Produkte > MILL-MAX MANUFACTURING CORP. > Alle Produkte des Herstellers MILL-MAX MANUFACTURING CORP. (41970) > Seite 427 nach 700
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 346-99-112-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCBNumber of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.175" (4.45mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 12 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 346-99-113-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCBNumber of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.120" (3.05mm) Part Status: Active Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 13 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 346-99-113-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCBNumber of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.175" (4.45mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 13 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 346-99-119-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 346-99-119-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCBPart Status: Active Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 19 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk Number of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.175" (4.45mm) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 346-99-114-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.1 TIN-LEAD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 1401-0-15-15-30-14-10-0 | Mill-Max Manufacturing Corp. |
Description: PIN RECEPTACLE Socket Depth: 0.145" (3.68mm) Pin Hole Diameter: 0.043" (1.09mm) Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm) Tail Type: No Tail Contact Material: Beryllium Copper Contact Finish Thickness: 10.0µin (0.25µm) Mounting Hole Diameter: 0.055" (1.40mm) Termination: Solder Length - Overall: 0.165" (4.19mm) Flange Diameter: 0.072" (1.83mm) Contact Finish: Gold Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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316-93-159-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 59POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 59 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.236" (6.00mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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316-93-159-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 59POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 59 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.315" (8.00mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 334-90-114-00-010000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 14POS TIN-LEADPackaging: Bulk Connector Type: Header Contact Finish: Tin-Lead Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Contact Type: Post, Extended Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 334-90-113-00-050000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 13POS TIN-LEAD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 334-90-114-00-050000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 14POS TIN-LEAD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 334-90-114-00-000000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 14POS TIN-LEAD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 334-90-113-00-100000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 13POS TIN-LEAD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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316-93-159-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 59POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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110-47-328-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 458 Stücke: Lieferzeit 10-14 Tag (e) |
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| 712-43-102-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 2POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 712-41-258-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 58POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 712-41-260-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 60POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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803-99-042-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 42POS 0.1 TIN-LEAD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 833-43-014-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.079 GOLD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 833-43-014-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.079 GOLD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 833-43-014-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.079 GOLD SMD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 833-43-014-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14P 0.079 GOLD PCB R/A |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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851-93-058-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 58POS 0.05 GOLD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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851-93-059-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 59POS 0.05 GOLD PCBContact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 59 Mounting Type: Through Hole Current Rating (Amps): 3A Connector Type: Receptacle Packaging: Bulk Number of Rows: 1 Insulation Height: 0.185" (4.70mm) Contact Length - Post: 0.115" (2.92mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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851-41-007-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 7POS 0.05 GOLD PCB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 515-91-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 515-91-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 515-91-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 515-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 515-93-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 515-93-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 515-13-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPackaging: Bulk Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 515-13-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 515-13-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 510-91-225-18-091002 | Mill-Max Manufacturing Corp. | Description: SOCKET SOLDERTAIL 225-PGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 510-91-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 510-91-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 614-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAPart Status: Active Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Type: PGA Mounting Type: Through Hole Features: Carrier, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 614-93-225-18-091007 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAPackaging: Bulk Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Carrier, Open Frame |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 614-93-225-18-091012 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Carrier, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 551-90-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTLPackaging: Bulk Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Type: PGA Mounting Type: Through Hole |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 511-91-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 511-91-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 511-91-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLHousing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 510-93-225-18-091002 | Mill-Max Manufacturing Corp. | Description: SOCKET SOLDERTAIL 225-PGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 510-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 510-93-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 614-13-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAFeatures: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 614-13-225-18-091007 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAFeatures: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 614-13-225-18-091012 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAFeatures: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 511-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLContact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Active Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 511-93-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 511-93-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 551-90-225-18-091005 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Type: PGA Mounting Type: Through Hole Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 510-13-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 510-13-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPackaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 510-13-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 522-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOSTPackaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 346-99-112-41-013000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 12
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 12
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 346-99-113-41-012000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.120" (3.05mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 13
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.120" (3.05mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 13
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 346-99-113-41-013000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 13
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 13
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 346-99-119-41-012000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 346-99-119-41-013000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 19
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 19
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 346-99-114-41-012000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 14POS 0.1 TIN-LEAD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 1401-0-15-15-30-14-10-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: PIN RECEPTACLE
Socket Depth: 0.145" (3.68mm)
Pin Hole Diameter: 0.043" (1.09mm)
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Tail Type: No Tail
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Mounting Hole Diameter: 0.055" (1.40mm)
Termination: Solder
Length - Overall: 0.165" (4.19mm)
Flange Diameter: 0.072" (1.83mm)
Contact Finish: Gold
Packaging: Bulk
Description: PIN RECEPTACLE
Socket Depth: 0.145" (3.68mm)
Pin Hole Diameter: 0.043" (1.09mm)
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Tail Type: No Tail
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Mounting Hole Diameter: 0.055" (1.40mm)
Termination: Solder
Length - Overall: 0.165" (4.19mm)
Flange Diameter: 0.072" (1.83mm)
Contact Finish: Gold
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 316-93-159-41-006000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.236" (6.00mm)
Number of Rows: 1
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.236" (6.00mm)
Number of Rows: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 316-93-159-41-003000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.315" (8.00mm)
Number of Rows: 1
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.315" (8.00mm)
Number of Rows: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 334-90-114-00-010000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 14POS TIN-LEAD
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin-Lead
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Post, Extended
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 1
Description: CONN HDR POST 14POS TIN-LEAD
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin-Lead
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Post, Extended
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 1
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 334-90-113-00-050000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 13POS TIN-LEAD
Description: CONN HDR POST 13POS TIN-LEAD
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 334-90-114-00-050000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 14POS TIN-LEAD
Description: CONN HDR POST 14POS TIN-LEAD
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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Stück im Wert von UAH
| 334-90-114-00-000000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 14POS TIN-LEAD
Description: CONN HDR POST 14POS TIN-LEAD
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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Stück im Wert von UAH
| 334-90-113-00-100000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 13POS TIN-LEAD
Description: CONN HDR POST 13POS TIN-LEAD
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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| 316-93-159-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 110-47-328-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 458 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.33 EUR |
| 14+ | 3.58 EUR |
| 28+ | 3.42 EUR |
| 56+ | 3.25 EUR |
| 112+ | 3.09 EUR |
| 252+ | 2.93 EUR |
| 712-43-102-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 2POS 0.1 GOLD PCB
Description: CONN RCPT 2POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 712-41-258-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 58POS 0.1 GOLD PCB
Description: CONN RCPT 58POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 712-41-260-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 60POS 0.1 GOLD PCB
Description: CONN RCPT 60POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 803-99-042-10-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 42POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 42POS 0.1 TIN-LEAD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 833-43-014-10-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.079 GOLD PCB
Description: CONN RCPT 14POS 0.079 GOLD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 833-43-014-10-002000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.079 GOLD PCB
Description: CONN RCPT 14POS 0.079 GOLD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 833-43-014-30-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.079 GOLD SMD
Description: CONN RCPT 14POS 0.079 GOLD SMD
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 833-43-014-20-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14P 0.079 GOLD PCB R/A
Description: CONN RCPT 14P 0.079 GOLD PCB R/A
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 851-93-058-10-002000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 58POS 0.05 GOLD PCB
Description: CONN RCPT 58POS 0.05 GOLD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 851-93-059-10-002000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.05 GOLD PCB
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 59
Mounting Type: Through Hole
Current Rating (Amps): 3A
Connector Type: Receptacle
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.185" (4.70mm)
Contact Length - Post: 0.115" (2.92mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Description: CONN RCPT 59POS 0.05 GOLD PCB
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 59
Mounting Type: Through Hole
Current Rating (Amps): 3A
Connector Type: Receptacle
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.185" (4.70mm)
Contact Length - Post: 0.115" (2.92mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 851-41-007-10-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 7POS 0.05 GOLD PCB
Description: CONN RCPT 7POS 0.05 GOLD PCB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 515-91-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 515-91-225-18-091002 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 515-91-225-18-091003 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 515-93-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 515-93-225-18-091002 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 515-93-225-18-091003 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 515-13-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Description: SKT PGA SOLDRTL
Packaging: Bulk
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 515-13-225-18-091002 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 515-13-225-18-091003 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 510-91-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SOCKET SOLDERTAIL 225-PGA
Description: SOCKET SOLDERTAIL 225-PGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 510-91-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 510-91-225-18-091003 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 614-93-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Part Status: Active
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Description: SKT CARRIER PGA
Part Status: Active
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 614-93-225-18-091007 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Description: SKT CARRIER PGA
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 614-93-225-18-091012 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Description: SKT CARRIER PGA
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 551-90-225-18-091003 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Type: PGA
Mounting Type: Through Hole
Description: CONN HDR SOLDRTL
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Type: PGA
Mounting Type: Through Hole
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 511-91-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 511-91-225-18-091002 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 511-91-225-18-091003 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 510-93-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SOCKET SOLDERTAIL 225-PGA
Description: SOCKET SOLDERTAIL 225-PGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 510-93-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 510-93-225-18-091003 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 614-13-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 614-13-225-18-091007 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 614-13-225-18-091012 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 511-93-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 511-93-225-18-091002 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 511-93-225-18-091003 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 551-90-225-18-091005 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Type: PGA
Mounting Type: Through Hole
Packaging: Bulk
Description: CONN HDR SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Type: PGA
Mounting Type: Through Hole
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 510-13-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 510-13-225-18-091002 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 510-13-225-18-091003 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 522-93-225-18-091001 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH





