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SY56016RMG-TR SY56016RMG-TR Microchip Technology sy56016r.pdf Description: IC LINE DVR/RCVR CML DIFF 10-MLF
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SY89251VMG-TR SY89251VMG-TR Microchip Technology sy89251v.pdf Description: IC RCVR ENH DIFF PECL/ECL 8-MLF
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AC244023 AC244023 Microchip Technology 50001292W.pdf Description: PROC EXTENS PAK PIC18F1XK50
Packaging: Box
For Use With/Related Products: PIC18F14K50, PIC18F13K50
Accessory Type: Processor Daughter Card
Utilized IC / Part: PIC18F14K50, PIC18F13K50
Part Status: Active
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DM240021 DM240021 Microchip Technology MPLAB%20Starter%20Kit%20for%20PIC24H%20User%20Guide_ds51780a.pdf description Description: MPLAB PIC24HJ128GP504 EVAL BRD
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MA180025 MA180025 Microchip Technology en539518.pdf Description: MODULE PLUG-IN PIC18F87J90 PIM
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PIC24FJ128GA106-I/MR PIC24FJ128GA106-I/MR Microchip Technology PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf Description: IC MCU 16BIT 128KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (43K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
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PIC24FJ128GB106-I/MR PIC24FJ128GB106-I/MR Microchip Technology 39897c.pdf Description: IC MCU 16BIT 128KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (43K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
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PIC24FJ192GA106-I/MR PIC24FJ192GA106-I/MR Microchip Technology PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf Description: IC MCU 16BIT 192KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (65.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
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PIC24FJ192GB106-I/MR PIC24FJ192GB106-I/MR Microchip Technology filehandler.aspx?ddocname=en534963 Description: IC MCU 16BIT 192KB FLASH 64QFN
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PIC24FJ256GA106-I/MR PIC24FJ256GA106-I/MR Microchip Technology PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf Description: IC MCU 16BIT 256KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
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PIC24FJ256GB106-I/MR PIC24FJ256GB106-I/MR Microchip Technology 39897c.pdf Description: IC MCU 16BIT 256KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
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PIC24FJ64GB106-I/MR PIC24FJ64GB106-I/MR Microchip Technology 39897c.pdf Description: IC MCU 16BIT 64KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (22K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATTINY45-20SUR ATTINY45-20SUR Microchip Technology Atmel-2586-AVR-8-bit-Microcontroller-ATtiny25-ATtiny45-ATtiny85_Datasheet-Summary.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 6
DigiKey Programmable: Verified
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RN131G-I/RM RN131G-I/RM Microchip Technology rn-131-ds-v3.2r.pdf Description: RF TXRX MOD WIFI CHIP + U.FL SMD
Packaging: Tray
Package / Case: Module
Sensitivity: -85dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 8MB Flash, 2MB ROM, 128kB RAM
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Power - Output: 18dBm
Data Rate: 54Mbps
Protocol: 802.11b/g
Current - Receiving: 40mA
Current - Transmitting: 140mA
Antenna Type: Integrated, Chip + U.FL
Modulation: CDK, DBPSK, DQPSK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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RN-131G-EVAL RN-131G-EVAL Microchip Technology filehandler.aspx?ddocname=en558057 Description: EVALUATION KIT FOR RN-131G
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MCP6051-E/SN MCP6051-E/SN Microchip Technology MCP6051_DS22182B.pdf description Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 30µA
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6051T-E/MNY MCP6051T-E/MNY Microchip Technology MCP6051_DS22182B.pdf Description: IC OPAMP GP 1 CIRCUIT 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 30µA
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6052-E/SN MCP6052-E/SN Microchip Technology MCP6051_DS22182B.pdf description Description: IC CMOS 2 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x2 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6052T-E/MNY MCP6052T-E/MNY Microchip Technology MCP6051_DS22182B.pdf Description: IC CMOS 2 CIRCUIT 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x2 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6054-E/SL MCP6054-E/SL Microchip Technology MCP6051_DS22182B.pdf Description: IC CMOS 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x4 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6054-E/ST MCP6054-E/ST Microchip Technology MCP6051_DS22182B.pdf Description: IC CMOS 4 CIRCUIT 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x4 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-TSSOP
Number of Circuits: 4
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6061-E/SN MCP6061-E/SN Microchip Technology MCP6061_DS22189B.pdf description Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 60µA
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6061T-E/MNY MCP6061T-E/MNY Microchip Technology MCP6061_DS22189B.pdf Description: IC OPAMP GP 1 CIRCUIT 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 60µA
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6062-E/SN MCP6062-E/SN Microchip Technology MCP6061_DS22189B.pdf description Description: IC CMOS 2 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x2 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6062T-E/MNY MCP6062T-E/MNY Microchip Technology MCP6061_DS22189B.pdf Description: IC CMOS 2 CIRCUIT 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x2 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6064-E/SL MCP6064-E/SL Microchip Technology MCP6061_DS22189B.pdf Description: IC OP AMP 4CH 14-SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x4 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6064-E/ST MCP6064-E/ST Microchip Technology MCP6061_DS22189B.pdf Description: IC OP AMP 4CH 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x4 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP98243-BE/MC MCP98243-BE/MC Microchip Technology Description: IC TEMP SENSOR 3V 2WIRE 8-DFN
Packaging: Tube
Package / Case: 8-VFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: No
Supplier Device Package: 8-DFN (2x3)
Part Status: Active
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MCP6051T-E/MNY MCP6051T-E/MNY Microchip Technology MCP6051_DS22182B.pdf Description: IC OPAMP GP 1 CIRCUIT 8TDFN
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 30µA
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6052T-E/MNY MCP6052T-E/MNY Microchip Technology MCP6051_DS22182B.pdf Description: IC CMOS 2 CIRCUIT 8TDFN
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x2 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6062T-E/MNY MCP6062T-E/MNY Microchip Technology MCP6061_DS22189B.pdf Description: IC CMOS 2 CIRCUIT 8TDFN
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x2 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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24VL025T/ST 24VL025T/ST Microchip Technology 22130A.pdf Description: IC EEPROM 2KBIT I2C 8TSSOP
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93LC86BT-I/SN 93LC86BT-I/SN Microchip Technology 21797L.pdf Description: IC EEPROM 16KBIT MICROWIRE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: Microwire
Memory Organization: 1K x 16
DigiKey Programmable: Verified
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MCP3901T-I/SS MCP3901T-I/SS Microchip Technology 22192d.pdf Description: IC AFE 2 CHAN 24BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 24
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Supplier Device Package: 20-SSOP
Number of Channels: 2
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MCP6051T-E/SN MCP6051T-E/SN Microchip Technology MCP6051_DS22182B.pdf Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 30µA
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6052T-E/SN MCP6052T-E/SN Microchip Technology MCP6051_DS22182B.pdf Description: IC CMOS 2 CIRCUIT 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x2 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6054T-E/SL MCP6054T-E/SL Microchip Technology MCP6051_DS22182B.pdf Description: IC CMOS 4 CIRCUIT 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x4 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-SOIC
Number of Circuits: 4
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6054T-E/ST MCP6054T-E/ST Microchip Technology MCP6051_DS22182B.pdf Description: IC CMOS 4 CIRCUIT 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x4 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-TSSOP
Number of Circuits: 4
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP6061T-E/SN MCP6061T-E/SN Microchip Technology MCP6061_DS22189B.pdf Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 60µA
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6064T-E/SL MCP6064T-E/SL Microchip Technology MCP6061_DS22189B.pdf Description: IC OP AMP 4CH 14-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x4 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6064T-E/ST MCP6064T-E/ST Microchip Technology MCP6061_DS22189B.pdf Description: IC OP AMP 4CH 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x4 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP98242T-BE/MCBAC MCP98242T-BE/MCBAC Microchip Technology filehandler.aspx?ddocname=en028100 Description: IC TEMP SENSOR 2WIRE 3V 8-DFN
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MCP98242T-BE/MNYBA2 MCP98242T-BE/MNYBA2 Microchip Technology filehandler.aspx?ddocname=en028100 Description: IC TEMP SENSOR 2WIRE 3V 8-TDFN
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MCP98242T-BE/MNYBAC MCP98242T-BE/MNYBAC Microchip Technology filehandler.aspx?ddocname=en028100 Description: IC TEMP SENSOR 2WIRE 3V 8-TDFN
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MCP98243T-BE/MC MCP98243T-BE/MC Microchip Technology Description: IC TEMP SENSOR 2WIRE 3V 8-DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: No
Supplier Device Package: 8-DFN (2x3)
Part Status: Active
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MCP98243T-BE/MCAA MCP98243T-BE/MCAA Microchip Technology 22153c.pdf Description: IC TEMP SENSOR 2WIRE 3V 8-DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3%
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: No
Supplier Device Package: 8-DFN (2x3)
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MCP98243T-BE/MCAB MCP98243T-BE/MCAB Microchip Technology filehandler.aspx?ddocname=en541317 Description: IC TEMP SENSOR 2WIRE 3V 8-DFN
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MCP98243T-BE/MNY MCP98243T-BE/MNY Microchip Technology Description: IC TEMP SENSOR 2WIRE 3V 8-TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: No
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
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MCP98243T-BE/MNYAB MCP98243T-BE/MNYAB Microchip Technology filehandler.aspx?ddocname=en541317 Description: IC TEMP SENSOR 2WIRE 3V 8-TDFN
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MCP98243T-BE/MUY MCP98243T-BE/MUY Microchip Technology filehandler.aspx?ddocname=en541317 Description: IC TEMP SENSOR 2WIRE 3V 8-UDFN
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MCP98243T-BE/MUYAA MCP98243T-BE/MUYAA Microchip Technology filehandler.aspx?ddocname=en541317 Description: IC TEMP SENSOR 2WIRE 3V 8-UDFN
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PIC24FJ128GA106-E/MR PIC24FJ128GA106-E/MR Microchip Technology PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf Description: IC MCU 16BIT 128KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (43K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
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PIC24FJ192GA106-E/MR PIC24FJ192GA106-E/MR Microchip Technology PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf Description: IC MCU 16BIT 192KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (65.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
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PIC24FJ256GA106-E/MR PIC24FJ256GA106-E/MR Microchip Technology PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf Description: IC MCU 16BIT 256KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
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SL006014 Microchip Technology Description: SOFTWARE LICENSE MPLAB C COMPIER
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1N4571A-1 1N4571A-1 Microchip Technology 10936-sa6-21-datasheet Description: DIODE ZENER 6.4V 500MW DO35
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-204AH (DO-35)
Part Status: Active
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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USB3321C-GL-TR USB3321C-GL-TR Microchip Technology 00001902A.pdf Description: IC TRANSCEIVER 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-WLCSP
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 1.8V
Protocol: USB 2.0
Supplier Device Package: 25-WLCSP
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KSZ8041MLL KSZ8041MLL Microchip Technology 00002436B.pdf Description: IC TRANSCEIVER FULL 1/1 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Protocol: MII
Supplier Device Package: 48-LQFP (7x7)
Duplex: Full
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25+4.16 EUR
100+4.01 EUR
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KSZ8041RNL KSZ8041RNL Microchip Technology 00002245B.pdf Description: IC TRANSCEIVER FULL 1/1 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Protocol: RMII
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
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KSZ8842-16MBLI KSZ8842-16MBLI Microchip Technology filehandler.aspx?ddocname=en581685 Description: IC ETHERNET SW 2PORT 100-LFBGA
auf Bestellung 226 Stücke:
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SY56016RMG-TR sy56016r.pdf
SY56016RMG-TR
Hersteller: Microchip Technology
Description: IC LINE DVR/RCVR CML DIFF 10-MLF
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SY89251VMG-TR sy89251v.pdf
SY89251VMG-TR
Hersteller: Microchip Technology
Description: IC RCVR ENH DIFF PECL/ECL 8-MLF
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AC244023 50001292W.pdf
AC244023
Hersteller: Microchip Technology
Description: PROC EXTENS PAK PIC18F1XK50
Packaging: Box
For Use With/Related Products: PIC18F14K50, PIC18F13K50
Accessory Type: Processor Daughter Card
Utilized IC / Part: PIC18F14K50, PIC18F13K50
Part Status: Active
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DM240021 description MPLAB%20Starter%20Kit%20for%20PIC24H%20User%20Guide_ds51780a.pdf
DM240021
Hersteller: Microchip Technology
Description: MPLAB PIC24HJ128GP504 EVAL BRD
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MA180025 en539518.pdf
MA180025
Hersteller: Microchip Technology
Description: MODULE PLUG-IN PIC18F87J90 PIM
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PIC24FJ128GA106-I/MR PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf
PIC24FJ128GA106-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (43K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
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PIC24FJ128GB106-I/MR 39897c.pdf
PIC24FJ128GB106-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (43K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
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2+12.35 EUR
25+11.36 EUR
100+10.28 EUR
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PIC24FJ192GA106-I/MR PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf
PIC24FJ192GA106-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 192KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (65.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC24FJ192GB106-I/MR filehandler.aspx?ddocname=en534963
PIC24FJ192GB106-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 192KB FLASH 64QFN
Produkt ist nicht verfügbar
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PIC24FJ256GA106-I/MR PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf
PIC24FJ256GA106-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
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PIC24FJ256GB106-I/MR 39897c.pdf
PIC24FJ256GB106-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
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PIC24FJ64GB106-I/MR 39897c.pdf
PIC24FJ64GB106-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (22K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATTINY45-20SUR Atmel-2586-AVR-8-bit-Microcontroller-ATtiny25-ATtiny45-ATtiny85_Datasheet-Summary.pdf
ATTINY45-20SUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 6
DigiKey Programmable: Verified
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RN131G-I/RM rn-131-ds-v3.2r.pdf
RN131G-I/RM
Hersteller: Microchip Technology
Description: RF TXRX MOD WIFI CHIP + U.FL SMD
Packaging: Tray
Package / Case: Module
Sensitivity: -85dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 8MB Flash, 2MB ROM, 128kB RAM
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Power - Output: 18dBm
Data Rate: 54Mbps
Protocol: 802.11b/g
Current - Receiving: 40mA
Current - Transmitting: 140mA
Antenna Type: Integrated, Chip + U.FL
Modulation: CDK, DBPSK, DQPSK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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RN-131G-EVAL filehandler.aspx?ddocname=en558057
RN-131G-EVAL
Hersteller: Microchip Technology
Description: EVALUATION KIT FOR RN-131G
Produkt ist nicht verfügbar
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MCP6051-E/SN description MCP6051_DS22182B.pdf
MCP6051-E/SN
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 30µA
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6051T-E/MNY MCP6051_DS22182B.pdf
MCP6051T-E/MNY
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 30µA
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6052-E/SN description MCP6051_DS22182B.pdf
MCP6052-E/SN
Hersteller: Microchip Technology
Description: IC CMOS 2 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x2 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6052T-E/MNY MCP6051_DS22182B.pdf
MCP6052T-E/MNY
Hersteller: Microchip Technology
Description: IC CMOS 2 CIRCUIT 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x2 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6054-E/SL MCP6051_DS22182B.pdf
MCP6054-E/SL
Hersteller: Microchip Technology
Description: IC CMOS 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x4 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6054-E/ST MCP6051_DS22182B.pdf
MCP6054-E/ST
Hersteller: Microchip Technology
Description: IC CMOS 4 CIRCUIT 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x4 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-TSSOP
Number of Circuits: 4
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6061-E/SN description MCP6061_DS22189B.pdf
MCP6061-E/SN
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 60µA
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6061T-E/MNY MCP6061_DS22189B.pdf
MCP6061T-E/MNY
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 60µA
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP6062-E/SN description MCP6061_DS22189B.pdf
MCP6062-E/SN
Hersteller: Microchip Technology
Description: IC CMOS 2 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x2 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6062T-E/MNY MCP6061_DS22189B.pdf
MCP6062T-E/MNY
Hersteller: Microchip Technology
Description: IC CMOS 2 CIRCUIT 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x2 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP6064-E/SL MCP6061_DS22189B.pdf
MCP6064-E/SL
Hersteller: Microchip Technology
Description: IC OP AMP 4CH 14-SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x4 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6064-E/ST MCP6061_DS22189B.pdf
MCP6064-E/ST
Hersteller: Microchip Technology
Description: IC OP AMP 4CH 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x4 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP98243-BE/MC
MCP98243-BE/MC
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 3V 2WIRE 8-DFN
Packaging: Tube
Package / Case: 8-VFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: No
Supplier Device Package: 8-DFN (2x3)
Part Status: Active
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MCP6051T-E/MNY MCP6051_DS22182B.pdf
MCP6051T-E/MNY
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT 8TDFN
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 30µA
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6052T-E/MNY MCP6051_DS22182B.pdf
MCP6052T-E/MNY
Hersteller: Microchip Technology
Description: IC CMOS 2 CIRCUIT 8TDFN
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x2 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6062T-E/MNY MCP6061_DS22189B.pdf
MCP6062T-E/MNY
Hersteller: Microchip Technology
Description: IC CMOS 2 CIRCUIT 8TDFN
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x2 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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24VL025T/ST 22130A.pdf
24VL025T/ST
Hersteller: Microchip Technology
Description: IC EEPROM 2KBIT I2C 8TSSOP
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93LC86BT-I/SN 21797L.pdf
93LC86BT-I/SN
Hersteller: Microchip Technology
Description: IC EEPROM 16KBIT MICROWIRE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: Microwire
Memory Organization: 1K x 16
DigiKey Programmable: Verified
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3300+0.89 EUR
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MCP3901T-I/SS 22192d.pdf
MCP3901T-I/SS
Hersteller: Microchip Technology
Description: IC AFE 2 CHAN 24BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 24
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Supplier Device Package: 20-SSOP
Number of Channels: 2
Produkt ist nicht verfügbar
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MCP6051T-E/SN MCP6051_DS22182B.pdf
MCP6051T-E/SN
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 30µA
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP6052T-E/SN MCP6051_DS22182B.pdf
MCP6052T-E/SN
Hersteller: Microchip Technology
Description: IC CMOS 2 CIRCUIT 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x2 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6054T-E/SL MCP6051_DS22182B.pdf
MCP6054T-E/SL
Hersteller: Microchip Technology
Description: IC CMOS 4 CIRCUIT 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x4 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-SOIC
Number of Circuits: 4
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP6054T-E/ST MCP6051_DS22182B.pdf
MCP6054T-E/ST
Hersteller: Microchip Technology
Description: IC CMOS 4 CIRCUIT 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 30µA (x4 Channels)
Slew Rate: 0.15V/µs
Gain Bandwidth Product: 385 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-TSSOP
Number of Circuits: 4
Current - Output / Channel: 26 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP6061T-E/SN MCP6061_DS22189B.pdf
MCP6061T-E/SN
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Current - Supply: 60µA
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 1
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6064T-E/SL MCP6061_DS22189B.pdf
MCP6064T-E/SL
Hersteller: Microchip Technology
Description: IC OP AMP 4CH 14-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x4 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP6064T-E/ST MCP6061_DS22189B.pdf
MCP6064T-E/ST
Hersteller: Microchip Technology
Description: IC OP AMP 4CH 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 60µA (x4 Channels)
Slew Rate: 0.25V/µs
Gain Bandwidth Product: 730 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 150 µV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 27 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP98242T-BE/MCBAC filehandler.aspx?ddocname=en028100
MCP98242T-BE/MCBAC
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 2WIRE 3V 8-DFN
Produkt ist nicht verfügbar
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MCP98242T-BE/MNYBA2 filehandler.aspx?ddocname=en028100
MCP98242T-BE/MNYBA2
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 2WIRE 3V 8-TDFN
Produkt ist nicht verfügbar
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MCP98242T-BE/MNYBAC filehandler.aspx?ddocname=en028100
MCP98242T-BE/MNYBAC
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 2WIRE 3V 8-TDFN
Produkt ist nicht verfügbar
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MCP98243T-BE/MC
MCP98243T-BE/MC
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 2WIRE 3V 8-DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: No
Supplier Device Package: 8-DFN (2x3)
Part Status: Active
auf Bestellung 16500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3300+1.86 EUR
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MCP98243T-BE/MCAA 22153c.pdf
MCP98243T-BE/MCAA
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 2WIRE 3V 8-DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3%
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: No
Supplier Device Package: 8-DFN (2x3)
Produkt ist nicht verfügbar
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MCP98243T-BE/MCAB filehandler.aspx?ddocname=en541317
MCP98243T-BE/MCAB
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 2WIRE 3V 8-DFN
Produkt ist nicht verfügbar
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MCP98243T-BE/MNY
MCP98243T-BE/MNY
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 2WIRE 3V 8-TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor), DIMM DDR Memory
Accuracy: ±3°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: No
Supplier Device Package: 8-TDFN (2x3)
Part Status: Active
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MCP98243T-BE/MNYAB filehandler.aspx?ddocname=en541317
MCP98243T-BE/MNYAB
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 2WIRE 3V 8-TDFN
Produkt ist nicht verfügbar
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MCP98243T-BE/MUY filehandler.aspx?ddocname=en541317
MCP98243T-BE/MUY
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 2WIRE 3V 8-UDFN
Produkt ist nicht verfügbar
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MCP98243T-BE/MUYAA filehandler.aspx?ddocname=en541317
MCP98243T-BE/MUYAA
Hersteller: Microchip Technology
Description: IC TEMP SENSOR 2WIRE 3V 8-UDFN
Produkt ist nicht verfügbar
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PIC24FJ128GA106-E/MR PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf
PIC24FJ128GA106-E/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (43K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
Produkt ist nicht verfügbar
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PIC24FJ192GA106-E/MR PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf
PIC24FJ192GA106-E/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 192KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (65.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
Produkt ist nicht verfügbar
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PIC24FJ256GA106-E/MR PIC24FJ256GA110-Family-Data-Sheet-DS30009905F.pdf
PIC24FJ256GA106-E/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64VQFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Part Status: Active
Number of I/O: 53
Produkt ist nicht verfügbar
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SL006014
Hersteller: Microchip Technology
Description: SOFTWARE LICENSE MPLAB C COMPIER
Produkt ist nicht verfügbar
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1N4571A-1 10936-sa6-21-datasheet
1N4571A-1
Hersteller: Microchip Technology
Description: DIODE ZENER 6.4V 500MW DO35
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-204AH (DO-35)
Part Status: Active
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
auf Bestellung 443 Stücke:
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2+12.23 EUR
25+11.36 EUR
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USB3321C-GL-TR 00001902A.pdf
USB3321C-GL-TR
Hersteller: Microchip Technology
Description: IC TRANSCEIVER 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-WLCSP
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 1.8V
Protocol: USB 2.0
Supplier Device Package: 25-WLCSP
Produkt ist nicht verfügbar
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KSZ8041MLL 00002436B.pdf
KSZ8041MLL
Hersteller: Microchip Technology
Description: IC TRANSCEIVER FULL 1/1 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Protocol: MII
Supplier Device Package: 48-LQFP (7x7)
Duplex: Full
auf Bestellung 1098 Stücke:
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5+5.01 EUR
25+4.16 EUR
100+4.01 EUR
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KSZ8041RNL 00002245B.pdf
KSZ8041RNL
Hersteller: Microchip Technology
Description: IC TRANSCEIVER FULL 1/1 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Protocol: RMII
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
Produkt ist nicht verfügbar
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KSZ8842-16MBLI filehandler.aspx?ddocname=en581685
KSZ8842-16MBLI
Hersteller: Microchip Technology
Description: IC ETHERNET SW 2PORT 100-LFBGA
auf Bestellung 226 Stücke:
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