Produkte > BINDER MPE > 001-3-008-3-B1STF-XT0

001-3-008-3-B1STF-XT0 BINDER MPE

Hersteller: BINDER MPE
Category: Precision sockets
Description: Socket: integrated circuits; DIP8; Pitch: 2.54mm; precision; THT
Operating temperature: -55...125°C
Application: DIP8
Type of Socket: integrated circuits
Body material: thermoplastic
Electrical mounting: THT
Sockets features: bushing contacts; round pins; suppressing capacitor 0.1 µF
Row pitch: 7.62mm
Contact plating: gold-plated
Terminal pitch: 2.54mm
Maximum current: 3A
Flammability rating: UL94V-0
Connector variant: precision

auf Bestellung 194 Stücke:

Lieferzeit 14-21 Tag (e)

Mindestbestellmenge: 10 Stücke

Im Einkaufswagen Stück im Wert von UAH

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Technische Details 001-3-008-3-B1STF-XT0 BINDER MPE

Category: Precision sockets, Description: Socket: integrated circuits; DIP8; Pitch: 2.54mm; precision; THT, Operating temperature: -55...125°C, Application: DIP8, Type of Socket: integrated circuits, Body material: thermoplastic, Electrical mounting: THT, Sockets features: bushing contacts; round pins; suppressing capacitor 0.1 µF, Row pitch: 7.62mm, Contact plating: gold-plated, Terminal pitch: 2.54mm, Maximum current: 3A, Flammability rating: UL94V-0, Connector variant: precision.