Produkte > MILL-MAX MANUFACTURING CORP. > Alle Produkte des Herstellers MILL-MAX MANUFACTURING CORP. (38755) > Seite 442 nach 646
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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614-93-225-18-091007 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-93-225-18-091012 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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551-90-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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511-91-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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511-91-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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511-91-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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510-93-225-18-091002 | Mill-Max Manufacturing Corp. | Description: SOCKET SOLDERTAIL 225-PGA |
Produkt ist nicht verfügbar |
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510-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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510-93-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-13-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Part Status: Active |
Produkt ist nicht verfügbar |
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614-13-225-18-091007 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-13-225-18-091012 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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511-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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511-93-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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511-93-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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551-90-225-18-091005 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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510-13-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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510-13-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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510-13-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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522-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Part Status: Active |
Produkt ist nicht verfügbar |
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522-93-225-18-091002 | Mill-Max Manufacturing Corp. | Description: SKT PGA WRAPOST |
Produkt ist nicht verfügbar |
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522-93-225-18-091003 | Mill-Max Manufacturing Corp. | Description: SKT PGA WRAPOST |
Produkt ist nicht verfügbar |
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523-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Part Status: Active |
Produkt ist nicht verfügbar |
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523-93-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Part Status: Active |
Produkt ist nicht verfügbar |
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523-93-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Part Status: Active |
Produkt ist nicht verfügbar |
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522-13-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Part Status: Active |
Produkt ist nicht verfügbar |
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522-13-225-18-091002 | Mill-Max Manufacturing Corp. | Description: SKT PGA WRAPOST |
Produkt ist nicht verfügbar |
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522-13-225-18-091003 | Mill-Max Manufacturing Corp. | Description: SKT PGA WRAPOST |
Produkt ist nicht verfügbar |
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523-13-225-18-091001 | Mill-Max Manufacturing Corp. | Description: SKT PGA WRAPOST |
Produkt ist nicht verfügbar |
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3130-3-00-15-00-00-08-0 | Mill-Max Manufacturing Corp. | Description: CONN PC PIN CIRC .025DIA GOLD |
Produkt ist nicht verfügbar |
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803-41-028-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 28POS 0.1 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 4.5A Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.338" (8.59mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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803-91-028-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 28POS 0.1 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 4.5A Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin-Lead Insulation Height: 0.338" (8.59mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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831-41-028-30-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 28POS 0.079 GOLD SMD |
Produkt ist nicht verfügbar |
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831-41-028-30-002000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 28POS 0.079 GOLD SMD |
Produkt ist nicht verfügbar |
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831-91-028-30-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 28POS 0.079 GOLD SMD |
Produkt ist nicht verfügbar |
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831-91-028-30-002000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 28POS 0.079 GOLD SMD |
Produkt ist nicht verfügbar |
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853-41-028-30-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 28POS 0.05 GOLD SMD |
Produkt ist nicht verfügbar |
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853-91-028-30-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 28POS 0.05 GOLD SMD |
Produkt ist nicht verfügbar |
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851-41-028-30-002000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 28POS 0.05 GOLD SMD |
Produkt ist nicht verfügbar |
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851-91-028-30-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 28POS 0.05 GOLD SMD |
Produkt ist nicht verfügbar |
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851-91-028-30-002000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 28POS 0.05 GOLD SMD |
Produkt ist nicht verfügbar |
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801-41-028-30-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 28POS 0.1 GOLD SMD |
Produkt ist nicht verfügbar |
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304-11-101-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 1POS GOLD PCB |
Produkt ist nicht verfügbar |
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310-99-104-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 4POS 0.1 TIN-LEAD PCB |
Produkt ist nicht verfügbar |
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310-99-105-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 5POS 0.1 TIN-LEAD PCB |
Produkt ist nicht verfügbar |
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110-93-322-61-105000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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110-93-322-61-801000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame, Decoupling Capacitor Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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7945-2-15-20-09-14-11-0 | Mill-Max Manufacturing Corp. |
Description: SPRING LOADED PIN WITH SOLDERTAI Packaging: Bulk Contact Finish: Gold Mounting Type: Through Hole Contact Type: Sleeve & Plunger (Pogo Pins) Contact Finish Thickness: 20.0µin (0.51µm) Contact Material: Brass Alloy Mating Cycles: 1000000 Part Status: Active Maximum Working Height: 0.266" (6.76mm) Recommended Working Height: 0.251" (6.38mm) Minimum Working Height: 0.236" (6.00mm) Pad Layout Dimension: Circular - 0.118" (3mm) (TH) Plunger Size: 0.091" (2.31mm) Dia Operating Force - Initial: 30gf Operating Force - Mid Compression: 55gf |
auf Bestellung 1023 Stücke: Lieferzeit 10-14 Tag (e) |
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6218-0-00-15-00-00-03-4 | Mill-Max Manufacturing Corp. | Description: CONN PC PIN CIRC |
Produkt ist nicht verfügbar |
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3404-0-00-15-00-00-03-4 | Mill-Max Manufacturing Corp. | Description: CONN PC PIN CIRC |
Produkt ist nicht verfügbar |
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6192-0-15-15-21-14-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT Packaging: Bulk Contact Finish: Gold Length - Overall: 0.275" (6.99mm) Termination: Press-Fit Mounting Hole Diameter: 0.032" (0.81mm) Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Tail Type: Standard Tail Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm) Pin Hole Diameter: 0.031" (0.79mm) Tail Diameter: 0.026" (0.66mm) Socket Depth: 0.135" (3.43mm) Part Status: Active |
Produkt ist nicht verfügbar |
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6192-0-15-15-21-27-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN RECEPT PIN .015-.021" .125" Packaging: Bulk Contact Finish: Gold Flange Diameter: 0.041" (1.04mm) Length - Overall: 0.275" (6.99mm) Termination: Press-Fit Mounting Hole Diameter: 0.032" (0.81mm) Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Tail Type: Standard Tail Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm) Pin Hole Diameter: 0.031" (0.79mm) Tail Diameter: 0.025" (0.64mm) Square Socket Depth: 0.135" (3.43mm) |
auf Bestellung 999 Stücke: Lieferzeit 10-14 Tag (e) |
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0492-0-15-15-13-14-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT Packaging: Bulk Contact Finish: Gold Flange Diameter: 0.119" (3.02mm) Length - Overall: 0.395" (10.03mm) Termination: Press-Fit Mounting Hole Diameter: 0.106" (2.69mm) Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Tail Type: Standard Tail Accepts Pin Diameter: 0.048" ~ 0.064" (1.22mm ~ 1.63mm) Pin Hole Diameter: 0.088" (2.24mm) Tail Diameter: 0.041" (1.04mm) Socket Depth: 0.200" (5.08mm) Part Status: Active |
Produkt ist nicht verfügbar |
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1703-3-17-01-30-14-02-0 | Mill-Max Manufacturing Corp. |
Description: RECEPT WRAPOST .015-.025" .510" Packaging: Bulk Contact Finish: Gold Length - Overall: 0.675" (17.15mm) Termination: Press-Fit Mounting Hole Diameter: 0.057" (1.45mm) Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Tail Type: Wire Wrap Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm) Pin Hole Diameter: 0.043" (1.09mm) Tail Diameter: 0.025" (0.64mm) Square Socket Depth: 0.145" (3.68mm) |
Produkt ist nicht verfügbar |
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334-40-102-00-100000 | Mill-Max Manufacturing Corp. | Description: CONN HDR POST 2POS TIN |
Produkt ist nicht verfügbar |
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334-90-102-00-100000 | Mill-Max Manufacturing Corp. | Description: CONN HDR POST 2POS TIN-LEAD |
Produkt ist nicht verfügbar |
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334-10-102-00-100000 | Mill-Max Manufacturing Corp. | Description: CONN HDR POST 2POS GOLD |
Produkt ist nicht verfügbar |
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416-91-232-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN SOCKET 32POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
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416-91-236-41-003000 | Mill-Max Manufacturing Corp. | Description: CONN SOCKET 36POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
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416-91-232-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN SOCKET 32POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
614-93-225-18-091007 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-93-225-18-091012 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
551-90-225-18-091003 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
511-91-225-18-091001 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
511-91-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
511-91-225-18-091003 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
510-93-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SOCKET SOLDERTAIL 225-PGA
Description: SOCKET SOLDERTAIL 225-PGA
Produkt ist nicht verfügbar
510-93-225-18-091001 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
510-93-225-18-091003 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-13-225-18-091001 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Produkt ist nicht verfügbar
614-13-225-18-091007 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-13-225-18-091012 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
511-93-225-18-091001 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
511-93-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
511-93-225-18-091003 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
551-90-225-18-091005 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
510-13-225-18-091001 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
510-13-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
510-13-225-18-091003 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
522-93-225-18-091001 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Produkt ist nicht verfügbar
522-93-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
Produkt ist nicht verfügbar
522-93-225-18-091003 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
Produkt ist nicht verfügbar
523-93-225-18-091001 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Produkt ist nicht verfügbar
523-93-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Produkt ist nicht verfügbar
523-93-225-18-091003 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Produkt ist nicht verfügbar
522-13-225-18-091001 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Produkt ist nicht verfügbar
522-13-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
Produkt ist nicht verfügbar
522-13-225-18-091003 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
Produkt ist nicht verfügbar
523-13-225-18-091001 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
Produkt ist nicht verfügbar
3130-3-00-15-00-00-08-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC .025DIA GOLD
Description: CONN PC PIN CIRC .025DIA GOLD
Produkt ist nicht verfügbar
803-41-028-30-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Surface Mount
Number of Positions: 28
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.338" (8.59mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 28POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Surface Mount
Number of Positions: 28
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.338" (8.59mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Produkt ist nicht verfügbar
803-91-028-30-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Surface Mount
Number of Positions: 28
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Insulation Height: 0.338" (8.59mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 28POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Surface Mount
Number of Positions: 28
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Insulation Height: 0.338" (8.59mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Produkt ist nicht verfügbar
831-41-028-30-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.079 GOLD SMD
Description: CONN RCPT 28POS 0.079 GOLD SMD
Produkt ist nicht verfügbar
831-41-028-30-002000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.079 GOLD SMD
Description: CONN RCPT 28POS 0.079 GOLD SMD
Produkt ist nicht verfügbar
831-91-028-30-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.079 GOLD SMD
Description: CONN RCPT 28POS 0.079 GOLD SMD
Produkt ist nicht verfügbar
831-91-028-30-002000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.079 GOLD SMD
Description: CONN RCPT 28POS 0.079 GOLD SMD
Produkt ist nicht verfügbar
853-41-028-30-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.05 GOLD SMD
Description: CONN RCPT 28POS 0.05 GOLD SMD
Produkt ist nicht verfügbar
853-91-028-30-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.05 GOLD SMD
Description: CONN RCPT 28POS 0.05 GOLD SMD
Produkt ist nicht verfügbar
851-41-028-30-002000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.05 GOLD SMD
Description: CONN RCPT 28POS 0.05 GOLD SMD
Produkt ist nicht verfügbar
851-91-028-30-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.05 GOLD SMD
Description: CONN RCPT 28POS 0.05 GOLD SMD
Produkt ist nicht verfügbar
851-91-028-30-002000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.05 GOLD SMD
Description: CONN RCPT 28POS 0.05 GOLD SMD
Produkt ist nicht verfügbar
801-41-028-30-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.1 GOLD SMD
Description: CONN RCPT 28POS 0.1 GOLD SMD
Produkt ist nicht verfügbar
304-11-101-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 1POS GOLD PCB
Description: CONN RCPT 1POS GOLD PCB
Produkt ist nicht verfügbar
310-99-104-61-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 4POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 4POS 0.1 TIN-LEAD PCB
Produkt ist nicht verfügbar
310-99-105-61-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 5POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 5POS 0.1 TIN-LEAD PCB
Produkt ist nicht verfügbar
110-93-322-61-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
110-93-322-61-801000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame, Decoupling Capacitor
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame, Decoupling Capacitor
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
7945-2-15-20-09-14-11-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SPRING LOADED PIN WITH SOLDERTAI
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Through Hole
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.266" (6.76mm)
Recommended Working Height: 0.251" (6.38mm)
Minimum Working Height: 0.236" (6.00mm)
Pad Layout Dimension: Circular - 0.118" (3mm) (TH)
Plunger Size: 0.091" (2.31mm) Dia
Operating Force - Initial: 30gf
Operating Force - Mid Compression: 55gf
Description: SPRING LOADED PIN WITH SOLDERTAI
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Through Hole
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.266" (6.76mm)
Recommended Working Height: 0.251" (6.38mm)
Minimum Working Height: 0.236" (6.00mm)
Pad Layout Dimension: Circular - 0.118" (3mm) (TH)
Plunger Size: 0.091" (2.31mm) Dia
Operating Force - Initial: 30gf
Operating Force - Mid Compression: 55gf
auf Bestellung 1023 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.42 EUR |
10+ | 4.02 EUR |
100+ | 3.54 EUR |
1000+ | 2.57 EUR |
6218-0-00-15-00-00-03-4 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Description: CONN PC PIN CIRC
Produkt ist nicht verfügbar
3404-0-00-15-00-00-03-4 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Description: CONN PC PIN CIRC
Produkt ist nicht verfügbar
6192-0-15-15-21-14-04-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Length - Overall: 0.275" (6.99mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.032" (0.81mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm)
Pin Hole Diameter: 0.031" (0.79mm)
Tail Diameter: 0.026" (0.66mm)
Socket Depth: 0.135" (3.43mm)
Part Status: Active
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Length - Overall: 0.275" (6.99mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.032" (0.81mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm)
Pin Hole Diameter: 0.031" (0.79mm)
Tail Diameter: 0.026" (0.66mm)
Socket Depth: 0.135" (3.43mm)
Part Status: Active
Produkt ist nicht verfügbar
6192-0-15-15-21-27-04-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RECEPT PIN .015-.021" .125"
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.041" (1.04mm)
Length - Overall: 0.275" (6.99mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.032" (0.81mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm)
Pin Hole Diameter: 0.031" (0.79mm)
Tail Diameter: 0.025" (0.64mm) Square
Socket Depth: 0.135" (3.43mm)
Description: CONN RECEPT PIN .015-.021" .125"
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.041" (1.04mm)
Length - Overall: 0.275" (6.99mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.032" (0.81mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm)
Pin Hole Diameter: 0.031" (0.79mm)
Tail Diameter: 0.025" (0.64mm) Square
Socket Depth: 0.135" (3.43mm)
auf Bestellung 999 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.24 EUR |
10+ | 1.88 EUR |
100+ | 1.69 EUR |
0492-0-15-15-13-14-04-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.119" (3.02mm)
Length - Overall: 0.395" (10.03mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.106" (2.69mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.048" ~ 0.064" (1.22mm ~ 1.63mm)
Pin Hole Diameter: 0.088" (2.24mm)
Tail Diameter: 0.041" (1.04mm)
Socket Depth: 0.200" (5.08mm)
Part Status: Active
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.119" (3.02mm)
Length - Overall: 0.395" (10.03mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.106" (2.69mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.048" ~ 0.064" (1.22mm ~ 1.63mm)
Pin Hole Diameter: 0.088" (2.24mm)
Tail Diameter: 0.041" (1.04mm)
Socket Depth: 0.200" (5.08mm)
Part Status: Active
Produkt ist nicht verfügbar
1703-3-17-01-30-14-02-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: RECEPT WRAPOST .015-.025" .510"
Packaging: Bulk
Contact Finish: Gold
Length - Overall: 0.675" (17.15mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.057" (1.45mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: Wire Wrap
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Pin Hole Diameter: 0.043" (1.09mm)
Tail Diameter: 0.025" (0.64mm) Square
Socket Depth: 0.145" (3.68mm)
Description: RECEPT WRAPOST .015-.025" .510"
Packaging: Bulk
Contact Finish: Gold
Length - Overall: 0.675" (17.15mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.057" (1.45mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: Wire Wrap
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Pin Hole Diameter: 0.043" (1.09mm)
Tail Diameter: 0.025" (0.64mm) Square
Socket Depth: 0.145" (3.68mm)
Produkt ist nicht verfügbar
334-40-102-00-100000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 2POS TIN
Description: CONN HDR POST 2POS TIN
Produkt ist nicht verfügbar
334-90-102-00-100000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 2POS TIN-LEAD
Description: CONN HDR POST 2POS TIN-LEAD
Produkt ist nicht verfügbar
334-10-102-00-100000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 2POS GOLD
Description: CONN HDR POST 2POS GOLD
Produkt ist nicht verfügbar
416-91-232-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 32POS 0.1 GOLD PCB
Description: CONN SOCKET 32POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
416-91-236-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 36POS 0.1 GOLD PCB
Description: CONN SOCKET 36POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
416-91-232-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 32POS 0.1 GOLD PCB
Description: CONN SOCKET 32POS 0.1 GOLD PCB
Produkt ist nicht verfügbar