging: Tape & Reel (TR)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 1
Description: IC DGTL POT 5KOHM 1024TAP 14TSOP
Packaging: Tape & Reel (TR)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 1
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| MCP41U83T-502E/ST |
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Hersteller: Microchip Technology
Description: IC DGTL POT 5KOHM 1024TAP 14TSOP
Packaging: Cut Tape (CT)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 1
Description: IC DGTL POT 5KOHM 1024TAP 14TSOP
Packaging: Cut Tape (CT)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 1
auf Bestellung 1936 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 3.17 EUR |
| 25+ | 2.64 EUR |
| 100+ | 2.4 EUR |
| 24LC025T/SN |
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Hersteller: Microchip Technology
Description: IC EEPROM 2KBIT I2C 400KHZ 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 2KBIT I2C 400KHZ 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| 24LC025T/SN |
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Hersteller: Microchip Technology
Description: IC EEPROM 2KBIT I2C 400KHZ 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 2KBIT I2C 400KHZ 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
auf Bestellung 3100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 32+ | 0.56 EUR |
| AT89C51IC2-RLTUM |
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Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
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| 2N2222AUA |
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Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A 4-SMD
Packaging: Bulk
Package / Case: 4-SMD
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: 4-SMD
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Description: TRANS NPN 50V 0.8A 4-SMD
Packaging: Bulk
Package / Case: 4-SMD
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: 4-SMD
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Produkt ist nicht verfügbar
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| VN0104N3-G-P013 |
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Hersteller: Microchip Technology
Description: MOSFET N-CH 40V 350MA TO92-3
Packaging: Cut Tape (CT)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Tj)
Rds On (Max) @ Id, Vgs: 3Ohm @ 1A, 10V
Power Dissipation (Max): 1W (Tc)
Vgs(th) (Max) @ Id: 2.4V @ 1mA
Supplier Device Package: TO-92-3
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 65 pF @ 25 V
Description: MOSFET N-CH 40V 350MA TO92-3
Packaging: Cut Tape (CT)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Tj)
Rds On (Max) @ Id, Vgs: 3Ohm @ 1A, 10V
Power Dissipation (Max): 1W (Tc)
Vgs(th) (Max) @ Id: 2.4V @ 1mA
Supplier Device Package: TO-92-3
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 65 pF @ 25 V
auf Bestellung 1969 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 14+ | 1.34 EUR |
| 25+ | 1.13 EUR |
| 100+ | 1.02 EUR |
| VN0104N3-G-P013 |
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Hersteller: Microchip Technology
Description: MOSFET N-CH 40V 350MA TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Tj)
Rds On (Max) @ Id, Vgs: 3Ohm @ 1A, 10V
Power Dissipation (Max): 1W (Tc)
Vgs(th) (Max) @ Id: 2.4V @ 1mA
Supplier Device Package: TO-92-3
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 65 pF @ 25 V
Description: MOSFET N-CH 40V 350MA TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Tj)
Rds On (Max) @ Id, Vgs: 3Ohm @ 1A, 10V
Power Dissipation (Max): 1W (Tc)
Vgs(th) (Max) @ Id: 2.4V @ 1mA
Supplier Device Package: TO-92-3
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 65 pF @ 25 V
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2000+ | 1.02 EUR |
| 1N5997B/TR |
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Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Description: DIODE ZENER 7.5V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Produkt ist nicht verfügbar
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| 1N5997UR/TR |
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Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 500MW DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Description: DIODE ZENER 7.5V 500MW DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Produkt ist nicht verfügbar
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| 1N5997UR-1/TR |
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Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 500MW DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Description: DIODE ZENER 7.5V 500MW DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Produkt ist nicht verfügbar
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| 1N5997UR-1/TR |
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Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 500MW DO213AA
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Description: DIODE ZENER 7.5V 500MW DO213AA
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Produkt ist nicht verfügbar
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| 1N5997C/TR |
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Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Description: DIODE ZENER 7.5V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Produkt ist nicht verfügbar
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| 803-1 |
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Hersteller: Microchip Technology
Bridge Rectifiers Single Phase Bridge
Bridge Rectifiers Single Phase Bridge
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| 682-1 |
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Hersteller: Microchip Technology
Bridge Rectifiers 3 Phase Bridge
Bridge Rectifiers 3 Phase Bridge
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| 800-2 |
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Hersteller: Microchip Technology
Bridge Rectifiers 3 Phase Bridge
Bridge Rectifiers 3 Phase Bridge
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| 680-5 |
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Hersteller: Microchip Technology
Bridge Rectifiers Bridges
Bridge Rectifiers Bridges
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| 803-4 |
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Hersteller: Microchip Technology
Bridge Rectifiers Single Phase Bridge
Bridge Rectifiers Single Phase Bridge
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| 682-2 |
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Hersteller: Microchip Technology
Bridge Rectifiers 3 Phase Bridge
Bridge Rectifiers 3 Phase Bridge
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