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614-83-121-13-061112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 121POS GOLD
Produkt ist nicht verfügbar
614-83-124-13-041112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 124POS GOLD
Produkt ist nicht verfügbar
614-83-132-13-041112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 132POS GOLD
Produkt ist nicht verfügbar
614-83-132-14-071112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 132POS GOLD
Produkt ist nicht verfügbar
614-83-133-14-071112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 133POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 133 (14 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-144-15-081112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 144POS GOLD
Produkt ist nicht verfügbar
614-83-145-15-081112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 145POS GOLD
Produkt ist nicht verfügbar
614-83-149-15-063112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 149POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 149 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-168-17-101112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 168POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 168 (17 x 17)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-175-16-072112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 175POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 175 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-179-15-041112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 179POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-179-18-111112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 179POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-179-18-112112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 179POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-181-15-051112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 181POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 181 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-210-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-210-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-225-17-061112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 225POS GOLD
Produkt ist nicht verfügbar
614-83-238-19-101112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 238POS GOLD
Produkt ist nicht verfügbar
614-83-279-19-081112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 279POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 279 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-281-19-001112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 281POS GOLD
Produkt ist nicht verfügbar
614-83-296-19-131144 Preci-Dip Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144 Description: CONN SOCKET PGA 296POS GOLD
Produkt ist nicht verfügbar
614-83-299-20-001112 Preci-Dip Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112 Description: CONN SOCKET PGA 299POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-304-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 4POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-304-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
614-83-306-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
614-83-306-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
614-83-308-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
614-83-308-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
614-83-310-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
614-83-310-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
614-83-312-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
614-83-312-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-314-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-314-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-316-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-316-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
614-83-318-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-318-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-320-19-131144 Preci-Dip Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144 Description: CONN SOCKET PGA 320POS GOLD
Produkt ist nicht verfügbar
614-83-320-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
614-83-320-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
614-83-321-19-121144 Preci-Dip Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144 Description: CONN SOCKET PGA 321POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 321 (21 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-322-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-83-322-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-83-324-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-83-324-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-325-18-111144 Preci-Dip Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144 Description: CONN SOCKET PGA 325POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 325 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-328-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
614-83-328-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
614-83-420-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
614-83-420-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
614-83-422-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-83-422-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-83-424-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-424-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-83-428-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
614-83-428-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
614-83-432-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
614-83-432-41-001101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
614-83-610-31-012101 Preci-Dip Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
614-83-121-13-061112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 121POS GOLD
Produkt ist nicht verfügbar
614-83-124-13-041112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 124POS GOLD
Produkt ist nicht verfügbar
614-83-132-13-041112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 132POS GOLD
Produkt ist nicht verfügbar
614-83-132-14-071112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 132POS GOLD
Produkt ist nicht verfügbar
614-83-133-14-071112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 133POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 133 (14 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-144-15-081112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 144POS GOLD
Produkt ist nicht verfügbar
614-83-145-15-081112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 145POS GOLD
Produkt ist nicht verfügbar
614-83-149-15-063112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 149POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 149 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-168-17-101112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 168POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 168 (17 x 17)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-175-16-072112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 175POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 175 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-179-15-041112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 179POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-179-18-111112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 179POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-179-18-112112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 179POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-181-15-051112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 181POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 181 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-210-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-210-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-225-17-061112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 225POS GOLD
Produkt ist nicht verfügbar
614-83-238-19-101112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 238POS GOLD
Produkt ist nicht verfügbar
614-83-279-19-081112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 279POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 279 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-281-19-001112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 281POS GOLD
Produkt ist nicht verfügbar
614-83-296-19-131144 Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 296POS GOLD
Produkt ist nicht verfügbar
614-83-299-20-001112 Default.aspx?c=12&i=1346&p=301&pdf=1&dsku=614-PP-NNN-XX-XXX112
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 299POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-304-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-304-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
614-83-306-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
614-83-306-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
614-83-308-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
614-83-308-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
614-83-310-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
614-83-310-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
614-83-312-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
614-83-312-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-314-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-314-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-316-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-316-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
614-83-318-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-318-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-320-19-131144 Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 320POS GOLD
Produkt ist nicht verfügbar
614-83-320-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
614-83-320-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
614-83-321-19-121144 Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 321POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 321 (21 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-322-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-83-322-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-83-324-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-83-324-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-325-18-111144 Default.aspx?c=12&i=1350&p=303&pdf=1&dsku=614-PP-NNN-XX-XXX144
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 325POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 325 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
614-83-328-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
614-83-328-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
614-83-420-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
614-83-420-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
614-83-422-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-83-422-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
614-83-424-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
614-83-424-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
614-83-428-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
614-83-428-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
614-83-432-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
614-83-432-41-001101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
614-83-610-31-012101 Default.aspx?c=14&i=1160&p=270&pdf=1&dsku=614-PP-XXX-XX-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
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