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ATSAMD21G18A-MUT ATSAMD21G18A-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
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ATSAMD21E17A-AUT ATSAMD21E17A-AUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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2000+3.72 EUR
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ATSAMD21E17A-MUT ATSAMD21E17A-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882.pdf Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMD21E18A-AUT ATSAMD21E18A-AUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 256KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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2000+5.04 EUR
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ATSAMD21E18A-MUT ATSAMD21E18A-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882.pdf Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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ATSAMD21J17A-AUT ATSAMD21J17A-AUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 52
DigiKey Programmable: Not Verified
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ATSAMD21J17A-MUT ATSAMD21J17A-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMD21J18A-AUT ATSAMD21J18A-AUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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25+6.15 EUR
100+5.59 EUR
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ATSAMD21J18A-MUT ATSAMD21J18A-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 256KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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ATSAMD21G17A-AUT ATSAMD21G17A-AUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
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ATSAMD21G18A-AUT ATSAMD21G18A-AUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 256KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Verified
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ATSAMD21G18A-MUT ATSAMD21G18A-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
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25+5.73 EUR
100+5.2 EUR
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ATSAMD21E17A-AUT ATSAMD21E17A-AUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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ATSAMD21E17A-MUT ATSAMD21E17A-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882.pdf Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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25+4.35 EUR
100+3.91 EUR
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ATSAMD21E18A-AUT ATSAMD21E18A-AUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 256KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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ATSAMD21E18A-MUT ATSAMD21E18A-MUT Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882.pdf Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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ATMEGA328P-XMINI ATMEGA328P-XMINI Microchip Technology 50002659A.pdf Description: ATMEGA328P XPLAINED MINI
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: AVR
Board Type: Evaluation Platform
Utilized IC / Part: ATmega328P
Platform: ATmega328P Xplained Mini
Part Status: Active
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MIC2004-0.5YML-TR MIC2004-0.5YML-TR Microchip Technology mic20xx.pdf Description: IC PWR SWITCH P-CHAN 1:1 6MLF
Features: Load Discharge
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad, 6-MLF®
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 70mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 500mA
Ratio - Input:Output: 1:1
Supplier Device Package: 6-DFN (2x2)
Fault Protection: Current Limiting (Fixed), Over Temperature
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MIC94310-4YM5-T5 MIC94310-4YM5-T5 Microchip Technology MIC94310-Data-Sheet-20006105B.pdf Description: IC REG LINEAR 1.2V 200MA SOT23-5
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 85dB ~ 50dB (100Hz ~ 10MHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.2V
Supplier Device Package: SOT-23-5
Number of Regulators: 1
Voltage - Input (Max): 3.6V
Current - Quiescent (Iq): 250 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Tape & Reel (TR)
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MIC94310-4YM5-T5 MIC94310-4YM5-T5 Microchip Technology MIC94310-Data-Sheet-20006105B.pdf Description: IC REG LINEAR 1.2V 200MA SOT23-5
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 85dB ~ 50dB (100Hz ~ 10MHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.2V
Supplier Device Package: SOT-23-5
Number of Regulators: 1
Voltage - Input (Max): 3.6V
Current - Quiescent (Iq): 250 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Cut Tape (CT)
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PIC18F13K22T-I/ML PIC18F13K22T-I/ML Microchip Technology 40001365F.pdf Description: IC MCU 8BIT 8KB FLASH 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 17
DigiKey Programmable: Verified
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25+2.99 EUR
100+2.7 EUR
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1N3155A 1N3155A Microchip Technology 5791-1n3154-3157a-datasheet Description: DIODE ZENER 8.4V 500MW DO35
auf Bestellung 156 Stücke:
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1N3155AE3 1N3155AE3 Microchip Technology 5791-1n3154-3157a-datasheet Description: DIODE ZENER 8.4V 500MW DO35
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1N3595-1 Microchip Technology Description: DIODE STD 125V 150MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 125 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 nA @ 125 V
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1N3595UR-1 1N3595UR-1 Microchip Technology 1N3595AUR.pdf Description: DIODE STD 125V 150MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 125 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 nA @ 125 V
Produkt ist nicht verfügbar
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1N3595US 1N3595US Microchip Technology 1N3595.pdf Description: DIODE STANDARD 4A B SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Current - Average Rectified (Io): 4A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 nA @ 125 V
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1N3998A 1N3998A Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 6.2V 10W DO213AA
Package / Case: DO-203AA, DO-4, Stud
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 10 µA @ 2 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Power - Max: 10 W
Part Status: Active
Supplier Device Package: DO-213AA (DO-4)
Impedance (Max) (Zzt): 1.1 Ohms
Voltage - Zener (Nom) (Vz): 6.2 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Chassis Mount
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1N4109 1N4109 Microchip Technology 10907-sa5-25-datasheet Description: DIODE ZENER 15V 500MW DO204AH
Current - Reverse Leakage @ Vr: 50 nA @ 11.4 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35 Glass)
Impedance (Max) (Zzt): 100 Ohms
Voltage - Zener (Nom) (Vz): 15 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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1N4370A 1N4370A Microchip Technology 10928-sa5-7-datasheet Description: DIODE ZENER 2.4V 500MW DO35
Current - Reverse Leakage @ Vr: 100 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 2.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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1N4454UR-1 1N4454UR-1 Microchip Technology 5814-1n4454ur-1-datasheet Description: DIODE GEN PURP 50V 200MA DO213AA
Current - Reverse Leakage @ Vr: 100 nA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Voltage - DC Reverse (Vr) (Max): 50 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: DO-213AA
Current - Average Rectified (Io): 200mA
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: DO-213AA
Packaging: Bulk
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1N4468US 1N4468US Microchip Technology 1N4460US-1N4496US.1N6485US-1NN6491US.pdf Description: DIODE ZENER 13V 1.5W D5A
Packaging: Bulk
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: D-5A
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 10.4 V
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1N4481US 1N4481US Microchip Technology 1N4460US-1N4496US.1N6485US-1NN6491US.pdf Description: DIODE ZENER 47V 1.5W D5A
Current - Reverse Leakage @ Vr: 50 nA @ 37.6 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 1.5 W
Supplier Device Package: D-5A
Impedance (Max) (Zzt): 50 Ohms
Voltage - Zener (Nom) (Vz): 47 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Tolerance: ±5%
Packaging: Bulk
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1N4568A-1 1N4568A-1 Microchip Technology 10936-sa6-21-datasheet Description: DIODE ZENER 6.4V 500MW DO35
Current - Reverse Leakage @ Vr: 2 mA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-35
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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1N4573A-1 1N4573A-1 Microchip Technology 10936-sa6-21-datasheet Description: DIODE ZENER 6.4V 500MW DO35
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1N4579A-1 1N4579A-1 Microchip Technology 10936-sa6-21-datasheet Description: DIODE ZENER 6.4V 500MW DO35
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Part Status: Discontinued at Digi-Key
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 50 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
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1N4581A-1 1N4581A-1 Microchip Technology 10936-sa6-21-datasheet Description: DIODE ZENER 6.4V 500MW DO204AH
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 25 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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1N4621UR-1 1N4621UR-1 Microchip Technology 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf Description: DIODE ZENER 3.6V 500MW DO213AA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 1700 Ohms
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
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1N4691 1N4691 Microchip Technology 1N4678-1N4717.pdf Description: DIODE ZENER 6.2V 500MW DO35
Current - Reverse Leakage @ Vr: 10 µA @ 5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-35
Voltage - Zener (Nom) (Vz): 6.2 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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1N4996US 1N4996US Microchip Technology 1N4954US-96US%2C1N5968US-69US%2C1N6632US-1N6637US.pdf Description: DIODE ZENER 390V 5W D5B
Packaging: Bulk
Tolerance: ±5%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 390 V
Impedance (Max) (Zzt): 1800 Ohms
Supplier Device Package: D-5B
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 297 V
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1N5231BUR-1 1N5231BUR-1 Microchip Technology 1N5221UR-1N5281BUR-E3.pdf Description: DIODE ZENER 5.1V 500MW DO213AA
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 5 µA @ 2 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 17 Ohms
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1N5234A 1N5234A Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 6.2V 500MW DO35
Current - Reverse Leakage @ Vr: 5 µA @ 3.8 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 7 Ohms
Voltage - Zener (Nom) (Vz): 6.2 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±10%
Packaging: Bulk
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1N5279B 1N5279B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 180V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 180 V
Impedance (Max) (Zzt): 2200 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 137 V
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1N5281B 1N5281B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 200V 500MW DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Supplier Device Package: DO-204AH (DO-35)
Part Status: Active
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 152 V
Tolerance: ±5%
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 200 V
Impedance (Max) (Zzt): 2500 Ohms
Power - Max: 500 mW
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1N5300-1 1N5300-1 Microchip Technology 1N5283-1_1N5314-1.pdf Description: DIODE CUR REG 100V 1.43MA 500MW
Voltage - Limiting (Max): 1.5V
Regulator Current (Max): 1.43mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Supplier Device Package: DO-7
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AA, DO-7, Axial
Packaging: Bulk
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1N5331 1N5331 Microchip Technology S%2CR21.pdf Description: DIODE STANDARD 1400V 22A DO4
Current - Reverse Leakage @ Vr: 10 µA @ 1400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Voltage - DC Reverse (Vr) (Max): 1400 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: DO-4
Current - Average Rectified (Io): 22A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Chassis, Stud Mount
Package / Case: DO-203AA, DO-4, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5419E3 1N5419E3 Microchip Technology LDS-0231%2C+1N5415+thru+1N5420%2C+MIL-PRF-19500-411.pdf Description: DIODE STANDARD 500V 3A B AXIAL
Technology: Standard
Reverse Recovery Time (trr): 250 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: B, Axial
Packaging: Bulk
Current - Reverse Leakage @ Vr: 1 µA @ 500 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Voltage - DC Reverse (Vr) (Max): 500 V
Operating Temperature - Junction: -65°C ~ 175°C
Supplier Device Package: B, Axial
Current - Average Rectified (Io): 3A
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1N5523BUR-1 1N5523BUR-1 Microchip Technology 8860-lds-0037-datasheet Description: DIODE ZENER 5.1V 500MW DO213AA
Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 26 Ohms
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
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1N5532BUR-1 1N5532BUR-1 Microchip Technology 1N5518BUR-1_1N5546BUR-1.pdf Description: DIODE ZENER 12V 500MW DO213AA
Current - Reverse Leakage @ Vr: 50 nA @ 10.8 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
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1N5711-1 1N5711-1 Microchip Technology LDS-0040_r4%2C+1N5711-12_1N6857-58_DSB2810_5712%2C+MIL-PRF-19500-444.pdf Description: DIODE SCHOTTKY 70V 33MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 33mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 70 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 15 mA
Current - Reverse Leakage @ Vr: 200 nA @ 50 V
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1N5822US 1N5822US Microchip Technology LDS-0303-1%2C+1N5820US-1N5822US%2C1N6864US%2C+MIL-PRF-19500-620.pdf Description: DIODE SCHOTTKY 40V 3A B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
Current - Reverse Leakage @ Vr: 100 µA @ 40 V
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1N5907 1N5907 Microchip Technology 8921-lds-0095-datasheet Description: TVS DIODE 5VWM 8.5VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 8.5V
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 5V
Current - Peak Pulse (10/1000µs): 120A
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
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1N6316US 1N6316US Microchip Technology 11083-lds-0193-1-datasheet Description: DIODE ZENER 4.7V 500MW SQ-MELF
Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: B, SQ-MELF
Impedance (Max) (Zzt): 1500 Ohms
Voltage - Zener (Nom) (Vz): 4.7 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: SQ-MELF, B
Packaging: Bulk
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1N6325US 1N6325US Microchip Technology lds-0193-1%2C+1N6309US-55US.pdf Description: DIODE ZENER 11V 500MW SQ-MELF
Current - Reverse Leakage @ Vr: 1 µA @ 8.5 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Power - Max: 500 mW
Supplier Device Package: B, SQ-MELF
Impedance (Max) (Zzt): 7 Ohms
Voltage - Zener (Nom) (Vz): 11 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: SQ-MELF, B
Tolerance: ±5%
Packaging: Bulk
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1N6335US 1N6335US Microchip Technology 11083-lds-0193-1-datasheet Description: DIODE ZENER 30V 500MW MELF
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1N6392 1N6392 Microchip Technology 8886-lds-0053-datasheet Description: DIODE SCHOTTKY 45V 54A DO5
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1N6490US 1N6490US Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 5.1V 1.5W D5A
Current - Reverse Leakage @ Vr: 1 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 1.5 W
Supplier Device Package: D-5A
Impedance (Max) (Zzt): 7 Ohms
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Tolerance: ±5%
Packaging: Bulk
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1N6640US 1N6640US Microchip Technology 1N6639US%2C_1N6640US%2C_1N6641US.pdf Description: DIODE STANDARD 75V 300MA D5D
Packaging: Bulk
Package / Case: SQ-MELF, D
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Current - Average Rectified (Io): 300mA
Supplier Device Package: D-5D
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 50 V
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1N6643US 1N6643US Microchip Technology 5895-1n6638-42-43us-datasheet Description: DIODE GEN PURP 50V 300MA D5B
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1N6659 1N6659 Microchip Technology 8910-lds-0068-datasheet Description: DIODE ARRAY GP 200V 15A TO254AA
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 200 V
Supplier Device Package: TO-254AA
Current - Average Rectified (Io) (per Diode): 15A
Diode Configuration: 1 Pair Common Anode
Technology: Standard
Reverse Recovery Time (trr): 35 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-254-3, TO-254AA (Straight Leads)
Packaging: Bulk
Produkt ist nicht verfügbar
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1N6663US 1N6663US Microchip Technology 11107-sd88a-datasheet Description: DIODE GEN PURP 600V 500MA D5A
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ATSAMD21G18A-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21G18A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
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ATSAMD21E17A-AUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21E17A-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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AnzahlPreis
2000+3.72 EUR
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ATSAMD21E17A-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882.pdf
ATSAMD21E17A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMD21E18A-AUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21E18A-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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ATSAMD21E18A-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882.pdf
ATSAMD21E18A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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ATSAMD21J17A-AUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J17A-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 52
DigiKey Programmable: Not Verified
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4+5.46 EUR
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ATSAMD21J17A-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J17A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMD21J18A-AUT SAM-D21-DA1-Family-Data-Sheet-DS40001882.pdf
ATSAMD21J18A-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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3+6.76 EUR
25+6.15 EUR
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ATSAMD21J18A-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21J18A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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ATSAMD21G17A-AUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21G17A-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
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4+4.59 EUR
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ATSAMD21G18A-AUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21G18A-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Verified
auf Bestellung 448 Stücke:
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3+6.44 EUR
25+5.83 EUR
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ATSAMD21G18A-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21G18A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 4005 Stücke:
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3+6.3 EUR
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ATSAMD21E17A-AUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21E17A-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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4+4.51 EUR
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ATSAMD21E17A-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882.pdf
ATSAMD21E17A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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4+4.75 EUR
25+4.35 EUR
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ATSAMD21E18A-AUT SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21E18A-AUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 3481 Stücke:
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AnzahlPreis
3+6.11 EUR
25+5.57 EUR
100+5.04 EUR
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ATSAMD21E18A-MUT SAM-D21-DA1-Family-Data-Sheet-DS40001882.pdf
ATSAMD21E18A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 19970 Stücke:
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3+6.02 EUR
25+5.44 EUR
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ATMEGA328P-XMINI 50002659A.pdf
ATMEGA328P-XMINI
Hersteller: Microchip Technology
Description: ATMEGA328P XPLAINED MINI
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: AVR
Board Type: Evaluation Platform
Utilized IC / Part: ATmega328P
Platform: ATmega328P Xplained Mini
Part Status: Active
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1+24.29 EUR
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MIC2004-0.5YML-TR mic20xx.pdf
MIC2004-0.5YML-TR
Hersteller: Microchip Technology
Description: IC PWR SWITCH P-CHAN 1:1 6MLF
Features: Load Discharge
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad, 6-MLF®
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 70mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 500mA
Ratio - Input:Output: 1:1
Supplier Device Package: 6-DFN (2x2)
Fault Protection: Current Limiting (Fixed), Over Temperature
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MIC94310-4YM5-T5 MIC94310-Data-Sheet-20006105B.pdf
MIC94310-4YM5-T5
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.2V 200MA SOT23-5
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 85dB ~ 50dB (100Hz ~ 10MHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.2V
Supplier Device Package: SOT-23-5
Number of Regulators: 1
Voltage - Input (Max): 3.6V
Current - Quiescent (Iq): 250 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Tape & Reel (TR)
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
500+0.5 EUR
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MIC94310-4YM5-T5 MIC94310-Data-Sheet-20006105B.pdf
MIC94310-4YM5-T5
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.2V 200MA SOT23-5
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 85dB ~ 50dB (100Hz ~ 10MHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.2V
Supplier Device Package: SOT-23-5
Number of Regulators: 1
Voltage - Input (Max): 3.6V
Current - Quiescent (Iq): 250 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Cut Tape (CT)
auf Bestellung 1013 Stücke:
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AnzahlPreis
28+0.65 EUR
33+0.55 EUR
100+0.5 EUR
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PIC18F13K22T-I/ML 40001365F.pdf
PIC18F13K22T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 17
DigiKey Programmable: Verified
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AnzahlPreis
6+3.24 EUR
25+2.99 EUR
100+2.7 EUR
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1N3155A 5791-1n3154-3157a-datasheet
1N3155A
Hersteller: Microchip Technology
Description: DIODE ZENER 8.4V 500MW DO35
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1N3155AE3 5791-1n3154-3157a-datasheet
1N3155AE3
Hersteller: Microchip Technology
Description: DIODE ZENER 8.4V 500MW DO35
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1N3595-1
Hersteller: Microchip Technology
Description: DIODE STD 125V 150MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 125 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 nA @ 125 V
Produkt ist nicht verfügbar
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1N3595UR-1 1N3595AUR.pdf
1N3595UR-1
Hersteller: Microchip Technology
Description: DIODE STD 125V 150MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 125 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 nA @ 125 V
Produkt ist nicht verfügbar
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1N3595US 1N3595.pdf
1N3595US
Hersteller: Microchip Technology
Description: DIODE STANDARD 4A B SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Current - Average Rectified (Io): 4A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 nA @ 125 V
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2+14.7 EUR
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1N3998A 8914-lds-0075-datasheet
1N3998A
Hersteller: Microchip Technology
Description: DIODE ZENER 6.2V 10W DO213AA
Package / Case: DO-203AA, DO-4, Stud
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 10 µA @ 2 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Power - Max: 10 W
Part Status: Active
Supplier Device Package: DO-213AA (DO-4)
Impedance (Max) (Zzt): 1.1 Ohms
Voltage - Zener (Nom) (Vz): 6.2 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Chassis Mount
auf Bestellung 88 Stücke:
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1N4109 10907-sa5-25-datasheet
1N4109
Hersteller: Microchip Technology
Description: DIODE ZENER 15V 500MW DO204AH
Current - Reverse Leakage @ Vr: 50 nA @ 11.4 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35 Glass)
Impedance (Max) (Zzt): 100 Ohms
Voltage - Zener (Nom) (Vz): 15 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 124 Stücke:
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5+3.71 EUR
100+3.46 EUR
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1N4370A 10928-sa5-7-datasheet
1N4370A
Hersteller: Microchip Technology
Description: DIODE ZENER 2.4V 500MW DO35
Current - Reverse Leakage @ Vr: 100 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 2.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 87 Stücke:
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AnzahlPreis
5+3.78 EUR
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1N4454UR-1 5814-1n4454ur-1-datasheet
1N4454UR-1
Hersteller: Microchip Technology
Description: DIODE GEN PURP 50V 200MA DO213AA
Current - Reverse Leakage @ Vr: 100 nA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Voltage - DC Reverse (Vr) (Max): 50 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: DO-213AA
Current - Average Rectified (Io): 200mA
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: DO-213AA
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4468US 1N4460US-1N4496US.1N6485US-1NN6491US.pdf
1N4468US
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 1.5W D5A
Packaging: Bulk
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: D-5A
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 10.4 V
auf Bestellung 111 Stücke:
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2+16.14 EUR
100+14.97 EUR
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1N4481US 1N4460US-1N4496US.1N6485US-1NN6491US.pdf
1N4481US
Hersteller: Microchip Technology
Description: DIODE ZENER 47V 1.5W D5A
Current - Reverse Leakage @ Vr: 50 nA @ 37.6 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 1.5 W
Supplier Device Package: D-5A
Impedance (Max) (Zzt): 50 Ohms
Voltage - Zener (Nom) (Vz): 47 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Tolerance: ±5%
Packaging: Bulk
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2+17.37 EUR
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1N4568A-1 10936-sa6-21-datasheet
1N4568A-1
Hersteller: Microchip Technology
Description: DIODE ZENER 6.4V 500MW DO35
Current - Reverse Leakage @ Vr: 2 mA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-35
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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2+9.79 EUR
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1N4573A-1 10936-sa6-21-datasheet
1N4573A-1
Hersteller: Microchip Technology
Description: DIODE ZENER 6.4V 500MW DO35
Produkt ist nicht verfügbar
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1N4579A-1 10936-sa6-21-datasheet
1N4579A-1
Hersteller: Microchip Technology
Description: DIODE ZENER 6.4V 500MW DO35
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Part Status: Discontinued at Digi-Key
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 50 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
auf Bestellung 14 Stücke:
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AnzahlPreis
1+45.88 EUR
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1N4581A-1 10936-sa6-21-datasheet
1N4581A-1
Hersteller: Microchip Technology
Description: DIODE ZENER 6.4V 500MW DO204AH
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 25 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4621UR-1 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf
1N4621UR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Current - Reverse Leakage @ Vr: 3.5 µA @ 2 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 1700 Ohms
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4691 1N4678-1N4717.pdf
1N4691
Hersteller: Microchip Technology
Description: DIODE ZENER 6.2V 500MW DO35
Current - Reverse Leakage @ Vr: 10 µA @ 5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-35
Voltage - Zener (Nom) (Vz): 6.2 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 191 Stücke:
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AnzahlPreis
3+5.95 EUR
100+5.52 EUR
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1N4996US 1N4954US-96US%2C1N5968US-69US%2C1N6632US-1N6637US.pdf
1N4996US
Hersteller: Microchip Technology
Description: DIODE ZENER 390V 5W D5B
Packaging: Bulk
Tolerance: ±5%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 390 V
Impedance (Max) (Zzt): 1800 Ohms
Supplier Device Package: D-5B
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 297 V
auf Bestellung 128 Stücke:
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AnzahlPreis
1+81.63 EUR
100+75.79 EUR
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1N5231BUR-1 1N5221UR-1N5281BUR-E3.pdf
1N5231BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 5.1V 500MW DO213AA
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 5 µA @ 2 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 17 Ohms
auf Bestellung 135 Stücke:
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AnzahlPreis
4+5.12 EUR
100+4.76 EUR
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1N5234A 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5234A
Hersteller: Microchip Technology
Description: DIODE ZENER 6.2V 500MW DO35
Current - Reverse Leakage @ Vr: 5 µA @ 3.8 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 7 Ohms
Voltage - Zener (Nom) (Vz): 6.2 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±10%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5279B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5279B
Hersteller: Microchip Technology
Description: DIODE ZENER 180V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 180 V
Impedance (Max) (Zzt): 2200 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 137 V
auf Bestellung 270 Stücke:
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AnzahlPreis
5+4.36 EUR
100+4.09 EUR
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1N5281B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5281B
Hersteller: Microchip Technology
Description: DIODE ZENER 200V 500MW DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Supplier Device Package: DO-204AH (DO-35)
Part Status: Active
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 152 V
Tolerance: ±5%
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 200 V
Impedance (Max) (Zzt): 2500 Ohms
Power - Max: 500 mW
auf Bestellung 1331 Stücke:
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AnzahlPreis
4+5.16 EUR
100+4.78 EUR
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1N5300-1 1N5283-1_1N5314-1.pdf
1N5300-1
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 1.43MA 500MW
Voltage - Limiting (Max): 1.5V
Regulator Current (Max): 1.43mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Supplier Device Package: DO-7
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AA, DO-7, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5331 S%2CR21.pdf
1N5331
Hersteller: Microchip Technology
Description: DIODE STANDARD 1400V 22A DO4
Current - Reverse Leakage @ Vr: 10 µA @ 1400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Voltage - DC Reverse (Vr) (Max): 1400 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: DO-4
Current - Average Rectified (Io): 22A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Chassis, Stud Mount
Package / Case: DO-203AA, DO-4, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5419E3 LDS-0231%2C+1N5415+thru+1N5420%2C+MIL-PRF-19500-411.pdf
1N5419E3
Hersteller: Microchip Technology
Description: DIODE STANDARD 500V 3A B AXIAL
Technology: Standard
Reverse Recovery Time (trr): 250 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: B, Axial
Packaging: Bulk
Current - Reverse Leakage @ Vr: 1 µA @ 500 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Voltage - DC Reverse (Vr) (Max): 500 V
Operating Temperature - Junction: -65°C ~ 175°C
Supplier Device Package: B, Axial
Current - Average Rectified (Io): 3A
Produkt ist nicht verfügbar
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1N5523BUR-1 8860-lds-0037-datasheet
1N5523BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 5.1V 500MW DO213AA
Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 26 Ohms
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+12.46 EUR
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1N5532BUR-1 1N5518BUR-1_1N5546BUR-1.pdf
1N5532BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO213AA
Current - Reverse Leakage @ Vr: 50 nA @ 10.8 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5711-1 LDS-0040_r4%2C+1N5711-12_1N6857-58_DSB2810_5712%2C+MIL-PRF-19500-444.pdf
1N5711-1
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 70V 33MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 33mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 70 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 15 mA
Current - Reverse Leakage @ Vr: 200 nA @ 50 V
auf Bestellung 549 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.79 EUR
100+9.11 EUR
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1N5822US LDS-0303-1%2C+1N5820US-1N5822US%2C1N6864US%2C+MIL-PRF-19500-620.pdf
1N5822US
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 3A B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
Current - Reverse Leakage @ Vr: 100 µA @ 40 V
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1N5907 8921-lds-0095-datasheet
1N5907
Hersteller: Microchip Technology
Description: TVS DIODE 5VWM 8.5VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 8.5V
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 5V
Current - Peak Pulse (10/1000µs): 120A
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
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1+28.53 EUR
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1N6316US 11083-lds-0193-1-datasheet
1N6316US
Hersteller: Microchip Technology
Description: DIODE ZENER 4.7V 500MW SQ-MELF
Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: B, SQ-MELF
Impedance (Max) (Zzt): 1500 Ohms
Voltage - Zener (Nom) (Vz): 4.7 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: SQ-MELF, B
Packaging: Bulk
Produkt ist nicht verfügbar
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1N6325US lds-0193-1%2C+1N6309US-55US.pdf
1N6325US
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 500MW SQ-MELF
Current - Reverse Leakage @ Vr: 1 µA @ 8.5 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Power - Max: 500 mW
Supplier Device Package: B, SQ-MELF
Impedance (Max) (Zzt): 7 Ohms
Voltage - Zener (Nom) (Vz): 11 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: SQ-MELF, B
Tolerance: ±5%
Packaging: Bulk
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1+24.9 EUR
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1N6335US 11083-lds-0193-1-datasheet
1N6335US
Hersteller: Microchip Technology
Description: DIODE ZENER 30V 500MW MELF
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1N6392 8886-lds-0053-datasheet
1N6392
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 45V 54A DO5
Produkt ist nicht verfügbar
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1N6490US 124793-lds-0183-1-datasheet
1N6490US
Hersteller: Microchip Technology
Description: DIODE ZENER 5.1V 1.5W D5A
Current - Reverse Leakage @ Vr: 1 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 1.5 W
Supplier Device Package: D-5A
Impedance (Max) (Zzt): 7 Ohms
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Tolerance: ±5%
Packaging: Bulk
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1+19.36 EUR
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1N6640US 1N6639US%2C_1N6640US%2C_1N6641US.pdf
1N6640US
Hersteller: Microchip Technology
Description: DIODE STANDARD 75V 300MA D5D
Packaging: Bulk
Package / Case: SQ-MELF, D
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Current - Average Rectified (Io): 300mA
Supplier Device Package: D-5D
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 50 V
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2+13.04 EUR
100+12.11 EUR
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1N6643US 5895-1n6638-42-43us-datasheet
1N6643US
Hersteller: Microchip Technology
Description: DIODE GEN PURP 50V 300MA D5B
auf Bestellung 961 Stücke:
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1N6659 8910-lds-0068-datasheet
1N6659
Hersteller: Microchip Technology
Description: DIODE ARRAY GP 200V 15A TO254AA
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 200 V
Supplier Device Package: TO-254AA
Current - Average Rectified (Io) (per Diode): 15A
Diode Configuration: 1 Pair Common Anode
Technology: Standard
Reverse Recovery Time (trr): 35 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-254-3, TO-254AA (Straight Leads)
Packaging: Bulk
Produkt ist nicht verfügbar
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1N6663US 11107-sd88a-datasheet
1N6663US
Hersteller: Microchip Technology
Description: DIODE GEN PURP 600V 500MA D5A
auf Bestellung 1 Stücke:
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AnzahlPreis
1+35.78 EUR
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