Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (336730) > Seite 785 nach 5613
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||||
|---|---|---|---|---|---|---|---|---|---|
 |
M2S150T-1FC1152I | Microchip Technology |
 Description: IC SOC CORTEX-M3 166MHZ 1152BGAPackaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 1152-FCBGA (35x35) Architecture: MCU, FPGA Flash Size: 512KB Part Status: Active |
Produkt ist nicht verfügbar |
|||||
 |
M2S150T-1FCG1152I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 1152BGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 150K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 1152-FCBGA (35x35) Architecture: MCU, FPGA Flash Size: 512KB |
auf Bestellung 48 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||
 |
M2S025-FGG484 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Packaging: Tray Package / Case: 484-BGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 484-FPBGA (23x23) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
auf Bestellung 491 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||
 |
M2S025T-VFG400 | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Package / Case: 400-LFBGA Speed: 166MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: FPGA - 25K Logic Modules Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES Supplier Device Package: 400-VFBGA (17x17) Architecture: MCU, FPGA Flash Size: 256KB |
Produkt ist nicht verfügbar |
|||||
|
|
M2GL150-FC1152 | Microchip Technology |
Description: IC FPGA 574 I/O 1152FCBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 2.625V Number of Logic Elements/Cells: 146124 Supplier Device Package: 1152-FCBGA (35x35) Total RAM Bits: 5120000 Number of I/O: 574 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
 |
M2S010TS-1FG484I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
M2S050-1FG484I | Microchip Technology |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA |
Produkt ist nicht verfügbar |
|||||
 |
APA600-PQG208M | Microchip Technology |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 600000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.3V ~ 2.7V Supplier Device Package: 208-PQFP (28x28) Total RAM Bits: 129024 Number of I/O: 158 DigiKey Programmable: Not Verified |
auf Bestellung 24 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||
 |
A54SX32A-TQG100M | Microchip Technology |
Description: IC FPGA 81 I/O 100TQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 2880 Number of I/O: 81 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
 |
A54SX32A-TQG144M | Microchip Technology |
Description: IC FPGA 113 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 2880 Number of I/O: 113 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
 |
A54SX72A-1CQ208M | Microchip Technology |
Description: IC FPGA 171 I/O 208CQFP Packaging: Tray Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 108000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-CQFP (75x75) Number of LABs/CLBs: 6036 Number of I/O: 171 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
 |
A54SX72A-1FG256M | Microchip Technology |
Description: IC FPGA 203 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX72A-1FGG256M | Microchip Technology |
Description: IC FPGA 203 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX72A-CQ208M | Microchip Technology |
Description: IC FPGA 171 I/O 208CQFP Packaging: Tray Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 108000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-CQFP (75x75) Number of LABs/CLBs: 6036 Number of I/O: 171 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
 |
A54SX72A-CQ256M | Microchip Technology |
Description: IC FPGA 213 I/O 256CQFP Packaging: Tray Package / Case: 256-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 108000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 256-CQFP (75x75) Number of LABs/CLBs: 6036 Number of I/O: 213 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX72A-FG256M | Microchip Technology |
Description: IC FPGA 203 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX72A-FGG256M | Microchip Technology |
Description: IC FPGA 203 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
| 5962-9958501QXC | Microchip Technology |
Description: IC FPGA 202 I/O 256CQFP Packaging: Bulk Package / Case: 256-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 54000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V Supplier Device Package: 256-CQFP (75x75) Total RAM Bits: 2560 Number of I/O: 202 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||
| 5962-9958501QYC | Microchip Technology |
Description: IC FPGA 176 I/O 208CQFP Packaging: Bulk Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 54000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V Supplier Device Package: 208-CQFP (75x75) Total RAM Bits: 2560 Number of I/O: 176 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||
| 5962-9958502QXC | Microchip Technology |
Description: IC FPGA 202 I/O 256CQFP Packaging: Bulk Package / Case: 256-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 54000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V Supplier Device Package: 256-CQFP (75x75) Total RAM Bits: 2560 Number of I/O: 202 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||
| 5962-9958502QYC | Microchip Technology |
Description: IC FPGA 176 I/O 208CQFP Packaging: Bulk Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 54000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V Supplier Device Package: 208-CQFP (75x75) Total RAM Bits: 2560 Number of I/O: 176 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||
| 5962-9958601QYC | Microchip Technology |
Description: IC FPGA 174 I/O 208CQFP Packaging: Bulk Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 3V ~ 3.6V, 4.75V ~ 5.25V Supplier Device Package: 208-CQFP (75x75) Number of LABs/CLBs: 2880 Number of I/O: 174 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||
| 5962-9958602QYC | Microchip Technology |
Description: IC FPGA 174 I/O 208CQFP Packaging: Bulk Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 3V ~ 3.6V, 4.75V ~ 5.25V Supplier Device Package: 208-CQFP (75x75) Number of LABs/CLBs: 2880 Number of I/O: 174 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||
|
|
A2F500M3G-1FG256M | Microchip Technology |
Description: IC SOC CORTEX-M3 100MHZ 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A2F500M3G-1FGG256M | Microchip Technology |
Description: IC SOC CORTEX-M3 100MHZ 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A2F500M3G-FG256M | Microchip Technology |
Description: IC SOC CORTEX-M3 80MHZ 256FBGA |
Produkt ist nicht verfügbar |
|||||
| A3P1000-PQG208M | Microchip Technology |
Description: IC FPGA 154 I/O 208QFP |
Produkt ist nicht verfügbar |
||||||
|
|
A3PE3000L-1FG484M | Microchip Technology |
Description: IC FPGA 341 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Number of Gates: 3000000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Supplier Device Package: 484-FPBGA (23x23) Total RAM Bits: 516096 Part Status: Active Number of I/O: 341 |
Produkt ist nicht verfügbar |
|||||
 |
A3PE3000L-1FGG484M | Microchip Technology |
Description: IC FPGA 341 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Number of Gates: 3000000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Supplier Device Package: 484-FPBGA (23x23) Total RAM Bits: 516096 Part Status: Active Number of I/O: 341 |
Produkt ist nicht verfügbar |
|||||
 |
A54SX16A-1PQG208M | Microchip Technology |
Description: IC FPGA 175 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1452 Part Status: Active Number of I/O: 175 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX16A-1TQG100M | Microchip Technology |
Description: IC FPGA 81 I/O 100TQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 1452 Number of I/O: 81 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX16A-1TQG144M | Microchip Technology |
Description: IC FPGA 111 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 1452 Number of I/O: 111 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
 |
APA300-BG456M | Microchip Technology |
Description: IC FPGA 290 I/O 456BGA |
Produkt ist nicht verfügbar |
|||||
|
|
APA300-CQ208M | Microchip Technology |
Description: IC FPGA 158 I/O 208CQFP Packaging: Tray Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 300000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.3V ~ 2.7V Supplier Device Package: 208-CQFP (75x75) Total RAM Bits: 73728 Number of I/O: 158 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
APA300-FG256M | Microchip Technology |
Description: IC FPGA 186 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX16A-PQG208M | Microchip Technology |
Description: IC FPGA 175 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1452 Number of I/O: 175 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX16A-TQG100M | Microchip Technology |
Description: IC FPGA 81 I/O 100TQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 1452 Number of I/O: 81 DigiKey Programmable: Not Verified |
auf Bestellung 90 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||
|
|
A54SX16A-TQG144M | Microchip Technology |
Description: IC FPGA 113 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 1452 Number of I/O: 113 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX32A-1CQ208M | Microchip Technology |
Description: IC FPGA 174 I/O 208CQFP Packaging: Tray Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-CQFP (75x75) Number of LABs/CLBs: 2880 Number of I/O: 174 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX32A-1CQ256M | Microchip Technology |
Description: IC FPGA 228 I/O 256CQFP Packaging: Tray Package / Case: 256-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 256-CQFP (75x75) Number of LABs/CLBs: 2880 Number of I/O: 228 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX32A-1FG256M | Microchip Technology |
Description: IC FPGA 203 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX32A-1FGG256M | Microchip Technology |
Description: IC FPGA 203 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX32A-1TQG100M | Microchip Technology |
Description: IC FPGA 81 I/O 100TQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 2880 Number of I/O: 81 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX32A-1TQG144M | Microchip Technology |
Description: IC FPGA 113 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 2880 Number of I/O: 113 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
APA300-FGG256M | Microchip Technology |
Description: IC FPGA 186 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
APA300-PQG208M | Microchip Technology |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 300000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.3V ~ 2.7V Supplier Device Package: 208-PQFP (28x28) Total RAM Bits: 73728 Part Status: Active Number of I/O: 158 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX32A-CQ208M | Microchip Technology |
Description: IC FPGA 174 I/O 208CQFP Packaging: Tray Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-CQFP (75x75) Number of LABs/CLBs: 2880 Number of I/O: 174 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
APA600-CQ208M | Microchip Technology |
Description: IC FPGA 158 I/O 208CQFP Packaging: Tray Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 600000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.3V ~ 2.7V Supplier Device Package: 208-CQFP (75x75) Total RAM Bits: 129024 Number of I/O: 158 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||
|
|
APA600-FG256M | Microchip Technology |
Description: IC FPGA 186 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
APA600-FGG256M | Microchip Technology |
Description: IC FPGA 186 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A2F500M3G-FGG256M | Microchip Technology |
Description: IC SOC CORTEX-M3 80MHZ 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX32A-FGG256M | Microchip Technology |
Description: IC FPGA 203 I/O 256FBGA |
Produkt ist nicht verfügbar |
|||||
|
|
A54SX16A-1PQ208M | Microchip Technology |
Description: IC FPGA 175 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1452 Part Status: Obsolete Number of I/O: 175 |
Produkt ist nicht verfügbar |
|||||
 |
APT30DF20HJ | Microchip Technology |
Description: BRIDGE RECT 1P 200V 45A SOT227 Packaging: Bulk Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis Mount Diode Type: Single Phase Operating Temperature: -55°C ~ 150°C (TJ) Technology: Standard Supplier Device Package: SOT-227 Voltage - Peak Reverse (Max): 200 V Current - Average Rectified (Io): 45 A Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A Current - Reverse Leakage @ Vr: 250 µA @ 200 V |
Produkt ist nicht verfügbar |
|||||
 |
APT50DF170HJ | Microchip Technology |
Description: BRIDGE RECT 1P 1.7KV 50A SOT227 Packaging: Bulk Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis Mount Diode Type: Single Phase Operating Temperature: -55°C ~ 150°C (TJ) Technology: Standard Supplier Device Package: SOT-227 (ISOTOP®) Part Status: Active Voltage - Peak Reverse (Max): 1.7 kV Current - Average Rectified (Io): 50 A Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 50 A Current - Reverse Leakage @ Vr: 250 µA @ 1700 V |
auf Bestellung 14 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||
|
|
APT40GL120JU3 | Microchip Technology |
Description: IGBT MOD 1200V 65A 220W SOT227 Packaging: Bulk Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis, Stud Mount Input: Standard Configuration: Single Operating Temperature: -55°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A NTC Thermistor: No Supplier Device Package: SOT-227 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 65 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 220 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V |
Produkt ist nicht verfügbar |
|||||
| APTGF150A60T3AG | Microchip Technology |
Description: IGBT MODULE 600V 230A 833W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Half Bridge Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: NPT Part Status: Obsolete Current - Collector (Ic) (Max): 230 A Voltage - Collector Emitter Breakdown (Max): 600 V Power - Max: 833 W Current - Collector Cutoff (Max): 350 µA Input Capacitance (Cies) @ Vce: 9 nF @ 25 V |
Produkt ist nicht verfügbar |
||||||
| APTGF50DH120T3G | Microchip Technology |
Description: IGBT MODULE 1200V 70A 312W SP3 |
Produkt ist nicht verfügbar |
||||||
| APTGF50DSK120T3G | Microchip Technology |
Description: IGBT MODULE 1200V 70A 312W SP3 |
Produkt ist nicht verfügbar |
||||||
| APTGL120TDU120TPG | Microchip Technology |
Description: IGBT MODULE 1200V 140A 517W SP6P Packaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Triple, Dual - Common Source Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 100A NTC Thermistor: Yes Supplier Device Package: SP6-P IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 140 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 517 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V |
Produkt ist nicht verfügbar |
| M2S150T-1FC1152I |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Part Status: Active
Produkt ist nicht verfügbar
| M2S150T-1FCG1152I |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 166MHZ 1152BGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 150K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 1152-FCBGA (35x35)
Architecture: MCU, FPGA
Flash Size: 512KB
auf Bestellung 48 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1278 EUR |
| M2S025-FGG484 |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 484-FPBGA (23x23)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
auf Bestellung 491 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 194.53 EUR |
| 100+ | 191.71 EUR |
| M2S025T-VFG400 |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 400-VFBGA (17x17)
Architecture: MCU, FPGA
Flash Size: 256KB
Produkt ist nicht verfügbar
| M2GL150-FC1152 |
|
Hersteller: Microchip Technology
Description: IC FPGA 574 I/O 1152FCBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 2.625V
Number of Logic Elements/Cells: 146124
Supplier Device Package: 1152-FCBGA (35x35)
Total RAM Bits: 5120000
Number of I/O: 574
DigiKey Programmable: Not Verified
Description: IC FPGA 574 I/O 1152FCBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 2.625V
Number of Logic Elements/Cells: 146124
Supplier Device Package: 1152-FCBGA (35x35)
Total RAM Bits: 5120000
Number of I/O: 574
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| M2S010TS-1FG484I |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Produkt ist nicht verfügbar
| M2S050-1FG484I |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Produkt ist nicht verfügbar
| APA600-PQG208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 600000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-PQFP (28x28)
Total RAM Bits: 129024
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 600000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-PQFP (28x28)
Total RAM Bits: 129024
Number of I/O: 158
DigiKey Programmable: Not Verified
auf Bestellung 24 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 3146 EUR |
| A54SX32A-TQG100M |
|
Hersteller: Microchip Technology
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 2880
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 2880
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX32A-TQG144M |
|
Hersteller: Microchip Technology
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 2880
Number of I/O: 113
DigiKey Programmable: Not Verified
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 2880
Number of I/O: 113
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX72A-1CQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 171 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 108000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 6036
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC FPGA 171 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 108000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 6036
Number of I/O: 171
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX72A-1FG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
Description: IC FPGA 203 I/O 256FBGA
Produkt ist nicht verfügbar
| A54SX72A-1FGG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
Description: IC FPGA 203 I/O 256FBGA
Produkt ist nicht verfügbar
| A54SX72A-CQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 171 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 108000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 6036
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC FPGA 171 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 108000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 6036
Number of I/O: 171
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX72A-CQ256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 213 I/O 256CQFP
Packaging: Tray
Package / Case: 256-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 108000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 256-CQFP (75x75)
Number of LABs/CLBs: 6036
Number of I/O: 213
DigiKey Programmable: Not Verified
Description: IC FPGA 213 I/O 256CQFP
Packaging: Tray
Package / Case: 256-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 108000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 256-CQFP (75x75)
Number of LABs/CLBs: 6036
Number of I/O: 213
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX72A-FG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
Description: IC FPGA 203 I/O 256FBGA
Produkt ist nicht verfügbar
| A54SX72A-FGG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
Description: IC FPGA 203 I/O 256FBGA
Produkt ist nicht verfügbar
| 5962-9958501QXC |
|
Hersteller: Microchip Technology
Description: IC FPGA 202 I/O 256CQFP
Packaging: Bulk
Package / Case: 256-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 54000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 256-CQFP (75x75)
Total RAM Bits: 2560
Number of I/O: 202
DigiKey Programmable: Not Verified
Description: IC FPGA 202 I/O 256CQFP
Packaging: Bulk
Package / Case: 256-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 54000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 256-CQFP (75x75)
Total RAM Bits: 2560
Number of I/O: 202
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 5962-9958501QYC |
|
Hersteller: Microchip Technology
Description: IC FPGA 176 I/O 208CQFP
Packaging: Bulk
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 54000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 2560
Number of I/O: 176
DigiKey Programmable: Not Verified
Description: IC FPGA 176 I/O 208CQFP
Packaging: Bulk
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 54000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 2560
Number of I/O: 176
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 5962-9958502QXC |
|
Hersteller: Microchip Technology
Description: IC FPGA 202 I/O 256CQFP
Packaging: Bulk
Package / Case: 256-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 54000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 256-CQFP (75x75)
Total RAM Bits: 2560
Number of I/O: 202
DigiKey Programmable: Not Verified
Description: IC FPGA 202 I/O 256CQFP
Packaging: Bulk
Package / Case: 256-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 54000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 256-CQFP (75x75)
Total RAM Bits: 2560
Number of I/O: 202
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 5962-9958502QYC |
|
Hersteller: Microchip Technology
Description: IC FPGA 176 I/O 208CQFP
Packaging: Bulk
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 54000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 2560
Number of I/O: 176
DigiKey Programmable: Not Verified
Description: IC FPGA 176 I/O 208CQFP
Packaging: Bulk
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 54000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 2560
Number of I/O: 176
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 5962-9958601QYC |
|
Hersteller: Microchip Technology
Description: IC FPGA 174 I/O 208CQFP
Packaging: Bulk
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.75V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Description: IC FPGA 174 I/O 208CQFP
Packaging: Bulk
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.75V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 5962-9958602QYC |
|
Hersteller: Microchip Technology
Description: IC FPGA 174 I/O 208CQFP
Packaging: Bulk
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.75V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Description: IC FPGA 174 I/O 208CQFP
Packaging: Bulk
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 3V ~ 3.6V, 4.75V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A2F500M3G-1FG256M |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 100MHZ 256FBGA
Description: IC SOC CORTEX-M3 100MHZ 256FBGA
Produkt ist nicht verfügbar
| A2F500M3G-1FGG256M |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 100MHZ 256FBGA
Description: IC SOC CORTEX-M3 100MHZ 256FBGA
Produkt ist nicht verfügbar
| A2F500M3G-FG256M |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 80MHZ 256FBGA
Description: IC SOC CORTEX-M3 80MHZ 256FBGA
Produkt ist nicht verfügbar
| A3P1000-PQG208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 154 I/O 208QFP
Description: IC FPGA 154 I/O 208QFP
Produkt ist nicht verfügbar
| A3PE3000L-1FG484M |
|
Hersteller: Microchip Technology
Description: IC FPGA 341 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Number of Gates: 3000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 484-FPBGA (23x23)
Total RAM Bits: 516096
Part Status: Active
Number of I/O: 341
Description: IC FPGA 341 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Number of Gates: 3000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 484-FPBGA (23x23)
Total RAM Bits: 516096
Part Status: Active
Number of I/O: 341
Produkt ist nicht verfügbar
| A3PE3000L-1FGG484M |
|
Hersteller: Microchip Technology
Description: IC FPGA 341 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Number of Gates: 3000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 484-FPBGA (23x23)
Total RAM Bits: 516096
Part Status: Active
Number of I/O: 341
Description: IC FPGA 341 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Number of Gates: 3000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 484-FPBGA (23x23)
Total RAM Bits: 516096
Part Status: Active
Number of I/O: 341
Produkt ist nicht verfügbar
| A54SX16A-1PQG208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Part Status: Active
Number of I/O: 175
DigiKey Programmable: Not Verified
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Part Status: Active
Number of I/O: 175
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX16A-1TQG100M |
|
Hersteller: Microchip Technology
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 1452
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 1452
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX16A-1TQG144M |
|
Hersteller: Microchip Technology
Description: IC FPGA 111 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 1452
Number of I/O: 111
DigiKey Programmable: Not Verified
Description: IC FPGA 111 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 1452
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| APA300-BG456M |
|
Hersteller: Microchip Technology
Description: IC FPGA 290 I/O 456BGA
Description: IC FPGA 290 I/O 456BGA
Produkt ist nicht verfügbar
| APA300-CQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 158 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 300000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 73728
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 300000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 73728
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| APA300-FG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
Description: IC FPGA 186 I/O 256FBGA
Produkt ist nicht verfügbar
| A54SX16A-PQG208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Number of I/O: 175
DigiKey Programmable: Not Verified
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Number of I/O: 175
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX16A-TQG100M |
|
Hersteller: Microchip Technology
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 1452
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 1452
Number of I/O: 81
DigiKey Programmable: Not Verified
auf Bestellung 90 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1591.38 EUR |
| A54SX16A-TQG144M |
|
Hersteller: Microchip Technology
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 1452
Number of I/O: 113
DigiKey Programmable: Not Verified
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 1452
Number of I/O: 113
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX32A-1CQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 174 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Description: IC FPGA 174 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX32A-1CQ256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 228 I/O 256CQFP
Packaging: Tray
Package / Case: 256-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 256-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA 228 I/O 256CQFP
Packaging: Tray
Package / Case: 256-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 256-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX32A-1FG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
Description: IC FPGA 203 I/O 256FBGA
Produkt ist nicht verfügbar
| A54SX32A-1FGG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
Description: IC FPGA 203 I/O 256FBGA
Produkt ist nicht verfügbar
| A54SX32A-1TQG100M |
|
Hersteller: Microchip Technology
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 2880
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 2880
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX32A-1TQG144M |
|
Hersteller: Microchip Technology
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 2880
Number of I/O: 113
DigiKey Programmable: Not Verified
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 2880
Number of I/O: 113
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| APA300-FGG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
Description: IC FPGA 186 I/O 256FBGA
Produkt ist nicht verfügbar
| APA300-PQG208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 300000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-PQFP (28x28)
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 300000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-PQFP (28x28)
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A54SX32A-CQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 174 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Description: IC FPGA 174 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| APA600-CQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 158 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 600000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 129024
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 600000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 129024
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| APA600-FG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
Description: IC FPGA 186 I/O 256FBGA
Produkt ist nicht verfügbar
| APA600-FGG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
Description: IC FPGA 186 I/O 256FBGA
Produkt ist nicht verfügbar
| A2F500M3G-FGG256M |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 80MHZ 256FBGA
Description: IC SOC CORTEX-M3 80MHZ 256FBGA
Produkt ist nicht verfügbar
| A54SX32A-FGG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
Description: IC FPGA 203 I/O 256FBGA
Produkt ist nicht verfügbar
| A54SX16A-1PQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Part Status: Obsolete
Number of I/O: 175
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Part Status: Obsolete
Number of I/O: 175
Produkt ist nicht verfügbar
| APT30DF20HJ |
|
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 200V 45A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 200 V
Current - Average Rectified (Io): 45 A
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
Description: BRIDGE RECT 1P 200V 45A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 200 V
Current - Average Rectified (Io): 45 A
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
Produkt ist nicht verfügbar
| APT50DF170HJ |
|
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 1.7KV 50A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227 (ISOTOP®)
Part Status: Active
Voltage - Peak Reverse (Max): 1.7 kV
Current - Average Rectified (Io): 50 A
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 50 A
Current - Reverse Leakage @ Vr: 250 µA @ 1700 V
Description: BRIDGE RECT 1P 1.7KV 50A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227 (ISOTOP®)
Part Status: Active
Voltage - Peak Reverse (Max): 1.7 kV
Current - Average Rectified (Io): 50 A
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 50 A
Current - Reverse Leakage @ Vr: 250 µA @ 1700 V
auf Bestellung 14 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 90.25 EUR |
| APT40GL120JU3 |
|
Hersteller: Microchip Technology
Description: IGBT MOD 1200V 65A 220W SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis, Stud Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Description: IGBT MOD 1200V 65A 220W SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis, Stud Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Produkt ist nicht verfügbar
| APTGF150A60T3AG |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 600V 230A 833W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Part Status: Obsolete
Current - Collector (Ic) (Max): 230 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 833 W
Current - Collector Cutoff (Max): 350 µA
Input Capacitance (Cies) @ Vce: 9 nF @ 25 V
Description: IGBT MODULE 600V 230A 833W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Part Status: Obsolete
Current - Collector (Ic) (Max): 230 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 833 W
Current - Collector Cutoff (Max): 350 µA
Input Capacitance (Cies) @ Vce: 9 nF @ 25 V
Produkt ist nicht verfügbar
| APTGF50DH120T3G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 70A 312W SP3
Description: IGBT MODULE 1200V 70A 312W SP3
Produkt ist nicht verfügbar
| APTGF50DSK120T3G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 70A 312W SP3
Description: IGBT MODULE 1200V 70A 312W SP3
Produkt ist nicht verfügbar
| APTGL120TDU120TPG |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 140A 517W SP6P
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Triple, Dual - Common Source
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 100A
NTC Thermistor: Yes
Supplier Device Package: SP6-P
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 517 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V
Description: IGBT MODULE 1200V 140A 517W SP6P
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Triple, Dual - Common Source
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 100A
NTC Thermistor: Yes
Supplier Device Package: SP6-P
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 517 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V
Produkt ist nicht verfügbar