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Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
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550-80-381-18-101135 Preci-Dip Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135 Description: PGA SOLDER TAIL
Produkt ist nicht verfügbar
558-10-192M16-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-192M16-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-255M16-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-255M16-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-256M16-000101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-256M16-000104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-256M20-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-256M20-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-272M20-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-272M20-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-292M20-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-292M20-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-352M26-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-352M26-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-356M26-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-356M26-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-357M19-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-357M19-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-360M19-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-360M19-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-388M26-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-388M26-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-400M20-000101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-400M20-000104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-420M26-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-420M26-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-432M31-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-432M31-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-456M26-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-456M26-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-478M26-131101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-478M26-131104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-480M29-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-480M29-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-500M30-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-500M30-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-504M29-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-504M29-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-520M31-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-520M31-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-560M33-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-560M33-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 560 (33 x 33)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-576M30-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-576M30-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-600M35-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-600M35-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-652M35-001101 Preci-Dip Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101 Description: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-652M35-001104 Preci-Dip Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104 Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
612-83-304-41-001101 612-83-304-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
612-83-306-41-001101 612-83-306-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
612-83-308-41-001101 612-83-308-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
612-83-310-41-001101 612-83-310-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
612-83-312-41-001101 612-83-312-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
612-83-314-41-001101 612-83-314-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
612-83-316-41-001101 612-83-316-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
612-83-318-41-001101 612-83-318-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
612-83-320-41-001101 612-83-320-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
612-83-322-41-001101 612-83-322-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
612-83-324-41-001101 612-83-324-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 24POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
550-80-381-18-101135 Default.aspx?c=12&i=1356&p=306&pdf=1&dsku=550-PP-NNN-XX-XXX135
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL
Produkt ist nicht verfügbar
558-10-192M16-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-192M16-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 192 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-255M16-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-255M16-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 255 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-256M16-000101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-256M16-000104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (16 x 16)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-256M20-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-256M20-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-272M20-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-272M20-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-292M20-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-292M20-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-352M26-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-352M26-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-356M26-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-356M26-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-357M19-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-357M19-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-360M19-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-360M19-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-388M26-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-388M26-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-400M20-000101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-400M20-000104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-420M26-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-420M26-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-432M31-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-432M31-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-456M26-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-456M26-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-478M26-131101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-478M26-131104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-480M29-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-480M29-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-500M30-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-500M30-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-504M29-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-504M29-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-520M31-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-520M31-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-560M33-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-560M33-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 560 (33 x 33)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
558-10-576M30-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Produkt ist nicht verfügbar
558-10-576M30-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Produkt ist nicht verfügbar
558-10-600M35-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-600M35-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 600 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-652M35-001101 Default.aspx?c=12&i=1360&p=309&pdf=1&dsku=558-10-NNNMXX-XXX101
Hersteller: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
558-10-652M35-001104 Default.aspx?c=12&i=1372&p=311&pdf=1&dsku=558-10-NNNMXX-XXX104
Hersteller: Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 652 (35 x 35)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
612-83-304-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-304-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
612-83-306-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-306-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
612-83-308-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-308-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
612-83-310-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-310-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
612-83-312-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-312-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
612-83-314-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-314-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
612-83-316-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-316-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
612-83-318-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-318-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
612-83-320-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-320-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
612-83-322-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-322-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
612-83-324-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-83-324-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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