Produkte > CQ-
| Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis ohne MwSt | ||||
|---|---|---|---|---|---|---|---|---|
| CQ-1-28H | Festo Corporation | Description: PUSH-IN FITTING Packaging: Bulk | Produkt ist nicht verfügbar | |||||
| CQ-1100 | AUDIOPIPE | Description: AUDIOPIPE - CQ-1100 - Automotive 0Awg To 4Awg Anl / Ane Fuse Holder Produktpalette: - SVHC: To Be Advised | Produkt ist nicht verfügbar | |||||
| CQ-3/8-12 | Festo Corporation | Description: PUSH-IN FITTING Packaging: Bulk Part Status: Active Color: Silver For Use With/Related Products: 12mm OD Tubing Mounting Type: Free Hanging (In-Line) Material: Polyoxymethylene (POM) Thread Size: G3/8 Type: Straight Fitting Connection Method: Push-In to Cartridge | Produkt ist nicht verfügbar | |||||
| CQ-702S | Chip Quik | Benchtop Oscilloscopes Digital Oscilloscope 10MHz Bandwidth, 48MSa/s Sampling Rate | auf Bestellung 5 Stücke: Lieferzeit 14-28 Tag (e) |
| ||||
| CQ-AAA | Seek Thermal | Description: THERMAL IMAGING CAMERA ANDROID Packaging: Box For Use With/Related Products: Android™, iPhone® Smartphone Tool Type: Thermal Imaging Camera Part Status: Discontinued at Digi-Key | Produkt ist nicht verfügbar | |||||
| CQ-AAAX | Seek Thermal | Description: COMPACT PRO TIC ANDROID >15HZ | Produkt ist nicht verfügbar | |||||
| CQ-ESD-WRIST-1 | Chip Quik | Antistatic Control Products Antistatic Wrist Strap for ESD Mat (stretches 3 to 6 feet) - 1M ohm | Produkt ist nicht verfügbar | |||||
| CQ-SS-6040-0.76MM | Chip Quik Inc. | Description: SOLDER SPHERES SN60/PB40 0.76MM Packaging: Bulk Composition: Sn60Pb40 (60/40) Type: Solder Sphere Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months Melting Point: 361°F (183°C) | auf Bestellung 4 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-623602-0.65MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN62/PB36/AG2 0.6 Packaging: Bulk Diameter: 0.026" (0.66mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Sphere Melting Point: 354°F (179°C) Form: Jar Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 10 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-623602-0.65MM-25000 | Chip Quik | Solder Solder Spheres Sn62/Pb36/Ag2 0.65mm diameter 25K Bottle | Produkt ist nicht verfügbar | |||||
| CQ-SS-SAC405-0.30MM-25000 | Chip Quik | Solder Solder Spheres Sn95.5/Ag4.0/Cu0.5 0.30mm diameter 25K Bottle | auf Bestellung 13 Stücke: Lieferzeit 14-28 Tag (e) |
| ||||
| CQ-SS-SAC405-0.30MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN95.5/AG4.0/CU0. Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn95.5Ag4Cu0.5 (95.5/4/0.5) Type: Solder Sphere Melting Point: 423°F (217°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 20 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-SAC405-0.50MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN95.5/AG4.0/CU0. Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn95.5Ag4Cu0.5 (95.5/4/0.5) Type: Solder Sphere Melting Point: 423°F (217°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 19 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-SAC405-0.50MM-25000 | Chip Quik | Solder Solder Spheres Sn95.5/Ag4.0/Cu0.5 0.50mm diameter 25K Bottle | auf Bestellung 14 Stücke: Lieferzeit 14-28 Tag (e) |
| ||||
| CQ-SS-SAC405-0.60MM-25000 | Chip Quik | Solder Solder Spheres Sn95.5/Ag4.0/Cu0.5 0.60mm diameter 25K Bottle | auf Bestellung 17 Stücke: Lieferzeit 14-28 Tag (e) |
| ||||
| CQ-SS-SAC405-0.60MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN95.5/AG4.0/CU0. Packaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn95.5Ag4Cu0.5 (95.5/4/0.5) Type: Solder Sphere Melting Point: 423°F (217°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 20 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.20MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN42/BI57.6/AG0.4 Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Sphere Melting Point: 280°F (138°C) Form: Jar Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 9 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.20MM-25000 | Chip Quik | Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.20mm diameter 25K Bottle | auf Bestellung 2 Stücke: Lieferzeit 14-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.25MM-25000 | Chip Quik | Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.25mm diameter 25K Bottle | Produkt ist nicht verfügbar | |||||
| CQ-SS-SNBIAG-0.30MM-25000 | Chip Quik | Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.30mm diameter 25K Bottle | auf Bestellung 1 Stücke: Lieferzeit 14-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.30MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN42/BI57.6/AG0.4 Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Sphere Melting Point: 280°F (138°C) Form: Jar Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 8 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.35MM-25000 | Chip Quik | Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.35mm diameter 25K Bottle | auf Bestellung 4 Stücke: Lieferzeit 14-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.35MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN42/BI57.6/AG0.4 Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Sphere Melting Point: 280°F (138°C) Form: Jar Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 10 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.40MM-25000 | Chip Quik | Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.40mm diameter 25K Bottle | auf Bestellung 2 Stücke: Lieferzeit 14-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.40MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN42/BI57.6/AG0.4 Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Sphere Melting Point: 280°F (138°C) Form: Jar Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 8 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.45MM-25000 | Chip Quik | Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.45mm diameter 25K Bottle | auf Bestellung 1 Stücke: Lieferzeit 14-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.45MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN42/BI57.6/AG0.4 Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Sphere Melting Point: 280°F (138°C) Form: Jar Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 10 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.50MM-25000 | Chip Quik | Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.50mm diameter 25K Bottle | auf Bestellung 1 Stücke: Lieferzeit 55-69 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.50MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN42/BI57.6/AG0.4 Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Sphere Melting Point: 280°F (138°C) Form: Jar Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 7 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.60MM-25000 | Chip Quik | Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.60mm diameter 25K Bottle | auf Bestellung 4 Stücke: Lieferzeit 14-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.60MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN42/BI57.6/AG0.4 Packaging: Bulk Diameter: 0.024" (0.61mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Sphere Melting Point: 280°F (138°C) Form: Jar Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 8 Stücke: Lieferzeit 21-28 Tag (e) |
| ||||
| CQ-SS-SNBIAG-0.76MM-25000 | Chip Quik | Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.76mm diameter 25K Bottle | Produkt ist nicht verfügbar | |||||
| CQ-SS-SNBIAG-0.76MM-25000 | Chip Quik Inc. | Description: SOLDER SPHERES SN42/BI57.6/AG0.4 Packaging: Bulk Diameter: 0.030" (0.76mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Sphere Melting Point: 280°F (138°C) Form: Jar Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months | auf Bestellung 9 Stücke: Lieferzeit 21-28 Tag (e) |
|