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614-83-312-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-314-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Post: Brass
Contact Finish - Post: Tin
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-314-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-316-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-316-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-318-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-318-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-320-19-131144 Preci-Dip Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144 Description: CONN SOCKET PGA 320POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 320 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-320-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-320-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-321-19-121144 Preci-Dip Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144 Description: CONN SOCKET PGA 321POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 321 (21 x 21)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-322-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-322-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-324-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-324-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-325-18-111144 Preci-Dip Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144 Description: CONN SOCKET PGA 325POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 325 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-328-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-328-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-420-31-012101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-420-41-001101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-422-31-012101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-422-41-001101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-424-31-012101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-424-41-001101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-428-31-012101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-428-41-001101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-432-31-012101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-432-41-001101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-610-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-610-41-001101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-624-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-624-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-628-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-628-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-632-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 32POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-632-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 32POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-636-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-636-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-640-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-640-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-642-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-642-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-648-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 48POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-648-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 48POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-650-31-012101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-650-41-001101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-652-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 52POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-652-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 52POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-950-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 50POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-950-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 50POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-952-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 52POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-952-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 52POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-964-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 64POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 64 (2 x 32)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-964-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 64POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 64 (2 x 32)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-044-08-031112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 44POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 44 (8 x 8)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-064-08-000112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 64POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-068-10-061112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 68POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-069-11-061112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 69POS GOLD
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 69 (11 x 11)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-084-10-001112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 84POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 84 (10 x 10)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-084-10-031112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 84POS GOLD
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 84 (10 x 10)
Operating Temperature: -55°C ~ 125°C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-312-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-314-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Post: Brass
Contact Finish - Post: Tin
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-314-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-316-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-316-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-318-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-318-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-320-19-131144 Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 320POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 320 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-320-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-320-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-321-19-121144 Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 321POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 321 (21 x 21)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-322-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-322-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-324-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-324-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-325-18-111144 Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 325POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 325 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-328-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-328-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-420-31-012101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-420-41-001101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-422-31-012101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-422-41-001101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-424-31-012101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-424-41-001101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-428-31-012101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-428-41-001101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-432-31-012101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-432-41-001101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-610-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-610-41-001101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-624-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-624-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-628-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-628-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-632-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-632-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-636-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-636-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-640-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-640-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-642-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-642-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-648-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-648-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-650-31-012101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-650-41-001101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-652-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-652-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-950-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-950-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-952-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-952-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-964-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 64POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 64 (2 x 32)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-83-964-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 64POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 64 (2 x 32)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-044-08-031112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 44POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 44 (8 x 8)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-064-08-000112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 64POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-068-10-061112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 68POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-069-11-061112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 69POS GOLD
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 69 (11 x 11)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-084-10-001112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 84POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 84 (10 x 10)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
614-87-084-10-031112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 84POS GOLD
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 84 (10 x 10)
Operating Temperature: -55°C ~ 125°C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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