auf Bestellung 491 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 1.69 EUR |
| 10+ | 1.44 EUR |
| 104+ | 1.29 EUR |
| 520+ | 1.06 EUR |
| 1040+ | 0.94 EUR |
| 2548+ | 0.85 EUR |
| 4368+ | 0.82 EUR |
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Technische Details 612-87-308-41-001101 Preci-dip
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Carrier, Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.
Weitere Produktangebote 612-87-308-41-001101
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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612-87-308-41-001101 | Hersteller : Preci-Dip |
 2.54mm, Carrier solder tail |
Produkt ist nicht verfügbar |
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 |
612-87-308-41-001101 | Hersteller : Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |