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612-87-314-41-001101

612-87-314-41-001101 Preci-dip

preci-dip_pdsad00016-22.pdf
Hersteller: Preci-dip
Board to Board & Mezzanine Connectors
auf Bestellung 511 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+4.24 EUR
10+3.69 EUR
30+3.14 EUR
270+3 EUR
510+2.76 EUR
1020+2.37 EUR
2520+2.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details 612-87-314-41-001101 Preci-dip

Description: CONN IC DIP SOCKET 14POS GOLD, Features: Carrier, Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.

Weitere Produktangebote 612-87-314-41-001101

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
612-87-314-41-001101 612-87-314-41-001101 Preci-Dip Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
 Mindestbestellmenge: 630 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
612-87-314-41-001101 Default.aspx?c=14&i=1128&p=269&pdf=1&dsku=612-PP-XXX-XX-XXX101
612-87-314-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 630 Stücke
Im Einkaufswagen  Stück im Wert von  UAH